Nexperia Product Change Notification 202109019F

PCN 202109019F Change of back side metallization thickness and introduction of new EMCs in SOT23

Revision: 08 October 2021 Self Qualification Report

Document Information

Information Content

Author Christian Tameling

Supplier Nexperia

Document Number PCN 202109019F

Revision History

Revision Date Description

08 October 2021 New document

Contact Information

For more information, please contact: [email protected]

PCN 202109019FChange of back side metallization thickness and introduction of new EMCs in SOT23

PCN 202109019F All information provided in this document is subject to legal disclaimers. © 2021 Nexperia B.V. / V1.3.

Self Qualification Report Revision: 08 October 2021 of 16

Table of Contents

1. Subject ................................................................................................................................... 3

2. Introduction ............................................................................................................................ 3

3. Material and process details ....................................................................................................... 3 3.1 Wafer material and process ................................................................................................ 3 3.2 Epoxy mold compound material ........................................................................................... 3

4. Reliability test program ............................................................................................................. 5 4.1 Qualification strategy ......................................................................................................... 5 4.2 Test vehicles .................................................................................................................... 5

5. Constructional details of test vehicles .......................................................................................... 5

6. Qualification family ................................................................................................................... 7

7. Qualification report ................................................................................................................... 8

8. Electrical and thermal performance ........................................................................................... 16 8.1 Electrical performance ...................................................................................................... 16 8.2 Thermal performance ....................................................................................................... 16

9. Comparison of visual appearance .............................................................................................. 16

10. Traceability ........................................................................................................................... 16

11. Conclusion ............................................................................................................................ 16

12. Legal Disclaimer ..................................................................................................................... 16




1. Subject

This Self Qualification Report gives background information about the change of the back side metallization

thickness and the introduction of new mould compounds for products in SOT23 package. This includes details

of the qualification strategy, and selected tests to confirm the zero hour and reliability performance of the

changed products. It refers to Nexperia PCN 202109019F.

2. Introduction

The total back side metallization thickness will be changed from 2.15 µm to 1.75 µm by reduced AuGe layer

thickness.

The change of the back side metallization thickness is combined with the introduction of additional epoxy mold

compounds (GR646CHN, CV4112 and EME-E500HK).

All affected product types are listed in Table 5.

3. Material and process details

3.1 Wafer material and process

The total back side metallization (Au/Ag/Ni/AuGe) thickness will be changed from 2.15 µm to 1.75 µm by

reduced AuGe layer thickness. No change of Au, Ag and Ni layer thickness. Die design and active area remain

unchanged. The affected product type are denoted in Table 5.

Table 1: Comparison of back side metallization

1.75 µm (changed) 2.15 µm (current)

Schematic of back side metallization layer

Au Contact layer to Si

Ag Intermediate layer

Ni Intermediate layer

AuGe Bond layer (1.0 µm)

Au Contact layer to Si

Ag Intermediate layer

Ni Intermediate layer

AuGe Bond layer (1.4 µm)

3.2 Epoxy mold compound material

Three additional epoxy mold compound (EMC) materials EME-E500HK (Sumitomo), GR646CHN (Hysol) and

CV4112 (Panasonic) will be introduced. Nexperia will use the same molding and electrolytic deflash method

for all EMC types. There is no difference of the mold and flash along the lead performance and no change of

the visual appearance. The details of this change can be found in Table 2 and 3. The affected product types

are denoted in Table 5.




Table 2: Comparison of epoxy mold compound

Product Changed Product Current Product

2PB710ASL; PD602ASL; BAT720; PDTB113ZT;

PMBTA56/DG/B3; PDTB123YT-Q/S400;

PDTD113ZT-Q/S400; PDTD123YT-Q/S400

GR646

EME-E500HK

GR646CHN

CV4112

GR646

3400FPG (where affected)

-

-

Table 3: Overview of epoxy mold compound

Item Name Supplier Response

Mold Compound

a. Mold compound supplier & ID

b. Mold compound type

c. Flammability rating

d. Fire Retardant type/composition

e. Tg (glass transition temp.) (°C) [1]

f. CTE (below Tg) (ppm/°C) [1]

CTE (above Tg) (ppm/°C) [1]

Hysol [2] GR646

epoxy (SiO2 filled)

UL 94 V0

None

min. 150

max. 25

max. 80

Hysol GR646CHN

epoxy (SiO2 filled)

UL 94 V0

None

min. 150

max. 20

max. 70


Mold Compound








Sumitomo EME-E500HK

epoxy (SiO2 filled)

UL 94 V0

None

min. 125

max. 20

max. 70

Panasonic CV4112

epoxy (SiO2 filled)

UL 94 V0

None

min. 137

max. 21

max. 75


Mold Compound








Panasonic 3400FPG

epoxy (SiO2 filled)

UL 94 V0

None

min. 145

max. 25

max. 75

[1] Specified under supplier molding conditions

[2] former Henkel




4. Reliability test program

In line with AEC-Q101 and Nexperia General Quality Specification, the product types to be changed have

been combined to generic leader type families due to their structural similarity. To validate the assembly

quality and reliability performance an extensive qualification program has been performed.

4.1 Qualification strategy

The qualification plan had been developed based on FMEA risk assessment. Potential failures have been

identified and addressed in qualification.

4.2 Test vehicles

Six leader types have been selected based on structural similarity to represent the qualification

family and the package technologies for the back side metallization qualification.

Thirteen leader types have been selected based on structural similarity to represent the qualification

family and the die technologies for the epoxy mold compound qualification.

The selected product types per qualification group are denoted in Table 4.

5. Constructional details of test vehicles

The representative leader types for the qualification family are presented in Table 4.

Table 4: Leader types for qualification family

Material used for

qualification

Product Lots Package Package Technology Back side thickness

BAT721A 1 SOT23 SMD Gullwing A42 1.75 µm

BC807-40 1 SOT23 SMD Gullwing A42 1.75 µm

PBSS5350T 1 SOT23 SMD Gullwing A42 1.75 µm

PBSS5140T 1 SOT23 SMD Gullwing A42 1.75 µm

BCW68H 1 SOT23 SMD Gullwing A42 1.75 µm

PDTD123YT 1 SOT23 SMD Gullwing A42 1.75 µm

Material used for

qualification

Product Package Die Technology Epoxy mold compound

BAV70 1 SOT23 Switching diode E500HK

BAS116 1 SOT23 Switching diode E500HK

BAT54C 1 SOT23 Schottky diode E500HK

PMBT2222A 2 SOT23 Switching transistor E500HK

2N7002P 2 SOT23 N-channel Trench MOSFET E500HK

2N7002 1 SOT23 N-channel Trench MOSFET E500HK

PMBTA45 2 SOT23 High voltage transistor E500HK

PDTA114TT 2 SOT23 resistor-equipped transistors E500HK




BAS116 2 SOT23 Switching diode E500HK

BAT54C 1 SOT23 Schottky diode GR646CHN

BAV70 1 SOT23 Switching diode GR646CHN

BAS116 1 SOT23 Switching diode GR646CHN

BSR15 2 SOT23 Switching transistor GR646CHN

PBSS5250TH 3 SOT23 General purpose transistor GR646CHN

2N7002P 2 SOT23 N-channel Trench MOSFET GR646CHN

2N7002 2 SOT23 N-channel Trench MOSFET GR646CHN

PMBTA45 1 SOT23 High voltage transistor GR646CHN

PBHV9050T 1 SOT23 High voltage transistor GR646CHN

BAS16TH 1 SOT23 Switching diode GR646CHN

PDTB114ET 1 SOT23 resistor-equipped transistors GR646CHN

PDTA114TT 2 SOT23 resistor-equipped transistors GR646CHN

BAS116 2 SOT23 Switching diode GR646CHN

BAV70 2 SOT23 Switching diode CV4112

BAS116 1 SOT23 Switching diode CV4112

BAT54C 2 SOT23 Schottky diode CV4112

BAT54 1 SOT23 Schottky diode CV4112

PMBT2222A 3 SOT23 Switching transistor CV4112

PBHV9050T 2 SOT23 High voltage transistor CV4112

2N7002P 2 SOT23 N-channel Trench MOSFET CV4112

2N7002 1 SOT23 N-channel Trench MOSFET CV4112

PMBTA45 3 SOT23 High voltage transistor CV4112

PMBT2907A 1 SOT23 Switching transistor CV4112

PDTA114TT 2 SOT23 resistor-equipped transistors CV4112

BAS116 2 SOT23 Switching diode CV4112




6. Qualification family

All product types to be released with this PCN are listed in Table 5.

Table 5: Qualification family of affected product types

Product 12NC Package

Type of change

back side

SEM-PW-06*)

mold compound SEM-PA-11*)

E500HK GR646CHN CV4112

2PB710ASL 9340 623 04215 SOT23 ● ● ● ●

2PB710ASL 9340 623 04235 SOT23 ● ● ● ●

2PD602ASL 9340 623 15215 SOT23 ● ● ● ●

2PD602ASL 9340 623 15235 SOT23 ● ● ● ●

BAT720 9340 512 80215 SOT23 ● ● ● ●

BAT720 9340 512 80235 SOT23 ● ● ● ●

PDTB113ZT 9340 589 79215 SOT23 ● ● ● ●

PDTB123YT-Q/S400 9346 633 91215 SOT23 ● ● ● ●

PDTD113ZT-Q/S400 9346 633 88215 SOT23 ● ● ● ●

PDTD113ZT-Q/S400 9346 633 88235 SOT23 ● ● ● ●

PDTD123YT-Q/S400 9346 633 90215 SOT23 ● ● ● ●

PMBTA56/DG/B3 9340 679 38235 SOT23 ● ● ● ●

*) according to DeltaQualificationMatrix ZVEI




7. Qualification report

The qualification as reported in the summary below was carried out to release all product types mentioned in

this PCN.

Production Part Approval - Environmental Test Summary (according to AEC-Q101-Rev-D standards)

Supplier User Part Number

Nexperia BAT721A ; BC807-40 ; PBSS5350T ; PBSS5140T ; BCW68H ; PDTD123YT

Name of Laboratory Part Description Nexperia Hamburg SMD Gullwing A42

Test # Test Description Test Conditions #

Lots #

Tested #

Failed

1 Pre- and Post-Stress test (TEST) at room temperature all1) all1) 0

2 Preconditioning (PC) JESD22 A-113, MSL 1 all2) all2) 0

3 External Visual (EV) JESD22 B-101 all3) all3) 0

4 Parametric verification (PV) T=-55°C, T=25°C, and T=150°C 6 25 0

5

High Temp. Rev. Bias (HTRB)

MIL-STD-750-1 M1038 Method A, Tj=Tjmax=150°C, 100% of max. rated breakdown voltage, t=1000h

6 80 0

5a AC blocking voltage (ACBV) MIL-STD-750-1 M1041 Test condition A -4) - -

5b

High Temperature Forward Bias (HTFB)

JESD22 A-108 -5) - -

5c Steady State Operational (SSOP) MIL-STD-750-1 M1038 Condition B (Zeners) -6) - -

6

High Temperature Gate Bias (HTGB)

JESD22-A108, Tj=Tjmax=150°C, 100% of max. specified breakdown voltage

-7) - -

High Temperature Negative Gate Bias (HTNGB)

JESD22-A108, Tj=Tjmax=150°C, 100% of max. specified breakdown voltage

-7) - -

7 Temperature Cycling (TC)

JESD22-A104, -65°C to +150°C, t(dwell)>15 min, 1000 cycles (2x 2000 cyl.)

6 80 0

7a

Temperature Cycling Hot Test (TCHT)

JESD22-A104, -65°C to +150°C, 125°C test after TC, followed by decap. and wire pull.

-7) - -

7a alt Temperature Cycling Delamination Test (TCDT)

JESD22-A104, J-STD-035, -65°C to +150°C, t(dwell) >15 min, CSAM inspection after TC, followed by decapsulation, wire inspection and wire pull.

-7) 13) - -

7b Wire Bond Integrity

MIL-STD-750 Method 2037, HTS (500h), Ta = max. rated Tj, followed by wire pull

-10) - -

8

Unbiased Highly Accelerated Stress Test (UHAST)

JESD22-A118, Ta=130°C, 85% RH, 96h -10) - -

8 alt Autoclave (AC)

JESD22-A102, Ta=121°C, P=15psig, 100% RH, t=96h

-13) - -

9

Highly Accelerated Stress Test (HAST)

JESD22-A110, Ta=130°C, 85% RH, 96h -13) - -

9 alt

High Humidity High Temperature Reverse Bias (H3TRB)

JESD22-A101, Ta=85°C, 85% RH, 80% of rated breakdown voltage, t=1000 hrs

6 80 0

9a

High Temperature High Humidity Bias (HTHHB)

JESD22-A101, T=85°C, RH=85%, parts forward biased

-5) - -

10 Intermittent Operating Life (IOL)

MIL-STD-750 Method 1037, T=25°C, ΔTj≧100°C, ton=toff=2 min, t=1000 hrs

6 80 0

10 alt Power and Temp.Cycle (PTC) JESD22-A105 -13) - -

11 ESD - HBM JESD22-A114, AEC: AEC-Q101-001 -10) - -

11 ESD - CDM JESD22 C-101, AEC-Q101-005 -9) - -

12 Destr. Physical Analysis (DPA) H3TRB/TC 1000h/cyc samples 6 2x 2 0

13 Physical Dimensions (PD) per spec. -10) - -

14 Terminal Strength (TS) MIL-STD-750 Method 2036 -11) - -

15 Resistance to Solvents (RTS) JESD22-B107 -12) - -

16

Constant Acceleration (CA)

MIL-STD-750 Method 2006, Items 16 through 19 are sequential tests for hermetic packages.

-8) - -




17

Vibration Variable Frequency (VVF)

JESD22-B103, Items 16 through 19 are sequential tests for hermetic packages.

-8) - -

18

Mechanical Shock (MS)

JESD22-B104, Items 16 through 19 are sequential tests for hermetic packages.

-8) - -

19

Hermeticity (HER)

JESD22-A109, Items 16 through 19 are sequential tests for hermetic packages.

-8) - -

20 Resist. to Solder Heat (RSH)

JESD22 A-111, SMD parts shall be fully submerged during test

3 30 0

21 Solderability (SD) J-STD-002, JESD22 B-102 -10) - -

22 Thermal Resistance (TR) JESD24-3, 24-4, 24-6 as appropriate 3 6 0

23 Wire Bond Strength (WBS)

MIL-STD-750 Method 2037, 10 bonds from min. 5 devices

6 10 0

24 Wire Bond Shear (BS) AEC-Q101-003, 10 bonds from min. 5 devices 6 10 0

25 Die Shear (DS) MIL-STD-750 Method 2017 6 5 0

26

Unclamped Inductice Switching (UIS)

AEC-Q101-004 Section 2 -7) - -

27 Dielectric Integrity (DI) AEC-Q101-004 Section 3 -7) - -

28

Short Circuit Reliability Characterization (SCR)

AEC-Q101-006 -14) - -

29 Lead Free (LF) AEC-Q005 all all 0

Comment:

Project Name: Change of back side metallization

Reason for Qualification: Compiled by:

Lab-Track No.: HT1026/27/28; HT1015/16; HD1068 Change of AuGe layer thickness

Christian Tameling

Batch/Lot No.: misc Date: FAB: DHAM 14-June-2021 Assembly: ATGD; ATSN

Notes: 1. All qualification parts according device specification 2. All SMD qualification parts prior to TC/TCHT/TCDT, AC/UHAST, IOL/PTC, H3TRB/HAST, RSH 3. All qualification parts submitted for testing 4. Required for Thyristors only 5. Required for LEDs only 6. Required for Voltage Regulators (Zener diodes) only 7. Required for MOS and IGBT parts only 8. Required for hermetic packaged parts only

9.

10. Small SMD packages not able to hold enough charge. See AEC-Q101 Section 4. Not necessary for back side metallization thickness change

11. Required for leaded parts only 12. Required for laser etched parts with no marking 13. Omitted in lieu of alternative test 14. Required for smart power parts only




Production Part Approval -

Environmental Test Summary

(according to AEC-Q101-Rev-D standards)


Nexperia BAV70, BAS116, BAT54, BAT54C, 2N7002, 2N7002P, PMBT222A, PMBTA45, PBHV9050T, BSR15, PDTB114ET, PMBT2907A

Name of Laboratory Part Description

Quality ATGD and Hamburg All types in SOT23 at assembly site ATGD


Lots #

Tested #

Failed

1 Pre and Post Stress Test (TEST)

Electrical test as specified in the applicable stress reference at room temperature

all1) all1) 0

2 Preconditioning (PC) JESD22-A113, TEST before and after PC, MSL level 1 all2) all2) 0

3 External Visual (EV)

JESD22-B101, inspect part construction, marking and workmanship

all3) all3) 0

4 Parametric Verification (PV) T=-55°C, T=25°C, and T=150°C 33 25 0

5

High Temperature Reverse Bias (HTRB)

MIL-STD-750 M1038 Condition A, T=150°C, reverse biased at max. rated breakdown voltage¹⁵⁾, t=2000 hrs

31 80 0

5a AC blocking voltage (ACBV) MIL-STD-750 M1040 Condition A -4) - -

5b


JESD22-A108 -5) - -

5c Steady State Operational (SSOP) MIL-STD-750 M1038 Condition B (Zeners) -6) - -

6


JESD22-A108, T=150°C, VGS=VGSmax, t=2000 hrs 10 80 0

6


JESD22-A108, T=150°C, VSG=VSGmax, t=2000 hrs 8 80 0

7 Temperature Cycling (TC) JESD22-A104, T=-65°C to 150°C, 2000 cycles 34 80 0

7a


JESD22-A104, T=-65°C to 150°C, 1000 cycles, followed by wire pull on 5 parts

5 80 0

7a alt

Temperature Cycling Delamination Test (TCDT)

JESD22-A104, T=-65°C to 150°C, 1000 cycles, followed by C-SAM inspection and wire pull

-7) 16) - -

7b Wire Bond Integrity (WBI)

MIL-STD-750 Method 2037, HTS, T=150°C, t=500 hrs, followed by wire pull

20 5 0

Project name: BG505_BIM_2nd_src_EMC Reason for Qualification: Compiled by: Trial-number: misc Introduction of 2nd source mold compounds H-J. Kühl Batch/Lot-number: misc (E500HK, GR646CHN, CV4112) Fab/Assembly: DHAM / ATGD Date: 17-Jun-2021

Notes:

1. All qualification parts according part specification

2. All SMD qualification parts prior to TC/TCHT/TCDT, AC/UHAST, IOL/PTC, H3TRB/HAST, RSH

3. All qualification parts submitted for testing

4. Required for Thyristors only

5. Required for LEDs only

6. Required for Voltage Regulators (Zener diodes) only

7. Required for MOS and IGBT parts only

15. The physical limitations of Schottky diodes have to be considered (thermal runaway)

16. Omitted in lieu of alternative test

page 1 of 3








Nexperia BAV70, BAS116, BAT54, BAT54C, 2N7002, 2N7002P, PMBT222A,

PMBTA45, PBHV9050T, BSR15, PDTD114ET, PMBT2907A




Lots #

Tested #

Failed

8


JESD22-A118, T=130°C, 85% RH, t=96 hrs -16) - -


JESD22-A102, T=121°C, p=15psig, 100% RH, t=96 hrs

25 80 0

9


JESD22-A110, T=130°C, 85% RH, t=96 hrs, reverse biased at 80% of rated voltage

-16) - -

9 alt


JESD22-A101, T=85°C, 85% RH, reverse biased at 80% of rated breakdown voltage, t=1000 hrs (9 lots 2000h)

29 80 0

9a


JESD22-A101, T=85°C, 85% RH, parts forward biased

-5) - -

10 Intermittent Operational Life (IOL)

MIL-STD-750 Method 1037, T=25°C, ΔTj≧100°C, ton=toff=2 min, t=1000 hrs (9 lots 2000h)

16 80 0

10 alt

Power and Temperature Cycle (PTC)

JESD22-A105, T=-40°C to x°C to obtain ΔTj≧100°C, ton=toff=2 min, t=1000 hrs

-16) 17) - -

11

ESD - Human Body Model (HBM) JESD22-A114, AEC-Q101-001 -8) - -

ESD - Machine Model (MM)

JESD22-A115, AEC-Q101-002 (decommissioned)

-18) - -

ESD - Charged Dev. Model (CDM) JESD22-C101, AEC-Q101-005 -9) - -

12

Destructive Physical Analysis (DPA)

AEC-Q101-004 Section 4 (after H3TRB or HAST, and TC)

63 2 0

13 Physical Dimensions (PD) JESD22-B100 3 30 0

14 Terminal Strength (TS)

MIL-STD-750 Method 2036, evaluate lead integrity of leaded parts only

-11) - -

15 Resistance to Solvents (RTS) JESD22-B107, verify marking permanency -12) - -

Project name: BG505_BIM_2nd_src_EMC Reason for Qualification: Compiled by:

