iNEMI Meetings at OFC 2015 Conference iNEMI Optoelectronic...

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iNEMI Meetings at OFC 2015 Conference iNEMI Optoelectronic TIG and Project Meetings Monday, March 23, 2015 10:00 am 5:15 pm PDT Los Angeles Convention Center

Transcript of iNEMI Meetings at OFC 2015 Conference iNEMI Optoelectronic...

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iNEMI Meetings at OFC 2015

Conference iNEMI

Optoelectronic TIG and Project Meetings

Monday, March 23, 2015

10:00 am – 5:15 pm PDT

Los Angeles Convention Center

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March 23, 2015

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Agenda

• 10:00 – 10.15 am Introductions and INEMI Overview: David Godlewski, iNEMI

• 10:15 – 10.40 am Development of cleanliness specification for expanded beam connectors project, Tatiana Berdinskikh, Celestica International Inc. and Tom Mitcheltree, USConec

• 10:40 – 11:05 am Optical modeling for contamination effects for transceivers using ZEMAX, Christine Chen, Avago Technologies

• 11:05 – 11:30 am The effect of dust on lensed and non-lensed connectors, Michael Kadar-Kallen, TE Connectivity

• 11.30 – 12.00 pm PSMC history and status, Bob Pfahl, iNEMI

• 12:00 – 1:00 pm Break

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Agenda

• 1:00 – 1.15 pm Introduction to IEC 86B Task Force Group on Scratch

Recognition,Tatiana Berdinskikh, Celestica International

Inc, and Jamie Chivers, DORC

• 1:15 – 1.30 pm Why is scratch analysis is so difficult, Jamie

Chivers, DORC

• 1.30 – 1.45 pm Effects of Video Noise on Defect Detection

Repeatability, Doug Wilson, Fiber QA

• 1.45- 2.00 pm Experiment of Measure Effect of Image Focus

on Defect Detection and Measurement, Doug

Wilson, Fiber QA

• 2.00 – 2.30 pm Fiber endface automated inspection: some

proposals, Vitalina Rudyk, Sumix

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Agenda

• 2:30- 2:45 pm Scratch vs RL, Matt Brown, JDSU

• 2.45 – 3:00 pm Break

• 3.00 – 3:30 pm Crosstalk Performance of MTP/MPO Connectors for High Power Applications, Toshiaki Satake, USConec

• 3: 30- 4:00 pm Proposal to Standardize Evaluation and Criteria for “Contamination-Repellant” by Connector Insertion/Extraction, Satoshi Kaneyuki and Sho Kondo, TOTO

• 4:00 – 4:15 pm Update on Visual Inspection Requirement and Artifact, Dr. Yu Lu, Ton Bolhaar, Mike Gurreri, Broadband Network Solutions

• 4:15 – 5:00 pm Opto Electronics Gaps analysis working session

• 5:00 – 5:15 pm Wrap up/Summary

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iNEMI Overview

March 2015

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Material Enclosed

iNEMI Overview

Membership

Technology Roadmap

Collaborative Initiatives & Projects

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About iNEMI

International Electronics Manufacturing Initiative (iNEMI) is an industry-led

consortium of over 100 global manufacturers, suppliers, industry

associations, government agencies and universities. A Non Profit Fully

Funded by Member Dues; All Funding is Returned to the Members in High

Value Programs and Services; In Operation Since 1994.

Visit us at www.inemi.org

5 Key Deliverables:

• Technology Roadmaps

• Collaborative Deployment

Projects

• Research Priorities Documents

• Proactive Forums

• Position Papers

Mission: Forecast and Accelerate improvements in the Electronics

Manufacturing Industry for a Sustainable Future.

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Global Operations

• iNEMI is headquartered in Herndon, Virginia, USA.

• Opened an office in Shanghai and added a team member in Europe in 2007.

• Dr. Haley Fu is leading operations in Asia, based in Shanghai, China.

• Grace O’Malley is representing iNEMI in Europe from her base in Ireland.

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Product

Needs

Technology

Evolution

GAP Analysis

Technology Plan

Research

Priorities

Research

Projects

Methodology

Competitive

Solutions

Roadmap

Industry Solution

Needed

Academia

Government

iNEMI

Members

Collaborate

No Work

Required

Available

to Market

Place

Global

Industry

Participation Disruptive

Technology

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iNEMI Methodology

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Technology Roadmap Process

ID key market trends & Evolution

Potential disruptive technologies

Looking 10 years into the future

Critical Analysis of Roadmap

Extract key gaps and challenges

Both Short & Long Term

Further Refine Opportunities

Use technology working groups

Use organized workshops

To ID collaborative projects

Organize & Direct Projects

Teams formed to clearly identify scope/deliverables

Call for member participation

Manage collaborative R&D process

Ensure delivered results

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Membership

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International Member Growth

Across The Total Supply Chain (Q1 2013)

