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The iNEMI Roadmap

Bob Pfahl, Vice President of Operations

2006 ITRS Public Conference

July 12, 2006; San Francisco

1

Topics To Be DiscussedTopics To Be Discussed

• The iNEMI Process

– iNEMI Mission

– Roadmap Methodology

– iNEMI Outputs

• Relationship to ITRS

– Organization and Structure

• The iNEMI Roadmaps

– 2004 Roadmap Demographics, Size, Results

– 2007 Roadmap Structure, Partners

– The 2007 Roadmap Schedule

• Conclusions from the 2004 Roadmap/2005 Research Priorities

• Concluding Thoughts

2

Mission StatementMission Statement

iNEMI mission is dedicated to providing

leadership for the global electronics

manufacturing supply chain for the

benefit of its member companies and

the industry.

3

Product

Needs

Technology

Evolution

GAP

AnalysisResearch

iNEMI

Projects

iNEMI Methodology & OutputsiNEMI Methodology & Outputs

Competitive

Solutions

Roadmap

TechnicalTechnical

PlanPlan

Academia

Government

No Work

Required

Available

to Market

Place

Disruptive

Technology

RoadmapsRoadmaps

ResearchResearch

PrioritiesPriorities

TechnicalTechnical

ProjectsProjects

4

ITRS and iNEMIITRS and iNEMI

• Advances in Semiconductor Technology continue to

enable exciting new products for the Electronics

Industry.

• International Technology Roadmap for Semiconductors

(ITRS) is the world-wide authority for the Semiconductor

Industry.

• iNEMI has a close working relationship with ITRS to

ensure that our Systems view of the industry has the

appropriate input for:

– Semiconductor Technology

– Packaging Technology

• In return, iNEMI PEGs provide systems input for ITRS.

5

ITRS Design TWG/iNEMI ITRS-iNEMI Domain SpaceITRS Design TWG/iNEMI ITRS-iNEMI Domain Space

Chip level System level

Tech

requirements

Market

requirements

iNEMI

(Emulators)

ITRS

(Drivers)

6

Market Input SRC

Sematech

ITRS IRC

ITRS TWGs

Organization Organization

TechnologyTechnologyRoadmappingRoadmapping

19 IndustryTWGs

ImplementationImplementation

8 iNEMITIGs

iNEMI StaffiNEMI Staff

Secretary to BoDCommunications

Membership DevelopmentTechnical Facilitation

iNEMI BoardiNEMI Boardof Directorsof Directors

Elected by iNEMI CouncilRepresentativesEMS Directors OEM Directors

Supplier DirectorsStrategic Objectives

Operational Responsibility

SubstratesTIG

MedicalElectronics

TIG

EnvironmentallyConsciousElectronics

TIG

Board AssemblyTIG

Product Life CycleInformation

ManagementTIG

TechnologyWorkingGroup

TechnologyWorkingGroup

TechnologyWorkingGroup

TechnologyWorkingGroup

Research CommitteeResearch Committee

EMS, OEM, Supplier &Academia/Government

Representatives

Technical CommitteeTechnical Committee

EMS, OEM, Supplier &Academia/Government

Representatives

ProductEmulator

Group

ProductEmulator

Group

• • •

Product NeedProduct NeedRoadmappingRoadmapping

5 IndustryPEGs

System in Package

TIG

Heat Transfer

Technology

TIG

OptoelectronicsTIG

(TechnologyIntegration Group)

7

iNEMI Roadmap Emulator ChaptersiNEMI Roadmap Emulator Chapters

• 2007 Roadmap cycle will include 5 Product

Emulator Chapters

• A product emulator is defined as an abstract

representation of a product to allow

companies to share needs without sharing

proprietary product information

• Each chapter sets OEM requirements over the

next 10 years

• Requirements are presented as key product

attributes in spreadsheet format (ORTC

equivalent) and supporting text discussing

business and state of the art issues

8

2007 Product Emulator Groups2007 Product Emulator Groups (PEGs)(PEGs)

Emulators Characteristics

Portable / Consumer High volume Consumer Products for which cost is the

primary driver including Hand held, battery -powered

products driven by size and weight reduction

Office / Large Business / Communications Systems

Products which seek maximum performance from a few

thousand dollar cost limit to literally no cost limit

Medical Products Products which must operate within a high ly reliab le

environment

Automotive Products which must operate in an automotive

environment

Defense and Aerospace Products which must operate in extreme environments

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Roadmap DevelopmentRoadmap Development