Trial-number: misc Introduction of 2nd source mold compounds H-J. Kühl

Batch/Lot-number: misc (E500HK, GR646CHN, CV4112)

Fab/Assembly: DHAM / ATGD Date: 17-Jun-2021

Notes:


8. Test passed at initial product release. Not required according Process Change Guidelines for this change

9. Small SMD packages not able to hold enough charge. See AEC-Q101 Section 4.2

10. No change of die, package and leads

11. Required for leaded parts only

12. Not required for laser etched parts or parts with no marking


17. Not required for Transient Voltage Suppressors (TVS)

18. ESD MM decommissioned, see information in JEP172

page 2 of 3








Nexperia BAV70, BAS116, BAT54, BAT54C, 2N7002, 2N7002P, PMBT222A,

PMBTA45, PBHV9050T, BSR15, PDTD114ET, PMBT2907A




Lots #

Tested #

Failed

16 Constant Acceleration (CA) MIL-STD-750 Method 2006 -13) - -

17 Vibration Variable Frequency (VVF) JESD22-B103 -13) - -

18 Mechanical Shock (MS) JESD22-B104 -13) - -

19 Hermeticity (HER) JESD22-A109 -13) - -

20 Resistance to Solder Heat (RSH)

JESD22-A111, SMD parts shall be fully submerged during test

24 30 0

21 Solderability (SD) J-STD-002, JESD22-B102 9 30 0



MIL-STD-750 Method 2037 10 bonds from min of 5 parts

- - -

24 Bond Shear (BS)

AEC-Q101-003 10 bonds from min of 5 parts

- - -

25 Die Shear (DS) MIL-STD-750 Method 2017 -10) - -

26 Unclamped Inductive Switching (UIS) AEC-Q101-004 Section 2 -7) - -


28


AEC-Q101-006 -14) - -

29 Lead Free (LF) AEC-Q005 - - -

Project name: BG505_BIM_2nd_src_EMC Reason for Qualification: Compiled by: Trial-number: misc Introduction of 2nd source mold compounds H-J. Kühl Batch/Lot-number: misc (E500HK, GR646CHN, CV4112) Fab/Assembly: DHAM / ATGD Date: 17-Jun-2021

Notes:



13. Required for hermetic packaged parts only

14. Required for smart power parts only

page 3 of 3








Nexperia PDTA114TT (6 lots), BAS116 (6 lots)


Quality ATGD and Hamburg All types in SOT23 at assembly site ATSN


Lots #

Tested #

Failed

1 Pre and Post Stress Test (TEST)

Electrical test as specified in the applicable stress reference at room temperature

all1) all1) 0

2 Preconditioning (PC) JESD22-A113, TEST before and after PC, MSL level 1 all2) all2) 0

3 External Visual (EV)

JESD22-B101, inspect part construction, marking and workmanship

all3) all3) 0

4 Parametric Verification (PV) T=-55°C, T=25°C, and T=150°C 12 25 0

5

High Temperature Reverse Bias (HTRB)

MIL-STD-750 M1038 Condition A, T=150°C, reverse biased at max. rated breakdown voltage¹⁵⁾, t=2000 hrs

12 80 0

5a AC blocking voltage (ACBV) MIL-STD-750 M1040 Condition A -4) - -

5b


JESD22-A108 -5) - -

5c Steady State Operational (SSOP) MIL-STD-750 M1038 Condition B (Zeners) -6) - -

6


JESD22-A108, T=150°C, VGS=VGSmax, t=2000 hrs -7) 80 -

6


JESD22-A108, T=150°C, VSG=VSGmax, t=2000 hrs -7) 80 -

7 Temperature Cycling (TC) JESD22-A104, T=-65°C to 150°C, 2000 cycles 12 80 0

7a


JESD22-A104, T=-65°C to 150°C, 1000 cycles, followed by wire pull on 5 parts

-7) 80 -

7a alt

Temperature Cycling Delamination Test (TCDT)

JESD22-A104, T=-65°C to 150°C, 1000 cycles, followed by C-SAM inspection and wire pull

-7) 16) - -

7b Wire Bond Integrity (WBI)

MIL-STD-750 Method 2037, HTS, T=150°C, t=500 hrs, followed by wire pull

12 5 0

Project name: BG505_BIM_2nd_src_EMC Reason for Qualification: Compiled by: Trial-number: misc Introduction of 2nd source mold compounds H-J. Kühl Batch/Lot-number: misc (E500HK, GR646CHN, CV4112) Fab/Assembly: DHAM / ATSN Date: 02-July-2021

Notes:

1. All qualification parts according part specification

2. All SMD qualification parts prior to TC/TCHT/TCDT, AC/UHAST, IOL/PTC, H3TRB/HAST, RSH

3. All qualification parts submitted for testing

4. Required for Thyristors only


6. Required for Voltage Regulators (Zener diodes) only


15. The physical limitations of Schottky diodes have to be considered (thermal runaway)


page 1 of 3












Lots #

Tested #

Failed

8


JESD22-A118, T=130°C, 85% RH, t=96 hrs -16) - -


JESD22-A102, T=121°C, p=15psig, 100% RH, t=96 hrs

12 80 0

9


JESD22-A110, T=130°C, 85% RH, t=96 hrs, reverse biased at 80% of rated voltage

-16) - -

9 alt


JESD22-A101, T=85°C, 85% RH, reverse biased at 80% of rated breakdown voltage, t=2000 hrs

12 80 0

9a


JESD22-A101, T=85°C, 85% RH, parts forward biased

-5) - -

10 Intermittent Operational Life (IOL)

MIL-STD-750 Method 1037, T=25°C, ΔTj≧100°C, ton=toff=2 min, t=2000 hrs

12 80 0

10 alt

Power and Temperature Cycle (PTC)

JESD22-A105, T=-40°C to x°C to obtain

ΔTj≧100°C, ton=toff=2 min, t=1000 hrs -16) 17) - -

11

ESD - Human Body Model (HBM) JESD22-A114, AEC-Q101-001 -8) - -

ESD - Machine Model (MM)

JESD22-A115, AEC-Q101-002 (decommissioned)

-18) - -

ESD - Charged Dev. Model (CDM) JESD22-C101, AEC-Q101-005 -9) - -

12

Destructive Physical Analysis (DPA)

AEC-Q101-004 Section 4 (after H3TRB or HAST, and TC)

12 2x 2 0

13 Physical Dimensions (PD) JESD22-B100 12 30 0

14 Terminal Strength (TS)

MIL-STD-750 Method 2036, evaluate lead integrity of leaded parts only

-11) - -

15 Resistance to Solvents (RTS) JESD22-B107, verify marking permanency -12) - -

Project name: BG505_BIM_2nd_src_EMC Reason for Qualification: Compiled by:

Trial-number: misc Introduction of 2nd source mold compounds H-J. Kühl

Batch/Lot-number: misc (E500HK, GR646CHN, CV4112)

Fab/Assembly: DHAM / ATSN Date: 02-July-2021

Notes:


8. Test passed at initial product release. Not required according Process Change Guidelines for this change

9. Small SMD packages not able to hold enough charge. See AEC-Q101 Section 4.2


11. Required for leaded parts only

12. Not required for laser etched parts or parts with no marking


17. Not required for Transient Voltage Suppressors (TVS)

18. ESD MM decommissioned, see information in JEP172

page 2 of 3












Lots #

Tested #

Failed

16 Constant Acceleration (CA) MIL-STD-750 Method 2006 -13) - -

17 Vibration Variable Frequency (VVF) JESD22-B103 -13) - -

18 Mechanical Shock (MS) JESD22-B104 -13) - -

19 Hermeticity (HER) JESD22-A109 -13) - -

20 Resistance to Solder Heat (RSH)

JESD22-A111, SMD parts shall be fully submerged during test

12 30 0

21 Solderability (SD) J-STD-002, JESD22-B102 4 30 0



MIL-STD-750 Method 2037 10 bonds from min of 5 parts

- - -

24 Bond Shear (BS)

AEC-Q101-003 10 bonds from min of 5 parts

- - -

25 Die Shear (DS) MIL-STD-750 Method 2017 -10) - -

26 Unclamped Inductive Switching (UIS) AEC-Q101-004 Section 2 -7) - -


28


AEC-Q101-006 -14) - -

29 Lead Free (LF) AEC-Q005 - - -

Project name: BG505_BIM_2nd_src_EMC Reason for Qualification: Compiled by: Trial-number: misc Introduction of 2nd source mold compounds H-J. Kühl Batch/Lot-number: misc (E500HK, GR646CHN, CV4112) Fab/Assembly: DHAM / ATSN Date: 02-July-2021

Notes:



13. Required for hermetic packaged parts only

14. Required for smart power parts only

page 3 of 3




8. Electrical and thermal performance

8.1 Electrical performance

Full electrical characterization over temperature range has been performed. Electrical parameters remain

unchanged in specification and with the same distribution.

8.2 Thermal performance

Thermal parameters remain unchanged in specification and with the same distribution.

9. Comparison of visual appearance

There is no change of visual appearance (within specification).

Product GR646 GR646CHN E500HK CV4112

Package

(e.g. PBSS5250TH)

Top view

Bottom view

10. Traceability

Changed product can be identified by date code after implementation.

11. Conclusion

The products will not change functionally. Nexperia does not anticipate any negative impact on fit, form,

function, and reliability.

12. Legal Disclaimer

All rights reserved. Reproduction in whole or in part is prohibited without the prior written consent of the

copyright owner. The information presented in this document does not form part of any quotation or

contract, is believed to be accurate and reliable and may be changed without notice. No liability will be

accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any

license under patent – or other industrial or intellectual property rights.

All information herein is per Nexperia’s best knowledge. This document does not provide for any

representation or warranty express or implied by Nexperia.

Standardized Information for Process/Product Change Notification PLEASE INSERT PCN No. IN HEADER!

1.1 Company

No.

#1

#2

Fo

rm p

rov

ide

d b

y Z

VE

I - Re

vis

ion

4.0

2.1.3 Email

2.1.2 Phone

1.8 Delta to previous revision (optional)

[email protected]

Nexperia B.V.

Change #1

Standardized Information for Process/Product Change Notification (PCN)

2.1 Contact supplier

2.1.1 Name

2. PCN Team

1.6 PCN revision history (optional)

3.0 Ident

1. PCN basic data

1.2 PCN No.

3.1 Category

1.3 Title of PCN change of back side metallization thickness and introduction of new EMCs in SOT23

1.7 Issue date of previous

revision (optional)

2021.10.08

2.2.2 Phone (optional)

2.2 Team supplier (optional)

2.2.3 Email (optional)

202109019F

1.5 Issue date

Customer Support

2.2.1 Name (optional)

PROCESS - WAFER PRODUCTION

PROCESS - ASSEMBLY

Change #2 GR646

EME-E500HK

GR646CHN

CV4112B

3. Changes

GR646

3400FPG (where affected)

3.2 Type of change

SEM-PW-06

No impact to the products' functionality anticipated.4.1 Anticipated impact on

form, fit, function, reliability

or processability?

Old

SEM-PA-11

4.2 Reference parts with

customer number (optional)

1.4 Product Category

4. Description of change

New / change of metallization (specifically chip backside)

Change of mold compound / encapsulation material

back side metallization thickness 2.15 µm back side metallization thickness 1.75 µm

New

1 of 18


issue date

11.1.1

Customer

Part No.

11.1.2 Supplier

Part Name

11.1.3

Supplier

Part No.

(optional)

11.1.4

Package

Name

11.1.5

Part

Description

(optional)

11.1.6

Additional

Part

Information

(optional)

11.2.2

Supplier

Part Name

11.2.3

Supplier Part

No.

(optional)

11.2.4

Package

Name

11.2.6

Additional

Part

Information

(optional)

see SQR see SQR see SQR

9. Input to customer for risk assessment process

8.2 Qualification report and qualification

results

7.5 Qualification samples available?Samples are available upon request.

5.2 Additional explanation (optional) - to increase efficiency of volume production

- to increase flexibility and volume ramp-up

7.4 Intended start of delivery

Changed products can be identified by date code after implementation.

11.1 Current

7. Timing / schedule

2021.11.07

11.2 New (if applicable)

SQR PCN 202109019F

2021.10.08

8.1 Description

(e.g. qual. plan/report, AEC-Q...)

10. Attachments (e.g. new datasheet, additional documentation, pictures, process flow, sample plan, ...)

7.2 Last order date (optional)

2022.02.01

7.3 Last delivery date (optional)

11. Affected parts

7.6 Customer feedback required until

8. Qualification / validation

available (see attachement)

7.1 Date of qualification results

5.1 Motivation

5. Reason / motivation for change

6.1 Description

2021.09.28

6. Marking of parts / traceability of change

2 of 18


3 of 18


1.1

Company

No.

#1

#2

e.g. Change in mold compound could have influence in

reliability and processability / manufacturability.

e.g. PHB series, PSM series

Change #4

Change #5

4.6 Anticipated impact on

form, fit, function, reliability

or processability?

4.7 Reference parts with

customer number (optional)

Change #1 Old mold compound is not longer RoHS compatible. New mold compound will fulfill RoHS requirements.

Change #2 Old mold compound is not longer RoHS compatible. New datasheet will give hint to RoHS compatibility.

Change #3

SEM-DS-02 DATA SHEET Correction of data sheet / errata

SEM-PA-11 PROCESS - ASSEMBLY Change of mold compound

4. Description of change

Old New

3. Changes

3.0 Ident 3.1 Category 3.2 Type of change

2.2.1 Name (optional) 2.2.2 Phone (optional) 2.2.3 Email (optional)

Carl Clever +49 123 987654 [email protected]

2. PCN Team


2.1.1 Name Mr. Mustermann

2.1.2 Phone +49 123 456789

2.1.3 Email [email protected]


e.g. CM1234566 2014.10.10 e.g. Change of mold compound into green mold for D2PAK

Standardized Information for Process/Product Change Notification (PCN)

1. PCN basic data

Fo

rm p

rov

ide

d b

y Z

VE

I - Re

vis

ion

4.0

Your company’s name and address

1.2 PCN No. e.g. CM123456

1.3 Title of PCN e.g. Change of mold compound into green mold for SOT23

1.4 Product Category

1.5 Issue date 2015.01.01

1.6 PCN revision history (optional) 1.7 Issue date of previous

revision (optional)

1.8 Delta to previous revision (optional)

Active Components – Integrated Circuits

4 of 18


issue date

11.1.1

Customer

Part No.

11.1.2 Supplier

Part Name

11.1.3

Supplier

Part No.

(optional)

11.1.4

Package

Name

11.1.5

Part

Description

(optional)

11.1.6

Additional

Part

Information

(optional)

11.2.2

Supplier

Part Name

11.2.3

Supplier Part

No.

(optional)

11.2.4

Package

Name

11.2.6

Additional

Part

Information

(optional)

890400001 BAS10 555 444 002 SOT23 diode see Chap. 10 BAS10-G 555 445 002 SOT23 see Chap. 10






890400007 BZX84B01 556 434 010 SOT23 diode see Chap. 10 BZX84B01-G 556 435 010 SOT23 see Chap. 10





890400012 BZX84B06 556 434 020 SOT23 doide see Chap. 10 BZX84B06-G 556 435 020 SOT23 see Chap. 10





9. Input to customer for risk assessment process

10. Attachments (e.g. new datasheet, additional documentation, pictures, process flow, sample plan, ...)

11. Affected parts

11.1 Current 11.2 New (if applicable)

7.6 Customer feedback required until 2012.02.01

8. Qualification / validation

8.1 Description

(e.g. qual. plan/report, AEC-Q...)

e.g. AEC-Q101

8.2 Qualification report and qualification

resultsavailable (see attachement)

7.3 Last delivery date (optional) 2013.06.30

7.4 Intended start of delivery 2012.06.01

7.5 Qualification samples available?Yes, available (date and/or types):

e.g. BAS21

6.1 Description e.g. Marking will added with the letter G.


7.1 Date of qualification results 2010.06.01

7.2 Last order date (optional) 2013.01.31

5.1 Motivation e.g. Change to RoHS compatible mold compound because of legal restrictions.

5.2 Additional explanation (optional)

6. Marking of parts / traceability of change

5. Reason / motivation for change

5 of 18


6 of 18

date:

date:

date:

Fo

rm p

rov

ided

by

ZV

EI - R

evis

ion

4.0

Customer PCN No.

Supplier PCN No.

We acknowledge qualification / validation as assigned in chapter 8 of the PCN.

Please check the appropriate box below:

We need the following samples:

202109019F

1. Feedback

2. Feedback

Title of PCN:

Customer Feedback/Approval Form

change of back side metallization thickness and introduction of new EMCs in SOT23

We agree with this proposed change schedule and will start with the PCN process. Approval

letter will be sent in written form after evaluation.

We agree with this proposed change for the parts as listed in chapter '11. Affected parts'.

Approval letter will be sent in written form.

We disapprove because:

We need more information:

Estimated closing date for PCN:

Remark:

Final Feedback/Approval

Email:

Address/Location:

[email protected]

Phone:

Address/Location:

Please return to: [your Sales partner]

Fax:

Date:

Name: Customer Support

Sender:

Signature:

Company:

Name:

Final Feedback/Approval date:

We need the following samples:

Estimated closing date for PCN:

Customer Feedback/Approval Form

Title of PCN:

#BEZUG!

Customer PCN No. PCN4567 Supplier PCN No. #BEZUG!

Remark:

2. Feedback

We need more information:

We acknowledge acknowledge qualification / validation as assigned in chapter 8 of the PCN.

At the moment we do not agree to your change. We point out that refering to our specification the parts

have to be delivered unchanged until the necessary measures at our company finished to assure

quality and to introduce the change at our company, and you have got our agreement to deliver the

changed version.

Please check the appropriate box below:

1. Feedback

We agree with this proposed change for the parts as listed in chapter 11. Affected parts.

Approval letter will be sent in written form.

We agree with this proposed change schedule and will start with the PCN Process. Approval

letter will be sent in written form

We disapprove because:

date: 2012.01.28

2012.02.14date:

Fax:

Email: #BEZUG!

Name: #BEZUG!

Address/Location:

Phone:

Address/Location:

#BEZUG!

Signature:

Date:

Please return to: [your Sales partner]

Sender:

Company:

Name:

Fo

rm p

rov

ided

by

ZV

EI - R

evis

ion

4.0


1.1

Company

8. Affected parts


7. Attachments (e.g. additional documentation, pictures, part list….)

6.1 Intended start of delivery

5.1 Description


4. Reason / motivation

4.1 Motivation


5. Marking of parts / traceability

Description #2

Description #5

Description #3

Description #4

Old New

Description #1

3. Description


2.1.2 Phone

2.1.3 Email


2. Contact


2.1.1 Name

1.3 Title of IN

1.4 Issue date

Standardized Information Note (IN)

1. Information Note basic data

1.2 Information Note No.

15 of 18


8.1.1

Customer

Part No.

8.1.2 Supplier

Part Name

8.1.3

Supplier

Part No.

(optional)

8.1.4

Package

Name

8.1.5

Part

Description

(optional)

8.1.6

Additional

Part

Information

(optional)

8.2.2

Supplier

Part Name

8.2.3

Supplier Part

No.

(optional)

8.2.4

Package

Name

8.2.6

Additional

Part

Information

(optional)

16 of 18


1.1

Company

Standardized Information Note (IN)

1. Information Note basic data

ZVEI - Zentralverband Elektrotechnik- und Elektronikindustrie e.V.

ZVEI-German Electrical and Electronic Manufacturers`Association

1.2 Information Note No. e.g.CM1234567

1.3 Title of IN e.g. New company lable and new colour of shipment boxes

1.4 Issue date 2012.01.01

2. Contact


Mr. Mustermann

2.1.3 Email [email protected]



2.1.2 Phone +49 123 456789

2.1.1 Name

Carl Clever +49 123 987654 [email protected]

3. Description

Old New

Description #1 zvei ZVEI

Description #2 blue paper boxes (outer packaging) blue paper boxes with two red dots (outer packaging)

Description #3

5. Marking of parts / traceability

Description #4

Description #5

4. Reason / motivation

4.1 Motivation e.g. New corporate design / corporate identity


8. Affected parts

5.1 Description e.g. New corporate design / corporate identity



6.1 Intended start of delivery2012.02.01

7. Attachments (e.g. additional documentation, pictures, part list….)

17 of 18

mailto:[email protected]

mailto:[email protected]


8.1.1

Customer

Part No.

8.1.2 Supplier

Part Name

8.1.3

Supplier

Part No.

(optional)

8.1.4

Package

Name

8.1.5

Part

Description

(optional)

8.1.6

Additional

Part

Information

(optional)

8.2.2

Supplier

Part Name

8.2.3

Supplier Part

No.

(optional)

8.2.4

Package

Name

8.2.6

Additional

Part

Information

(optional)

see

chapter 7

see

chapter 7

see

chapter 7

see

chapter 7

see

chapter 7

18 of 18

DeltaQualifikationsMatrixAchtung!