Total Global Supply Chain Integration

70% Growth in past 3 years

The International Membership Incorporated Location; Number of Members

INEMI Member Business TypeNorth

AmericaAsia

RegionEurope Totals

OEM 14 3 2 19

ODM/EMS (inc. pkg. & test services) 5 6 1 11

Suppliers (materials, software, services) 9 18 12 39

Equipment 8 0 2 10

Universities & Research Institutes 8 3 2 13

Organizations 11 1 2 14

Totals 55 31 21 107

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Areas of “Critical Mass”

Laminate/Substrate Suppliers

Samsung Electro Mechanics Doosan

Endicott Interconnect Tech. Multejk

Shengyi Sci. Tech AT&S

Elec & Eltek Nanya

Ibiden ITEQ

NGK/NTK Dyconex

Research Institutions

SUNY Binghamton CALCE

Georgia Tech IMEC

UC Berkeley NIST

Fraunhofer ASU

Griffith U ITRI

Peking U MIT

CEA/Leti Aalto U

RIT Purdue

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Equipment Firms

Micronic/Mydata Universal

Assembleon Teradyne

Hover Davis Nordson

PVI Systems Agilent

Akrometrix Corelis

Speedline Acutronic

OEMs & Semiconductors

Alcatel Lucent MSEI

Microsoft BSCI

Cochlear Intel

Juniper Dell

Lenovo IBM

Med El Blackberry

Delphi HP

Cisco TI

Infineon Emerson

Hillcrest Labs Agilent

Chemicals, Adhesives, Metals

Hitachi Chem Nippon

NAMICS Henkel

Inventec Indium

Heraeus Dow

ODM / EMS Firms

Sanmina SCI Wistron

Flextronics Plexus

Celestica IEC

Valtronic

Packaging Firms

STATS ChipPAC

ASE Group

Amkor

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Direct Roadmap Development

iNEMI Organization; How Work Gets Done

Research Committee

Stimulate research to address gaps identified by

iNEMI roadmaps

Technical Committee

Develop & integrate

technology strategies & plans

Drive/coordinate all technical

activities

Board of DirectorsSet strategic objectives &

priorities

Ensure financial ethics &

responsibility

Product Needs

6 Product Emulator Groups

Technology Needs

21 Technology Working Groups

Focus AreaSteering Committees

Drive progress on key

priorities

Ensure membership support

Direct Collaborative R&D

RegionalSteering Committees

Help ensure that iNEMI

addresses member needs in

Europe & Asia

The Technical Plan & Gaps are Defined By:

8 Technology Integration Groups

Gap Analysis

Workshop Identified Gaps

Member Identified Needs

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Unique Attributes of iNEMI

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10 year Technology | Business Roadmap

Delivered every two years like clockwork

Unique Gap Analysis

Technical/Business Evolution Details

Proven Collaborative R&D Methodology

Time tested over 19 years

20-25 active collaborative R&D projects

Strong Global Membership

Depth and Breadth of Supply Chain Leaders

Strong set of Universities & Research Institutes

Ability to Execute

Integrated supply chain approach

Solving complex manufacturing issues

Drive widespread adoption and impact

iNEMI Reputation

Track record of sustainability leadership

In demand for knowledge/science input

Results oriented workshops

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Why Organizations Participate

Collaborate & Leverage Precious R&D Resources

Engage with key supplier, customer, and competitor experts

Using a proven methodology and expert project managers

Business Opportunity

Develop relationships with supplier and customer experts

• Leading to more business success down the road

Better anticipation of technology trends and inflexion points

Networking in the Industry

Learning from knowledge experts within the iNEMI membership

Access to In Depth Reports and Studies

Detailed project data and analysis for members only

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Membership Rights – Data & Events

• Any staff of your company world wide can create account at iNEMI web site and access member only information

• Monthly iNEMI member newsletter

• Free access to:

– iNEMI Technology Roadmap ($3,000 per copy for non-members)

– Member only Technical Plan

– iNEMI Project Completion Webinars

– Project Reports and Publications

• Can join any project by agreement to the project statement (PS) and SOW

• Can raise project ideas or proposals to meet your needs

• Free or discounted fee for participating in iNEMI workshops and forums

• Pick and choose the Technical Groups of your interest

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New Type of iNEMI Project

Quick Turn

• First iNEMI Quick Project - Development of cleanliness

specification for expanded beam connectors project

• Must be completed in less than a year

• Non-Members can join for $5,000

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The Industries Broadest

Technology Roadmap

Chuck Richardson, iNEMI

Director of Roadmapping

Provide Update at 4:00 pm

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Collaborative Projects

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21Jim Arnold02/27/2012 Slide 21

iNEMI

ODM / EMS

Equipment

Suppliers

Device &

Material

Suppliers

Misc Org &

Consulting

OEM

Academic

& Research

Institutes

LEVERAGING BROAD INDUSTRY EXPERTISETO FORECAST AND ACCELERATE IMPROVEMENTS IN THE

ELECTRONICS MANUFACTURING INDUSTRY FOR A SUSTAINABLE

FUTURE

Test, Inspection

& Measurement

Environmental

Sustainable

Electronics

Final Assembly

Board Assembly

Semiconductor

Technology

Semiconductor

TechnologyPassive

Components

Packaging &

Component

Substrates

Optoelectronics

MEMs / SensorsInterconnect

PCB - Organic

Interconnect

Substrates -

Ceramic

Electronic

Connectors

Thermal

Management

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• Cost Reduction by leveraging resources – Typically in the 8X to

20x range on key projects and thrusts:

– Reduce resource demands and $ investments for each

company.

