“Call for Prioritization

& Participation” In MEMS

iNEMI Initiatives

Oct 26, 2011

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Agenda

• Objectives from this Webinar

• iNEMI Overview (for non workshop attendees)

• Seven Potential MEMS Collaboration Initiatives

• Requested focus and deliverables in Research

• Process and timeline to be involved moving

forward

• Request for action

• Q&A

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International Electronics Manufacturing Initiative (iNEMI) is an industry-led consortium of over 92 global manufacturers,

suppliers, industry associations, government agencies and research institutes/universities. Working on advancing

manufacturing technology since 1994.

Introduction to iNEMI

5 Key Deliverables:

• Technology Roadmaps

• Collaborative Deployment

Projects

• Research Priorities

• Proactive Forums

• Position Papers

4 Major Focuses:

• Environment

• Miniaturization

• Medical Electronics

• Alternative Energy

Mission: Forecast and Accelerate improvements in the Electronics

Manufacturing Industry for a Sustainable Future.

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Leadership through Innovative Projects

• iNEMI uses a proven approach for technology road mapping that identifies gaps in the industry; and then delivers a technical plan and research priorities

• iNEMI is currently focused in four key areas:

• Miniaturization, Environment, Medical Electronics and Alternative Energy

• iNEMI has a strong track record of developing supply chains to introduce new materials, processes, and technologies into production.

• Examples: HDI (high density interconnect); Pb-Free; BFR-Free

• iNEMI has currently 22 active collaborative R&D projects plus 25 proposed initiatives in process

• They address some key gaps in areas such as Miniaturization, the Environment, Manufacturing and Test capabilities, Optoelectronics, and Medical

• Projects typically have 10-20 member companies/institutions participating

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Motivation for Participating in Collaborative

Projects

• Large Cost savings by leveraging resources – Typically in the 8X to

20x range on key projects and focus areas

– Reduce resource demands and $ investments for each

company.

– Ensure technology or business issues are resolved when

required.

– Projects can result in cost reduction (ex. Copper wire bonding).

• Reduce risk of technology; design, manufacturing, supply, process

– Reliability – Hard to measure the negative impact of poor

reliability, but can be disastrous.

– Source of supply – Also hard to apply general cost impact

numbers to being late to market – Can also be huge.

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Current Members with MEMS Interests

MEMS

Increase value through

collaboration

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Background & Current Situation Analysis

• iNEMI has been road mapping semiconductors and packaging for

nine roadmap iterations.

• In the 2011 RM MEMS was added as a focused technology chapter.

• Three of our product emulator groups highlighted MEMS as a rapidly

growing technology in their product lines

– Automotive

– Medical

– Portable/Consumer

• Each of these segments have very different needs and challenges.

• We believe it is time to expand the collaborative agenda for MEMS

• iNEMI held a workshop on MEMS at the EMPC Conference in

Brighton England on Sept 16th and 17th

Brief Roadmap Highlights

Michael Gaitan

NIST

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Automotive MEMS; Growing Rapidly

Key Challenges are Long Life & Extreme Thermal

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MEMS Roadmap Identified Current Needs

• Development of a detailed understanding of the basic material

failure mechanisms.

• Generic reliability test standards for all MEMS.

– Stiction, thermally induced deformation, fatigue, creep, fracture

• 8" wafer manufacturing capability to meet the projected

growth

• Procedures for testing the long term hermeticity and out-

gassing behavior of packages

• Low Cost Functional Testing

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Potential Solutions

Difficult Challenges Potential Solutions

Integration of MEMS in the Package • Standardization for MEMS packaging to support integration.

• Packages are needed that reduce or eliminate mechanical stress and enhancing hermeticity.

• Package data that can be used to accurately predict the effect of the package on device performance.

Testing of MEMS • More testing towards the wafer level. • Validated tools to predict device performance

from wafer tests. • Methodologies for “Design for Test” or

“Design for NO Test.”

Validated accelerated life testing for MEMS

• More knowledge of the physics of failure is required to develop accelerated life tests.

