Muon EDR material specification: Epoxy glue 16/04/20031T.Schneider/LHCb Muon EDR 1.Different...

16/04/2003 1T.Schneider/LHCb Muon EDR

Muon EDR material specification: Epoxy glue

1. Different application of epoxy glue in the muon chambersa) Wire fixation on Anode wire barb) Bar gluing on the cathode panelc) Peripheral gluing to close and seal the chamber

2. Epoxy glue requirements

3. Table of possible glue candidates

4. Additional test done for direct comparison:a) Viscosityb) Electrical resistivityc) Attachment properties (shear test ISO9664)

5. Conclusions for the different applications



1.a) Wire fixation on the anode wire bar

The 5mm wide glue line in front of the soldering has to keep the wires with a tension of 60g.

Low glue viscosity assures that the 30µm wire is well enclosed by the glue.

The glue line thickness shall not exceed 1mm as we have ground in only 2.5mm distance.

All Proto-types have been done with Adekit 145=> good experience


Muon EDR material specification: Epoxy glue1.b) Bar gluing on the cathode panel

Special tooling has been developed to glue the bars precise

(2.5mm ± 50μm) to the panel.

Function to the glue:

-Mechanical fixation of bars on the panel. Wires pull with ~300gr /cm on the bar-Filling the gap between bars and panel (0.1mm-0.6mm depends on thickness of the chosen bar material)-Provide sufficient gas tightness for the chamber


Muon EDR material specification: Epoxy glue1.c) Peripheral gluing to close and seal the

chamber

In some chamber design peripheral sealing is foreseen. Once

the HV and uniformity test of the assembled chamber aresatisfying this final procedure can be performed.

Function of the glue:

-Good attachment properties to keep the chamber mechanically together

-High viscosity to facilitate the work all around the chamber

-Provide sufficient gas tightness for the chamber



- Working time >30min- Manipulation time < 8h- Good adhesive behavior for FR4 to copper/gold- Low viscosity for wire gluing- Medium to high viscosity epoxy for bar gluing /gap

filling procedure to ensure mechanical strength and gas tightness

- High electrical resistance (risk of dark currents)- Good chemical resistance (CF4/radiation/high el.

field)- Good shock resistance (elastic behavior to avoid

cracks and consequent leaks)

2. Epoxy glue requirements


Muon EDR material specification: Epoxy glue3. Table of possible glue candidates

supplier AXSON/Adekit Ciba/Araldite Scotch 3Mrecomended recommended recommended recommended

personal wire gluing CERNpanel border HoneyC.Structureexperience PNPI INFN CERN bars gluing CERN

A145 A140 Araldite 2011 Araldite 2012 DP490 DP460 DP810shear force(on treated Al) 18 Mpa 21 Mpa 27 N/mm² 18 N/mm² 30 MPa 31.5 Mpa 4200 psiworking time 90 min 40 min 120 min 4 min 180 min 60 min 10 minmanipulation 12h (20º)time 6h (23º) 4.5h (23º) 4h (40º) 4h 4-6h 1h (50%)tolal polimerisation 72h 20h (50%) 8-24h

Thixotropeviscosity medium 430 PaS ok 30 PaS 520 PaS 16.000 cps 20.000 cpsshock good flexibleresistance 75Shore D (mix ratio) 25KJ/cm 75-80 Shore Delectrical < 0.1nA 0.9nA <0.1nA 0.8nA <0.1nAresistance 2.4*exp14Ω/cmchem. resistance ok ok50mlprice CHF/Kg 200 200 320 400 400400 or 200mlprice CHF/Kg 78.5 75 195 207 2072 components price CHF/Kg 35

Captiontests to be done Recommendation or good experience acceptable not acceptable no information

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Muon EDR material specification: Epoxy glue4.a) Viscosity test

Adekit 140 Adekit 145 Araldite 2011 3M DP490 3M DP460


Muon EDR material specification: Epoxy glue4.a) Viscosity test

Different Glue candidates have been applied to a declined surface “structural” “low viscosity” “structural” “medium viscosity”

Adekit 140 Adekit 145 Araldite 2011 3M DP490 3M DP460


Muon EDR material specification: Epoxy glue4.b) Electrical resistivity test

• Samples for volume resistivity have been prepared.• 3KV have been applied to the samples under controlled condition

(T const, dry air)• Sensitivity of measuring device is 0.1nA


Muon EDR material specification: Epoxy glue4.b) Electrical resistivity

Results:

A145 A140 Araldite2011 DP490DP460

<0.1nA 0.9nA <0.1nA 0.8nA <0.1nA (3.3TΩ; 130TΩcm) (3.7TΩ; 150TΩcm)

=>The 2 structural glues have lower volume resistivity !The test of volume resistivity is more an academic approach. Real conditions might be dominated by surface currents.Tests are ongoing to get some answers on surface resistivity from theepoxy glues. Reliable measurements are difficult to obtain due toenvironmental conditions such as humidity and temperature. Experience and results from Proto-types should enter into theseconsiderations.


