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PSMN2R0-30YLEN-channel 30 V 2 mΩ logic level MOSFET in LFPAK12 October 2012 Product data sheet

1. Product profile

1.1 General descriptionLogic level N-channel MOSFET in LFPAK package qualified to 175 °C. This productis designed and qualified for use in a wide range of industrial, communications anddomestic equipment.

1.2 Features and benefits• Enhanced forward biased safe operating area for superior linear mode operation• Very low Rdson for low conduction losses

1.3 Applications• Electronic fuse• Hot swap• Load switch• Soft start

1.4 Quick reference dataTable 1. Quick reference dataSymbol Parameter Conditions Min Typ Max Unit

VDS drain-source voltage Tj ≥ 25 °C; Tj ≤ 175 °C - - 30 V

ID drain current Tmb = 25 °C; VGS = 10 V; Fig. 1 [1] - - 100 A

Ptot total power dissipation Tmb = 25 °C; Fig. 2 - - 272 W

Static characteristics

VGS = 10 V; ID = 25 A; Tj = 25 °C;Fig. 12

- 1.7 2 mΩRDSon drain-source on-stateresistance

VGS = 4.5 V; ID = 25 A; Tj = 25 °C;Fig. 12

- 3 3.5 mΩ

Dynamic characteristics

QGD gate-drain charge VGS = 4.5 V; ID = 25 A; VDS = 15 V;Fig. 14; Fig. 15

- 13.8 - nC

QG(tot) total gate charge VGS = 10 V; ID = 25 A; VDS = 15 V;Fig. 14; Fig. 15

- 87 - nC

© Nexperia B.V. 2017. All rights reserved

Nexperia PSMN2R0-30YLEN-channel 30 V 2 mΩ logic level MOSFET in LFPAK

PSMN2R0-30YLE All information provided in this document is subject to legal disclaimers.

Product data sheet 12 October 2012 2 / 13

Symbol Parameter Conditions Min Typ Max Unit

Avalanche ruggedness

EDS(AL)S non-repetitive drain-source avalancheenergy

VGS = 10 V; Tj(init) = 25 °C; ID = 100 A;Vsup ≤ 30 V; unclamped; RGS = 50 Ω;Fig. 3

- - 370 mJ

[1] Capped at 100A due to package

2. Pinning informationTable 2. Pinning informationPin Symbol Description Simplified outline Graphic symbol

1 S source

2 S source

3 S source

4 G gate

mb D mounting base; connected todrain

mb

1 2 3 4

LFPAK; Power-SO8 (SOT669)

S

D

G

mbb076

3. Ordering informationTable 3. Ordering information

PackageType number

Name Description Version

PSMN2R0-30YLE LFPAK;Power-SO8

plastic single-ended surface-mounted package; 4 leads SOT669

4. MarkingTable 4. Marking codesType number Marking code

PSMN2R0-30YLE 2R030

5. Limiting valuesTable 5. Limiting valuesIn accordance with the Absolute Maximum Rating System (IEC 60134).Symbol Parameter Conditions Min Max Unit

VDS drain-source voltage Tj ≥ 25 °C; Tj ≤ 175 °C - 30 V

VDGR drain-gate voltage Tj ≤ 175 °C; Tj ≥ 25 °C; RGS = 20 kΩ - 30 V

VGS gate-source voltage -20 20 V





Symbol Parameter Conditions Min Max Unit

VGS = 10 V; Tmb = 100 °C; Fig. 1 [1] - 100 AID drain current

VGS = 10 V; Tmb = 25 °C; Fig. 1 [1] - 100 A

IDM peak drain current pulsed; tp ≤ 10 µs; Tmb = 25 °C; Fig. 4 - 1084 A

Ptot total power dissipation Tmb = 25 °C; Fig. 2 - 272 W

Tstg storage temperature -55 175 °C

Tj junction temperature -55 175 °C

Tsld(M) peak soldering temperature - 260 °C

Source-drain diode

IS source current Tmb = 25 °C [1] - 100 A

ISM peak source current pulsed; tp ≤ 10 µs; Tmb = 25 °C - 1084 A

Avalanche ruggedness

EDS(AL)S non-repetitive drain-sourceavalanche energy

VGS = 10 V; Tj(init) = 25 °C; ID = 100 A;Vsup ≤ 30 V; unclamped; RGS = 50 Ω;Fig. 3

