XINThv
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XINT – Device Reliability Testing High Voltage Reliability Test System Family • XINThv-sb static HTRB-HTGB stress and test • XINThv-hc HCI stress, test and characterization • XINThv-em electromigration test • Powerful software for development and analysis
Transcript of XINThv
XINT – Device Reliability Testing
High Voltage Reliability Test System Family
• XINThv-sb static HTRB-HTGB stress and test• XINThv-hc HCI stress, test and characterization• XINThv-em electromigration test• Powerful software for development and analysis
XINThv-sb Reliability test on transistor structures P and N channel devices, 80 devices tested in
parallel -50 ..+150°C temperature HTRB (High temperature reverse bias)
o Up to 2000V drain voltageo Gate tied to groundo Ids monitoring during stress for device life signo Breakdown detection
HTRB (High temperature gate bias)o Up to 100V gate voltageo Drain tied to groundo Igs monitoring during stress for device life signo Breakdown detection
XINThv-hc Reliability test on transistor structures JEDEC characterization during stress P and N channel devices, 15 devices tested in
parallel -50 ..+175°C temperature HCI (hot carrier injection)
o Up to 2000V drain voltage, up to 100V gate voltageo Up to 200mA per device, 2uA measurement accuracyo Ids monitoring during stress for device life signo Gate and drain breakdown detection
JEDEC characterizationo Linear and logarithmic time interval programmableo Ids(Vg) and Ids (Vd) per device
XINThv-em (in development) Reliability test on resistor structures 60 devices tested in parallel Temperature up to +350°C High-current electromigration test
o Independent parameters per boardo Up to 3A per deviceo High accuracy resistance measuremento Extrusion current measurement with 1nA resolution
Software for Execution and Analysis Common control software based on NTEE
o Local and remote control and monitor possibilityo Engineering mode for interactive parameter selectiono Operator mode for safe and reliable test execution
On-the-fly data consultationo Test results can be consulted during executiono Plots and numerical informationo EXCEL export
Off-line processing using BARNIEo Datalogs can be stored in the BARNIE test data analysis
suiteo Characterization curveso Fail trendso Parametric trendso Fail density and weibull diagrams
Integration with Data AnalysisTest result generation
o Bitmaps and detailed test results can be sent on-line via TCP-IP to a data analysis tools
o XML-based datalogo STDF datalog (future)
BARNIE test data analysis suiteo Bitmap view and processingo BIST result post-processingo Datalog load and analysis
NplusT
would like to thank youfor your time and
consideration
for further information: [email protected]
