Imec presentation

IMECAT A GLANCEAT A GLANCE

HISTORY

▸ Established by state

HISTORY

▸ Established by state government of Flanders in 1984

▸ Independent non-profit organization

▸ Worldwide reach

▸ Initial investment: 62M€

▸ Initial staff: ~70

© IMEC 2012© IMEC 2012

MISSION

▸ W ld l di h i

MISSION

▸ World-leading research in nano-electronics

▸ Scientific knowledge with Scientific knowledge with innovative power of global partnerships in ICT, healthcare and energyhealthcare and energy

▸ Industry-relevant technology solutionstechnology solutions

▸ International top talent in a unique high-tech environment committed to provide building blocks for a better life in a

© IMEC 2012

sustainable society

FULL ECO SYSTEMFULL ECO SYSTEM

Universities

GovernmentEurope IMEC

Industryy

FACTS & FIGURES

▸ Total revenue in 2011 of

FACTS & FIGURES

▸ Total revenue in 2011 of 300M€, a growth of 5%

▸ 1 773 publications R&D 1,773 publications R&D related in 2011

▸ 132 patents awarded & p133 patents submitted in 2011

▸ Collaboration with 600 companies & 208 universities

▸ 600 residents

© IMEC 2012

Top 5 foreign employees1 The Netherlands (# HEADCOUNT 1. The Netherlands (#

159)2. China (# 87)3. France (# 86)4. India (# 76)May 2012:

HEADCOUNT

4. India (# 76)5. Japan (# 61)▸ 1,077 Belgians

▸ 72 foreign nationalities 159

140

160

87 8676

100

120

46

76

59 61

43

40

60

80

1 1 3 1 2 27 7 5

1 1 1 4 4

16

1 1

30

18

1 1 2 1

13

3

13

2 1

31

1 1 2 5 81 3 1 1 1 4 1 4

10

2

1015

8 5 61 2

25

4 2

28

1

12

15

1 17

10

20

40

IMEC IN THE WORLDIMEC IN THE WORLD

BelgiumBelgium

The NetherlandsThe Netherlands

office Japanoffice Japanoffice USoffice USChinaChina

TaiwanTaiwanIndiaIndia

Silicon Organic solar cell

NERF 200mm pilot line

Silicon solar cell

lineline NERF

lab

300mm pilot line

Nano biolabs

450mm 450mm ready

STATE-OF-THE-ART RESEARCH FACILITIESRESEARCH FACILITIES

300mm PILOT LINE300mm PILOT LINE

IMEC TOWER

‣ Expansion of 14 208 m2‣ Expansion of 14,208 m

‣ 16 floors – capacity of 450 people & lab space

RESEARCH PROGRAMS FOR FULL ECO SYSTEM

Green RadioLow power

wireless communication

ImagingImage sensors

& vision systems

EnergyPhotovoltaicsPower devices

LEDs

Sensor systems for industrial applications

BANLife Sciences

Human++

communication

OrganicCMORE

LEDsapplications

Core CMOSelectronicsMEMS, Sensor

PhotonicsLithography Devices Interconnects

SCALINGSCALING

‣ 1965: 1965: Lithography enabled scaling

‣ 2002-2003: ~ 90 nm2002 2003: 90 nmMaterials enabled scaling

‣ ~ 14 nm:‣ 14 nm:3D enabled scaling

© IMEC 2012

FINFETFINFET

‣ 22nm – 14nm22nm 14nm

‣ FinFET introduction at 22nm for high-end 22nm for high end applications

‣ 14nm for foundry ‣ 14nm for foundry processes

© IMEC 2012

LOGICLOGIC

‣ High mobility channelHigh mobility channel

‣ 10 nm – 7nm

GeGe

© IMEC 2012

LOGICLOGIC

‣ High mobility channelHigh mobility channel

‣ 10nm – 7nm

Ge

InGaAs

GeInP

GaAs

Si

Ge

GaAs

© IMEC 2012

LOGICLOGIC

‣ New device concepts

Tunnel FET

New device concepts

‣ Tunnel FETPinch-off FET

‣ Pinch-off FET

‣ 7nm – 5nm

© IMEC 2012

ReRAMReRAM

‣ Resistive RAMResistive RAM

‣ Integration in a vertical conceptconcept

‣ In 2011: world’s smallest, fully-functional HfO2-based fully-functional HfO2-based ReRAM cell, with an area of less than 10 x 10nm²