- 370 mJ

[1] Capped at 100A due to package

003aah010

0

100

200

300

0 50 100 150 200Tmb(°C)

ID(A)

(1)

(1) Capped at 100A due to package

Fig. 1. Continuous drain current as a function ofmounting base temperature

Tmb (°C)0 20015050 100

03aa16

40

80

120

Pder(%)

0

Fig. 2. Normalized total power dissipation as afunction of mounting base temperature





003aaj896

1

10

102

103

10-3 10-2 10-1 1 10tAL(ms)

IAL(A)

(1)

(2)

Fig. 3. Single pulse avalanche rating; avalanche current as a function of avalanche time

003aah012

1

10

102

103

104

10-1 1 10 102

VDS(V)

ID(A)

Limit RDSon = VDS/ ID

DC

100 µs

10 ms

tp =10 µs

100 ms

1 ms

Fig. 4. Safe operating area; continuous and peak drain currents as a function of drain-source voltage

6. Thermal characteristicsTable 6. Thermal characteristicsSymbol Parameter Conditions Min Typ Max Unit

Rth(j-mb) thermal resistancefrom junction tomounting base

Fig. 5 - 0.45 0.55 K/W





003aag993

single shot

0.2

0.1

0.05

10-3

10-2

10-1

1

10-6 10-5 10-4 10-3 10-2 10-1 1tp (s)

Zth(j-mb)(K/W)

δ = 0.5

0.02

tpT

P

t

tpT

δ =

Fig. 5. Transient thermal impedance from junction to mounting base as a function of pulse duration

7. CharacteristicsTable 7. CharacteristicsSymbol Parameter Conditions Min Typ Max Unit

Static characteristics

ID = 250 µA; VGS = 0 V; Tj = -55 °C 27 - - VV(BR)DSS drain-sourcebreakdown voltage ID = 250 µA; VGS = 0 V; Tj = 25 °C 30 - - V

ID = 1 mA; VDS = VGS; Tj = 175 °C;Fig. 10

0.5 - - V

ID = 1 mA; VDS = VGS; Tj = 25 °C;Fig. 11; Fig. 10

1.3 1.7 2.15 V

VGS(th) gate-source thresholdvoltage

ID = 1 mA; VDS = VGS; Tj = -55 °C;Fig. 10

- - 2.45 V

VDS = 30 V; VGS = 0 V; Tj = 25 °C - 0.05 10 µAIDSS drain leakage current

VDS = 30 V; VGS = 0 V; Tj = 100 °C - - 200 µA

VGS = 16 V; VDS = 0 V; Tj = 25 °C - 10 100 nAIGSS gate leakage current

VGS = -16 V; VDS = 0 V; Tj = 25 °C - 10 100 nA

VGS = 10 V; ID = 25 A; Tj = 25 °C;Fig. 12

- 1.7 2 mΩ

VGS = 10 V; ID = 25 A; Tj = 100 °C;Fig. 13; Fig. 12

- - 2.8 mΩ

VGS = 4.5 V; ID = 25 A; Tj = 25 °C;Fig. 12

- 3 3.5 mΩ

RDSon drain-source on-stateresistance

VGS = 10 V; ID = 25 A; Tj = 175 °C;Fig. 13; Fig. 12

- - 3.8 mΩ





Symbol Parameter Conditions Min Typ Max Unit

RG internal gateresistance (AC)