PEGsTWGs

Po

rtab

le/C

on

su

mer

Off

ice/L

arg

e B

usin

ess/C

om

m.

Med

ical

Au

tom

oti

ve

Defe

nse a

nd

Aero

sp

ace

Semiconductor Technology

Design Technologies

Manufacturing Technologies

Comp./Subsyst. Technologies

Modeling, Thermal, etc.

Board Assy, Test, etc.

Packaging, Substrates, Displays, etc.

Product Sector Needs Vs. Technology Evolution

Business Processes

Prod Lifecycle Information Mgmt.

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Potential mapping approachPotential mapping approach

between iNEMI and ITRS roadmapsbetween iNEMI and ITRS roadmaps

MPU DSPAMS Memory

Network PortableOffice

SIP/SOC

(iNEMI/ITRS)

Applications/Emulators

(iNEMI)

Chips /Fabrics

(ITRS)

Medical Automotive Defense

Device ArchitecturesA1A2A3A4

Source: ITRS Design TWG

SIP/SOC

Market/Technical/Legislative Drivers

Market Architectures

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ITRS Design TWG/iNEMI PEG MatrixITRS Design TWG/iNEMI PEG Matrix

Network PortableOfficeMedical Automotive Defense [Industrial]

MPU

PE(DSP)

AMS

Memory

Fabrics

Markets

2005

CPHP

Siz

e/w

eig

ht

ratio

, b

att

ery

life

…

Po

we

r, in

terc

on

ne

ct

sp

ee

d…

12

More than MooreMore than Moore

More than Moore: Diversification

Mo

re M

oo

re:

Min

iatu

riza

tio

n

Combining SoC and SiP: Higher Value System

s

Ba

se

lin

e C

MO

S:

CP

U,

Me

mo

ry,

Lo

gic

BiochipsSensors

Actuators

HV

PowerAnalog/RF Passives

130nm

90nm

65nm

45nm

32nm

22nm...V

Information

Processing

Digital content

System-on-chip

(SoC)

Interacting with people

and environment

Non-digital content

System-in-package

(SiP)

Beyond CMOS

More than Moore: Diversification

Mo

re M

oo

re:

Min

iatu

riza

tio

nM

ore

Mo

ore

: M

inia

turi

za

tio

n

Combining SoC and SiP: Higher Value System

s

Ba

se

lin

e C

MO

S:

CP

U,

Me

mo

ry,

Lo

gic

BiochipsSensors

Actuators

HV

PowerAnalog/RF Passives

130nm

90nm

65nm

45nm

32nm

22nm...V

130nm

90nm

65nm

45nm

32nm

22nm...V

Information

Processing

Digital content

System-on-chip

(SoC)

Interacting with people

and environment

Non-digital content

System-in-package

(SiP)

Beyond CMOS

13

The iNEMI Roadmaps

14

Statistics for the 2004 RoadmapStatistics for the 2004 Roadmap

• > 470 Participants

• > 220 Companies/organizations

• 11 Countries from 3 Continents

• 19 Technology Working Groups

(TWGs) (added Sensors)

• 7 Product Emulator Groups (PEGs)

• Over 1200 Pages of Information

• Roadmaps the needs for 2005-2015

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iNEMI MethodologyiNEMI Methodology

iNEMI Manufacturing System Plan

Product Sector Requirements

International Electronic ManufacturingRoadmap

iNEMI Gap Analysis

iNEMI Technical Plan

iNEMI Projects

RoadmappingRoadmapping

Technical PlanningTechnical Planning

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iNEMI Manufacturing Systems Plan determinesiNEMI Manufacturing Systems Plan determines