Allgemeines

Kurze Produkt- und Technologiezyklen elektronischer Bauelemente sowie neue Umweltauflagen führen häufig zu prozeß- und werkstofftechnischen Änderungen an Bauelementen, Leiterplatten, Verbindungstechnik und Schaltung, welche evaluiert werden müssen. Eine geeignete Methodik zur Handhabung von Änderungen an elektronischen Bauelementen beschreibt die ZVEI "Guideline for Customer Notifications of Product and /or Process Changes (PCN) of Electronic Components specified for Automotive Applications". Ein wesentlicher Teil dieser Guideline sind die hier vorliegenden Matrizen, welche sich als Empfehlungen für die Evaluierung von typischen Änderungen an elektronischen Bauelementen verstehen. Dies sollte Teil des offenen und risikobewussten Dialoges zwischen Lieferant und Kunden sein.Diese DeltaQualifikationsMatrizen wurden durch den Industriearbeitskreis "PCN DeltaQualifikationsMatrix" und den Bauteilexperten des ZVEI Arbeitskreis "PCN-Methodik" erarbeitet. Der Inhalt wurde basierend auf dem aktuellen Stand der Technik erstellt und erhebt keinen Anspruch auf Vollständigkeit. Im Einzelfall ist ggf. ein abweichendes Vorgehen abzustimmen, da kundenspezifische Vereinbarungen zur Qualifikation zu berücksichtigen sind.

Anwendung der DeltaQualifikationsMatrix (auszufüllen durch den Bauelementehersteller)

a) Diese Tabelle ist nur bei Änderungen anzuwenden. Neuqualifikationen und Sonderqualifikation (z.B. Verguß von Modulen) sowie Information Notes bleiben von diesen Matrizen unberührt.b) Ist eine Änderung in dieser Tabelle nicht aufgeführt, so ist der Qualifikationsumfang zwischen Kunde und Lieferant abzustimmen.c) Die Matrix der Aktiven Bauelemente ist so aufgebaut, dass zwischen integrierten Halbleitern (AEC-Q100 Rev. H) und diskreten Halbleitern (AEC-Q101 Rev. D1) auszuwählen ist (Zelle D4). Für passive Bauelemente gilt die AEC-Q200. Für LED's gilt die AEC-Q102. Für Multi-Chip-Module gilt die AEC-Q104.d) Alle Änderungen in der PCN sind in der Spalte B durch ein Kreuz (x) zu markieren und werden dadurch farblich hervorgehoben. Sofern dies geschehen ist, werden im Feld "Tests, which should be considered for the appropriate process change" alle in Betracht zu ziehenden Zuverlässigkeitstests angezeigt.e) In "Tests, which should be considered for the appropriate process change after selection of condition table" wird die Anpassung der in Betracht zu ziehenden Tests in Folge der Relevanz bezüglich der Änderung berücksichtigt. Dazu ist die Tabelle "Conditions" entsprechend der Auswahl (A/B/C) mit einem (x) zu bewerten.f) In "Suppliers performed tests" dokumentiert der Bauelementehersteller die durchgeführten bzw. geplanten Tests.g) Falls von der Testempfehlung abgewichen wird, so sollten diese Abweichungen vom Bauelemente- hersteller angezeigt und kommentiert werden. Hierzu ist der Bereich "Reason for exception of tests" zu verwenden. Werden die in Betracht zu ziehenden Tests durch generische Daten (G) belegt, ist dies ebenfalls hier anzuzeigen und zu begründen.

Die Einstufung des Untersuchungslevel erfolgt in folgende Kategorien

"C: Component level": Die Evaluierung der Änderung am Bauelement ist durch Untersuchungen ausschließlich am Bauelement beim Bauelementehersteller durchführbar. Zur Evaluierung der Änderung dürfen Ergebnisse aus bereits durchgeführten Untersuchungen herangezogen werden, wenn diese zu einem ähnlichen Bauelement bereits vorliegen (Generische Daten).

"B: Board level": Die beschriebene Änderung hat möglicherweise Einfluss auf die Verarbeitbarkeit des Bauelementes im Steuergerät. Die Evaluierung der Änderung wird wie unter C beim Bauelementehersteller durchgeführt. Zusätzlich ist durch den Kunden/Steuergerätehersteller die Verarbeitbarkeit zu prüfen, die z.B. abhängig von der Änderung, Zuverlässigkeitsuntersuchungen auf applikationsrelevanten Testbords erfordert. "A: Application level": Die beschriebene Änderung hat möglicherweise Einfluss auf die Applikation/ das Steuergerät. Die Evaluierung der Änderung wird wie unter C oder B durchgeführt. Zusätzlich ist vom Kunden/Steuergerätehersteller der Einfluss der Änderung im Steuergerät durch geeignete Untersuchungen zu bewerten. Dieses Vorgehen ist mit dem OEM abzustimmen. Hierbei ist zu berücksichtigen, ob die Steuergeräte- / Baugruppenanforderungen durch andere Qualifikationen bereits hinreichend abgesichert sind (applikationsspezifische Risikobetrachtung).

" *: Not relevant for qualification matrix": Änderung(en), die nicht in A, B oder C eingestuft werden können und somit nicht relevant für die DeQuMa sind

Infomation Notes

Änderungen die nur eine Information Note benötigen (bei der Bewertung Risk on Supply Chain als "I" gekennzeichnet ), dürfen nicht in der DeQuMa angekreuzt werden, da Sie ansonsten den erforderlichen Evaluierungslevel verfälschen. Für als "I" bewertete Änderungen ist das Information Note Formblatt zu verwenden.

Wichtige Hinweise

- Zur formgerechten Anwendung der DeltaQualifikationsMatrizen steht auf der Homepage des ZVEI AK ein Tutorial bereit (ZVEI-Tutorial). - ID Nummer: ist eine eindeutige Identifikationsnummer für jede angegebene Änderung, die in den ZVEI PCN DeltaQualifikatiosMatrizen identifiziert ist. Die gleiche ID Nummer wird zur Identifizierung der Änderung im PCN Form Sheet verwendet.- Die mittels Matrix identifizierten Tests sind in Betracht zu ziehen, d.h. es ist zu prüfen, ob der jeweilige Test für die spezifische Änderung in dieser Form notwendig ist. Abweichungen oder generische Daten sind im Detail zu begründen.- Die Spalte "Further applicable conditions", Bemerkungen und Fußnoten sind unbedingt zu beachten, da sie wichtige Hinweise und Einschränkungen enthalten.- Zur Nutzung aller Funktionen muss in Excel die Anwendung von Makros freigegeben sein.

Form provided by ZVEI - Revision 4.1 - November 2019

DeltaQualificationMatrixAttention!General

Short product and technology cycles as well as new environmental regulations frequently result in process and material changes of components, printed circuit boards, assembly techniques and circuit layout which have to be evaluated. The ZVEI "Guideline for Customer Notifications of Product and /or Process Changes (PCN) of Electronic Components specified for Automotive Applications” describes an appropriate methodology for dealing with changed electronic components. The qualification matrices in this guideline are recommendations for how to assess typical changes of electronic components. These recommendations promote an open risk-based discussion between supplier and customer regarding qualifications. The DeltaQualificationMatrices were developed by the Industry Task Force Team "PCN DeltaQualificationMatrix" together with component experts from the ZVEI Working Group "PCN-Methodology". Actual content represents state-of-the-art technology and does not claim to be comprehensive. Deviation from proposed guideline should be mutually agreed as customer specific requirements have to be considered.

DeltaQualificationMatrix Application (completion by component manufacturer)

a) This table has to be used for changes only. The matrices are not applicable for new product, special qualifications (for instance for encapsulation of module) or Information Notes.b) If a change is not listed in this table, the qualification plan has to be defined and agreed between customer and supplier.c) The matrix for Active Components requires the user to choose between integrated circuits (AEC-Q100 Rev. H) and discrete semiconductors (AEC-Q101 Rev. D1) (cell D4). For Passive Components AEC-Q200 is used. For LED'S the AEC-Q102 is used. For Multi-Chip-Modules the AEC-Q104 is used.d) All changes as listed in the PCN have to be marked by a cross (x) in column B and will appear colored. The relevant reliability tests are then shown in "Tests, which should be considered for the appropriate process change". e) In "Tests, which should be considered for the appropriate process change after selection of condition table" is for modification of the found relevant tests under consideration of the weight of change. Related table “Conditions” has to be assessed per proposed letters with an (x).f) In "Suppliers performed tests" the component manufacturer documents the planned and performed tests.g) In case of deviations from tests, which should be considered this should be notified and commented by the component manufacturer in the area "Reason for exception of tests". Test results in form of generic data (G) are allowed when notified and justified.

Evaluation Levels are categorized as follows

"C: Component level": The evaluation of a change at component level by the component manufacturer is sufficient. Generic data from other relevant evaluations can be used.

"B: Board level": The intended change described in the PCN may influence processability / manufacturability of the component at board level. Therefore additional evaluation by customer may be necessary, for example reliability tests on application relevant testboards, depending on change.

"A: Application level": The intended change described in the PCN may influence the properties of the application (e.g. Electronic Control Unit). In addition to the evaluation under C or B the influence of the change in the application is evaluated by suitable investigations by the customer. The scope of the evaluation has to be aligned with the OEM. It has to be considered whether the application / assembly requirements are already sufficiently safeguarded by other qualifications (application

specific risk assessment).

" *: Not relevant for qualification matrix": Changes which fulfill neither A,B nor C definitions

Infomation Notes

Changes indicated as “I” shall not be marked in the DeQuMa. For those changes the Information Note sheet shall be used. As the DeQuMa is desired for PCN only, a marking of “I”-changes would automatically influence evaluation level and test effort.

Important Notes

- To use the matrices in the right form the ZVEI working group provides a Tutorial on its homepage (ZVEI-Tutorial )- ID number: is a unique identification number for each indicated change defined in the ZVEI PCN DeltaQualificationMatrices. The same ID number is used in the PCN Form sheet to identify the change.- Tests identified by the matrix have to be considered and checked if they are necessary to assess the specific change. Test modifications or generic data have to be justified in detail.- "Further applicable conditions", comments and notes need attention, as they provide important hints and limitations.- In order to use all functions in EXCEL, macros have to be allowed.

Version2.02.12.1.12.22.2.22.2.32.2.43.0

3.0.43.0.53.14.0

4.1

RemarksRevised by ZVEI PCN Methodology Workgroup in March 2015Released March 2015Active Components - delete write protection in comments Solved problems with some ActiveX configurationsSolved Problems in Active ComponentsSolved Problems ActiveX, Active Components SEM-DE-02 (Design changes in routing) error fixed Minor fixesGeneral Revision by ZVEI PCN Methodology Workgroup in June 2016Changes are indicated by underlining in the read only version named Changes_DeQuMa_rev3_vs_rev2.xlsx

Expert ReleaseFixing of macro bugsFinal Release (orthographic and punctuation corrections) General Revision by ZVEI PCN Methodology Workgroup in July 2019.Muliti Chip Modules newly added to DeQuMa LED Components now based on the AEC Q102 Further Changes see separate PDF’s Excel-File, where changes are indicated by underlining

LED worksheet: Content of columns had been swapped due to rearrangement and omission of columns.

History of DeQuMa

Christian Tameling

07.10.2021

202109019F

Ev

alu

ati

on

le

ve

l

A /

B /

C

Assessment of impact on Supply Chain regarding following aspects

- contractual agreements - technical interface of processability/manufacturability of customer - form, fit, function, quality performance, reliabil ity

For

Cu

Wir

e P

rodu

cts:

Con

side

r A

EC

-Q00

6

IDType of change No Yes

EV

PV

HT

RB

AC

BV

HT

FB

SS

OP

HT

GB

TC

TC

Ho

tT

C D

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Headi ngs ANY 3 4 5abc 6 7 7ab 8/alt 9/alt/a 10/alt 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29

Headi ngs DATA SHEET

Headi ngs DESIGN

Headi ngs PROCESS - W AFER PRODUCTION

x SEM-PW-06 New / change of backside operation (grinding / metallization) P P

Change of bottom layer of die (between die and leadframe). Change in process, material, or dimensions necessary.Alternative see SEM-PW-09

e. g. change from Cr/NiV/Au to Cr/NiV/Ag C

A: If thermal conductivity is affected (like MOSFET; IGBT, BGA package, stacked dies, …)A: If impact on EMC or ESD behavior cannot be evaluated / excluded on component level.

- ● - - ● - - ● - Z ● ● - - - - - - - - - ● - ● - - ● - - - - - - ● - AEQ-Q100: Applicable to all smart power devices

Headi ngs BARE DIE

Headi ngs PROCESS - ASSEMBLY

x SEM-PA-11 Change of mold compound / encapsulation material P P Change of mold compound / encapsulation material.e.g. change to green mold compounde.g. change of filler particles

C

B: impact on thermo-mechanical stress caused by mismatch of mold compound, interconnecting technology and carrier is anticipated (specific for Power Devices). B: for wave soldered devices A: in case of high frequency signals (> 3GHz) it should be assessed if possible changes in permeability of mold compound could affect signal behavior (e.g. digital signal processor).

- ● ● ● ● ● ● ● ● ● ● ● - ● ● - B - - - H ● ● ● - - - - ● - - A,F,# - - ●

Headi ngs PACKING/SHIPPING

Headi ngs EQUIPMENT

Headi ngs TEST FLOW

Headi ngs Q-GATE

- - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -

- - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - --

X X X X X X X X X X X X X X X n/a X X

only poRequired for smart power parts only

-- Not required.

I Information Note required.

P PCN required.

CONDITIONS No

A Acoustic Microscopy x

B If not laser etched x

C Only for Leadframe Plating change x

D Only for Lead Finish change x

E If Applicable x

F Finite Element Analysis x

G Generic Data available x

H Hermetic device only x

I Infant Mortality Rate x

M Power MOS/IGBT devices only x

P CV Plot (MOS only) x

R Spreading Resistance Profile x

S Steady State Mortality Rate x

X X-Ray x

Z For backside operation changes x

1 If bond pads are affected x

2 Verify #2 (package) post x

3 Only for changes at the periphery x

4 Only for oxide etches or etches prior to oxidation x

5 For source or channel region changes x

6 For field termination changes x

7 For passivation changes x

8 For contact changes x

9 For epitaxial changes x

0 Required for Schottky barrier changes. x

# Glass Transition Temperature x

* For "burn in" changes IOL or ELFR recommended x

=> Please mark 'NO' with 'x', default is 'YES'

- - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -- - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -- - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -- - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -

PCN number:

Date:

Signature:

Worked on:

(Name, Function)


A: A

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Further applicable conditions

Understanding of semiconductors

experts Examples to explain

Remarks

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For integrated circuits or

discrete semiconductors select

below:

A letter or "●" indicates that performance of that stress test should be considered for the appropriate process change.A @ recommended additionally by ZVEI

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Device evaluation

MATERIAL PERFORMANCE TEST RESULTS (on the basis of AEC-Q101 Revision D)

includes e.g. small signal diodes (bipolar - and Schottky diodes), small signal transistors, MOSFETS, IGBTs, power diodes, …

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Reason for exception of tests and/or usage of generic data:

Tests, which should be considered for the appropriate process change.

Suppliers performed tests (mark with an 'X' for done or 'G' for generic)

Mark change with an "x"

AEC-Q101 Revision D

Max Mustermann

Evalu

ati

on

level

A / B

/ C


- contractual agreements - technical interface of processability/manufacturability of customer - form, f it, function, quality performance, reliability

Understanding of semiconductors experts Examples to explain Further applicable conditions

ID Type of change No Yes

Headi ngs ANY

LED-AN-01 Any change with impact on agreed upon technical contractual agreements P PIntended to be used if no other ty pe of change i applicable but the change af f ects agreed technical contractual agreements.

* - - - - - - - - - - - - - - - - - - - - - - - -

LED-AN-02 Any change with impact on technical interf ace or processability /manuf acturabiliy of customer, which is not cov ered in the matrix below P P

See processability on board lev eltechnical interf ace means component terminals

B Check if LED-DS-01 is af f ectedProcessability should be assessed.

- - - - T - - - - - - - - S,T - - - - - - - - - - -


LED-DS-01 Change of datasheet parameters/electrical specif ication (min./max./ty p. v alues) and/or Pulse/DC specif ication P P

Change of application relev ant inf ormation (e.g. maximum pulse current) due to a technical product or process change. e.g. change of die substrate material.

A - - - E E E - E E - - - - S - - E - - E - - - - E

LED-DS-02 Correction of data sheet or issue of errata I I

No technical change of product, process or test. New description of behav iorwhich was not specif ied bef ore or whichis dif f erent f rom initial specif ication.Please indicate clearly , that Inf onote contains this ty pe of change!Assessment in application required

e.g. Erratae.g. change of ty p. v alues due to new inf ormation about component behav ior e.g. improv ed statistics.e.g. reduction of max. allowed f orward v oltage due to improv ed statistics.

A - - - - - - - - - - - - - - - - - - - - - - - - -

LED-DS-03 Specif ication of additional parameters I P

I: Def inition of an additional parameter which was not specif ied bef ore P: If there is a risk on supply chain where at least one additional other PCN-relev ant change category will apply .

I: e.g.: adding new tested parameterI: e.g.: additional temperature coef f icient parameter

A - - - - - - - - - - - - - - - - - - - - - - - - ●Formalism since this is not a product change, ony addtional inf ormationClassif ication: C

Headi ngs DESIGN

LED-DE-01 Design changes in epitaxy . P P

Any dev ice relev ant changes in design / lay out of epitaxial lay ersNot included: Changes within design rules and design specif ication without af f ecting specif ied f unctions, parameters and reliability .

e.g. change f rom Double-hetero to Quantum wellse.g. change of barrier thickness

C A: change f rom Double hetero to Quantum wells --> spectrum is af f ected

- ● - ● - ● ● ● ● - - - - - - - ● H - - - - - - ●

LED-DE-02 Design changes in routing/lay out. P P

Any change in chip design / lay out.Not included: Changes within design rules and design specif ication without af f ecting specif ied f unctions, parameters and reliability .

e.g. change in lay out of current spreader; thickness of current spreadere.g. reduction of bond pad size

CA: change in lay out of current spreader --> radiation pattern changes - ● - ● ● ● ● - - - - - - ● - M ● M M - B B D,M - ● TR might be considered f or complex die bond technologies

LED-DE-03 Die shrink P PShrink of activ e area.Not included: sawing street/kerf /scribe line

Ty pical shrink of die. APlease check if change in process technology (LED-PW-08) is also af f ected.

- ● - ● ● ● ● ● ● - - - - ● - - ● - - ● B B ● - ●

LED-DE-04 LED package (except leadf rame) P Pany change in housing thicknessany change in f orm or dimensions

e.g. change of dimensionse.g. change of x, y , or z dimension of the package B

Check if LED-DS-02 is af f ected which leads to a change of the elctrooptic parameters or distributions.

- ● - ● ● ● ● - - ● - V V ● T D - D D L B B D - ●

LED-DE-05 Design of leadf rame P Pany change of leadf rame / carrier dimensionsany change of outer dimensions

e.g. change in leadf rame / carrier dimensions in x,y , or z directione.g. change inner design of the leadf eame not af f ecting the e/o perf ormance & reliability of the dev ice

BCheck if LED-DS-02 is af f ected which leads to a change of the elctrooptic parameters or distributions.

- - ● ● ● ● ● ● ● ● - V V ● T - - - - ● B B D 2 ●

Headi ngs PROCESS - WAFER PRODUCTION

LED-PW-01 New / change of waf er substrate or carrier material P P New waf er substrate material.e.g. dif f erent waf er material to currently released material (change f rom Sapphire to Silicon)

CCheck if LED-DS-02 is af f ected which leads to a change of the elctrooptic parameters or distributions.

- ● ● ● P P ● P P - - - - ● - P ● P P ● - - ● - ●

LED-PW-02 Waf er diameter P Pchange of waf er diameter resulting in equipment and process changes

e.g. 4" to 6" C

In case other ty pe of changes are af f ected i.e equipment/process technology - they need to be identif ied in addition

● ● ● ● - ● - P P - - - - ● - - ● - - ● - - - ●

LED-PW-03 New f inal waf er thickness P P Change in f inal waf er thickness e.g. change in f inal chip/die thickness CCheck if LED-DS-02 is af f ected which leads to a change of the elctrooptic parameters or distributions.