f = 1 MHz 0.3 0.6 1.2 Ω

Dynamic characteristics

ID = 25 A; VDS = 15 V; VGS = 10 V;Fig. 14; Fig. 15

- 87 - nC

ID = 25 A; VDS = 15 V; VGS = 4.5 V;Fig. 14; Fig. 15

- 41 - nC

QG(tot) total gate charge

ID = 0 A; VDS = 0 V; VGS = 10 V - 79 - nC

QGS gate-source charge - 13.3 - nC

QGS(th) pre-threshold gate-source charge

- 8.1 - nC

QGS(th-pl) post-threshold gate-source charge

- 5.2 - nC

QGD gate-drain charge

ID = 25 A; VDS = 15 V; VGS = 4.5 V;Fig. 14; Fig. 15

- 13.8 - nC

VGS(pl) gate-source plateauvoltage

ID = 25 A; VDS = 15 V; Fig. 14; Fig. 15 - 2.8 - V

Ciss input capacitance - 5217 - pF

Coss output capacitance - 1015 - pF

Crss reverse transfercapacitance

VDS = 15 V; VGS = 0 V; f = 1 MHz;Tj = 25 °C; Fig. 16

- 474 - pF

td(on) turn-on delay time - 32.7 - ns

tr rise time - 55.7 - ns

td(off) turn-off delay time - 41.5 - ns

tf fall time

VDS = 15 V; RL = 0.6 Ω; VGS = 4.5 V;RG(ext) = 4.7 Ω; Tj = 25 °C

- 29.5 - ns

Source-drain diode

VSD source-drain voltage IS = 25 A; VGS = 0 V; Tj = 25 °C; Fig. 17 - 0.8 1.2 V

trr reverse recovery time - 42.6 - ns

Qr recovered charge

IS = 25 A; dIS/dt = 100 A/µs; VGS = 0 V;VDS = 15 V - 49.8 - nC





003aah014

0

20

40

60

80

100

0 0.5 1 1.5 2VDS(V)

ID(A)

VGS(V) = 3.5

2.6

2.8

4.510

2.4

3

Fig. 6. Output characteristics; drain current as afunction of drain-source voltage; typical values

003aah015

0

2

4

6

8

0 4 8 12 16VGS(V)

RDSon(mΩ)

Fig. 7. Drain-source on-state resistance as a functionof gate-source voltage; typical values

003aah016

0

30

60

90

120

150

0 20 40 60 80 100ID (A)

gfs(S)

Fig. 8. Forward transconductance as a function ofdrain current; typical values

003aah017

0

50

100

150

200

0 1 2 3 4 5VGS(V)

ID(A)

Tj = 25 °C

Tj = 175 °C

Fig. 9. Transfer characteristics; drain current as afunction of gate-source voltage; typical values





003aaj515

0

1

2

3

-60 0 60 120 180Tj (°C)

VGS(th)(V)

max

typ

min

Fig. 10. Gate-source threshold voltage as a function ofjunction temperature

003aaj514

10-6

10-5

10-4

10-3

10-2

10-1

0 1 2 3VGS(V)

ID(A)

maxtypmin

Fig. 11. Sub-threshold drain current as a function ofgate-source voltage

003aah020

0

10

20

30

10 30 50 70 90ID(A)

RDSon(mΩ)

4.5

VGS(V) = 3

10

3.5

2.8

Fig. 12. Drain-source on-state resistance as a functionof drain current; typical values

003aag820

0

0.5

1

1.5

2

-60 0 60 120 180Tj (°C)

a

Fig. 13. Normalized drain-source on-state resistancefactor as a function of junction temperature





003aaa508

VGS

VGS(th)

QGS1 QGS2

QGD

VDS

QG(tot)

ID

QGS

VGS(pl)

Fig. 14. Gate charge waveform definitions

003aah022

0

2

4

6

8

10

0 20 40 60 80 100QG (nC)

VGS(V)

VDS= 15V

24 V

6 V

Fig. 15. Gate-source voltage as a function of gatecharge; typical values

003aah023

102

103

104

10-1 1 10 102

VDS(V)

C(pF)

Ciss

Crss

Coss

Fig. 16. Input, output and reverse transfer capacitancesas a function of drain-source voltage; typicalvalues

003aah024

0

20

40

60

80

100

0 0.3 0.6 0.9 1.2VSD(V)

IS(A)