© IMEC 2012

DRAMDRAM

‣ STT RAM as stand alone STT RAM as stand alone and for embedded memory

© IMEC 2012

<20nm

3D INTEGRATION3D INTEGRATION

‣ Reducing floor space –Reducing floor space small form factor

‣ 3D stacking of memory on 3D stacking of memory on logic or RF on interposer

© IMEC 2012

OPTICAL I/OOPTICAL I/O

‣ Extreme high bandwidth Extreme high bandwidth I/O in high performance computing

‣ Imec world-first sub-100nm photonics components on 300mm Si technology with optical li h hlithography

© IMEC 2012

EUVEUV

‣ ASML preproduction ASML preproduction scanner NXE:3100 for extreme UV lithography

© IMEC 2012

LITHO POWERLITHO POWER

‣ 16nm half pitch16nm half pitch

‣ Phenomenal lithographic power can be achievedpower can be achieved

© IMEC 2012

DIRECTED SELF DIRECTED SELF ASSEMBLY

‣ Extending optical g plithography beyond its current limits

‣ Alternative patterning enabling frequency multiplication through use p gof block copolymers

© IMEC 2012

INSITEINSITE

‣ Technology insights for gy gproduct roadmapsSYSTEM DESIGN

(Fabless - Fablite)

INSITE

PROCESS TECHNOLOGY(Foundry)

© IMEC 2012

INSITEINSITE

‣ Linking process technology

Technology Option

selection g p gy& system design

Path-findingTechnology-

designTest chips

Design & gco-exploration build

ModelMeasure &

© IMEC 2012

Measure & characterize


‣ Investment > 1B$$

‣ Unique lithography cluster centered around ASML equipment

‣ Advanced equipment and preproduction toolspreproduction tools

‣ Ballroom type of cleanroom

4 800 ² l 1 000 ‣ 4,800m² class 1,000 area

© IMEC 2012


300mm PILOT LINE:

‣ Silicon pilot line for (sub-)22nm‣ Silicon pilot line for (sub-)22nm

‣ Semi-industrial operation - 24/7, process monitoring, short cycle time

PREPARING 450mmPREPARING 450mm

‣ Funding Flemish gGovernment

‣ Towards Europe’s innovation engine

© IMEC 2012

GLOBAL NETWORK

SYSTEM COMPANIES

MEMORY IDM LOGIC IDM FOUNDRIES FABLITE FABLESS

EQUIPMENT SUPPLIERS

MATERIAL SUPPLIERS

SOFTWARE SUPPLIERS

GLOBAL NETWORK

Foundries Fablite FablessLogic IDMMemory IDM

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CORE CMOS PARTNERS


LamRESEARCH





& vision systems


LEDs


BANLife Sciences

Human++

communication

OrganicCMORE

LEDsapplications



BODY AREA NETWORKSNETWORKS

BODY AREA internetdoctor BODY AREA

NETWORKShospital

W bl h l h d ▸ Wearable health and comfort monitoring

© IMEC 2012

HEALTH PATCHHEALTH PATCH

M l i ▸ Multi parameter: - heartbeat - skin temperature- skin conductance- sweat analysis - chemical sensingg

© IMEC 2012

HEALTH PATCHECG PATCHECG PATCH

Ul l ECG ▸ Ultra-low power ECG patch

▸ Bluetooth low energygy▸ Embedded algorithm▸ 30 days autonomy

© IMEC 2012

WIRELESS EEGWIRELESS EEG

A li iApplications:▸ Improving traffic safety

through drowsiness gmonitoring

▸ Games that adapt to the player’s cognitive stateplayer s cognitive state

▸ E-learning that adapts to the user’s concentration

▸ Accurate EEG monitoring at home, e.g. epilepsy patients

© IMEC 2012

patients

ULTRA LOW ULTRA LOW ENERGY DESIGN

Di i l d i f ▸ Digital system design for battery operated and harvested devices with 10-100 times less power consumption