Muon EDR material specification: Epoxy glue4.b) Attachment FR4 to Cu/Au

For good comparison for our special use (FR to Cu/au) a test for

“fatigue properties of structural adhesives in tensile shear”

( ISO 9664) has been performed in the CERN EST Division.



Five samples per candidate (5) and condition (Cu or Au) have been

prepared =>50 in total.Humidity and temperature were kept stable during this

operation.200mm wires were introduced as spacers to simulate the

realcondition of our chamber construction.



*Adekit 145 is only candidate for the wire gluing The 4 others are possible candidates for the bar gluing and peripheral gluing

EST/SM-MESection de métallurgie / Metallurgy sectionRapport expérimental / Investigation report

Glue Average of Samples Cu/FR4 Average of Samples Au/FR4

Samples N MPa Samples N Mpa

Araldite2011 1 to 5 3304 ± 366 10.6 ± 1.2 26 to 30 2053 ± 57 6.6 ± 0.2

3M DP 460 6 to 10 3642 ± 1065 11.6 ± 3.4 31 to 35 2482 ± 432 7.9 ± 1.4

3MDP 490 11 to 15 4174 ± 486 13.4 ± 1.6 36 to 40 2213 ± 648 7.1 ± 2.1

Adekit 140 16 to 20 3460 ± 329 11.1 ± 1.1 41 to 45 3269 ± 240 10.5 ± 0.8

Adekit 145* 21 to 25 1660 ± 311 5.3 ± 1.0 46 to 50 1483 ± 309 4.7 ± 1.0



• Apart from the Adekit 145 the result

are “quite similar”.• Best result for FR4/Cu : DP490• Best result for FR4/Au : Adekit140

Comments:

The 2 structural glues (DP490/Adekit140)

break in the glue. The glue stays on both

surfaces. The 3 transparent less viscous

ones (DP460/Adekit145/Araldite2011)

break at the glue metal connection.


Muon EDR material specification: Epoxy glue5. Conclusions for the different

applicationssupplier AXSON/Adekit Ciba/Araldite Scotch 3M recomended recommended recommended recommended

personal wire gluing panel border gluing HC and bar gluingexperience CERN / PNPI / INFN CERN CERN / PNPI

A145 A140 Araldite 2011 DP490 DP460shear force NFr4/copper 1660 3460 3304 4174 3642FR4/gold 1483 3269 2053 2213 2482working time 90 min 40 min 120 min 180 min 60 minmanipulation 12h (20º)time 6h (23º) 4.5h (23º) 4h (40º) 4h 4-6htolal polimerisation 72h 20h (50%)

low viscosity high viscosity low viscosity high viscosity medium viscosityviscosity structural glue structural glue okshock flexibleresistance 75Shore D (mix ratio) 25KJ/cm 75-80 Shore Delectrical < 0.1nA 0.9nA <0.1nA 0.8nA <0.1nAresistance 130 TΩcm 150 TΩcmchem. Gif aging Gif agingresistance ok ok50mlprice CHF/Kg 200 200 320 400 400400 or 200mlprice CHF/Kg 78.5 80 195 207 2072 components price CHF/Kg 35

Caption

tests to be done Recommendation or good experience good acceptebale not acceptable



applications

Wire gluing:

• We agreed to continue with Adekit 145 as we had quite good feed back in all our proto types. It was satisfying all requirements for this application (attachment, el. resistifity, viscosity, chemical resistance)

• Calculating the attachment force corresponding to the wire surface in a 5mm wide gluing line the breaking limit is still factor 4 (2.3N0.6N wire tension) above our use.



applications

Bar and peripheral gluing:

• High viscosity to obtain good leak tightness as well as the attachment force are the most important properties for this application.

• A good candidate is the Adekit 145. We decided to use this glue for the next chambers. This will give us soon answers about the missing chemical and electrical properties.

Muon EDR material specification: Epoxy glue 16/04/20031T.Schneider/LHCb Muon EDR 1.Different...

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