Tj = 25 °C

Tj = 150°C

Fig. 17. Source current as a function of source-drainvoltage; typical values





8. Package outline

REFERENCESOUTLINEVERSION

EUROPEANPROJECTION ISSUE DATE

IEC JEDEC JEITA

SOT669 MO-235 06-03-1611-03-25

0 2.5 5 mm

scale

e

E1

b

c2

A2

A2 b cA eUNIT

DIMENSIONS (mm are the original dimensions)

mm 1.100.95

A3A1

0.150.00

1.201.01

0.500.35

b2

4.413.62

b3

2.22.0

b4

0.90.7

0.250.19

c2

0.300.24

4.103.80

6.25.8

H

1.30.8

L2

0.850.40

L

1.30.8

L1

8°0°

w yD(1)

5.04.8

E(1)

3.33.1

E1(1)D1(1)

max

0.25 4.20 1.27 0.25 0.1

1 2 3 4

mountingbase

D1

c

Plastic single-ended surface-mounted package (LFPAK; Power-SO8); 4 leads SOT669

E

b2

b3

b4

H D

L2

L1

A

Aw M

C

C

X

1/2 e

y C

θ

θ

(A )3

L

A

A1

detail X

Note1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

Fig. 18. Package outline LFPAK; Power-SO8 (SOT669)





9. Legal information

9.1 Data sheet statusDocumentstatus [1][2]

Productstatus [3]

Definition

Objective[short] datasheet

Development This document contains data fromthe objective specification for productdevelopment.

Preliminary[short] datasheet

Qualification This document contains data from thepreliminary specification.

Product[short] datasheet

Production This document contains the productspecification.

[1] Please consult the most recently issued document before initiating orcompleting a design.

[2] The term 'short data sheet' is explained in section "Definitions".[3] The product status of device(s) described in this document may have

changed since this document was published and may differ in case ofmultiple devices. The latest product status information is available onthe Internet at URL http://www.nexperia.com.

9.2 DefinitionsPreview — The document is a preview version only. The document is stillsubject to formal approval, which may result in modifications or additions.Nexperia does not give any representations or warranties as tothe accuracy or completeness of information included herein and shall haveno liability for the consequences of use of such information.

Draft — The document is a draft version only. The content is still underinternal review and subject to formal approval, which may result inmodifications or additions. Nexperia does not give anyrepresentations or warranties as to the accuracy or completeness ofinformation included herein and shall have no liability for the consequencesof use of such information.

Short data sheet — A short data sheet is an extract from a full data sheetwith the same product type number(s) and title. A short data sheet isintended for quick reference only and should not be relied upon to containdetailed and full information. For detailed and full information see therelevant full data sheet, which is available on request via the local Nexperiasales office. In case of any inconsistency or conflict with theshort data sheet, the full data sheet shall prevail.

Product specification — The information and data provided in a Productdata sheet shall define the specification of the product as agreed betweenNexperia and its customer, unless Nexperia andcustomer have explicitly agreed otherwise in writing. In no event however,shall an agreement be valid in which the Nexperia productis deemed to offer functions and qualities beyond those described in theProduct data sheet.

9.3 DisclaimersLimited warranty and liability — Information in this document is believedto be accurate and reliable. However, Nexperia does not giveany representations or warranties, expressed or implied, as to the accuracyor completeness of such information and shall have no liability for theconsequences of use of such information. Nexperia takes noresponsibility for the content in this document if provided by an informationsource outside of Nexperia.

In no event shall Nexperia be liable for any indirect, incidental,punitive, special or consequential damages (including - without limitation -lost profits, lost savings, business interruption, costs related to the removalor replacement of any products or rework charges) whether or not suchdamages are based on tort (including negligence), warranty, breach ofcontract or any other legal theory.

Notwithstanding any damages that customer might incur for any reasonwhatsoever, Nexperia’s aggregate and cumulative liability towardscustomer for the products described herein shall be limited in accordancewith the Terms and conditions of commercial sale of Nexperia.

Right to make changes — Nexperia reserves the right tomake changes to information published in this document, including withoutlimitation specifications and product descriptions, at any time and withoutnotice. This document supersedes and replaces all information supplied priorto the publication hereof.

Suitability for use — Nexperia products are not designed,authorized or warranted to be suitable for use in life support, life-critical orsafety-critical systems or equipment, nor in applications where failure ormalfunction of a Nexperia product can reasonably be expectedto result in personal injury, death or severe property or environmentaldamage. Nexperia and its suppliers accept no liability forinclusion and/or use of Nexperia products in such equipment orapplications and therefore such inclusion and/or use is at the customer’s ownrisk.