- ● - ● ● P ● P P - - - - - - - ● - - ● B B ● - ●

LED-PW-04 Change of electrically activ e doping/implantation element P PChange in electrically activ e doping / implantation element resulting in a new technology .

e.g. change f rom Be to C as dopant C - ● C ● - C C ● ● - - - - - - - ● - - ● - - - - ●

LED-PW-05 Change of stacking P P change in lay er sequence or thicknesse.g. change of isolation lay er thickness between n- and p-material

Acustomer application needs to be checked due to potential sy stem v oltage dif f erences

- - - ● F ● ● ● ● - - - - - - - ● F - - - - - - ●

LED-PW-06 New / change of metallization (specif ically chip f rontside) P P Change in metallization of bondpads, material, lay er thickness e.g. change in bond pad metallization thickness C - ● M ● ● ● ● M,B M,B - - - - - - M ● M M - ● ● - - ●

LED-PW-07 New / change of metallization (specif ically chip backside) P PChange of bottom lay er of die (between die and leadf rame/carrier). Change in process, material, or dimensions necessary .

e.g. change f rom Au to Au/Ge CA: customer application needs to be checked due to potential sy stem v oltage dif f erences

- ● M ● ● ● ● D,M D,M - - - - ● - D,M ● D,M D,M D,M - - ● - ●

LED-PW-08 Change in process technique (e.g. signif icant process changes like lithography , etch, oxide deposition, die back surf ace preparation/backgrind, ...) -- P

Change f rom wet to dry etching, change f rom horizontal to v ertical ov en f or oxidation, change f rom contact litho into stepper litho, …

e.g. change f rom wet etch to dry etche.g. change f rom laser cutting (sawing) to plasma cutting (sawing)e.g. change f rom contact litho to stepper litho

C

B: change f rom CVD dep to sputter dep f or backside/f rontside metallization.In case of new equipment please check if LED-PA-14 is also af f ected.

- ● - - - - - - - - - - - - - - - - - - - - - - - Qualif ication ef f ort depends on ty pe of change.

LED-PW-09 Process Integrity : Tuning within specif ication -- P Variation within process specif ication e.g. process control C - - - - - - - - - - - - - - - - - - - - - - - - _

LED-PW-10 Change of material supplier with no impact on agreed specif ications -- PChange of waf er supplier. Change of supplier f or chemicals needed f or waf er production.

e.g. Change of waf er supplier. C - ● - - - - - - - - - - - - - - - - - - - - - - - Qualif ication ef f ort depends on ty pe of change.

LED-PW-11 Change of specif ied waf er process sequence (deletion and/or additional process step) -- PAny change which is not cov ered by another ty pe of change. Risk is to be assessed.

e.g. additional cleaning process in waf er production C - - - - - - - - - - - - - - - - - - - - - - - - - Qualif ication ef f ort depends on ty pe of change.PPAP has to be updated.

LED-PW-12 Change in die coating or passiv aton P PChange in material, thickness, and process f or coating and passiv ation

e.g. change f rom SiO2 to SiN3 C - ● P ● ● ● P P P - - - - - - P - P P - P P - - ●

LED-PW-13 New waf er production location or transf er of waf er production to a dif f erent not prev iously released location/site/subcontractor P P

New waf er propduction location or transf er of waf er production with possible additional changes.

C

A or B: Impact on other ty pe of changes described under PROCESS - WAFER PRODUCTION and EQUIPMENT categories of this DeQuMa

● ● - ● ● ● - ● ● - - - - ● - - ● - - J ● ● ● - ●

Headi ngs BARE DIE DELIVERIES

LED-BD-01 New / change of f ront side metallization P PChange in bondpads, material, pad pitch, surf ace changes, lay er thickness

e.g. change f rom Au to Au alloye.g. change in ov er pad metalization

B - - M ● ● ● ● M,B M,B - - - - - - ● ● ● ● ● ● ● - - -

LED-BD-02 New / change of backside metallization P PChange of bottom lay er of die (between die and leadf rame/carrier). Change in process, material, or dimensions.

e.g. change f rom Au to Au alloy BCheck if LED-DS-02 is af f ected which leads to a change of the elctrooptic parameters or distributions.

- - M ● ● ● ● D,M D,M - - - - ● - ● ● ● ● ● - - ● - -customer application needs to be checked due to potential sy stem v oltage dif f erences

LED-BD-03 Change of waf er setup or number of dies on waf er. I P

Needed inf ormation f or pick & place machine.I: only additional number of chipsP: change in spacing between chips and f orm of waf er

e.g. inf ormation change f or pick & place machine. B - - - - - - - - - - - - - - - - - - - - - - - - -

LED-BD-04 New f inal waf er thickness P PChanges in f inal Chip height (including carrier); v ery rare and usually combined with a material change (change of carrier material)

e.g. change on conv erter thickness B Check if LED-DS-01 is also af f ected.- - P ● ● P ● P P ● - - - ● - - ● - - ● B B ● - ●

LED-BD-05 Change in die coating or passiv ation P PChange in material, thickness, and process f or coating and passiv ation

e.g. change f rom SiO2 to SiN3 B Check if LED-DS-01 is also af f ected.- ● P ● ● ● P P P - - - - ● - P - P P - P P - - ●

Headi ngs PROCESS - ASSEMBLY

LED-PA-01 Change of leadf rame/carrier base material P P New leadf rame/carrier material (new in composition) e.g. change f rom copper alloy to bare copper BCheck if LED-DS-02 is af f ected which leads to a change of the elctrooptic parameters or distributions.

- ● ● P ● ● - - - - 3 - - ● ● A - A A P,1 ● ● ● P - Explanation should be prov ided in case H2S test is not applicableRegarding applicable materials please ref er to the Whisker standard.

LED-PA-02 Change of leadf rame/carrier f inishing material (internal) P PChange of surf ace material of die attach pad and second bond area (e.g. inf luence in adhesion to mold compound, wedge bond reliability )

e.g. change f rom Ag f lash to NiPd protection lay ere.g. change f rom Ag spot to Au spot

A - ● ● P ● ● ● - - - - - - ● ● A - A A P,1 ● ● ● - -H2S test should be considered f or automotiv e exterrior applications.explanation should be prov ided in case H2S test is not applicable

LED-PA-03 Change of lead and heat slug plating material/plating thickness (external) P P

Change in material and process technique f or f inal pin termination (e.g. pure tin). Herein package, processability and reliability on board lev el can be v erif ied by generic data. Classif ication depends on impact of change

e.g. change in heat slug stacke.g. change f rom Sn into Ni/Pd/Aue.g. change of lay er thickness

B - - M P ● K - - - 1 - - - ● ● A - A A P,1 - - - K - Explanation should be prov ided in case H2S test is not applicableRegarding applicable materials please ref er to the Whisker standard.

LED-PA-04 Bump Material / Metall Sy stem (internal) P P Stack die or die to substrate e.g. change to Pb-f ree material A - - ● ● ● ● ● - - - - - - ● - W - W W ● - - ● - -

LED-PA-05 Die attach material P PChange of die attach material (e.g. sof t solder, epoxy , etc). Thermal managment must be respected.

e.g. change of Ag glue to Au glue; B - ● ● ● ● ● ● - - - - N N ● - Q - N Q ● - - ● - -

LED-PA-06 Change of bond wire material P P Material, wire diameter, change in process technique e.g. change f rom 30µ to 25µ A - ● ● ● ● P,D ● - - - - D D ● - P,D ● - P,D - ● ● - - - Site audit f or material change with impact on bondprocess (e.g. f rom Au to Cu) recommended.

LED-PA-07 Change in material f or sub-components (excluding LED chip & LED package related items) with impact on agreed specif ications P P

Change of sub-component supplier using dif f erent technology /materialsNote: Jump start test at OEMs might be necessary

e.g. using a dif f erent ESD-diode in technology and material than prev iously

A Check if LED-DS-01 is also af f ected.- - - - - - - - - - - - - - - - - - - - - - - - - Qualif ication ef f ort depends on ty pe of change.

LED-PA-08 Die Ov ercoat / Underf ill -- P

Supporting lay ers f or complex packages like f lip chip.--: No change in product integrityP: change can inf luence the integrity of f inal product

P: e.g. change of underf ill with change of thermal resistance

B Check if LED-DS-01 is also af f ected.- ● P ● ● P ● - - - - - P ● - P ● - P U - - U - -

LED-PA-09 Change of mold compound/encapsulation/sealing material P P

Change of mold compound, encapsulation, or sealing material might be af f ected optical f unction in case of package related ef f ect (e.g. browning). Component assembly and board coating has to be assessed. MSL might be changed.

e.g. PPA mold compound A Check if LED-DS-01 is also af f ected.- ● ● ● - ● ● - - D 3 D D ● T P P P P P - - - - -

LED-PA-10 Change of conv ersion material P P Change of material class. e.g. change f rom granats to nitrides C Check if LED-DS-01 is af f ected f or optical/photometric parameters - ● ● ● Y ● ● - - - - Y Y ● - P P P P Y - - - - ●

LED-PA-11 Change of direct supplier f or conv erter material -- P New supplier with same material specif ication C - - ● ● P ● ● - - - - P P ● - P P P P P - - - - ●

LED-PA-12 Change of conv erter process technology I P

new technology f or conv erter productionI: no inf luence on e/o perf ormance of productP: in case of impact on product integrity

e.g. change f rom v olume conv ersion to lay er conv ersion; e.g. change f rom stamping to printing of lay er

CCheck if any change in electro-optical characteristics results in change of data sheet LED-DS-01

- ● - ● Y ● ● - - - - Y Y ● - Z Z Z Z Y - - - - ●

LED-PA-13 Change of product marking I P

Marking on dev ice.I: change in appearance; readability not af f ectedP: change of content or change of appearance of data matrix code

e.g. marking of cathode; B - - - - O - - - - - - - - T T - - - - - - - - - -

LED-PA-14 Change in process technique (e.g., die attach, bonding, moulding, plating, trim and f orm, …) P P Any change in assembly process technique e.g. change die attached f rom gluing to soldering; BA or B: Please check if EQUIPMENT and other ty pe of changes of material (LED-

PA-04/05/06/07/08/09/10) are af f ected - ● - - - - - - - - - - - - - - - - - - - - - - - Qualif ication ef f ort depends on ty pe of change.

LED-PA-15 Process Integrity : Tuning within specif ication -- P Variation within process specif ication e.g. process control C - - - - - - - - - - - - - - - - - - - - - - - - -

LED-PA-16 Change of direct material supplier with no impact on specif ication -- PChange of suppliers e.g. f or lead f rames, wire material, die attach, electronical components …

Change of suppliers e.g. f or lead f rames, wire material, ESD-diode …

CAssumption that change material specif ication remains unchanged. Otherwise see change of material.

- - ● - - - - - - - - - - - - - - - - - - - - - - See change of material.

LED-PA-17 Change of specif ied assembly process sequence (additional and/or deletion of process step) I P

Addition or deletion of a process step in assembly process sequence with potentially signif icant impact on the product perf ormanceI: no inf luence on product integrityP: inf luence on product integrity expected

e.g. additional or deletion plasma cleaning process C Single case assessment necessary to identif y possible interactions or risk. - - - - - - - - - - - - - - - - - - - - - - - - - Qualif ication ef f ort depends on ty pe of change.

LED-PA-18 New assembly location or transf er of assembly to a dif f erent not prev iously released location/site/subcontractor P P

New assembly location, assembly transf er or relocation. Transf er of known technology and equipment.

e.g. Dual source strategy CA or B: Impact on other ty pe of changes described under PROCESS ASSEMBLY

and EQUIPMENT

● ● - - - - - - - - - - - - - - - - - - - - - - - Qualif ication ef f ort depends on ty pe of change.


LED-PS-01 Inner Packing/shipping specif ication change P P dimension change of direct product packing e.g. SMT pocket in tape changes B- - P - - - - P P - - - - - T - - - - - - - - - -

LED-PS-02 Outer Packing/shipping specif ication change I P

dimension changes indirect product packingI: small changes in dimension or appearanceP: number of reels in the packing are changing

e.g. pizza box *

-- - - - - - - - - - - - - - - - - - - - - - - -

LED-PS-03 Change of labelling I P

Change of labelling also on reel.I: additional inf ormation no change of prev ious inf ormationP: change in content of prev ious inf ormation

(I) e.g. additional inf ormation (RoHS stamp)(P) e.g. change of customer specif ic inf ormation

B Check if LED-DS-01 is also af f ected.

-- - - - - - - - - - - - - - - - - - - - - - - -

LED-PS-04 Dry pack requirement change P P Change of dry pack requirements (change in MSL) e.g. change f rom MSL3 to MSL1 * Check if LED-DS-02 is also af f ected. -- - - - - - - - - - - - - - - - - - - - - - - -

Headi ngs EQUIPMENT

LED-EQ-01 Production f rom a new equipment/tool which uses a dif f erent basic technology P P

Change in process technique which is not already cov ered abov e.Note: Major changes af f ecting the product not cov ered by the table require also a PCN.

e.g change f rom single waf er to batch process e.g. ov er pad metalisatione.g. dambar cutting (mechanical to laser cutting)

BCheck if LED-DS-01 is also af f ected.Corrosion stability should be assessed. - ● - - - - - - - - - - - - - - - - - - - - - - - Qualif ication ef f ort depends on ty pe of change.

LED-EQ-02 Production f rom a new equipment/tool which uses the same basic technology (replacement equipment or extension of existing equipment pool) without change of process. -- P

PCN required f or dedicated equipment f or sensitiv e component production.

e.g. change f rom single site to multi site handler. C - ● - - - - - - - - - - - - - - - - - - - - - - - Qualif ication ef f ort depends on ty pe of change.

LED-EQ-03 Change in f inal test equipment ty pe that uses a dif f erent technology I P

Change of tester platf orm (e.g. major test program changes , new tester interf ace, …).I: product specif ication is not af f ectedP: product specif ication is af f ected

e.g. change in test method f rom cd to lumen B - ● - - - - - ● ● - - - - - T - - - - - - - - - ● Gage R&R / delta correlation

Headi ngs TEST FLOW

LED-TF-01 Mov e of all or part of electrical waf er test and/or f inal test to a dif f erent location/site/subcontractor P P Tester transf er or relocation. e.g. Dual source strategy C ● - - B ● ● B ● ● - - - - ● T - B - - - B B B - ● Gage R&R / delta correlation; addtional specif ication checkB should be considered f or Waf er testing

Headi ngs Q-GATE

LED-QG-01Change of the test cov erage/testing process f low used by the supplier to ensure data sheet compliance (e.g. elimination/addition of electrical measurement/test f low block; relaxation/enhancement of monitoring procedure or sampling)

-- PReduction or additional control steps, test cov erage within the process f low

e.g. test f low block like Final test / f inal clearance C - - - - - - - - - - - - - - - - - - - - - - - - ●

- - - - - - - - - - - - - - - - - - - - - - - - -

- - - - - - - - - - - - - - - - - - - - - - - - -



-- Not required.


P PCN required.

CONDITIONS NoA Not for Ag plated devices applicable (Ag intended to fail for this test)B Only if Bondarea/Wirebond is changed/affectedC Only if dopand/implantation material is changedD Only if Dimensions are changingE Only if min/max Values are changingF Sequence change onlyH Non Epoxy Casted Devices onlyJ Only for chip technology using w afer bondingK Not for Au plated devicesL Only if Leadframe/Substrate Dimensions are changedM Only if metal composition is changed including sequenceN Only for glued chips O Only if process is changingP Only if material properties are changedQ Only if glue components are changingR Only if marking technology changesS Only if Floor Life is affectedT Only if Board Reliability is affectedU Only if underfill is affectedV Only for non-hermetic devicesW Only if risk of corrosion is increasingY Only for layer technologyZ Only if conversion technology changes1 Only if data sheet parameters are affected2 Only if outer dimensions are critical3 Only for leaded parts

=> Please mark 'NO' w ith 'x', default is 'YES'

- - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -

- - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -

- - - - - - - - - - - - - - - - - - - - - - - - -

Worked on:

(Name, Function)

Date:

PCN number:

Signature:

Form prov ided by ZVEI - Rev ision 4.1 - Nov ember 2019

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Device evaluation

MATERIAL PERFORMANCE TEST RESULTS (on the basis of AEC Q102 – Revision March15, 2017)

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- contractual agreements - technical interface of processability/manufacturability of customer - form, fit, function, quality performance, reliability

ID Type of change No Yes

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Headi ngs ANY A2 A3 A4 A5 A6 B1 B2 B3 C1 C2 C3 C4 C5 C6 C7 E2 E3 E4 E5 E6 E7 E8 E9 G1-4 G5 G6 G7 G8 H1 H2 H3 H4 H5 H6 H7

MCM-AN-01 Any change with impact on agreed upon technical contractual agreements P PIntended to be used if no other type of change is applicable but the change affects agreed technical contractual agreements.

* - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -

MCM-AN-02Any change with impact on processability/manufacturability at customer, which is not covered in the matrix below.

P PAny change which is not covered in the matrix below, but risk assessment at customer is recommended.

B - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -


MCM-DS-01Change of datasheet parameters/electrical specification (min./max./typ. values) and/or AC/DC specification

P PUpdate of data sheet because of technical change of the product.

e.g. recommendations for pull-up/pull-down or NC pins, MSL

A - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -

MCM-DS-02 Correction of data sheet / errata I I

No technical change of product, process or test.New description of behaviour which was not specified before or which is different from initial specification.Please indicate clearly, that Info note contains this type of change!Assessment in application required!

e.g. Errata A - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -

MCM-DS-03 Specification of additional parameters I P

Description of a new not previously covered parameter. No technical change of the product.(I): Definition of new parameter which was not documented before.(P): Not known as single change. Only in combination with other changes.

(I): e.g. adding new tested parameter. A - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -

Headi ngs DESIGN

MCM-DE-01 Firmware modification I P

Integrated software by design or memory as defined by supplier.(I): Firmware modification or update without effect of functional performance at the customer (bug fix).(P): Firmware modification or update with effect of functional or reliabil ity performance at the customer.

(I): e.g. addition of Firmware opportunities(P): e.g. bug fix with impact on functional performance

A - - ● - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -

MCM-DE-02 Change that adds or subtracts sub-components from the module BOM P P e.g. addition of passive elements in fi lter circuit A ● ● @ ● ● ● @ ● @ ● ● ● - - - - - - - - ● ● ● ● ● ● ● M @ ●,D - - @ F - - - - - - - - - - ●

Headi ngs PROCESS - ASSEMBLY - MATERIALS

MCM-PA-01 Replacement of any sub-component by a Non-AEC qualified sub-component P P

Change from an AEC Qualified sub-component to a Non-AEC Qualified sub-component orChange from a Non-AEC Qualified sub-component to another Non-AEC Qualified sub-component

A ● ● ● ● ● ● ● ● ● ● - - - - - - ● ● ● ● ● ● ● M @●,D @ ● - @ F - - - - - @ ● @ ● @ ● - - ●

MCM-PA-02Replacement of any sub-component by an AEC qualified sub-component

P P

Change from one AEC Qualified sub-component toanother AEC Qualified sub-componentChange from a Non-AEC Qualified sub-component to an AEC Qualified sub-componente.g. with impact on electrical robustness (ESD, latch up, …) electrical functionality, test

A Requires additional evidence that new sub-component is AEC qualified ● ● - - - - - ● - ● - - - - - - ● ● ● ● ● ● ● M @●,D @ ● - @ F - - - - - @ ● @ ● @ ● - - ●

MCM-PA-03Replacement of any sub-component by an AEC qualified sub-component Critical characteristics of sub-component are not affected

I Pe.g. with no impact on electrical robustness (ESD, latch up, …) electrical functionality, test coverage

C Requires additional evidence that new sub-component is AEC qualified ● ● - - - - - @ ● - @ ● - - - - - - @ ● @ ● @ ● @ ● @ ● ● ● @ M @●,D @ ● - @ F - - - - - @ ● @ ● @ ● - - ●

MCM-PA-04Change within a sub-component that has been requalifiedCritical characteristics of sub-component are affected

P Pe.g. with impact on electrical robustness (ESD, latch up, …) electrical functionality, test coverage

ARequires additional use of the appropriate ZVEI DeQuMa

(e.g. active, passive component) for qualification of the changed sub-component

● ● - - - - - ● - ● - - - - - - ● ● ● ● ● ● ● M @●,D - - @ F - - - - - - - - - - ●

MCM-PA-05Change within a sub-component that has been requalifiedCritical characteristics of sub-component are not affected

I Pe.g. with no impact on electrical robustness (ESD, latch up, …) electrical functionality, test coverage

CRequires additional use of the appropriate ZVEI DeQuMa

(e.g. active, passive component) for qualification of the changed sub-component

● ● - - - - - @ ● - @ ● - - - - - - @ ● @ ● @ ● ● @ ● @ ● ● @ M @●,D - - @ F - - - - - - - - - - ●

MCM-PA-06Substrate change affecting module schematic(Changes to the internal dimensions and / or schematics) P P

Design change and routingChange in substrate, leadframe dimensions which has impact to the specified electrical parameter acc. data sheet or specification (e.g. heat sink, pin dimensions, die paddle size, ...)Not included: Variation within specification.

A ● ● @ ● ● ● @ K - ● ● - @ ● @ ● - - - - - ● ● ● ● ● ● ● M - - - - - - - - - @ ● - - - - ●

MCM-PA-07Change to the processes used in module assembly (e.g., pick & place, die attach, bonding, reflow, encapsulation, singulation, die overcoat, underfi l l, die preparation, die clean) - P

(--): If the change in process technology does not influence the integrity of the final product.(P): If the change in process technology can influence the integrity of the final product.