• Need to share information. Individual solutions exist but are not being generalized across the industry.

MEMS Workshop in Brighton

England

Sept 2011

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Workshop Participants

Key Representatives from the Following:

ASE Bosch

CEA/LETI Coventor

CSR European Space Agency

Fraunhofer IZM

IQE Silicon Ltd

IMEC iNEMI

NGK SparkPlugs Co Ltd ON Semiconductor

SPTS STMicroelectronics

Tronics VTT Technical Research

Finland

Yole Development

Workshop Identified Collaboration Needs Not in Priority Order

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Key Problems and Opportunities

1.) Definition of the methodology for the development and

implementation of a highly integrated package with multiple

MEMS devices and a high performance ASIC. Includes:

– Identification of the key barriers to success and how to address

them

– Clarify the material flows and handling requirements

– How IP will be managed

– Change Control and Management

– Systems level calibration must also be owned and managed by

the product specified

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Key Problems and Opportunities

2.) Understand and guide the industry movement towards high

volume MEMS Modules (Design, Manufacturing, Materials,

Interface Specifications) that can then be used widely by

many different system integrators.

- And…..standard modules must be updated frequently

and stay up to date with industry technology

advancements

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Key Problems and Opportunities

3.) Develop generic reliability testing standards/methods for

integrated MEMS devices that enable spec conformance and

effectively propagate key device failure mechanisms

– First step would be to do an analysis of existing MEMS reliability

testing methods that are in place, standards in existence, and

standards in the work

• Create a baseline of existing capability and gaps

– Second step or phase would be to attack gaps with appropriate

study and research that ultimately deliver best known reliability

test suites for market specific MEMS segments

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Key Problems and Opportunities

4.) Definition of the market specific reliability requirements for

testing of medical MEMS

– Note that the existing iNEMI Team working Medical product

reliability test methodology could add MEMS as a category to be

defined/developed.

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Key Problem and Opportunity

5) Identify MEMS aspects of manufacturing that could benefit

from common approach in test methods. This could include

developing the following:

– Industry Standard Test vehicles for device qualification

– Common Material properties Characterization method

• Stress mitigation etc

– Simulation Tools

– Standard Test Methods

– E.g. Wafer level test Methods

• Need for both electrical and mechanical

• Need after dicing testing

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Key Problem and Opportunity

6) Identify opportunities for development of more effective in-

line testing capabilities:

– In process monitoring

• Etch depth monitoring

– Testing leakage after capping

• What standard tests are used

• What is needed

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Key Problem and Opportunity

7) Potential for development of Collaborative Design for

Manufacturability Rules and Guidelines

– That accommodate best in class equipment capabilities including

blind etch

– And detailed tool learning to incorporate in line process test

capabilities to calibrate and refine equipment set up and assure

product specs are in control

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Key Area of MEMS Research

• Do the in-depth research on new materials and technologies

to efficiently initiate the transduction of electro mechanical

devices.

– Today's technologies require high (30 VDC) voltages with slow

turn on times.

– Fast response low voltage stimulation is needed

Moving Forward

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Please take the following iNEMI Survey and identify which initiatives your

company or institution would like to participate in

http://www.surveymonkey.com/s/MEMS_Interest_Survey

Be clear to indicate which initiatives you or your organization would be

willing to co-chair.

Leadership sets direction and drives aggressive prioritized goals that deliver

BUSINESS IMPACT

iNEMI will provide project management support

Respond to the survey within 10 days!

Complete no later than November 4th

The survey results will be reviewed and meetings for initiatives with 5

or more participating organizations will be scheduled

First meetings to be called by December 6th

Reminder: To participate and/or be a chair at the initiative stage, your

organization does not need to be an iNEMI Member.

The MEMS Initiatives

A Call to Action & NEXT Steps

www.inemi.org Email contacts:

Bill Bader

bill.bader@inemi.org

Bob Pfahl

bob.pfahl@inemi.org

Grace O’Malley - Europe

gomalley@inemi.org

Haley Fu - Asia

haley.fu@inemi.org