Quick reference data — The Quick reference data is an extract of theproduct data given in the Limiting values and Characteristics sections of thisdocument, and as such is not complete, exhaustive or legally binding.

Applications — Applications that are described herein for any of theseproducts are for illustrative purposes only. Nexperia makes norepresentation or warranty that such applications will be suitable for thespecified use without further testing or modification.

Customers are responsible for the design and operation of theirapplications and products using Nexperia products, and Nexperiaaccepts no liability for any assistance with applications orcustomer product design. It is customer’s sole responsibility to determinewhether the Nexperia product is suitable and fit for thecustomer’s applications and products planned, as well as for the plannedapplication and use of customer’s third party customer(s). Customers shouldprovide appropriate design and operating safeguards to minimize the risksassociated with their applications and products.

Nexperia does not accept any liability related to any default,damage, costs or problem which is based on any weakness or defaultin the customer’s applications or products, or the application or use bycustomer’s third party customer(s). Customer is responsible for doing allnecessary testing for the customer’s applications and products using Nexperiaproducts in order to avoid a default of the applicationsand the products or of the application or use by customer’s third partycustomer(s). Nexperia does not accept any liability in this respect.

Limiting values — Stress above one or more limiting values (as defined inthe Absolute Maximum Ratings System of IEC 60134) will cause permanentdamage to the device. Limiting values are stress ratings only and (proper)operation of the device at these or any other conditions above thosegiven in the Recommended operating conditions section (if present) or theCharacteristics sections of this document is not warranted. Constant orrepeated exposure to limiting values will permanently and irreversibly affectthe quality and reliability of the device.

Terms and conditions of commercial sale — Nexperiaproducts are sold subject to the general terms and conditions of commercialsale, as published at http://www.nexperia.com/profile/terms, unless otherwiseagreed in a valid written individual agreement. In case an individualagreement is concluded only the terms and conditions of the respectiveagreement shall apply. Nexperia hereby expressly objects toapplying the customer’s general terms and conditions with regard to thepurchase of Nexperia products by customer.

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grant, conveyance or implication of any license under any copyrights, patentsor other industrial or intellectual property rights.

Export control — This document as well as the item(s) described hereinmay be subject to export control regulations. Export might require a priorauthorization from competent authorities.

Non-automotive qualified products — Unless this data sheet expresslystates that this specific Nexperia product is automotive qualified,the product is not suitable for automotive use. It is neither qualified nortested in accordance with automotive testing or application requirements.Nexperia accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications.

In the event that customer uses the product for design-in and use inautomotive applications to automotive specifications and standards,customer (a) shall use the product without Nexperia’s warrantyof the product for such automotive applications, use and specifications, and(b) whenever customer uses the product for automotive applications beyondNexperia’s specifications such use shall be solely at customer’sown risk, and (c) customer fully indemnifies Nexperia for anyliability, damages or failed product claims resulting from customer design anduse of the product for automotive applications beyond Nexperia’sstandard warranty and Nexperia’s product specifications.

Translations — A non-English (translated) version of a document is forreference only. The English version shall prevail in case of any discrepancybetween the translated and English versions.

9.4 TrademarksNotice: All referenced brands, product names, service names andtrademarks are the property of their respective owners.





10. Contents1 Product profile ....................................................... 11.1 General description .............................................. 11.2 Features and benefits ...........................................11.3 Applications .......................................................... 11.4 Quick reference data ............................................ 12 Pinning information ...............................................23 Ordering information .............................................24 Marking ................................................................... 25 Limiting values .......................................................26 Thermal characteristics .........................................47 Characteristics .......................................................58 Package outline ................................................... 109 Legal information .................................................119.1 Data sheet status ............................................... 119.2 Definitions ...........................................................119.3 Disclaimers .........................................................119.4 Trademarks ........................................................ 12

© Nexperia B.V. 2017. All rights reservedFor more information, please visit: http://www.nexperia.comFor sales office addresses, please send an email to: [email protected] Date of release: 12 October 2012

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