(--): e.g. tuning within process specification C ● - ● - ● @ K - @ A - - ● ● - ● ● - ● - - - @ H - @ ● - - - - - - - - - - - @ ● - - - - ●

MCM-PA-08 Process integrity: tuning within specification - P

Variation within process specification(--): If tuning within process specification does not influence the integrity of the final product.(P): If impact on product specification is anticipated.

(--): e.g. process control C - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -

MCM-PA-09Change to materials used in module assembly (e.g., adhesive, underfi l l, encapsulate, solder, epoxy, bump material, die attach material, bond wire, die overcoat, substrate, leadframe base material)

P P

Change of used material (e.g. bump material, die attach material, soft solder, epoxy, etc.)Change of bond wire material, diameter, change in bonding diagram

e.g. Stack die or die to substrate (fl ip chip)e. g. change to Pb-free materiale. g. change of copper pil larse.g. change from Sn into Ni/Pd/Au

C

B: impact on thermomechanical stress caused by mismatch of mold compound, interconnecting technology and carrier is

anticipatedB: external lead finishing material is affected

● ● ● - ● @ K @ ● @ E @ E - ● ● ● ● ● ● - - - - ● - @ ● - - - - - - - - - - - @ ● - - - - ●

MCM-PA-10 Change of direct material supplier - P

Change of suppliers for direct materials which are used in assembly process (BOM).(--): If change does not influence the integrity of the final product.(P): If impact on product integrity is anticipated.

(--): e.g. change of wire material supplier.(P): e.g. change to new mold compound suppliere.g. additional leadframe supplier with specific leadframe manufacturing technologye.g. additional or new substrate supplier

C Please check if material is changed! - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - See change of material.

MCM-PA-11Change to assembly location(Move all or parts of production to a different assembly site)

P PAssembly transfer or relocationIncludes transfer as well as additional site

e.g. dual source / fab strategy C

A or B: impact on other type of changes described under PROCESS ASSEMBLY and SEM-EQ-01.

In case of Cu wire product please consider AEC-Q006.

● ● - ● ● ● @ K - ● ● - ● ● ● ● @ T ● - - - ● - @ ● - - - - - - - - - @ ● - @ ● ●Whisker tests have to be done on monitoring basis!

AEC-Q100: "For broad changes that involve multiple attributes (e.g., site, materials, processes), refer to section A1.3 of this appendix and section 2.3 of Q100, which allows for the selection of worst-case test vehicles to cover all the possible permutations."

MCM-PA-12 Change of product marking I P

Change of marking on device and / or change in process resulting in a new technology..(I): If change does not influence the integrity of the final product.(P): If impact on product integrity is anticipated.

(I): e.g. change of appearance (additional marking)(P): e.g. change from inked marking to laser markinge.g. marking of pin 1

B - - - - - - - - - - - - - B - - - - - - - - - - - - - - - - - - - - - - - - - -


MCM-PS-01 Packing/shipping specification change P P Packing/shipping specification change. * - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -

MCM-PS-02 Dry pack requirements change P PChange of dry pack requirements (e.g. change of MSL)

*- - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -

MCM-PS-03 Change of carrier (tray, reel) P P Change of carrier (tray, reel) B - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -

MCM-PS-04 Change of labelling I P

Change of labelling also on reel.(I): Change of material label without impact on barcode.(P): Changes of material label information which affects data processing at customer.

(I) e.g. additional information (RoHS stamp)(P) e.g. change of defined nomenclature for data processing

B

-

- - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -

Headi ngs EQUIPMENT

MCM-EQ-01Production from a new equipment/tool which uses a different basic technology or which due to its unique form or function can be expected to influence the integrity of the final product

P PChange in process technique which is not already covered above.

Change from single wafer to batch process (e.g. over pad metall ization)e.g. dambar cutting (mechanical to laser cutting)

A - - - - - - - - - - - - - - - - - - - - ● - @ ● - - - - - - - - - - - - - - - - ● Affected process change is to check.

MCM-EQ-02Production from a new equipment/tool which uses the same basic technology (replacement equipment or extension of existing equipment pool) without change of process. - P

PCN required for dedicated equipment for sensitive component production.(--): If change does not influence the integrity of the final product.(P): If impact on product integrity is anticipated.

(--): e.g. extension of existing equipment pool(P): e.g. extension of dedicated equipment in case basic technology sti l l need to be proven

C - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -

MCM-EQ-03Change to testing platform(Change in final test equipment type leading to a different test concept)

P PChange of tester platform with differences in HW or SW that makes a change in test concept necessary

e. g. change tester equipment from LTX to Teradyne

C - ● - - - - - - - - - - - - - - - - - - ● - @ ● - - - - - - - - - - - - - - - - ● Gage R&R / delta correlation

Headi ngs TEST FLOW

MCM-TF-01Change to testing location(Move of all or part of the final test to a different test site) P P

Tester transfer or relocation. Check impact on MCM-AN-01Includes transfer as well as additional site

Dual source strategy C ● ● - - - - - - - - - - - - - - - - - - ● - @ ● - - - - - - - - - - - - - - - - ● Gage R&R / delta correlation

Headi ngs Q-GATE

MCM-QG-01Change of the test coverage/testing process flow used by the supplier to ensure data sheet compliance (e.g. elimination/addition of electrical measurement/test flow block; relaxation/enhancement of monitoring procedure or sampling)

- P

e.g. test flow block, reduction from three temperature measurements to two temperature measurements, change in burn in / run in process.(--): If change does not influence the integrity of the final product.(P): If impact on product integrity is anticipated.

(--): e.g. test implemented without customer requirement(P): e.g. reduction from three temperature measurements to two temperature measurementse.g. change in burn in / run in process.

C ● - - - - - - - - * - - - - - - - - - - ● - @ ● - - - - - - - - - - - - - - - - ●Parameter Analysis: Delta correlation

* For "burn in" changes ELFR recommended

- - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -

- - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -- -

-- Not required.


P PCN required.

CONDITIONS No

A die preparation and/or die cleanB For symbol rework, new cure time, temp C If bond to leadfinger (requirement in Q100)D G1 - G3; no G4E only for bare die and change of mold compoundF bare die sub-component onlyH processes for material in direct contact with die surfaces K For devices requiring PTC (requirement in Q100)M Applicable for subcomponents with > 1M SRAM or DRAM per AEC-Q100T Only for Solder Ball SMD (requirement in Q100)* For "burn in" changes IOL or ELFR recommended


- - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -- -- - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -- -- - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -- -- - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -- -

Worked on:

(Name, Function)

Date:

PCN number:

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Signature:


Device evaluation

MATERIAL PERFORMANCE TEST RESULTS on the basis of AEC-Q104 Revision -September 14, 2017 additional to

AEC-Q10x


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Shear

Low

Tem

pera

ture

Sto

rage L

ife

Sta

rt U

p a

nd T

em

pera

ture

Ste

ps

MC

M D

rop T

est

Lid

Torq

ue

X-r

ay / C

SA

M

Ele

ctr

onic

Dis

charg

eH

um

an B

ody M

odel

Ele

ctr

onic

Dis

charg

eC

harg

ed D

evic

e M

odel

Latc

h u

p

Ele

ctr

ical D

istr

ibutio

n

Fault

Gra

din

g

Chara

cte

risatio

n

Ele

ctr

om

agnetic

Com

patib

ility

Soft E

rror

Rate

Herm

etic

Package T

est

Package D

rop

Pa

ram

ete

r-A

na

lysi

s:

Co

mp

aris

on

of

curr

en

t w

ith c

ha

ng

ed

de

vice

cha

ract

eriz

atio

n,

ele

ctric

al d

istr

ibu

tion

RemarksRemaining

risks within

Supply

Chain? Understanding of semiconductors


A

: A

pp

lica

tion

leve

l

B:

Bo

ard

leve

l

C:

Co

mp

on

en

t le

vel

*

: N

ot

rele

van

t fo

r q

ua

lific

atio

n m

atr

ix

Destr

uctiv

e P

hysic

al A

naly

sis

X-r

ay

Acoustic

Mic

roscopy

Wh

iske

r te

st(I

EC

60

06

8-T

2-8

2,

JED

EC

JE

SD

20

1)

Die

Shear

Inte

rnal W

ate

r V

apor

Board

Level R

elia

bility





A letter or "●" indicates that performance of that stress test should be considered for the appropriate process change.A @ recommended additionally by ZVEI.


Selection of

componentID

NETWORKS & RESISTORS Headings


NETWORKS & RESISTORSPAS-RES-AN-01

NETWORKS & RESISTORSPAS-RES-AN-02


NETWORKS & RESISTORSPAS-RES-DS-01

Worked on:

(Name, Function)

Date:

PCN number:

Signature:


NETWORKS & RESISTORS

PAS-RES-DS-02


PAS-RES-DS-03


NETWORKS & RESISTORSPAS-RES-MA-01


PAS-RES-MA-02



NETWORKS & RESISTORS PAS-RES-MA-05


PAS-RES-MA-06


NETWORKS & RESISTORS PAS-RES-DE-01

NETWORKS & RESISTORS PAS-RES-DE-02



PAS-RES-PR-01

NETWORKS & RESISTORS PAS-RES-PR-02



NETWORKS & RESISTORSPAS-RES-PR-05

NETWORKS & RESISTORSPAS-RES-PR-06




NETWORKS & RESISTORS PAS-RES-PN-01

NETWORKS & RESISTORSPAS-RES-PN-02

NETWORKS & RESISTORSPAS-RES-PN-03



PAS-RES-PV-01


PAS-RES-PV-02


PAS-RES-PV-03



PAS-RES-EQ-01


PAS-RES-EQ-02


PAS-RES-EQ-03



PAS-RES-PF-01


PAS-RES-PF-02



PAS-RES-QG-01

INDUCTORS Headings

INDUCTORS Headings

INDUCTORSPAS-IND-AN-01

INDUCTORSPAS-IND-AN-02

INDUCTORS Headings

INDUCTORS

PAS-IND-DS-01

INDUCTORS

PAS-IND-DS-02

INDUCTORS

PAS-IND-DS-03

INDUCTORS Headings

INDUCTORS

PAS-IND-MA-01

INDUCTORSPAS-IND-MA-02

INDUCTORS

PAS-IND-MA-03


INDUCTORS

PAS-IND-MA-05

INDUCTORS

PAS-IND-MA-06

INDUCTORS

PAS-IND-MA-07

INDUCTORS

PAS-IND-MA-08

INDUCTORS

PAS-IND-MA-09


INDUCTORS Headings

INDUCTORS

PAS-IND-DE-01

INDUCTORSPAS-IND-DE-02

INDUCTORS

PAS-IND-DE-03



INDUCTORS

PAS-IND-DE-06


INDUCTORS Headings

INDUCTORS

PAS-IND-PR-01

INDUCTORSPAS-IND-PR-02

INDUCTORS

PAS-IND-PR-03








INDUCTORS Headings

INDUCTORSPAS-IND-PN-01

INDUCTORS

PAS-IND-PN-02

INDUCTORSPAS-IND-PN-03

INDUCTORS Headings

INDUCTORSPAS-IND-PV-01

INDUCTORS

PAS-IND-PV-02

INDUCTORS

PAS-IND-PV-03

INDUCTORS Headings

INDUCTORS

PAS-IND-EQ-01

INDUCTORS

PAS-IND-EQ-02

INDUCTORS

PAS-IND-EQ-03

INDUCTORS Headings

INDUCTORS

PAS-IND-PF-01

INDUCTORS

PAS-IND-PF-02

INDUCTORS

PAS-IND-PF-03

INDUCTORS Headings

INDUCTORS

PAS-IND-QG-01

CERAMIC / TANTALUM Headings


CERAMIC / TANTALUMPAS-CER-AN-01

CERAMIC / TANTALUMPAS-CER-AN-02


CERAMIC / TANTALUM

PAS-CER-DS-01

CERAMIC / TANTALUM

PAS-CER-DS-02

CERAMIC / TANTALUM

PAS-CER-DS-03


CERAMIC / TANTALUM PAS-CER-MA-01



CERAMIC / TANTALUMPAS-CER-MA-04






CERAMIC / TANTALUMPAS-CER-DE-01



CERAMIC / TANTALUM PAS-CER-DE-04




CERAMIC / TANTALUM PAS-CER-PR-01

CERAMIC / TANTALUMPAS-CER-PR-02



CERAMIC / TANTALUM

PAS-CER-PR-05


CERAMIC / TANTALUM

PAS-CER-PR-07



CERAMIC / TANTALUMPAS-CER-PN-01

CERAMIC / TANTALUM

PAS-CER-PN-02

CERAMIC / TANTALUMPAS-CER-PN-03


CERAMIC / TANTALUMPAS-CER-PV-01

CERAMIC / TANTALUM

PAS-CER-PV-02

CERAMIC / TANTALUM

PAS-CER-PV-03


CERAMIC / TANTALUM

PAS-CER-EQ-01

CERAMIC / TANTALUM

PAS-CER-EQ-02

CERAMIC / TANTALUM

PAS-CER-EQ-03


CERAMIC / TANTALUM

PAS-CER-PF-01

CERAMIC / TANTALUM

PAS-CER-PF-02


CERAMIC / TANTALUM

PAS-CER-QG-01

Film capacitors Headings


Film capacitorsPAS-FLM-AN-01

Film capacitorsPAS-FLM-AN-02


Film capacitors

PAS-FLM-DS-01

Film capacitors

PAS-FLM-DS-02

Film capacitors

PAS-FLM-DS-03


Film capacitors

PAS-FLM-MA-01

Film capacitors

PAS-FLM-MA-02

Film capacitors

PAS-FLM-MA-03

Film capacitors

PAS-FLM-MA-04

Film capacitorsPAS-FLM-MA-05

Film capacitorsPAS-FLM-MA-06

Film capacitors

PAS-FLM-MA-07


Film capacitorsPAS-FLM-DE-01

Film capacitors

PAS-FLM-DE-02


Film capacitors

PAS-FLM-DE-04

Film capacitors PAS-FLM-DE-05

Film capacitors

PAS-FLM-DE-06



Film capacitors

PAS-FLM-PR-01

Film capacitors

PAS-FLM-PR-02

Film capacitorsPAS-FLM-PR-03

Film capacitors PAS-FLM-PR-04


Film capacitorsPAS-FLM-PN-01

Film capacitors

PAS-FLM-PN-02

Film capacitorsPAS-FLM-PN-03


Film capacitors

PAS-FLM-PV-01

Film capacitors

PAS-FLM-PV-02

Film capacitors

PAS-FLM-PV-03


Film capacitors

PAS-FLM-EQ-01

Film capacitors

PAS-FLM-EQ-02

Film capacitors

PAS-FLM-EQ-03


Film capacitors

PAS-FLM-PF-01

Film capacitors

PAS-FLM-PF-02


Film capacitors

PAS-FLM-QG-01

QUARTZ CRYSTAL / SAW Headings


QUARTZ CRYSTAL / SAWPAS-QUA-AN-01

QUARTZ CRYSTAL / SAWPAS-QUA-AN-02


QUARTZ CRYSTAL / SAW

PAS-QUA-DS-01


PAS-QUA-DS-02


PAS-QUA-DS-03


QUARTZ CRYSTAL / SAWPAS-QUA-MA-01


PAS-QUA-MA-02






PAS-QUA-MA-07


PAS-QUA-MA-08



PAS-QUA-MA-10



PAS-QUA-MA-12


QUARTZ CRYSTAL / SAWPAS-QUA-DE-01


PAS-QUA-DE-02



PAS-QUA-DE-04


PAS-QUA-DE-05




QUARTZ CRYSTAL / SAW PAS-QUA-PR-01

QUARTZ CRYSTAL / SAWPAS-QUA-PR-02




PAS-QUA-PR-05




PAS-QUA-PR-08


QUARTZ CRYSTAL / SAW PAS-QUA-PR-10



PAS-QUA-PN-01


PAS-QUA-PN-02

QUARTZ CRYSTAL / SAWPAS-QUA-PN-03



PAS-QUA-PV-01


PAS-QUA-PV-02


PAS-QUA-PV-03



PAS-QUA-EQ-01


PAS-QUA-EQ-02


PAS-QUA-EQ-03



PAS-QUA-PF-01

QUARTZ CRYSTAL / SAWPAS-QUA-PF-02



QUA-QG-01

Al-Cap Headings

Al-Cap Headings

Al-CapPAS-ALU-AN-01

Al-CapPAS-ALU-AN-02

Al-Cap Headings

Al-Cap

PAS-ALU-DS-01

Al-Cap

PAS-ALU-DS-02

Al-Cap

PAS-ALU-DS-03

Al-Cap Headings

Al-Cap

PAS-ALU-MA-01

Al-Cap

PAS-ALU-MA-02

Al-CapPAS-ALU-MA-03

Al-CapPAS-ALU-MA-04

Al-Cap

PAS-ALU-MA-05

Al-Cap

PAS-ALU-MA-06

Al-Cap PAS-ALU-MA-07

Al-Cap PAS-ALU-MA-08

Al-Cap

PAS-ALU-MA-09

Al-Cap Headings

Al-CapPAS-ALU-DE-01

Al-CapPAS-ALU-DE-02

Al-Cap

PAS-ALU-DE-03

Al-CapPAS-ALU-DE-04

Al-Cap PAS-ALU-DE-05



Al-CapPAS-ALU-DE-08


Al-CapPAS-ALU-DE-10

Al-Cap Headings

Al-Cap

PAS-ALU-PR-01

Al-Cap PAS-ALU-PR-02

Al-CapPAS-ALU-PR-03

Al-CapPAS-ALU-PR-04

Al-CapPAS-ALU-PR-05

Al-CapPAS-ALU-PR-06

Al-CapPAS-ALU-PR-07

Al-CapPAS-ALU-PR-08

Al-Cap Headings

Al-Cap

PAS-ALU-PN-01

Al-CapPAS-ALU-PN-02

Al-CapPAS-ALU-PN-03

Al-Cap Headings

Al-CapPAS-ALU-PV-01

Al-Cap

PAS-ALU-PV-02

Al-Cap

PAS-ALU-PV-03

Al-Cap Headings

Al-Cap

PAS-ALU-EQ-01

Al-Cap

PAS-ALU-EQ-02

Al-Cap

PAS-ALU-EQ-03

Al-Cap Headings

Al-Cap

PAS-ALU-PF-01

Al-CapPAS-ALU-PF-02

Al-CapPAS-ALU-PF-03

Al-Cap Headings

Al-Cap

PAS-ALU-QG-01

NTC Headings

NTC Headings

NTC

PAS-NTC-AN-01

NTCPAS-NTC-AN-02

NTC Headings

NTCPAS-NTC-DS-01

NTC

PAS-NTC-DS-02

NTC

PAS-NTC-DS-03

NTC Headings

NTCPAS-NTC-MA-01

NTC

PAS-NTC-MA-02

NTC

PAS-NTC-MA-03

NTC

PAS-NTC-MA-04

NTC

PAS-NTC-MA-05

NTC

PAS-NTC-MA-06

NTC Headings

NTCPAS-NTC-DE-01

NTCPAS-NTC-DE-02

NTCPAS-NTC-DE-03

NTC

PAS-NTC-DE-04

NTC

PAS-NTC-DE-05

NTCPAS-NTC-DE-06

NTC

PAS-NTC-DE-07

NTC Headings

NTCPAS-NTC-PR-01

NTCPAS-NTC-PR-02

NTCPAS-NTC-PR-03

NTC

PAS-NTC-PR-04

NTCPAS-NTC-PR-05

NTC

PAS-NTC-PR-06

NTC PAS-NTC-PR-07

NTC Headings

NTCPAS-NTC-PN-01

NTCPAS-NTC-PN-02

NTCPAS-NTC-PN-03

NTC Headings

NTCPAS-NTC-PV-01

NTC

PAS-NTC-PV-02

NTC

PAS-NTC-PV-03

NTC Headings

NTC

PAS-NTC-EQ-01

NTC

PAS-NTC-EQ-02

NTC

PAS-NTC-EQ-03

NTC Headings

NTC

PAS-NTC-PF-01

NTCPAS-NTC-PF-02

NTC Headings

NTC

PAS-NTC-QG-01

PTC Headings

PTC Headings

PTCPAS-PTC-AN-01

PTCPAS-PTC-AN-02

PTC Headings

PTC

PAS-PTC-DS-01

PTC

PAS-PTC-DS-02

PTC

PAS-PTC-DS-03

PTC Headings

PTCPAS-PTC-MA-01

PTC

PAS-PTC-MA-02

PTCPAS-PTC-MA-03

PTC

PAS-PTC-MA-04

PTC

PAS-PTC-MA-05

PTC

PAS-PTC-MA-06

PTC Headings

PTCPAS-PTC-DE-01

PTCPAS-PTC-DE-02

PTCPAS-PTC-DE-03

PTC

PAS-PTC-DE-04

PTCPAS-PTC-DE-05

PTCPAS-PTC-DE-06

PTC

PAS-PTC-DE-07

PTC Headings

PTCPAS-PTC-PR-01

PTCPAS-PTC-PR-02

PTCPAS-PTC-PR-03

PTC

PAS-PTC-PR-04

PTCPAS-PTC-PR-05

PTC

PAS-PTC-PR-06

PTCPAS-PTC-PR-07

PTC Headings

PTCPAS-PTC-PN-01

PTCPAS-PTC-PN-02

PTCPAS-PTC-PN-03

PTC Headings

PTCPAS-PTC-PV-01

PTC

PAS-PTC-PV-02

PTC

PAS-PTC-PV-03

PTC Headings

PTC

PAS-PTC-EQ-01

PTC

PAS-PTC-EQ-02

PTC

PAS-PTC-EQ-03

PTC Headings

PTC

PAS-PTC-PF-01

PTCPAS-PTC-PF-02

PTC Headings

PTC

PAS-PTC-QG-01

VDR Headings

VDR Headings

VDR

PAS-VDR-AN-01

VDRPAS-VDR-AN-02

VDR Headings

VDR

PAS-VDR-DS-01

VDR

PAS-VDR-DS-02

VDR

PAS-VDR-DS-03

VDR Headings

VDRPAS-VDR-MA-01

VDR PAS-VDR-MA-02

VDR

PAS-VDR-MA-03

VDR

PAS-VDR-MA-04

VDR

PAS-VDR-MA-05

VDR

PAS-VDR-MA-06

VDR Headings

VDRPAS-VDR-DE-01

VDRPAS-VDR-DE-02

VDRPAS-VDR-DE-03

VDR

PAS-VDR-DE-04

VDRPAS-VDR-DE-05

VDRPAS-VDR-DE-06

VDR

PAS-VDR-DE-07

VDR

PAS-VDR-DE-08

VDRPAS-VDR-DE-09

VDR Headings

VDRPAS-VDR-PR-01

VDRPAS-VDR-PR-02

VDRPAS-VDR-PR-03

VDR

PAS-VDR-PR-04

VDRPAS-VDR-PR-05

VDRPAS-VDR-PR-06

VDR PAS-VDR-PR-07

VDR Headings

VDRPAS-VDR-PN-01

VDRPAS-VDR-PN-02

VDRPAS-VDR-PN-03

VDR Headings

VDRPAS-VDR-PV-01

VDR

PAS-VDR-PV-02

VDR

PAS-VDR-PV-03

VDR Headings

VDR

PAS-VDR-EQ-01

VDR

PAS-VDR-EQ-02

VDR

PAS-VDR-EQ-03

VDR Headings

VDR

PAS-VDR-PF-01

VDRPAS-VDR-PF-02

VDR Headings

VDR

PAS-VDR-QG-01

--

I

P

Tests, which should be

Tests, which should be

Suppliers performed tes

Reason for exception of t

A

C

B

E

F

N

R

S

W

Y

Note 1:

A letter or "●" indicates that performance of that stress test should be considered for the appropriate process change.A "@" is recommended a

Max Mustermann


- contractual agreements - technical interface of processability/manufacturability of customer - form, fit, function, quality performance, reliability

Type of change No


ANY

Any change with impact on agreed upon technical contractual agreements P

Any change with impact on processability/manufacturabiliy at customer, which is not covered in the matrix below.

