09 Sputter Deposition

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    Sputter Deposition

    Lecture 9

    G.J. Mankey

    [email protected]

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    Sputter Deposition

    Magnetron sputtering is the most widely used method for

    vacuum thin film deposition.

    Although the basic diode sputtering method (without

    magnetron or magnetic enhanced) is still used in some

    application areas, magnetron sputtering now serves over 90%

    of the market for sputter deposition.

    Magnetron sputtering can be used to coat virtually anything

    with a wide range of materials - any solid metal or alloy and a

    variety of compounds.

    ref: www.gencoa.com

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    Sputtering System

    A typical sputtering

    system consists of a

    vacuum chamber

    with substrate

    holders andmagnetron guns,

    vacuum pumps and

    gauging, a gas

    supply system,

    power supplies and a

    computer control

    system.ref: http://www.teercoatings.co.uk

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    The Magnetron

    A Magnetron is comprised of :

    A CATHODE= electron source

    An ANODE= electron collector

    A combined ELECTRIC &MAGNETIC FIELD B X E

    ref: www.gencoa.com

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    The Plasma Discharge

    Plasma is a fluid of positive ions

    and electrons in a quasi-neutral

    electrical state. The vessel that

    contains this fluid is formed by

    electric and magnetic fields.

    In many plasma coating applications

    positive ions are generated bycollisions between neutral particles

    and energetic electrons. The

    electrons in a plasma are highly

    mobile, especially compared to the

    larger ions (typically argon for

    sputtering). Control of the highly mobile plasma

    electrons is the key to all forms of

    plasma control.ref: www.gencoa.com

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    Microscopic View of Sputtering The impact of an atom or ion on a surface produces

    sputtering from the surface as a result of themomentum transfer from the incoming particle. Unlike

    many other vapor phase techniques there is no melting

    of the material.

    History of Sputtering

    The verb to SPUTTER originates from Latin SPUTARE(To

    emit saliva with noise).

    Phenomenon first described 150 years ago ...

    Grove (1852) and plcker (1858) first reported vaporization

    and film formation of metal films by sputtering.

    Key for understanding discovery of electrons and positive

    ions in low pressure gas discharges and atom structure (J.J.

    Thomson, Rutherford), 1897-- Other names for SPUTTERING were SPLUTTERING and

    CATHODE DESINTEGRATION.

    ref: www.gencoa.com

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    The Magnetron Gun

    A magnetron consists of a target with magnets arranged

    behind it to make a magnetic trap for charged particles, such

    as argon ions, in front of the target.

    Atoms are knocked out of the target surface by the ions - this

    is sputtering. These sputtered atoms arent charged

    negatively or positively, so they go straight out of the

    magnetic trap to coat the substrate.ref: http://www.teercoatings.co.uk

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    The Magnetron Plasma

    Confinement between a negatively biased target and closed magnetic

    field produces a dense plasma. High densities of ions are generated within the confined plasma, and

    these ions are subsequently attracted to the negatively biased target,

    producing sputtering at high rates.ref: www.gencoa.com

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    Target Erosion

    Target erosion is greatest where the magnetic field and the subsequent

    plasma density is greatest. This leads to inefficient use of target material, particularly in the case

    of ferromagnetic targets.

    ref: www.gencoa.com

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    Sputtering Insulators

    For an insulator target, the ions bombarding the target will create

    charging, and the electric field necessary to maintain a plasma is

    greatly diminished.

    To alleviate this problem, an RF power supply is used to generate

    the electric field.

    ref: www.gencoa.com

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    Magnetron Guns

    ref: www.lesker.com

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    The Latest in UHV Sputtering

    A UHV, magnetron sputter source that fits through the port of a 2.75" CF flange

    complete with its tilt gimbals assembly.

    The AJA International new A310-XP only needs a 2.75" CF to accommodate the

    source head, tilt gimbals and gas injection/isolation chimney.

    This revolutionary new design is true UHV - all ceramic to metal construction.

    http://www.ajaint.com