▸ Reliable near-threshold Reliable near threshold design

▸ Ultra energy efficient bi di l ibiomedical processing

© IMEC 2012

MOBILE MOBILE DIAGNOSTICS

Aff d bl ▸ Affordable ▸ Health monitoring to rural

environments in developing countries

© IMEC 2012

CMUT

4D RT imaging

CMUT

C i i Mi hi d

4D RT imaging

▸ Capacitive MicromachinedUltrasonic Transducers technology

▸ Towards mobile real-time 4D ultrasound

▸ More precise & faster

Mock up

▸ More precise & faster ultrasound scans

© IMEC 2012

CMUT: BASED ON CMUT: BASED ON SiGe MEMS

SiG MEMS f ▸ SiGe MEMS on top of CMOS

▸ Membranes integrated gwith electronics

▸ More compact, faster, more sensitive increasing more sensitive, increasing pixel density

© IMEC 2012

LIFE SCIENCES:EARLY DIAGNOSTICSEARLY DIAGNOSTICS

EARLYEARLYDETECTION

E l d i f ▸ Early detection of cancer cells

▸ Secondary tumors are ymain cause of most cancer deaths

▸ Challenge: detecting one ▸ Challenge: detecting one in 5 billion cells

© IMEC 2012

INSPECTION INSPECTION CIRCUITS

Chi i h h d f ▸ Chip with thousands of parallel inspection circuits

▸ Each containing gelectronics, microfluidics & imaging hardware

▸ Goal: inspect 20 million ▸ Goal: inspect 20 million cells per second with high reliability

© IMEC 2012

LIFE SCIENCES:PERSONALIZED THERAPYPERSONALIZED THERAPY

STEM CELLSSTEM CELLS

T di b i b ▸ Treat diabetes patients by replacing faulty pancreas cells with new pancreas cells

▸ Reprogrammed on the basis of own stem cellsbasis of own stem cells

© IMEC 2012

STEM CELL STEM CELL BIOREACTOR

G i ll & i ▸ Growing cells & tissues on chips

▸ Two-way communication ybetween electronics & cells

▸ Expertise in electrode ▸ Expertise in electrode arrays on active CMOS for cell recording of

& di llneurons & cardiac cells

© IMEC 2012

PRECISE PRECISE REPROGRAMMING

Ch ll l f f ▸ Challenge: a platform for precise reprogramming and growth of stem cells

▸ Built on expertise in advanced semiconductor equipment & advanced equipment & advanced metrology

© IMEC 2012

NERF LABNERF LAB

▸ I & VIB & KU L▸ Imec & VIB & KU Leuven▸ Unraveling the human

brain

▸ Research interests: - sensory integration &

i i h processing in the zebrafish brain

- neural circuits &behavior

- functional assembly of l i it

© IMEC 2012

neural circuits

HUMAN++ PROGRAM PARTNERSHUMAN++ PROGRAM PARTNERS



& vision systems


LEDs


BANLife Sciences

Human++ Green RadioLow power


OrganicCMORE

LEDsapplications

Core CMOS

communication

electronicsMEMS, Sensor Photonics

Lithography Devices Interconnects

WIRLESS SENSORSWIRLESS SENSORS

▸ Improving connectedness▸ Improving connectedness

▸ Smarter world: - smart healthcare- smart buildings - smart phone

smart display- smart display

© IMEC 2012

WIRELESS WIRELESS COMMUNICATION

▸ Innovative solutions for ▸ Innovative solutions for tomorrow’s wireless communication

▸ By combining advanced IC technology with innovative design strategies & smart design strategies & smart software techniques

▸ Fully-integrated energy-efficient solutions with more performance & flexibility

© IMEC 2012

y

RECONFIGURABLE RECONFIGURABLE RADIOS

▸ Towards low cost & low▸ Towards low-cost & low-power reconfigurable radios

▸ Enabling future 4G networks and digital video broadcasting

▸ Reconfigurable analog front-Reconfigurable analog frontend

▸ Reconfigurable digital b b dbaseband

▸ Spectrum sensing▸ Record breaking ADCs

© IMEC 2012

▸ Record breaking ADCs

mmWAVEmmWAVESOLUTIONS

‣ Wireless solutions that ‣ Wireless solutions that exploit the bandwidth capacity available at 60GH f h t 60GHz for short-range Gigabit/s communication

‣ Radar & backhaul Radar & backhaul applications emerging

© IMEC 2012

ULTRA-LOW ULTRA LOW POWER RADIOS

‣ Radios for battery & ‣ Radios for battery & energy harvested devices with power consumption th t i 10 100 ti l that is 10-100 times lower than conventional low-power systems