P

DATASHEET

Change of datasheet parameters/electrical specification (min./max./typ. values) and / or AC/DC specification

P

Remaining

risks within

Supply

Chain?

Correction of data sheet or issue of errata I

Specification of additional parameters I

MATERIAL

Change of material composition - Ink/Wire material of Resistor element P

Change of material composition - Ink/Wire material of Terminal element P

Change of material composition - Package/ Mold P

Change of material composition - Passivation P

Change of material composition - Substrate material P

Change of supplier of material -

DESIGN

Changes of termination, surface finish, shape, color, appearance or dimension structure I

Changes of inner construction - Passivation -

PROCESS

Changes in process technology or manufacturing methods - Ink Fire -

Changes in process technology or manufacturing methods - Ink Print -

Changes in process technology or manufacturing methods - Trim -

Changes in process technology or manufacturing methods - Lead Form -

Changes in process technology or manufacturing methods - Termination Attach -

Changes in process technology or manufacturing methods - Marking -

Changes in process technology or manufacturing methods - Molding -

Process integrity: tuning within specification -

PACKING / SHIPPING - NEW MATERIAL, CRITICAL DIMENSIONS

Packing / shipping specification change (loosening of tolerances) P

Dry pack requirements change P

Change of carrier (tray, reel) P

PACKING / SHIPPING - VISUAL INSPECTION

Change of labelling I

Change of product marking I

Change of packing/shipping specification P

LOGISTICS / CAPACITY / TESTING - EQUIPMEMENT

Production from a new equipment/tool which uses a different technology or which due to its unique form or function can be expected to influence the integrity of the final product

P

Production from a new equipment/tool which uses the same basic technology (replacement equipment or extension of existing equipment pool)

-

Change in final test equipment type that uses a different technology P

LOGISTICS / CAPACITY / TESTING - PROCESS FLOW

Manufacturing site transfer or movement of a part of production process to a different location/site P

Elimination or addition of a manufacturing process step -

LOGISTICS / CAPACITY / TESTING - Q-GATE

Change of test coverage used by the supplier to ensure data sheet compliance (e.g., elimination/addition of electrical measurement/test flow block, relaxation/enhancement of monitoring procedure or sampling)

-

INDUCTORS

ANY



P

DATASHEET


P



MATERIAL

Change of material composition - Bobbin Material P

Change of material composition - Core Material P

Change of material composition - Insulation Material P

Change of material composition - Lead Material P

Change of material composition - Mold Compound P

Change of material composition - Solder Material P

Change of material composition - Wire / Foil Material P

Change of material composition - Glue P


Change of material composition - Potting Material P

DESIGN

Changes of termination, surface finish, shape, color, appearance or dimension structure - Bobbin I

Changes of termination, surface finish, shape, color, appearance or dimension structure - Lead/Terminals

I

Changes of termination, surface finish, shape, color, appearance or dimension structure - Mold I

Changes of inner construction - Core Construction -

Changes of inner construction - Insulation System -

Changes of inner construction - Wire / Foil Construction -

Changes of termination, surface finish, shape, color, appearance or dimension structure - Potting Material

I

PROCESS

Changes in process technology or manufacturing methods - Insulation Strip -

Changes in process technology or manufacturing methods - Lead Prep. / Plating -

Changes in process technology or manufacturing methods - Terminal Attach -



Changes in process technology or manufacturing methods - Soldering Internal Connections -

Changes in process technology or manufacturing methods - Winding Insulation -

Changes in process technology or manufacturing methods - Winding Wire -


Changes in process technology or manufacturing methods - Potting -











P


-





Elimination of final electrical measurement / test flow block I



-

CERAMIC / TANTALUM

ANY



P

DATASHEET


P



MATERIAL

Change of material composition - Ceramic Binder PChange of material composition - Tantalum Binder PChange of material composition - Dielectric P

Change of material composition - Electrode Attach P

Change of material composition - Electrode Material P

Change of material composition - Encapsulation P

Change of material composition - Lead material / Termination P


DESIGN

Changes of termination, surface finish, shape, color, appearance or dimension structure - Lead Diameter

I

Changes of termination, surface finish, shape, color, appearance or dimension structure - Termination Area

I

Changes of termination, surface finish, shape, color, appearance or dimension structure - Termination Interface

I

Changes of inner construction - Electrode Thickness -

Changes of inner construction - Layer Thickness -

Changes of inner construction - Number of Layers -

PROCESS

Changes in process technology or manufacturing methods - Dicing -

Changes in process technology or manufacturing methods - Electrode apply -

Changes in process technology or manufacturing methods - Firing -

Changes in process technology or manufacturing methods - Lamination -

Changes in process technology or manufacturing methods - Particle Size -

Changes in process technology or manufacturing methods - Screening/Printing -

Changes in process technology or manufacturing methods - Termination -












P


-







-

FILM CAPACITORS

ANY



P

DATASHEET


P



MATERIAL

Change of material composition - Sealing Compound P

Change of material composition - Package P

Change of material composition - Lead/Termination P

Change of material composition - Metal Spray (Schoop) P

Change of material composition - Film P

Change of material composition - Metal Foil P


DESIGN

Changes of termination, surface finish, shape, color, appearance or dimension structure - Lead Diameter / Thickness

I


I

Changes of inner construction - Inner Connection -

Changes of termination, surface finish, shape, color, appearance or dimension structure - Appearance

I

Changes of inner construction - Film/Foil -

Changes of inner construction - Insulation System -

Changes of termination, surface finish, shape, color, appearance or dimension structure - Package

I

PROCESS

Changes in process technology or manufacturing methods - Package -


Changes in process technology or manufacturing methods - Winding -










LOGISTICS / CAPACITY / TESTING - EQUIPEMEMENT


P


-







-


ANY



P

DATASHEET


P



MATERIAL

Change of material composition - Quartz Blank P

Change of material composition - Base P

Change of material composition - Lead / Termination P

Change of material composition - Sealing P

Change of material composition - Can / Cap P

Change of material composition - Blank Support P

Change of material composition - Overmold P

Change of material composition - Case Sealing P

Change of material composition - Electrode P

Change of material composition - Insulator P

Change of material composition - Marking P


DESIGN

Changes of termination, surface finish, shape, color, appearance or dimension structure - Base I

Changes of termination, surface finish, shape, color, appearance or dimension structure - Lead / Termination

I

Changes of termination, surface finish, shape, color, appearance or dimension structure - Can / Cap

I

Changes of termination, surface finish, shape, color, appearance or dimension structure - Package

I

Changes of termination, surface finish, shape, color, appearance or dimension structure - Insulator

I

Changes of inner construction - Quartz Blank -

Changes of inner construction - Blank Support -

PROCESS

Changes in process technology or manufacturing methods - Quartz Blank -

Changes in process technology or manufacturing methods - Blank Etching / Cleaning -

Changes in process technology or manufacturing methods - Electrode Formation -

Changes in process technology or manufacturing methods - Trimming -

Changes in process technology or manufacturing methods - Bonding / Annealing -

Changes in process technology or manufacturing methods - Can / Cap Attaching -



Changes in process technology or manufacturing methods - Aging -












P


-







-

ALUMIUM ELECTROLYTIC CAPACITORSANY



P

DATASHEET


P



MATERIAL

Change of material composition - Housing P

Change of material composition - Sealing P

Change of material composition - External Insulation P

Change of material composition - Lead / Termination P

Change of material composition - Internal Insulation / Paper P

Change of material composition - Electrolyte P

Change of material composition - Tape Material P

Change of material composition - Base Plate P


DESIGN

Changes of termination, surface finish, shape, color, appearance or dimension structure - Wire Diameter

I

Changes of termination, surface finish, shape, color, appearance or dimension structure - Termination

I


I

Changes of termination, surface finish, shape, color, appearance or dimension structure - Rubber Sealing

I

Changes of inner construction - Aluminum Foil -

Changes of inner construction - Seperator -

Changes of inner construction - Seperator Density -

Changes of inner construction - Inner Connection -

Changes of inner construction - Closing Tape -

Changes of inner construction - Foil -

PROCESS


Changes in process technology or manufacturing methods - Winding -

Changes in process technology or manufacturing methods - Impregnation -

Changes in process technology or manufacturing methods - Assembly -

Changes in process technology or manufacturing methods - Aging / Testing -

Changes in process technology or manufacturing methods - Trim & Form Leaded -

Changes in process technology or manufacturing methods - Trim & Form SMD -












P


-





Elimination of final electrical measurement / test flow block I



-

NTC

ANY



P

DATASHEET


P



MATERIAL

Change of material composition - Ceramic Binder P

Change of material composition - Ceramic P

Change of material composition - Inner Electrode P




DESIGN


I


I

Changes of termination, surface finish, shape, color, appearance or dimension structure - Internal Connection

I


I

Changes of inner construction - Electrode -



PROCESS


















P


-







-

PTC

ANY



P

DATASHEET


P



MATERIAL



Change of material composition - Polymer P




DESIGN


I


I


I


I




PROCESS


















P


-







-

VDR

ANY



P

DATASHEET


P



MATERIAL



Change of material composition - Electrode P




DESIGN


I


I


I


I




Changes of inner construction - Grain size -

Changes of inner construction - Grain boundary size -

PROCESS


















P


-







-

Not required

Information Note required

PCN required

hould be considered for the appropriate process change.

hould be considered for the appropriate process change after selection of condition table.

rformed tests (mark with an 'X' for done or 'G' for generic)

ption of tests and/or usage of generic data:

CONDITIONS No

Termination equipment only

Ceramics only

Comparative data (unchanged vs. changed) required

Capacitive trimmers only

Film products only

Networks only

Resistors only

SMD components only

Wirewound products only

Component not hermitically sealedFor parts marked with ink only. Laser and stamp marked parts shall be exempt.


A letter or "●" indicates that performance of that stress test should be considered for the appropriate process change.nded additionally by ZVEI

Yes

PIntended to be used if no other type of change is applicable but the change affects agreed technical contractual agreements.

Not relevant for technical evaluation.

P Technical interface means component terminals.

PChange of application relevant information Not included: Editorial changes.

e.g. tighten of electrical parameter distribution


Remaining

ks within

Supply

Chain?Understanding of component


I

No technical change of product, process or test.New description of behavior which was not specified before or which is different from initial specification.Please indicate clearly, that Infonote contains this type of change!Assessment in application required!!

e.g. data sheet correction because of new information about component behavior

P

Description of a new not previously covered parameter. No technical change of the product.(I): no influence(P): Risk assessment depending on change for each application to provide evidence of additional parametes (stat. evaluation)

e.g. adding new (tested) parameter.

P Change of Ink / Wire material e.g. resistor paste, NiCr, resistor wire

P Change of Ink / Wire materiale.g. AgPd paste, Ag paste, lead wire , NiCr for side termination

P Change of Package e.g. for chip res.: final coating, epoxy

P Change of Passivation /Inner protection e.g. change of glass

P Change of substrate material

PChange to a new or additional material supplier at component manufacturer.

e.g. for 2nd source purpose

P Change of package

P Change of passivation/Inner protection e.g. change of glass, laquer, epoxy, ...

P Change of ink fire processe.g. change of firing profilee.g. change from normal atmospher to nitrogen atmospher

P Change of ink print process

P Change of trim process e.g. change from mill trimming to laser trimming

P Change of lead form process e.g. change from bending to punching

P Change of termination attach processe.g. chip resistors: electroplating processe.g. welding of leads for through put devices.

P Change of marking process e.g. change from tampon printing to laser marking

P Change of molding process

P Variation within process specification. e.g. process control

P Change of packing specification. e.g. number of pieces on reel.

P Change of dry pack requirements.e.g. change of MSLe.g. change in dry pack assurance (HIC, MBB)

P Change of carriere.g. change by materiale.g. change by geometry.

P Change of labelling, also on reel.(I) e.g. additional information (RoHS stamp)(P) e.g. change of customer specific information

P Marking on device.e.g. change of content of markinge.g. change of method of markinge.g. change of appearance of marking

PChange in packing specification which does not described a change of dimensions or material of the packing.

e.g. change of documentation in packing specification

P

Change in process technique which is not already covered above.Note: Changes affecting the product not covered by the table require also a PCN.

e.g. new equipment supplier with different process concept

PPCN required for dedicated equipment for sensitive component production.

e.g. additional equipment to increase production capacitye.g. replacement of same equipment

P

Change of final test equipment which use different technology.PCN required for dedicated equipment for sensitive parameters.

e.g. change of tester platform

P

Change of manufacturing site.Includes transfer as well as additional site.Note: Reorganization inside one plant/site is not affected!

e.g. movement or transfer of manufacturing site or process step(s) to a different location/site.

e.g. dual source / fab strategy

P Change of manufacturing process sequence.e.g. washing / cleaning processe.g. change of order of processes

P Change of test coverage.

e.g. change from 100% to sample inspectione. g. test flow block, reduction from three to two temperature measurementse.g. change in burn in/run in process.




PChange of application relevant information Not included: Editorial changes. e.g. tighten of electrical parameter distribution

I



P



PMaterial without magnetic function ("Spulenkörper") typically made by plastic material

e.g. change from Thermoset to Thermoplastic

PChange of core material, which is material with magnetic function

e.g. change from NiZn into MnZn

P Change of insulation materiale.g. wire insulation, insulation tapes, …e.g. change from Polyurethane to Polyamide

P Change of lead materiale.g. change from tin coverd to non-coverd lead material

P Change of mold compound materiale.g. change to green mold

PChange of solder material at internal connection.

e.g. change of SnAgCu composition

PWire for wounded inductors.Foil for multilayer inductors (inner electrode).

e.g. change of Cu composition

P Change of glue material e.g. change from glue A into glue B



P Change of potting material e.g. change from epoxy resin to silicon

PMaterial without magnetic function ("Spulenkörper") typically made by plastic material

e.g. construction / dimension change of bobbin

P Change of lead/terminals e.g. change from PTH terminals to SMD terminals

P Change of mold e.g. new mold material with different color

PChange of core construction, which is material with magnetic function

e.g. change fromdrum core & shield core into pot core & cover plate core

P Change of insulation systeme.g. wire insulation, insulation tapes, …e.g. change from Polyurethane to PTFE (Teflon)

P Change of wire / foil dimensions

e.g. change from round cross section to rectangular cross sectione.g. from single wire to litz wire

P Change of potting dimension e.g. change of potting (filling) height

P (Mechanical) removal of insulation.e.g. change from mechanical removal to laser removal

P Change of lead prep. / plating e.g. change from hot dip tinning to electroplating

PConnection of wire terminal and / orconnection of termination to core/bobbin.

e.g. chanfe from Manual winding to Semi-automtic winding (winding of wire on terminal)

P Change of marking process e.g. change from ink marking to laser marking

P Change of molding processe.g. change from one component molding to two component molding (other technology needed)

P Change of soldering internal connection e.g. change from hot tip tinning to resistance welding

P Change of winding - insulation e.g. change from manual to automatic process

P Change of winding - wiree.g. change from semi-automatic winding to full automatic winding


P Change of potting processe.g. change from manual potting process to automatic potting process


P Change of drypack requirements.e.g. change of MSLe.g. change in dry pack assurance (HIC, MBB)






P


e.g. introduction of potting process


e.g. duplication of existing winding machine

P



P





PReduction of final testing.PCN required for dedicated final test reductions for sensitive parameters.

e. g. elimination of High-voltage measurement








I



P



P Binder material (ceramic)

P Binder material (tantal) e.g. change from wax 1 to wax 2

P Dielectric change (ceramic only) e.g. change from ceramic A into ceramic B

P Electrode attach (only tantal, glue, carbon, Ag)e.g. change of Ag particle size in conductive adhesive

PElectrode Material (only ceramic, inner elctrode)

e.g. change from spehric to flake shape (Ni paste)

P Encapsulation e.g. change from epoxy1 into epoxy2

P Lead material / Termination e.g. change from SnPb to pure Sn

PChange to a new or additional material supplier at component manufacturer. e.g. for 2nd source purpose

P Lead diameter e.g. change from 0.8mm into 0.6mm

P Termination areae.g. change in width of termination from 0.1 -0.3mm into 0.2 - 0.4 mm

P Terminal interface e.g. additional layer in termination

P Electrode thickness (ceramic only) e.g. Ni layer change from 2.5µm into 3.5µm

P Layer thickness (dielectric thickness)e.g. Ceramic layer thickness changes from 3µm into 5µm.

PNumber of layers (ceramic only). Allways in combination with PAS-CER-DE-05.

see also layer thickness

P Change of dicing e.g. change from cutting to sawing

P Electrode apply (dielectric layer process) e.g. change from wet to dry process

P Change of firing profile e.g. seperation of decarbonization and firing profile.

P Change of lamination / press techinque e.g. standard pressing to iso static pressing.

PChange of powder particle size. Allways in combination with PAS-CER-MA-03.

e.g. change D50 from 0.5µm into 0.4µm

P Change of screening / printing e.g. change from screen printing into offset printing

PChange for termination preparation like plating or apply of termination base layer.

e.g. change in plating technology (final termination)e.g. change from dip in paste to platimg (apply)









P


e.g. change from wet to dry technology.


e.g. elimination of manual handling processes

P



P












I



P



P

Typicaly change within epoxy or PU sealing without effect to mechanical properties.Note: Change from epoxy sealing into PU sealing (both direction) will lead to generate a new product.

e.g. change of epoxy or PU composition

P Change material of packageChange material of package,e.g. change from PBT to PPSe.g. change of glas fiber ratio

P

Change of Lead/TerminationNote: If change of lead frame material leads to an ESR change, than change of data sheet (PAS-FLM-DS-01) has to be respected.

e.g. change of basis material from Cu to Fee.g. change of finishing from SnPb to Sn

PChange of Metal Spray (Schoop): Use different material for metal spray process for boxed and naked types

e.g. from Zn to Al

PChange of film material for boxed and naked types

e.g. change of additives (<1%) of film composition (same raw material)

P Change of metal foil for inner electrode e.g. change from Al to Al-Zn alloy

PChange to a new or additional material supplier at component manufacturer which are described above.


