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Agenda
• Objectives from this Webinar
• iNEMI Overview (for non workshop attendees)
• Seven Potential MEMS Collaboration Initiatives
• Requested focus and deliverables in Research
• Process and timeline to be involved moving
forward
• Request for action
• Q&A
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International Electronics Manufacturing Initiative (iNEMI) is an industry-led consortium of over 92 global manufacturers,
suppliers, industry associations, government agencies and research institutes/universities. Working on advancing
manufacturing technology since 1994.
Introduction to iNEMI
5 Key Deliverables:
• Technology Roadmaps
• Collaborative Deployment
Projects
• Research Priorities
• Proactive Forums
• Position Papers
4 Major Focuses:
• Environment
• Miniaturization
• Medical Electronics
• Alternative Energy
Mission: Forecast and Accelerate improvements in the Electronics
Manufacturing Industry for a Sustainable Future.
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Leadership through Innovative Projects
• iNEMI uses a proven approach for technology road mapping that identifies gaps in the industry; and then delivers a technical plan and research priorities
• iNEMI is currently focused in four key areas:
• Miniaturization, Environment, Medical Electronics and Alternative Energy
• iNEMI has a strong track record of developing supply chains to introduce new materials, processes, and technologies into production.
• Examples: HDI (high density interconnect); Pb-Free; BFR-Free
• iNEMI has currently 22 active collaborative R&D projects plus 25 proposed initiatives in process
• They address some key gaps in areas such as Miniaturization, the Environment, Manufacturing and Test capabilities, Optoelectronics, and Medical
• Projects typically have 10-20 member companies/institutions participating
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Motivation for Participating in Collaborative
Projects
• Large Cost savings by leveraging resources – Typically in the 8X to
20x range on key projects and focus areas
– Reduce resource demands and $ investments for each
company.
– Ensure technology or business issues are resolved when
required.
– Projects can result in cost reduction (ex. Copper wire bonding).
• Reduce risk of technology; design, manufacturing, supply, process
– Reliability – Hard to measure the negative impact of poor
reliability, but can be disastrous.
– Source of supply – Also hard to apply general cost impact
numbers to being late to market – Can also be huge.
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Background & Current Situation Analysis
• iNEMI has been road mapping semiconductors and packaging for
nine roadmap iterations.
• In the 2011 RM MEMS was added as a focused technology chapter.
• Three of our product emulator groups highlighted MEMS as a rapidly
growing technology in their product lines
– Automotive
– Medical
– Portable/Consumer
• Each of these segments have very different needs and challenges.
• We believe it is time to expand the collaborative agenda for MEMS
• iNEMI held a workshop on MEMS at the EMPC Conference in
Brighton England on Sept 16th and 17th
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MEMS Roadmap Identified Current Needs
• Development of a detailed understanding of the basic material
failure mechanisms.
• Generic reliability test standards for all MEMS.
– Stiction, thermally induced deformation, fatigue, creep, fracture
• 8" wafer manufacturing capability to meet the projected
growth
• Procedures for testing the long term hermeticity and out-
gassing behavior of packages
• Low Cost Functional Testing
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Potential Solutions
Difficult Challenges Potential Solutions
Integration of MEMS in the Package • Standardization for MEMS packaging to support integration.
• Packages are needed that reduce or eliminate mechanical stress and enhancing hermeticity.
• Package data that can be used to accurately predict the effect of the package on device performance.
Testing of MEMS • More testing towards the wafer level. • Validated tools to predict device performance
from wafer tests. • Methodologies for “Design for Test” or
“Design for NO Test.”
Validated accelerated life testing for MEMS
• More knowledge of the physics of failure is required to develop accelerated life tests.
• Need to share information. Individual solutions exist but are not being generalized across the industry.
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Workshop Participants
Key Representatives from the Following:
ASE Bosch
CEA/LETI Coventor
CSR European Space Agency
Fraunhofer IZM
IQE Silicon Ltd
IMEC iNEMI
NGK SparkPlugs Co Ltd ON Semiconductor
SPTS STMicroelectronics
Tronics VTT Technical Research
Finland
Yole Development
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Key Problems and Opportunities
1.) Definition of the methodology for the development and
implementation of a highly integrated package with multiple
MEMS devices and a high performance ASIC. Includes:
– Identification of the key barriers to success and how to address
them
– Clarify the material flows and handling requirements
– How IP will be managed
– Change Control and Management
– Systems level calibration must also be owned and managed by
the product specified
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Key Problems and Opportunities
2.) Understand and guide the industry movement towards high
volume MEMS Modules (Design, Manufacturing, Materials,
Interface Specifications) that can then be used widely by
many different system integrators.
- And…..standard modules must be updated frequently
and stay up to date with industry technology
advancements
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Key Problems and Opportunities
3.) Develop generic reliability testing standards/methods for
integrated MEMS devices that enable spec conformance and
effectively propagate key device failure mechanisms
– First step would be to do an analysis of existing MEMS reliability
testing methods that are in place, standards in existence, and
standards in the work
• Create a baseline of existing capability and gaps
– Second step or phase would be to attack gaps with appropriate
study and research that ultimately deliver best known reliability
test suites for market specific MEMS segments
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Key Problems and Opportunities
4.) Definition of the market specific reliability requirements for
testing of medical MEMS
– Note that the existing iNEMI Team working Medical product
reliability test methodology could add MEMS as a category to be
defined/developed.
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Key Problem and Opportunity
5) Identify MEMS aspects of manufacturing that could benefit
from common approach in test methods. This could include
developing the following:
– Industry Standard Test vehicles for device qualification
– Common Material properties Characterization method
• Stress mitigation etc
– Simulation Tools
– Standard Test Methods
– E.g. Wafer level test Methods
• Need for both electrical and mechanical
• Need after dicing testing
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Key Problem and Opportunity
6) Identify opportunities for development of more effective in-
line testing capabilities:
– In process monitoring
• Etch depth monitoring
– Testing leakage after capping
• What standard tests are used
• What is needed
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Key Problem and Opportunity
7) Potential for development of Collaborative Design for
Manufacturability Rules and Guidelines
– That accommodate best in class equipment capabilities including
blind etch
– And detailed tool learning to incorporate in line process test
capabilities to calibrate and refine equipment set up and assure
product specs are in control
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Key Area of MEMS Research
• Do the in-depth research on new materials and technologies
to efficiently initiate the transduction of electro mechanical
devices.
– Today's technologies require high (30 VDC) voltages with slow
turn on times.
– Fast response low voltage stimulation is needed
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Please take the following iNEMI Survey and identify which initiatives your
company or institution would like to participate in
http://www.surveymonkey.com/s/MEMS_Interest_Survey
Be clear to indicate which initiatives you or your organization would be
willing to co-chair.
Leadership sets direction and drives aggressive prioritized goals that deliver
BUSINESS IMPACT
iNEMI will provide project management support
Respond to the survey within 10 days!
Complete no later than November 4th
The survey results will be reviewed and meetings for initiatives with 5
or more participating organizations will be scheduled
First meetings to be called by December 6th
Reminder: To participate and/or be a chair at the initiative stage, your
organization does not need to be an iNEMI Member.
The MEMS Initiatives
A Call to Action & NEXT Steps
www.inemi.org Email contacts:
Bill Bader
Bob Pfahl
Grace O’Malley - Europe
Haley Fu - Asia
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