Technology Working Groups (TWGs)Technology Working Groups (TWGs)

Organic SubstratesBoard

Assembly Customer

RF Components &

Subsystems

OptoelectronicsOrganic & Printed Electronics

Energy Storage Systems

Modeling, Simulation,

and Design

PackagingSemiconductor

Technology

Final

Assembly

Mass Storage (Magnetic & Optical)

Passive Components

Product Lifecycle

Information

Management (PLIM)

Test, Inspection &

Measurement

Environmentally

Conscious

Electronics

Ceramic

Substrates

Thermal

Management

Connectors

Sensors

Red=Business Green=Engineering Blue=Manufacturing Blue=Component & Subsystem

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iNEMI

Optoelectronics

TWG

Optoelectronics and

Optical Storage

Interconnect

Substrates—Ceramic

Interconnect

Substrates—Organic

Magnetic and

Optical Storage

Supply Chain

Management

Semiconductors

iNEMI Roadmap

iNEMI

Product

Lifecycle

Information

Management

TWG

iNEMI

Mass Data

Storage TWG

iNEMI /

IPC/JIEP

Interconnect

TWG

iNEMI / ITRS

Packaging

TWG

iNEMI

Board Assy

TWG

9 Contributing Organizations9 Contributing Organizations

18 RecommendationsRecommendations

RoadmappingRoadmapping

BenchmarkingBenchmarking

Format for TWG ChaptersFormat for TWG Chapters

• Executive Summary (half page)

• Introduction

• Situation (Infrastructure) Analysis

– Manufacturing Equipment

– Manufacturing Processes

– Materials

– Quality/Reliability

– Environmental Technology

– Test, Inspection, Measurement (TIM)

• Roadmap of Quantified Key Attribute Needs

• Critical (Infrastructure) Issues

• Technology Needs:

– Prioritized Research, Development

– Implementation

• Gaps and Showstoppers

• Recommendations on Potential Alternative Technologies

• Contributors

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Key Parameter Tables (Each Emulator)Key Parameter Tables (Each Emulator)

• Equivalent to ORTC

• Provided in tabular form for the 10 year roadmap period

• At least one metrics from each TWG

• Metrics include performance, size, cost, and cycle time

• Key changes from previous roadmap are identified, often

indicate a paradigm shift.

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2007 Roadmap Priorities 2007 Roadmap Priorities

• Change Name to Better Reflect Year of Release.

• Maintain strong linkages with other roadmaps.

• Maintain emphasis on disruptive events (business &

technical).

• Maintain emphasis on identifying market needs and

business situations.

• Increase quantification of needs.

• Prioritize Research and Deployment needs.

• Increase strategic vision of the roadmap: 2011-2017

• Improve and expand sensors chapter

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2007 Two Year Roadmap Cycle2007 Two Year Roadmap Cycle

• 3Q 2005: Select Product Sector Champions and refine data charts

• 3-4Q 2005: Product Sector Champions Develop Emulators

• Organizing Teleconference with TWG Chairs 1/11/2006

• February 2006 PEG Workshop/TWG Kick-off at APEX Meeting in Anaheim:

– Product Sector Tables Complete – Chapters Written

– Cross cut issues addressed

• 2Q2006: International Public Workshop Reviews

– April - Roadmap Workshop Europe in Munich, Germany

– May - Roadmap Workshop in Herndon, VA

– June - Roadmap Workshop in Shanghai, China

• July 2006 – TWG Drafts Due for TC Review

• September 2006 – Council Review of Key Issues and Summary

• December 2006– Release to iNEMI Members

• February 2007 – Industry Release at APEX

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Conclusions from the2004 Roadmap/2005Research Priorities

23

2005 Research Priorities2005 Research Priorities

Research

Priorities

• Gap analysis completed

• 10 year priorities created

• Available on the web

• Contents:

– Technology Research Needs byProduct Sector

– Priorities Summarized byResearch Area• Manufacturing Processes

• System Integration

• Materials & Reliability

• Energy and the Environment

• Design

– Significant Gaps and Issuesfrom Roadmap

– Options for Innovation

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• Active Device Technology

• Thermal Management

• Communications Bandwidth

• Next Generation Packaging Technology

• Design and Simulation Tools

• Sustainability Metrics

Six Identified Strategic GapsSix Identified Strategic Gaps

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Active Device TechnologyActive Device Technology

• Implementation of advanced, non-classical CMOS devices withenhanced drive current

• Identification, selection, and implementation of advanced devices(beyond-CMOS)

• Device technology drives the following three strategic systemgaps:

– Thermal Management

– Communications Bandwidth

– Next Generation Packaging Technology

Multi-wall carbon nanotubes (NanoDynamics Inc.)

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Thermal ManagementThermal Management

• Increased need for improved cooling

• Improved materials and design concepts

• Focus is on local hot spots

• Must design from device to system level.

BN coated with Al203 (ALD Nanosolutions Inc)

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Communications BandwidthCommunications Bandwidth

• Copper?

• RF?

• Optical?

• Where?

• When?

• How Fast?

• At what cost?

Will the 2007 roadmap provide guidance?

28

Next Generation Packaging TechnologyNext Generation Packaging Technology

Source: Professor Dr. Reichl, Fraunhofer IZM, Berlin Germany

Innovative Miniaturized Packaging

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Design and Simulation ToolsDesign and Simulation Tools

Design & simulation tools are main roadblocks to more

rapid introduction of new technologies:

– Multi-physics design (co-design)

• Electrical

• Mechanical & reliability modeling

• Thermal & thermo-fluid simulation

– Multilevel Simulation

– Harsh Environment Simulation

– Nanoscale material behavior

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Sustainability MetricsSustainability Metrics

• Development & implementation of scientificmethodologies:

– Assess true environmental impacts of materials

– Potential trade-offs for alternatives

• Focus on system energy reduction at thebeginning of the design process

• Develop a common, straightforwarddefinition of sustainability

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Conclusion

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Increasing Coordination between ITRS &Increasing Coordination between ITRS &

iNEMI for 2007 ITRS RoadmapiNEMI for 2007 ITRS Roadmap

Working

together

Juan-

Antonio

Carballo

Design and

System Drivers

Product Emulator

Groups

Start DialogueMargaret

Huang

RF &A/MSEric StridRF Components

Same TWGBill BottomsAssembly &

Packaging

Joe AdamPackaging

Mike

Rodgers

Test & Test

Equipment

Michael

Reagin

Test, Inspection, and

Measurement

Increase

Dialogue

Jim JewettES&HMark NewtonECE

Start DialogueJürgen

Lorenz

Modeling &

Simulation

Sanjeev SatheModeling, Simulation,

and Design Tools

Mani

Janakiram

Factory

Integration

Eric SimmonPLIM

Currently

Coordinated

Paolo

Gargini

IRCAlan AllanSilicon Technology

Recommended

Action

ChairITRS TWGChairiNEMI TWG

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Summary of iNEMI RoadmapSummary of iNEMI Roadmap

– Broad global industry participation

– Global acceptance as the source that provides a

system view of electronics manufacturing

– Coordinated with other major organizations: ITRS, IPC,

JIEP, OIDA, NSIC, Supply Chain Council, SMTA, IMAPS, CPMT

– Has accurately predicted needs for a number of

disruptive technologies: Area Interconnect, Microvia PWB,

Pb-Free solders

– Evolving to address changing markets and priorities:Convergence of Products and Markets, Supply Chain

Management, Environmentally Conscious Electronics,

Distributed Manufacturing Model, System in Package, Medical

Systems

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www.inemi.orgwww.inemi.orgEmail contacts:Email contacts:

Bob PfahlBob Pfahl

bob.pfahl@inemi.orgbob.pfahl@inemi.org

Chuck RichardsonChuck Richardson

chuck.richardson@inemi.orgchuck.richardson@inemi.org