P Change of lead diameter thicknesse.g. change lead diameter from 0.5 to 0.4 mme.g. change of thickness of terminal

PChanges of termination area are changes which are affecting the area for connection of component and PCB

e.g. change of termination layer thicknesse.g. change in termination dimensions / shape

P Change of inner connectione.g. change from soldered connection to welded connection

P

Change of appearance.(I): Change in appaerance without impact on product integrity.(P): Change in appaerance with impact on product integrity. Note: Marking on device is defined as seperate change (PAS-FLM-PV-02).

e.g. change or adding of color on component

P Change of film or foil design e.g. change to a different foil supplier.

PChange of inner insulation to protect winding element against housing.

e.g. change of potting materiale.g. change of number of inner insulation layers (depending of insulation material thickness)

P Change of packaginge.g. change of dimension or shapee.g. change of surface

PChange of resin filling or hardening process (relevant for boxed types only)

e.g. change in resin filling process (mixing, sequences, potting, …)e.g. change in hardening process (temperature, time, …)

PChange Terminal Attach Process to winding element for boxed and nacked types

e.g. spraying and / or galvanic process,e.g. welding / soldering

PChange of winding, flattening or tempering process

e.g. change of tempering temperature









P


e.g. implementation of new machines


e.g. extension of existing machine capacity

P



P






e.g. change from 100% to sample inspectione.g. test flow block, reduction from three to two temperature measurementse.g. change in burn in/run in process.






I



P



PA change of Quartz Blank is avery rare case. Mainly for SAW-Filter

P Changing of the material of the base. e.g. change from ceramic to epoxy

P Change of Lead/Termination e.g. change of plating finish. (eg:Au, AgPd,Sn)

P Change of Glass Seal e.g. change to lead free glass

P Changing of the material of the can/cap e.g. change from metal to ceramic material

P Change of Blank Supporte.g. change of glue (Silicone to Epoxy)e.g. change metal holders (old types)

P Change of Overmolde.g. change to green mold compounde.g. change of filler particles

P

Change of Case Sealing. Change of material for seam weldingRelevant for components with ceramic base and metall cap.

e.g. change from solder paste to adhesive glue

P Change of Electrode material on crystal blank. e.g. change from Au to Ag

PChange of Insulator. Only for leaded typesNot relevant for typical SMD.

e.g. Insulating plate under crystale.g. Glass sealing for leads

P Change of marking materiale.g. change of inke.g. chemical to environmental friendly



P Change of Base design e.g. due to miniaturization purpose.

PChange of Lead/Termination design. Change geometry or terminal pad or lead form

e.g. change lead design to improve reliability.

P Change of Can/Cap design e.g. due to miniaturization purpose.

PChange of Package (Molded). Change the design of the package.Not relevant for typical SMD.

e.g. change from welded device to glued device (case sealing)

PChange of Insulator design. Only for leaded types (old technology)Not relevant for typical SMD.

P Change of Quartz Blank designe.g. change dimension of blank, add phase, electrode design, …

P Change of Blank Support designe.g. change design of glue shapee.g. change design of metall supporter

P Change of Quartz Blank process e.g. change of cutting or lapping technology

PChange of Blank Etch/Clean processUsing different / new technology

e.g. change from liquid etching to plasma etching

P Change of Electrode Formation process e.g. change from evaporation to sputtering

PChange of Auto Trim process (Method of final frequency tuning)

e.g. change from evaporation to ion beam

PChange of Blank bonding / annealing process. Change of method how apply conductive material to base or blank

P Change of Cap/Can attaching processe.g. change of the sealing methode.g. change from batch oven to reflow oven

PChange of Overmolding process. Not relevant for typical SMD.

e.g. change of overmold process parameter

P Change of Marking processe.g. change from inked marking to laser markinge.g. marking of pin 1e.g. change of appearance (additional marking)

PChange of Aging process. Typically no aging done on quartz crystals.

If aging is done: e.g. change of times or temperatures




P Change of carriere.g. change by material e.g. change by geometry.





P


e. g. new equipment supplier with different process concept



P



P









PTechnical interface means component terminals.See processability on board level.



I



P



P Change of housing e.g. change Al alloy for housing

P Change of sealinge.g. change of rubber compounde.g. change of sealing disc material (axial, Snap in)

P Change of external insulation / sleevinge.g. change from PVC into PETe.g. change of color

P Change of lead or outer termination.e.g. change of leadframe from iron into coppere.g. change of leadframe finish from tin/lead into tin

P Change of paper type / internal insulation e.g. change of paper thickness 50 µm to 40µm

P Change of electrolyte e.g. change in formulation

P Change of closing tape material e.g. change of glue or basis material

P Change of base plate material e.g. change of used plastic material



P Change of wire diameter e.g. change from 0.8 into 0.6 mm wire diameter.

PChange of termination appearanceFor welded Al capacitors only.

e.g. change from matt tin into bright tin.

PChange of appearanceNote: Marking on device is defined as seperate change (PAS-ALU-PV-02).

e.g. change of color/appearancee.g. change of safety vent shape

PChange of rubber sealing stand-off shape (for radial)

e.g. change of profile / design

P Change of Al foil width e.g. change of width

P Change of seperator width e.g. change of width

P Change of seperator density e.g. change of seperator density/resistivity

P Change of inner connection e.g. change of shape/dimension

P Change of closing tape e.g. change of dimension

P Change of foil typee.g. change of etching levele.g. change of thickness

P Change of terminal attach process e.g. change of stitching / welding layout

P Change of winding process e.g. change of material disposition

P Change of impregantione.g. change of bulk process into individual impregnation

P Change of assembly processe.g. change of sealing methode.g. change of assembly process sequence

P Change of aging/testing processe.g. change of timing, voltage or temperature of process

P Change of trim & form process (leaded) e.g. change of tooling shape or bending procedure

P Change of trim & form process (SMD) e.g. change of tooling shape or bending procedure









P


e. g. new equipment supplier with different process concept



P



P





PReduction of final testing.PCN required for dedicated final test reductions for sensitive parameters.

e.g. elemination of additional impedance control








I



P



P Change of Binder Material to bind ceramics.

P Change of ceramic composition e.g. changes in additives amount

PChange of inner electrode material (ink material). Valid in case of multilayer structures only.

e.g. change from AgPt material to AgPd material

P Change of encapsulation material.e.g. change of coatinge.g. change of additives in an insulation.

PChange of lead or outer termination. Change of lead (finish) material, termination material or attachment material.

e.g. change from SnPb to pure Sn



P Change of lead diameter e.g. change lead diameter from 0.5 to 0.4 mm

P Change of termination areae.g. change of termination layer thicknesse.g. change in termination dimensions


PChange of appearance.Note: Marking on device is defined as seperate change (PAS-FLM-PV-02).

e.g. change or adding of color on componentMainly in combination with other changes!

PChange of electrode layer thickness or geometry. For multi-layer technology only.

e.g. change of electrode design

PChange of ceramic layer thickness. For multi-layer technology only.

e.g. change from 1.5µm into 1.0µm

PChange of number of ceramic or electrode layers. For multi-layer technology only. Allways in combination with PAS-NTC-DE-06.


PChange of lamination / press technique technology

e.g. stamp press to isostatic press

P Change of firing / sintering profilee.g. temperature and / or time and / or atmosphere. e.g. from tunnel to batch kiln.

P Change of dicing / slicing e.g. change from cutting to sawing



PChange of electrode apply. For multi layer technology only.

e.g. change of inner electrode lay down method.

PChange in assembly process for leaded or encapsulated devices.

e.g. soldering method for lead attach to element or coating / encapsulation process









P


e. g. change from wet to dry technology.



P



P












I



P





P Change of polymer composition


PChange of lead (finish) material, termination material or attachment material.







PChange of appearance.Note: Marking on device is defined as seperate change (PAS-PTC-PV-02).


PChange of electrode layer thickness or geometry.




PChange of number of ceramic or electrode layers. For multi-layer technology only. Allways in combination with PAS-PTC-DE-06.


PChange of lamination / press technique technology

e.g. stamp press to isostatic press


P Change of dicing / slicing e.g. change from cutting to sawing















P





P



P












I



P





PChange of inner electrode material. Valid in case of multilayer structures only.

e.g. change from AgPt material to AgPd material


PChange of lead (finish) material, termination material or attachment material.







PChange of appearance.Note: Marking on device is defined as seperate change (PAS-VDR-PV-02).


PChange of electrode layer thickness or geometry.




PChange of number of ceramic or electrode layers. For multi-layer technology only. Allways in combination with PAS-VDR-DE-06.


PChange of grain size. Grain size is a result of process and / or material change.

e. g. change of grain size.

PChange of grain boundary size. Grain boundary size is a result of process and / or material change.

e.g. change of grain boundary size.

P Change of lamination / press technique method e.g. pressures or temperature


P Change of dicing e.g. change from cutting to sawing















P





P



P






e.g. change from 100% to sample inspectione.g. test flow block, reduction from three to two temperature measurementse.g. change in burn in/run in process.

ion table.

A letter or "●" indicates that performance of that stress test should be considered for the appropriate process change.

Ev

alu

ati

on

le

ve

l

A /

B /

C

3

* - - - -

B - - - -

ARisk assessment depending on change for each application. - - - -

Hig

h T

em

p E

xposu

re (

Sto

rage)

AE

C-Q

200 R

evis

ion

D

Ch

eck o

f sp

ecif

icati

on

(fo

r ra

w m

ate

rial o

nly

)

A

: A

pplic

atio

n le

vel

B

: B

oard

leve

l C

: C

om

ponent le

vel

*

: N

ot re

leva

nt fo

r qualif

icatio

n m

atr

ix


Lin

e e

valu

ati

on

(can

be e

valu

ate

d b

y d

ata

or

au

dit

/on

sit

e c

heck)

A - - - -

A - - - -

C - ● ● ●

B - ● ● ●

B - ● ● ●

C - ● ● ●C - ● ● -

C - ● ● -

B - ● - ●C - ● - ●

C ● ● - -

C ● ● - ●C ● ● - -B ● ● - -

B ● ● - -

B ● ● - -

B ● ● - ●C - - - -

B - - - -

B - - - -

B - - - -

B - - - -

B - - - -

* - - - -

C ● ● - -

C ● ● - -

C ● - - -

B ● ● - ●

C ● - - -

C - - - -

* - - - -

B - - - -


A - - - -

A - - - -

B - ● ● ●

A - ● ● @●

C - ● ● ●

B - ● - -

B - ● ● ●

B - ● ● -

B - ● ● @●

C - ● ● -

C - ● ● -

CA: If influence on other connections on PCB or laquer expected. - - ● -

B - ● - -

A - ● - -

B - ● - -

A - ● - -

C - ● - @●

B - ● - -

C If data sheet is affected (PAS-IND-DS-01) - - - -

B ● ● - -

B ● ● - -

C ● ● - -

B ● ● - -

B ● ● - ●

B ● ● - -

B ● ● - @●

C ● ● - @●

C - - - -

C ● - - -

B - - - -

B - - - -

B - - - -

B - - - -

B - - - -

* - - - -

C ● - - -

C ● - - -

C ● - - -

B ● ● - ●

C ● - - -

C - - - -

C - ● - -

* - - - -

B - - - -


A - - - -

A - - - -

C - ● ● -C - ● ● -C - ● ● ●C - ● ● ●

C - ● ● ●

C - ● ● -

C - ● ● -

C - ● ● ●

B - ● - -

B - ● - ●

B - ● - ●C - ● - ●C - ● - ●

C - ● - -

C ● ● - ●C ● ● - C

C ● ● - -

C ● ● - -

C ● ● - -

C ● ● - -

B ● ● - ●

C - - - -

B - - - -

B - - - -

B - - - -

B - - - -

B - - - -

* - - - -

C ● ● - -

C ● ● - -

C ● - - -

B ● ● - ●

C ● - - -

C - - - -

* - - - -

B - - - -


A - - - -

A - - - -

C

A: in combination with PAS-FLM-DS-01

or if change of sealing compound with effect to mechanical properties.

- ● ● ●

B - ● ● -

B

A: in combination with PAS-FLM-DS-01

- ● ● -

C

B: for naked SMD

- ● ● -

CB: for naked SMD

- ● ● -

C - ● ● -

C

Check if other PAS-FLM-MA is affected

- ● ● ●

B - ● - -

B - ● - -

C - ● - -

B

Check if MATERIAL is affected.

- ● - -

C A: in combination with PAS-FLM-DS-01 - ● - -

C - ● - -

B - ● - -

C ● ● - ●

C

B: for naked SMD

● ● - -

C ● ● - ●

C - - - -

B - - - -

B - - - -

B - - - -

B - - - -

B - - - -

* - - - -

C ● ● - -

C ● ● - -

C ● - - -

B ● ● - ●

C ● - - -

C - - - -

* - - - -

B - - - -


A - - - -

A - - - -

A - ● ● ●

A - ● ● -

B - ● ● -

B - ● ● ●

A - ● ● @●C - ● ● @●

B - ● ● ●

C

-- ● ● ●

C - ● ● ●

B - ● ● ●

B - ● ● -

C - ● ● -

B - ● - ●

B - ● - -

A - ● - @●

B - ● - @●

B - ● - @●

C - ● - -

C - ● - @●

C ● ● - -

C ● ● - -

C ● ● - -

C ● ● - -

C ● ● - ●

C ● ● - ●

C ● ● - @●

B ● ● - -

C ● ● - @●C - - - -

B - - - -

B - - - -

B - - - -

B - - - -

B - - - -

* - - - -

C ● - - -

C ● - - -

C ● - - -

B ● ● - ●

C ● - - -

C - - - -

* - - - -

B - - - -


A - - - -

A - - - -

C

B: only if a cap holder holds the Capacitor body by pressing. - ● ● -

CB: in case of external surface of sealing is changed.Evaluation only, if capacitor is glued

- ● ● -

CB: Only for glued capacitors.

- ● ● @●

B - ● ● -

CA: Only if impedance increase (delta characterization). Check if datasheet is affected (PAS-ALU-DS-01).

- ● ● -

CA: Only if impedance increase (delta characterization). Check if datasheet is affected (PAS-ALU-DS-01).

- ● ● ●

C - ● ● -B - ● ● -

C - ● ● ●

B - ● - -

B - ● - -

B - ● - -

A - ● - -

C - ● - -C - ● - -C - ● - -

C - ● - -

C - ● - @●C - ● - @●

C ● ● - -

B A: only for HV application ● ● - -

C ● ● - ●

C ● ● - -

C ● ● - -

B ● ● - -

B ● ● - -

C - - - -

B - - - -

B - - - -

B - - - -

B - - - -

B - - - -

* - - - -

C ● ● - -

C ● ● - -

C ● - - -

B ● ● - ●

C ● - - -

C - - - -

C - - - -

* - - - -

B - - - -


A - - - -

A - - - -

C - ● ● -

C - ● ● -

C - ● ● ●

B

A: Risk assessment on application level, if interaction with other material expected. - ● ● ●

B

Risk assessment needed to evaluate compatibility of soldering process.

- ● ● -

C - ● ● -

B - ● - -

B - ● - -

C - ● - -

B - ● - -

C - ● - -

C - ● - -

C - ● - -

C ● ● - -

C ● ● - -

C ● ● - @●

B ● ● - -

C ● ● - @●

B ● ● - ●

C - - - -

B - - - -

B - - - -

B - - - -

B - - - -

B - - - -

* - - - -

C ● - - -

C ● - - -

C ● - - -

B ● ● - ●

C ● - - -

C - - - -

* - - - -

B - - - -


A - - - -

A - - - -

C - ● ● -

C - ● ● -

C - - ● @●

B

A: Risk assessment on application level, if interaction with other material expected. - ● ● ●

B

Risk assessment needed to evaluate compatibility of soldering process. - ● ● -

C - ● ● -

B - ● - -

B - ● - -

C - ● - -

B - ● - -

C - ● - -

C - ● - -

C - ● - -

C ● ● - -

C ● ● - -

C ● ● - @●

B ● ● - -

C ● ● - @●

B ● ● - ●

C - - - -

B - - - -

B - - - -

B - - - -

B - - - -

B - - - -

* - - - -

C ● - - -

C ● - - -

C ● - - -

B ● ● - ●

C ● - - -

C - - - -

* - - - -

B - - - -


A - - - -

A - - - -

C - ● ● -

C - ● ● -

C - ● ● @●

B

A: Risk assessment on application level, if interaction with other material expected. - ● ● @●

B

Risk assessment needed to evaluate compatibility of soldering process.

- ● ● -

C - ● ● ●

B - ● - -

B - ● - -

C - ● - -

B - ● - -

C - ● - -

C - ● - -

C - ● - -

C - ● - -

C - ● - -

C ● ● - -

C ● ● - ●

C ● ● - @●

B ● ● - ●

C ● ● - @●

B ● ● - @●C - - - -

B - - - -

B - - - -

B - - - -

B - - - -

B - - - -

* - - - -

C ● ● - -

C ● ● - -

C ● - - -

B ● ● - ●

C ● - - -

C - - - -

- - - -

- - - -

4 5 6 7 8 9 10 11 12

- - - - - - - - -

- - - - - - - - -

- - - - - - - - -

MATERIA

Dest

ruct

ive P

hys

ical A

naly

sis

Phys

ical D

imensi

on

Term

inal S

trength

(Leaded)