© IMEC 2012

PARTNERS WIRELESS TECHNOLOGYS W SS C O OG





LEDs


BANLife Sciences

Human++ ImagingImage sensors

& vision systemscommunication

OrganicCMORE

LEDsapplications



TARGET MARKETSTARGET MARKETS

▸ Spacep▸ Instrumentation▸ Machine vision▸ Medical▸ Biology

© IMEC 2012

SPECIALIZED SPECIALIZED IMAGING

▸ Ultra fast ▸ Non-visible light▸ Enhanced performance▸ Hyperspectral▸ Lensless

© IMEC 2012

ULTRA FAST ULTRA FAST IMAGING

Challengeg▸ Fast readout at low

power consumption▸ Towards million

frames/sec

Building on imec expertise:▸ High speed ADCs▸ Embedded CCD

© IMEC 2012

IMAGING NON IMAGING NON VISIBLE LIGHT

▸ Fully qualified EUV sensors y qinstalled in customer’s product: ASML/3100 lithography toollithography tool

- EUV Energy sensor to monitor EUV dosemonitor EUV dose

- 2 EUV position sensors to calibrate, align and focus lens systems

© IMEC 2012

ENHANCED ENHANCED PERFORMANCE

▸ Backside illumination for:- High quantum

efficiencyBroad spectral range - Broad spectral range from 193nm to 1μm

© IMEC 2012

HYPERSPECTRALHYPERSPECTRALIMAGING

Advantages: g▸ More spectral

information (than RGB)▸ Extreme miniaturization▸ Low cost▸ High speed▸ High speed▸ Wafer-level filter

integration

© IMEC 2012

LENSLESSLENSLESS

Microscopic imaging over a p g glarge area

Biomedical applications:▸ Cell sorting & monitoring

(flow cytometry)▸ Molecular diagnostics Molecular diagnostics

(biomarkers assays)▸ DNA sequencing150 µm

© IMEC 2012





& vision systems


LEDs

BANLife Sciences

Human++ Sensor systems for industrial applicationscommunication

OrganicCMORE

LEDs

Core CMOS

applications



APPLICATIONSAPPLICATIONS

‣ Smart buildingsg

‣ Preventive maintenance

‣ LogisticsLogistics

‣ Automotive

‣ Monitoring environmental ‣ Monitoring environmental parameters

© IMEC 2012

SENSOR SYSTEMSSENSOR SYSTEMS

‣ Long-time autonomy g y

‣ Ultra-low power wireless solutions: 10 – 100 times lower than conventional low-power systems p y

© IMEC 2012

MEMSMEMSHARVERSTER

‣ Piezoelectric harvesters

‣ MEMS harvester to power intelligent tire

‣ Record output of 489µW

© IMEC 2012

ETHYLENEETHYLENESENSOR

‣ Sensor in one single chipg p

‣ Monitor fruit ripening

‣ Low detection limits low Low detection limits, low cost, low power consumption

© IMEC 2012

2.3/2.4 GHZ 2.3/2.4 GHZ TRANSMITTER

‣ Multi-standard transceiver for sensor networks

‣ 2.3/2.4GHz transmitter for wireless sensor applications compliant with 4 wireless standards

‣ 3 to 5 times more power efficient than state-of-the-

Bl h LE art Bluetooth LE

© IMEC 2012





& vision systems


BANLife Sciences

Human++ EnergyPhotovoltaicsPower devices

LEDscommunication

OrganicCMORE

applications

Core CMOS

LEDs



ENERGY ENERGY STRATEGY

▸ Solar energy generationSolar energy generation

▸ Switching energy

▸ Storing energy▸ Storing energy

▸ Saving energy

© IMEC 2012

SILICONPVPV

COMBININGCOMBININGEXPERTISE

▸ Process steps▸ Process steps▸ Materials ▸ Device/module conceptsp

Towards world record performance

© IMEC 2012

SILVER SILVER REPLACEMENT

▸ 7% of all silver used in PV▸ 7% of all silver used in PV▸ A major part of PV cell cost

is silver▸ Replacing silver by copper

© IMEC 2012

Cu-PLATED Cu PLATED Si SOLAR CELL

▸ Copper electroplating▸ Copper electroplating▸ >21% efficiency

© IMEC 2012

INTERDIGITATEDINTERDIGITATEDBACK-CONTACT SiSOLAR CELL

▸ > 23% efficiency

SOLAR CELL

▸ > 23% efficiency

© IMEC 2012

I-MODULEI MODULE

▸ Cell integration of ultra▸ Cell integration of ultra-thin wafers onto module glass