– Ensure technology readiness when required.

– Projects can result in cost reduction (ex. Copper wire bonding).

– Access to thought leaders and senior problem solvers from

across the supply chain.

• Reduce risk of technology introduction

– Reliability – Hard to measure the negative impact of poor

reliability, but can be disastrous.

– Source of supply – Also hard to apply general cost impact

numbers to being late to market – Can also be huge.

• Create globally aligned specifications and methods – pre

competitive level playing field reduces cost

Motivation to Participate in Collaborative Projects

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Project Status

10 Ongoing projects since start 2015

8 scheduled to finish in 2015

4 projects planning second phase in 2015/2016

4 Projects planned to start in Q1

13 more initiatives from the end of year survey being

investigated

Goal to start 8-10 new projects in 2015

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10 New or Continuing ProjectsProject Name TIG Chair Name Member -

Company Name

Est Start Date Actual End Date

Alternative Materials Assessment

Project

Environmental Leo Kenny Intel 01-07-2014 07-20-2015

Automotive Electronic Material

Challenges

Other Anitha Sinkfield Delphi 01-13-2015 02-03-2016

Characterization of Pb-Free Alloy

Alternatives

Board

Assembly

Richard Coyle Alcatel-Lucent 08-01-2013 12-31-2014

Connector High Speed Signaling

Metrology Program: Phase 1

Board

Assembly

Zhichao Zhang Intel 07-24-2014 10-29-2015

Development of Cleanliness

Specification for Expanded Beam

Optoelectronics Tatiana Berdinskikh Celestica 01-19-2015 04-25-2016

Impact of Low CTE Mold

Compound on 2nd Level Solder

Joint Reliability - phase 1

Board

Assembly

Bart Vandevelde imec 07-01-2014 08-01-2015

Metals Recycling Environmental Adam Wheeler Lenovo 01-28-2014 06-02-2015

Quantifying Recycling and Repair

Metrics

Environmental Lisa Dender IBM 11-06-2013 06-02-2015

Ultra Low Loss Laminate/PCB for

High Reliability & Performance

Organic PCB Gary Long Intel 06-18-2014 06-18-2015

Warpage Characteristics of

Organic Packages

Packaging Wei Keat Loh Intel 03-01-2012 01-28-2015

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Initiatives

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Results of Initiative Survey

• Survey conducted online in Dec and January

– Members and non members

– 195 respondents

• 23 potential project areas

– Selected from areas identified in technical plan, member

suggestions and output of workshops

• 13 selected for further investigation

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2015 Initiatives

1•Define the product detailed requirements and the process material and equipment needed to enable

2/2 then 1/1 micron line & spacing")MT

2 •Define and execute a study to characterize and quantify the reliability of Copper Micro Bumps MT/ HF

3•Characterize and quantify the reliability performance of Ag alloy bonding wires for high reliability

(example automotive) applicationsMT

4 •Improve warpage qualification framework to ensure SMT yield results at 2nd level interconnect. HF

5•Define material specifications for high power and high density PCB's needed to support under-the-

hood automotive applicationsBB/SP/GO

6 •Develop recommendations of best practices to deliver high yield soldering of QFN-type packages MT

Final Assembly 7 •Develop best automation and design practices for final assembly to optimize cost & quality BG

8•Develop optimized design rules/DFM/DFT & test methodologies to support HDI technology ( <0.3mm

pitch )DG

9•Characterize and quantify the inspection capability of the AXI on HoP (head on pillow) and HiP (Head

in Pillow) defectsDG

10•Develop a industry aligned test and measurement method for peel strength of bendable and wearable

devices.GO/ BB

11•Define a test vehicle for evaluation of specific component packaging technology options for advanced

miniaturization of high reliability medical applicationsDG/GO

MEMS 12•Develop detailed and optimized reliability testing requirements for prioritized and high market impact

MEMS devicesBB

Environment 13•Develop clear business models for key supply chain nodes on the incorporation of Eco Design for high

impact product types and marketsMS

Medical

Package

Board Assembly

Test

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Annual Participation Fees

Participating Members (For Profit)

Corporate Sales (USD) Membership Dues

$0-5M $5,000

$5-10M $10,000

$10-100M $15,000

$100M-1B $25,000

$1-10B $40,000

$10-15B $55,000

$15B+ $75,000

Affiliate Members (Not-For-Profit)

Category Membership Dues

University $5,000

RI/Org./Gov. Lab/R&D

Center $10,000