Mois

ture

Resi

stance

Bia

sed H

um

idity

Resi

stance

to S

olv

ents

Opera

tional L

ife

Ext

ern

al V

isual

Tem

pera

ture

Cyc

ling

- - - - - - - - -

- - - - - - - - -

● - - - ● - - W -

● - - - ● - - W -

● - ● ● - ● ● ● ●

● - ● ● ● - - - ●

● - ● ● ● - - ● -

● - ● - - - ● ● ●

● - ● ● - ● ● ● ●● - ● ● ● - - - ●

● - - - ● - - R -

● - - - ● - - R -- - - ● ● - - - -- - - ● - ● ● ● -

- - - ● - - - ● -

- - - - - ● - - ●

● - ● ● - ● ● ● ●- - - - - - - - -

- - - - - - - - -

- - - - - - - - -

- - - - - - - - -

- - - - - - - - -

- - - - - - - - -

- - - - - - - - -

● - ● - ● - - - -

● - ● - ● - - - -

- - - - - - - - -

● - ● ● ● ● ● ● ●

- - - - - - - - -

- - - - - - - - -

- - - - - - - - -

- - - - - - - - -

- - - - - - - - -

- - - - - - - - -

- - - - - - - - -

● - - ● ● ● @● - -

● - - - ● ● - - -

● - - ● ● ● - - ●

- - - - ● ● - ● -

● - ● ● ● ● - - ●

● - - - - ● - ● -

- - ● ● ● ● - - -

@● - - @● - @● - - -

● - ● @● - ● ● ● -

@● - - @● - @● @● - -

● - - - - ● ● - -

- - - - - ● ● ● -

● - ● @● - ● ● - ●

● - - - - ● ● - -

- - - ● ● ● ● - ●

● - - - - ● ● - -

@● - - - - @● @● - -

- - ● - - ● - - ●

● - - - - ● - ● -

● - ● @● - ● - ● -

- - - - - ● - - ●

● - - ● ● ● ● - ●

● - - - - ● - ● -

- - - ● ● @● - - ●

- - ● - ● ● - - -

- - - - - - - - -

@● - - @● - @● @● - -

- - - - - - - - -

- - - - - - - - -

- - - - - - - - -

- - - - - - - - -

- - - - - - - - -

- - - - - - - - -

- - - - - - - - -

- - - - - - - - -

- - - - - - - - -

● - ● @● ● @● - ● -

- - - - - - - - -

- - - - - - - - -

- - - - - ● ● - -

- - - - - - - - -

- - - - - - - - -

- - - - - - - - -

- - - - - - - - -

- - - - - - - - -

● ● - - - - - - -● ● - - - - - - -● ● - ● ● - - ● ●● - - - ● - - - -

● ● - ● ● - - ● ●

● - ● ● - ● ● - ●● ● - - ● ● - ● -

● ● ● ● ● - - ● ●

● - ● ● ● ● ● ● -

- - ● - - ● ● - -

● ● ● ● ● - - ● -

● ● - - ● - ● - -

● ● - ● ● - ● ● -

C C - C C - C - -

● - ● ● - ● ● - ●- - - C - - - - -

● ● - - ● - - - -

- ● - ● - - - - -

● - - ● - - - - -

- - - - C - - - -

● ● ● ● ● ● ● ● ●

- - - - - - - - -

- - - - - - - - -

- - - - - - - - -

- - - - - - - - -

- - - - - - - - -

- - - - - - - - -

- - - - - - - - -

● - ● ● ● - ● A -

● - ● ● ● - ● A -

- - - - - - - - -

● ● ● ● ● ● ● ● ●

- - - - - - - - -

- - - - - - - - -

- - - - - - - - -

- - - - - - - - -

- - - - - - - - -

- - - - - - - - -

- - - - - - - - -

● - ● ● ● ● ● @● ●

● - - ● ● ● ● ● @●

- - ● - - - ● ● -

@● - @● - @● - - @● -

@● - - @● @● @● @● - -

@● - - @● @● @● - - -

● - ● - ● - - ● ●

@● - - - - @● @● @● -

@● - - - - - - - -

@● - - - @● @● - @● -

- - - - - - - - -

● - - @● ● - - - -

● - - - ● - - - -

@● - @● - - @● @● - @●

● - - ● ● ● - - ●

● - ● - ● - - ● ●

- - - @● ● - - - -

- - - - - - - - -

- - - - - - - - -

- - - - - - - - -

- - - - - - - - -

- - - - - - - - -

- - - - - - - - -

- - - - - - - - -

● - ● @● ● @● @● ● -

● - ● @● ● @● @● ● -

- - - - - - - - -

● - ● ● ● ● ● ● ●

- - - - - - - - -

- - - - - - - - -

- - - - - - - - -

- - - - - - - - -

- - - - - - - - -

- - - - - - - - -

- - - - - - - - -

● - - - ● - - - -

● - @● ● - ● ● - ●

● - - - - ● ● ● ●

● @● ● ● ● ● - ● ●

● - @● ● @● ● ● - ●

● - @Y @Y ● - - - -

● @● ● @● @● ● ● - ●

● - @Y ● - ● - - ●

● - @Y @Y ● - - - @Y

● @● ● - @● ● ● - ●

- - - - - @● - - @●

● - ● - ● ● ● ● ●

● - @● ● - ● ● ● @●

● - - - - ● ● ● -

● @● ● ● - ● ● - @●

● @● ● @● @● ● ● ● ●

@● @● @● - @● ● ● - ●

● - - - @● - - - -

● - @Y @Y ● - - - -

● - - - ● - - - -

- - - - - - - - -

● - - - ● - - - -

- - - - - - - - -

● @● @Y @Y ● - - - -

● @● @Y ● ● ● ● - -

● @● ● @● @● ● ● @● -

- - - - - ● - - ●

- - - - - - - - -

- - - - - - - - -

- - - - - - - - -

- - - - - - - - -

- - - - - - - - -

- - - - - - - - -

- - - - - - - - -

- - - - - - - - -

- - - - - - - - -

- - - - - - - - -

- - - - - - - - -

● - ● ● ● ● ● ● ●

- - - - - - - - -

- - - - - - - - -

- - - - - - - - -

- - - - - - - - -

- - - - - - - - -

- - - - - - - - -

- - - - - - - - -

● - ● - - - ● - -

● - ● ● ● ● ● - ●

● - ● @● ● ● ● - ●

- - - - - - - ● -

● - - - ● - - - -

● - - - ● - - - -

@● - - - @● - - - -@● - - - - - - - -

● - ● ● - - - ● ●

- - - - - - - ● -

- - - - - - - ● -

- - - - - - - - -

- - - - - - @● - -

● - - - ● - - - -● - - - ● - - - -● - - - ● - - - -

@● - - - - - - @● -

- @● - - - - - - -

● - - - ● - - - -

● - - - - - - ● -

● - - - ● - - - -

● - - - ● - - - -

@● - - - - - @● - -

- - - - - - - - -

- - - - - - @● - -

- - - - - - @● - -

- - - - - - - - -

- - - - - - - - -

- - - - - - - - -

- - - - - - - - -

- - - - - - - - -

- - - - - - - - -

- - - - - - - - -

● - - - ● - ● ● -

● - - - ● - ● ● -

- - - - - - - - -

● @● ● ● ● ● ● ● ●

- - - - - - - - -

- - - - - - - - -

- - - - - - - - -

- - - - - - - - -

- - - - - - - - -

- - - - - - - - -

- - - - - - - - -

- - - - - - - - -

- - - - - - - - -

- - - - - - - - -

● - - ● ● - - - -

● - ● - - - - - -

- - @● @● @● - - @● -

● - ● - ● - - ● ●

- - @● - - @● @● @● -

- - @● - - @● @● - -

- - @● @● @● - - @● -

- - - - - @● - - -

@● @● - - - - @● - -

@● @● - - - - @● - -

@● @● - - - - @● - -

- @● - @● - - - - -

@● @● - - @● - @● - -

@● - @● @● - @● @● - @●

- - ● ● ● - - ● -

- - - @● - - - - -

● - - - - ● ● - ●

- - - - - - - - -

- - - - - - - - -

- - - - - - - - -

- - - - - - - - -

- - - - - - - - -

- - - - - - - - -

- - - - - - - - -

- - - - - - - - -

- - - - - - - - -

- - - - - - - - -

● - ● - ● ● ● ● -

- - - - - - - - -

- - - - - - - - -

- - - - - - - - -

- - - - - - - - -

- - - - - - - - -

- - - - - - - - -

- - - - - - - - -

- - - - - - - - -

- - - - - - - - -

@● - @● @● @● - - - @●

● - ● - - - - - -

- - @● @● @● - - @● -

● - ● - ● - - ● ●

- - @● - - @● @● @● -

- - @● - - @● @● - -

- - @● @● @● - - @● -

- - - - - @● - - -

@● @● - - - - @● - -

@● @● - - - - @● - -

@● @● - - - - @● - -

- @● - @● - - - - -

@● @● - - @● - @● - -

@● - @● @● - @● @● - @●

- - ● ● ● - - ● -

- - - @● - - - - -

● - - - - ● ● - ●

- - - - - - - - -

- - - - - - - - -

- - - - - - - - -

- - - - - - - - -

- - - - - - - - -

- - - - - - - - -

- - - - - - - - -

- - - - - - - - -

- - - - - - - - -

- - - - - - - - -

● - ● - ● ● ● ● -

- - - - - - - - -

- - - - - - - - -

- - - - - - - - -

- - - - - - - - -

- - - - - - - - -

- - - - - - - - -

- - - - - - - - -

- - - - - - - - -

- - - - - - - - -

@● - - @● @● - - - -

@● - @● - - - - - -

- - @● @● @● - - @● -

● - ● - ● - - ● -

- - @● - - @● @● @● -

- - @● - - @● @● - -

- - @● @● @● - - @● -

- - - - - @● - - -

@● @● ● - ● - @● - -

@● @● ● - ● - @● - -

● @● ● - ● - @● - -

- - - - ● - - - -

- - ● - ● - - - -

- @● - @● - - - - -

● @● ● - ● - @● - -

● - @● ● - ● ● - @●

● - - - ● - ● ● -

- - - @● - - - - -

@● - - - - @● @● - @●- - - - - - - - -

- - - - - - - - -

- - - - - - - - -

- - - - - - - - -

- - - - - - - - -

- - - - - - - - -

- - - - - - - - -

● - ● - ● - - ● -

● - ● - ● - - ● -

- - - - - - - - -

● - ● ● ● ● ● ● -

- - - - - - - - -

- - - - - - - - -

- - - - - - - - -

- - - - - - - - -

13 14 15 16 17 18 19 20 21

- - - - - - - - -

- - - - - - - - -

- - - - - - - - -

Device evaluation

MATERIAL PERFORMANCE TEST RESULTS (on the basis of AEC-Q200 Rev

Sold

era

bili

ty

Ele

ctrica

l Chara

cteriza

tion

Ele

ctro

static

Dis

charg

e (

ES

D)

Mech

anic

al S

hock

Vib

ratio

n

Resi

stance

to S

old

ering H

eat

Therm

al S

hock

Fla

mm

abili

ty

Board

Fle

x

- - - - - - - - -

- - - - - - - - -

- - - ● F - B - ●

- - - ● F - B - ●

- ● - ● ● - - ● ●

- - - ● - - - ● -

- - ● ● - ● B - ●

- - ● ● ● - B ● -

- ● ● ● ● ● - ● ●- - - ● - - - ● -

- - - - - - B - -

- - - ● - - B - R- - - - - - B - -- - - - - ● B - -

● - ● - - - B - -

- - - - - - - - -

- ● - ● ● - - ● ●- - - - - - - - -

- - - - - - - - -

- - - - - - - - -

- - - - - - - - -

- - - - - - - - -

- - - - - - - - -

- - - - - - - - -

- - - ● ● - B - -

- - - ● ● - B - -

- - - - - - @B - -

- - ● ● ● - B - ●

- - - - - - @B - -

- - - - - - - - -

- - - - - - - - -

- - - - - - - - -

- - - - - - - - -

- - - - - - - - -

- - - - - - - - -

● - - ● - - - ● -

● - - ● - - B ● -

- - ● ● A - B ● -

- ● ● - - ● - - ●

● - - ● - - B ● -

● ● @● ● - ● - - ●

- - - - ● - B - ●

- @● @● - - @● @B - -

- - - ● - - B - -

- @● @● - - @● @B - -

● - - ● ● - B - -

- ● ● - ● ● - - ●

● - - ● - - B - -

● ● - ● - - B - -

- - ● - A - B ● -

- @● - ● - - B - ●

- @● @● - - - @B - -

- - ● - - @● - - -

- ● ● ● - ● - - ●

● ● A ● - ● - - -

- - - - - - - - -

● - - ● - - B ● -

- ● - ● - ● - - ●

- - ● - A - B - -

- - - - - - B - -

- - - - - - - - -

- - - - - - - - -

- - - - - - - - -

- - - - - - - - -

- - - - - - - - -

- - - - - - - - -

- - - - - - - - -

- - - - - - - - -

- - - - - - @B - -

- - - - - - - - -

- - - - - - @B - -

- - ● ● - - B - -

- - - - - - - - -

- - - - - - - - -

- - - - - - - - -

- - - - - - - - -

- - - - - - - - -

- - - - - - - - -

- - - - - - - - -

- - - - - - - - -

- ● - ● - - - - -- ● - ● - - - - -● ● - ● ● - B - C

- - C ● - - B - C

- ● - ● ● - B - -

- - - - - - - - -

- ● ● - - ● B - -

● ● ● ● ● ● B - ●

- ● - - - - - - -

- ● - - - - - - ●

● ● ● - - - B - ●● ● - ● ● - B - -

● - - ● ● - B - -

C - - C C - B,C - -

● - - - - - B - -

- - C C C - B,C - C

- - - ● ● - B - -

- - ● ● - - B - ●

- - ● - ● - B - ●

C - - - C - B,C - -

● ● ● - - ● B - ●

- - - - - - - - -

- - - - - - - - -

- - - - - - - - -

- - - - - - - - -

- - - - - - - - -

- - - - - - - - -

- - - - - - - - -

- ● - - ● ● B - -

- ● - - ● ● B - -

- - - - - - @B - -

● ● ● ● ● ● B - ●

- - - - - - - - -

- - - - - - - - -

- - - - - - - - -

- - - - - - - - -

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- - - - - - - - -

- - - - - - - - -

● ● - ● - - - ● -

● ● - - - ● - @● -

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- ● ● ● - ● - ● -

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@● @● - - - - - @● -

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- - - - - - - - -

- - - - - - - - -

- - - - - - - - -

- - - - - - - - -

- - - - - - - - -

- - - ● ● - B - -

- - - ● ● - B - -

- - - - - - @B - -

● ● ● ● ● ● B ● ●

- - - - - - - - -

- - - - - - - - -

- - - - - - - - -

- - - - - - - - -

- - - - - - - - -

- - - - - - - - -

- - - - - - - - -

● ● - ● - - B - ●

● ● @● @● - - - @● ●

- ● ● - - ● B - ●

● ● ● ● - - B - ●

● ● @● @● - - @B - ●

● ● @● ● - - B - ●

● ● ● ● - - @B ● ●

● ● ● ● - - B ● ●

- ● @● ● - - @B - -

- ● ● ● - - B ● ●

- - @● - - - - - -

● ● - ● - ● B ● ●

● ● @● ● - - - @● ●

● ● ● ● - ● B - ●

● ● @● ● - - B - ●

● ● ● ● - - B ● ●

- @● @● @● - - @B - @●

● ● - @● - - B - ●

● ● @● ● - - B - ●

● ● - ● - - B - ●

- @● - @● - - B - -

- ● - @● - - B - ●

● ● - @● - - B - ●

● ● - ● - - B - ●

● ● - ● - - B - ●

● ● - ● - - B ● ●

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● ● - ● - - B - ●- - - - - - - - -

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- - - - - - - - -

- - - - - - - - -

- - - - - - - - -

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- - - - - - @B - -

- - - - - - @B - -

- - - - - - @B - -

● ● ● ● - ● B ● ●

- - - - - - - - -

- - - - - - - - -

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- - - - - - - - -

- - - - - - - - -

- - - - - - - - -

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● @● - ● - - - ● -

- @● @S ● - - - ● -

- - @S ● - - - ● -

- ● ● - - ● B - ●

- - - - ● - B - -

- - - ● ● - B - -

- @● - - - - - - -- @● @● - - - - - -

● ● ● ● - ● B ● ●

- ● - - - ● B - ●

- ● - - - ● B - ●

- - - - - - - - -

- @● - - - - - - -

- @● - - ● - B - -- @● - - ● - B - -- - - - ● - B - -

@● @● @● - - - @B - @●- @● - - - - - - -

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- ● - - - - B - -

- - - - ● - B - -

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- - - - - - @B - -

- - - - - - - - -

- @● - - - @● - - @●

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- - - - - - @B - -

● ● ● ● ● ● B ● ●

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● ● ● ● ● ● B ● ●

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- - @● @● @● - @B - @●

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● ● ● ● ● ● B ● ●

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- - - - - - - - -

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@● - @● @● - @● @B @● @S

- - - - @● - @B - -

- - @● @● - - @B @● -

@● - - - @● @● @B - @●

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- - - - - - @B - @●- - - - - @● @B - @●

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- - @● @● - - B - ●

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- ● @● ● - - - - @●

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- - - - ● - B - -

- - @● @● - - @B - @●

- - - ● ● - B - -

@● - - ● - - B - ●

- @● ● ● - ● B - ●

- - @● @● @● - @B - @●

- @● @● - - @● - @● -

- - - - - - - - -

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- - - - - - - - -

- - - - - - - - -

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- - - - - - - - -

- - - - - - - - -

- ● - - ● - B - -

- ● - - ● - B - -

- - - - - - @B - -

● ● ● ● ● ● B - ●

- - - - - - - - -

- - - - - - - - -

- - - - - - - - -

- - - - - - - - -

22 23 24 25 27 29 30 31 32

- - - - - - - - -

- - - - - - - - -

- - - - - - - - -

EC-Q200 Revision D)

Salt

Spra

y

Fla

me R

eta

rdance

Ele

ctrica

l Tra

nsi

ent C

onduct

ion

Shear

Str

ength

Fault

Curr

ent D

ura

bili

ty

Rota

tion L

ife

Surg

e V

olta

ge

Term

inal S

trength

(S

MD

)

Beam

Load T

est

- - - - - - - - -

- - - - - - - - -

● - R - - - - - -

● - R - - - - - -

● - R - - - - - -

- - R - - N - - -

● - - - - - - - -

- - R - - N - - -

● - R - - - - - -

- - R - - N - - -

- - - - - - - - -

R - R - - - - - -- - - - - - - - -- - - - - N - - -

- - - - - N - - -

- - - - - - - - -

● - R - - - - - -

- - - - - - - - -

- - - - - - - - -

- - - - - - - - -

- - - - - - - - -

- - - - - - - - -

- - - - - - - - -

- - - - - - - - -

- - - - - - - - -

- - - - - - - - -

- - - - - - - - -

● - R - - N - - -

- - - - - - - - -

- - - - - - - - -

- - - - - - - - -

- - - - - - - - -

- - - - - - - - -

- - - - - - - - -

- - - - - - - - -

- - - - - - - - -

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- - - - - - - - -

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● - - - - - - - -

- - - - - - - - -

- C - - - - - - -

- C - - - - - - -

- C - - - - - - -

- - - - - - - - -

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- C - - - - - - -

- - - - - - - - -

- C - - - - - - -

● - - - - - - - -

- - - - - - - - -

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- - - - - - - - -

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- C - - - - - - -

- C - - - - - - -

- - - - - - - - -

● C - - - - - - -

- - - - - - - - -

- - - - - - - - -

- - - - - - - - -

- - - - - - - - -

- - - - - - - - -

- - - - - - - - -

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- - - - - - - - -

- - - - - - - - -

- - - - - - - - -

33 34 35

- - - - -

- - - @● -

- - - - -

additional to AEC-

Q200

Remarks

Whis

ker

Test

(IE

C 6

0068-T

2-8

2, JE

DE

C J

ES

D201)

Para

mete

r-A

naly

sis:

C

om

pariso

n o

f cu

rrent w

ith c

hanged d

evi

cech

ara

cteriza

tion, ele

ctrica

l dis

trib

utio

n

End-o

f-Life

Mode V

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- - - - - Check whether AOI at tier 1 can be affected.

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- - - - @●Assumption material specification remains unchanged. Otherwise see change of material.

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- - - - @●Test effort depends on final risk assessment.Performance test according to affected process change.

- - - - @●Test effort depends on final risk assessment. Performance test according to affected process change.

- - - - @● Gage R&R / delta correlation

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- - - - @● Characterisation depends on impact of production flow.

- - - - -R (electr. funct.): test coverage.R (reliability) only for change in burn in process.

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- - - - @●Electrical function affected if mechanical stress distribution changes. AOI, wave soldering and board coating has to be assessed. MSL might change.

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- - - - @● Considere in case of core-core glue the air gap.


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- - - - @●Parameter Analysis only for components where mold material has magnetic function

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- - - - -Mechanical damage of wire,impact on solderability in case of stripping process is affecting soldering area.

- - - @● - Influence regarding reliability of solder joint.

- - - @● - Increase of contact resistance.

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- - - - - Consider vibration in application

- - - - - Consider AOI and processability

- - - @● - Change of base material: Consider ESR, high frequency parameter

- - - - -Consider ESR.Solderability Test for naked SMD components.

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- - - - -Consider ESR.Solderability Test for naked SMD components.

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- - - - -C0 may be influencedTemperature expansion coefficient may change

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- - - - - X-Ray inspection may be influenced when sealing is containing Pb

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Electrical function affected in case of mechanical stress distribution change. AOI, wave soldering and board coating has to be assessed. MSL might be changed.

- - - - - Impedance my be influenced.

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- - - - - AOI check necessary!

- - - - -Assumption material specification remains unchanged. Otherwise see change of material.

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- - - - -C0 may be influencedReliabiliy of solder joints may be affected

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Electrical function affected in case of mechanical stress distribution change. AOI, wave soldering and board coating has to be assessed. MSL might be changed.

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Test effort depends on final risk assessment.Performance test according to affected material.Assumption material specification remains unchanged. Otherwise see change of material.

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- - - - - Terminal Strength (11) not for axial components without paddle tabs.

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- - - - -Terminal Strength (11) and Vibration (14) not for axial components without paddle tabs.

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components only.

- - - - - R: Depends on process change

- - - - @● R: Depends on process change

- - - - - Solderability may be influenced

- - - - - Solderability may be influenced

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- - - - @●Parameter analyse only necessary if an anticipated impact on electrical performance.S = SMD device only

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- - - - @●Parameter analyse only necessary if an anticipated impact on electrical performance.

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- - - - @●Characterisation depends on impact of test coverage.R (electr. funct.): test coverage.R (reliability) only for change in burn in process.

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SalesItem_name SalesItem_orderablePartNumber SalesOrder_customerPartNumber

934062304215 2PB710ASL,215

934062304235 2PB710ASL,235

934062315215 2PD602ASL,215

934062315235 2PD602ASL,235

934051280215 BAT720,215 BAT720,215

934051280235 BAT720,235

934058979215 PDTB113ZT,215 PDTB113ZT,215

ProductType_name BasicType_description PackageOutlineVersion_description

2PB710ASL 50 V, 500 mA PNP general-pSOT23

2PB710ASL 50 V, 500 mA PNP general-pSOT23

2PD602ASL 50 V, 500 mA NPN general-pSOT23

2PD602ASL 50 V, 500 mA NPN general-pSOT23

BAT720 Schottky barrier diode SOT23

BAT720 Schottky barrier diode SOT23

PDTB113ZT PNP 500 mA, 50 V resistor-eqSOT23

PackageType_description SalesItem_state SalesItem_discontinuationType

TO-236AB RFS

TO-236AB RFS

TO-236AB RFS

TO-236AB RFS

TO-236AB RFS

TO-236AB RFS

TO-236AB RFS

SalesItem_availability SalesItem_source SalesItem_lastTimeBuyDate

SalesItem_lastTimeShipDate SalesItem_customerSpecificIndicator

No

No

No

No

No

No

No

Replacement_SalesItem_orderablePartNumber Replacement_SalesItem_name

Replacement_ProductType_name Replacement_BasicType_description

BusinessLine_description

Bipolar Discretes

Bipolar Discretes

Bipolar Discretes

Bipolar Discretes

Bipolar Discretes

Bipolar Discretes

Bipolar Discretes

Nexperia Product Change Notification 202109019F

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Transcript of Nexperia Product Change Notification 202109019F