▸ Integrating additional electronics to module for power conversion & load poptimization

© IMEC 2012

Si-PV IIAP PARTNERS

COMBINING COMBINING EXPERTISE

▸ Materials and cell architectures

▸ Collaboration between ▸ Collaboration between world-class chemical companies, innovative d l developers & imec

© IMEC 2012

GaN-on-Si LEDsGaN on Si LEDs

▸ Process flow fully compatible with 200mm CMOS processing lineCMOS processing line

© IMEC 2012

OLEDOLED

▸ New flexible OLED lighting program

▸ Economically scalable ▸ Economically scalable route to high-volume manufacturing

▸ Low power consumption, high resolution, large area, outdoor readability, outdoor readability, flexibility & light weight

© IMEC 2012

GaN PARTNERS

25 year solar25 year solar cell research





& vision systems


LEDs


BANLife Sciences

Human++

communication

Organic

LEDsapplications

Core CMOS CMOREelectronicsLithography Devices Interconnects MEMS, Sensor

Photonics

CMORE

MEMS NANO-PHOTONICS

CMORE

‣ Turn your silicon concept y pinto a product

SENSORS POWER-HIGH V-HBT

BIO-INTERFACE GaN

© IMEC 2012

CMORE

STEP 1 STEP 4

CMORE

PR

O

‣ Turn your silicon concept

- CONCEPT DESIGN - PROTOTYPING - LOW-VOLUME MANUFACTURING AT IMEC

OT

OT

YP

IN y pinto a product

STEP 2

- PROCESS DEVELOPMENT

AT IMEC

STEP 5

TRANSFERLOP

ME

NT

NG

- PROCESS DEVELOPMENT - PACKAGING - TESTING - RELIABILITY

- TRANSFER

O-)

DE

VE

L

STEP 3

- PRODUCT QUALIFICATION

STEP 6

- HIGH-VOLUME MANUFACTURING

(CO

PR

OD

U

QUALIFICATION MANUFACTURING AT FOUNDRY PARTNER

CT

ION

© IMEC 2012

EUV SENSORSEUV SENSORS

‣ High-quality EUV sensors g q yfor ASML’s next-generation lithography tools

‣ Main requirements:- superior lifetime - sensitivity to direct and yhigh doses of EUV irradiation

N i‣ Next generation:- NXE:3100- NXE: 3300

© IMEC 2012

BIOSENSORSBIOSENSORS

‣ Biosensor chips for pGenalyte diagnostic & molecular detection equipmentequipment

‣ CMORE service making use of imec’s silicon photonic ptechnology

© IMEC 2012

CMORE PARTNERS





& vision systems


LEDs


BANLife Sciences

Human++

communication

CMORE

LEDsapplications

Core CMOS OrganicMEMS, Sensor

PhotonicsLithography Devices Interconnects electronics

SYSTEM ON FOILSYSTEM ON FOIL

Thin-film electronics on flexible plastic foils

Applications:Applications:

▸ rollable displays for tablet computers or phonesp p

▸ electronics printed on objects

▸ intelligent food packaging, or paper with integrated electronics

© IMEC 2012

electronics

IMECWHAT WE OFFERWHAT WE OFFER

BUSINESS MODELBUSINESS MODEL

Services TrainingServices Training

Spin-offs Transfer & licenses

Joint Joint R&D

© IMEC 2012

OPEN OPEN INNOVATION

Ri kRi kIP

CostCostRiskRisk

Services Training

TalentTalent Spin-offs

Transfer & licensesoffs licenses

Joint

Accelerated, ff R&D

Joint R&D

© IMEC 2012

cost-effective R&D

OPEN OPEN INNOVATIONPartner

A

Partner B

Partner E

ProgramBE

Services Training

Partner C

Partner D

Spin-offs


Joint

I i d t i l ffili ti

Joint R&D

© IMEC 2012

Imec industrial affiliation programCustomized programs

RESEARCH RESEARCH PROGRAMS

System

Fabless

System

Services Training

FablessFablite

Logic IDM

Memory IDMSpin-offs

Transfer & licensesFoundries

Suppliers

offs licenses

Joint SuppliersEquipmentSuppliers

MaterialSuppliers

EDA SAT

Joint R&D

© IMEC 2012

RESEARCH PROGRAMS FOR FULL INDUSTRY ECO SYSTEMFOR FULL INDUSTRY ECO SYSTEM

Foundries Fablite FablessLogic IDMMemory IDM


SERVICES

▸ ASIC services:

SERVICES

- Design- Prototyping to low-volume

▸ CMORE platform:- Design- Process techn.

Services Training

development- Prototyping to low-volume

Spin-offs

Transfer & licenses

▸ CAMS:- A unique set of reliability and Joint

offs licenses

q ycharacterization services

Joint R&D

© IMEC 2012

TRAINING

▸ Imec Academy

TRAINING

y

▸ Training for industry & academia on advanced concepts and technologies

▸ Advanced training programs on IC technology and design and related Services Training

▸ E-learning and web-based training

▸ On-line knowledge exchange Spin-offs

Transfer & licenses

Joint

offs licenses

Joint R&D

© IMEC 2012

www.imec-academy.be

SPIN-OFFSSPIN OFFS

Services Training

Spin-offs


Joint Integrated in Cypress Integrated in Agilent T h l i

Integrated in Synopsis Inc. Joint R&D

g ypTechnologies

Integrated in ARM Belgium Integrated in Huawei

© IMEC 2012

Alphabit & UCB Electronics integrated in Agilent TechnologiesCobrain integrated in Matrix Integrated Systems, Inc.

TRANSFER & TRANSFER & LICENSES

▸ Process steps, modules, technologies: 65nm and 28nm CMOS platform

Services Training▸ IP blocks:- ADCs

Spin-offs

Transfer & licenses

ADCs- Software-defined radio- Reconfigurable processor- offs licenses

Joint

- …

Joint R&D

© IMEC 2012

IMECIN FLANDERSIN FLANDERS

LEVERAGE TO FLANDERS

With a dedicated team stimulating, initiating &

coordinating cooperation with Flemish companies & with Flemish companies &

innovation actors

Exploration, transfer & consolidation in Flanders

Worldwide industrial networkof top companies

Build up of technology portfolio in generic R&D ProgramsBuild-up of technology portfolio in generic R&D Programs

COOPERATION WITH LOCAL COMPANIES / ACTORSLOCAL COMPANIES / ACTORS

Timely insight and inputs for LT research

Participation in LT/MT/ST

h

Sharing technological

LT research research

Application of Application of 1 few

Focussed added valuetechnological know-how

ppresearch results

ppresearch results

Cooperation with local

Informing about technological

Support for development of

d

Support for development of

d local companies/actors

technological opportunities new products

and processesnew products and processes

1 manyLow threshold

1 1High thresholdLow threshold

Generic added valueHigh thresholdSpecific added value

EXPANSION MODEL: MICROELECTRONICS FOR BENEFIT OF OTHER SECTORSMICROELECTRONICS FOR BENEFIT OF OTHER SECTORS

AutomotiveTextile

FoodBiomedical

Construction Health & WellnessElectronic Design

IMEC’S IMPACT ON THE LOCAL INDUSTRYEVOLUTION COLLABORATION LOCAL COMPANIESEVOLUTION COLLABORATION LOCAL COMPANIES

464486500

600

1984 2001: 142 local companies

350381

411447

464

400

5002002 2011: 344 extra local companies, >60% SME’s!

222

261

306

350

300

102 110127

142166

222

200

26 32 45 5774 86

102 110

0

100

01992 1993 1994 1995 1996 1997 1998 1999 2000 2001 2002 2003 2004 2005 2006 2007 2008 2009 2010 2011

OUR PARTNERS

1066 4

38

3

810

20

32

11

1510

9

38

Hasselt8 24

20

58

102 68

PARTNERS SPREAD OUT OVER FLANDERS

A SAMPLE OF THE FLEMISH PARTNERS

COOPERATION IN DIFFERENT SECTORS 2011WITH LOCAL COMPANIES WITH LOCAL COMPANIES

22%

34%

Non-ICTMicroelectronics

TextileAutomotive

Medical

26%

FoodGraphicsWellness

H lth

18% Electronic prod.

ICT (others)

HealthChemical

ConstructionDomotics

Imec presentation

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