Behavior of Electrons in a Dual-m Agnetron Sputter Deposition System a Monte Carlo Model
Equipment Solutions - Sistem Technology · PDF fileSiSTEM Technology has attended at many of...
Transcript of Equipment Solutions - Sistem Technology · PDF fileSiSTEM Technology has attended at many of...
Semiconductor and High Technology
Equipment Solutions
SiSTEM Technology Ltd
SiSTEM Technology Ltd 02
Supplies that meet your time, cost and quality expectations.
The Company
SiSTEM Technology Ltd is a full service company in operation since June 2004. Prior to this , SiSTEM’s founder, Chris Ridge, had worked in the semiconductor and high technology industries for over 30 years in research and development, process engineering and later capital equipment distribution.
Our Goals
Our company goals are to supply to our customer’s advanced tech-nology products which meet their needs of quality build and reliabil-ity , on-time delivery, and competitive cost . Only in this way will we establish a justifiable reputation as a key supplier in what is an in-creasingly demanding and ever-changing advanced technology mar-ket place.
Our Suppliers
A key part of our success to date may be attributed to the impressive list of manufacturing suppliers that we are privileged to represent in the UK and Ireland, Europe and, in some cases ,Globally. Many of these companies are world-wide leaders in their fields and they contin-ue to contribute to the outstanding developments and ranges of products offered by the Micro and Nano-electronics, Photovoltaic, Thin Film display, and other High Technology industries.
Customer Support
From our offices in the Caswell Science & Technology Park, we support our customers across the UK and Ireland and in Mainland Europe. We offer installation, commissioning, warranty support, service contracts and upgrades from our factory-trained engineers who share our commitment to quality of supply.
Marketing and Affiliations
SiSTEM Technology has attended at many of the UK and Ireland exhi-bitions and conferences in recent years and our customer base contin-ues to grow as a result of our ever –increasing exposure through these events. Our affiliations with the UK’s leading trade associations for our industry, NMI (National Microelectronics Institute) and JEMI ( Joint Equipment and Materials Initiative) also play a major role in helping to promote the goods and services our company provides.
SiSTEM Technology Ltd 03
Supplies that meet your time, cost and quality expectations.
Atomic layer Deposition
PICOSUN R-SERIES
Manual or semi-automatic processing for
research and development
PICOPLASMA™ Source System
Picosun’s innovative PICOPLASMA TM plas-
ma enhanced ALD (PEALD) source system
is based on a highly advanced, ion-free
remote plasma source.
PICOSUN P-SERIES
Fully automatic single wafer,
cluster and batch processes for
high-volume manufacturing
SiSTEM Technology Ltd 04
Supplies that meet your time, cost and quality expectations.
Atomic layer Deposition
Picofloat™ Particle Coating System
The powder to be coated is in a constant motion which ensures uniform ALD film
formation on every particle down to nano-scaled dimensions
PICOSUN™ novel, innovative Roll-to-Roll ALD Coating System.
ALD is well suited technique for depositing thin inorganic coatings onto temperature-sensitive and/or flexible
PICOSUN™ P-1000 ALD Reactor
Has an extra-large reaction chamber for wafers up to 450
mm diameter, sheets of glass, and large batches of 3D
objects.
SiSTEM Technology Ltd 05
Supplies that meet your time, cost and quality expectations.
High Vacuum Process Systems
Nanoquest III Multi-substrate ion milling system
with next-gen RF ICP ion source.
Features
• 22cm RF ICP Ion Source
• Up to 3×6” Planetary
• S.I.M.S. End-point Detection
Nanoquest Pico A compact, low-cost
Ion milling platform for advanced R & D
Process methods:
Ion Beam Etching (IBE)
Reactive Ion Beam Etching (RIBE)
Nanoquest II Ion Beam Etch platform for wafers
up to 8 inches.
Options Include:
• IBS Deposition
• Sputter Deposition
• In-situ Camera
• S.I.M.S. End-point Detection
• Load-lock
NANOQUEST ION BEAM ETCH
Nanoquest I A compact, low cost platform
for advanced Ion beam process
Process methods:
Ion Beam Etching (IBE)
Ion Beam Sputter Deposition
Ion Beam Assisted Deposition (IBAD)
Reactive Ion Beam Etching (RIBE)
Chemically Assisted Ion Beam Etching ( CAIBE)
SiSTEM Technology Ltd 06
Supplies that meet your time, cost and quality expectations.
High Vacuum Process Systems
Nanochrome IV Plasma Assisted Reactive
Magnetron Sputtering
Key Benefits:
Exceptional process repeatability
Stable deposition rates up to 10 Å/Sec
Very low arcing
Capable of producing films with 100+ layers
Optional load-lock operation
Nanochrome Pico A compact, low-cost
platform for advanced Thin Film Coating
Process methods:
Magnetron Sputtering
E-beam Evaporation
Thermal Evaporation
Ion Assisted Deposition
Knudson Cell Evaporation
Nanochrome II An R&D/Pilot Physical
Vapour Deposition System.
Process methods:
Co-Sputtering
Ion Beam Assisted Deposition (IBAD)
RF, AC & Planar Magnetron Sputtering
NANOCHROME PHYSICAL VAPOUR DEPOSITION
Nanochrome I An R&D/Pilot Physical Vapour
Deposition System
Process methods:
Co-Evaporation
Multi-Layered E-beam Deposition
Ion Beam Assisted Deposition (IBAD)
Thermal Evaporation)
Planar Magnetron Sputtering
SiSTEM Technology Ltd 07
Supplies that meet your time, cost and quality expectations.
High Vacuum Process Systems
Advantages of DLC for
Infrared Optics
• High hardness
• Low Friction
• Electrical Insulation
• Resistance to Wear
• Chemical Inertness
• Good Thermal Conductivity
• Optical Transparency
• Biological Compatibility
Applications Optics DLC coating acts as a single-layer anti-reflection coating for high index substrates and it
provides wear & chemical resistance for optical elements used in harsh environments.
• Intlvac Thin Film DLC conforms to TS1888 Wiper Test and all relevant MIL-C-48497A tests.
Bio-engineering DLC provides advantages of bio-compatibility, wear resistance, and diffusion resistance.
Mechanical Engineering
DLC provides wear & corrosion resistance, low friction, and good thermal conductivity.
DLC on wide variety of substrates that include: IR Optics:
• Silicon, Germanium, Chalcogenides
Plastics: • Ultem, Polycarbonate, Polyimide, PEEK
Glass: • Crown Glass, UVFS, SF11, Sapphire
Metals: • Aluminium, Copper, High-carbon Steel
d a m o n d l k e c a r b o
PECVD DIAMOND LIKE CARBON
SiSTEM Technology Ltd 08
Supplies that meet your time, cost and quality
Photolithography
Comprehensive coating (spin/spray), Developing, Etching and
Cleaning Systems.
EL 200 System consisting of:
Spinner Bowl
Input Terminal with 3.5” colour-touch screen with Windows CE up to
40 programmable recipes with 8 individual steps
3 different nozzles (Special Options)
Suitable for processes like:
Coating, Etching, Cleaning , Developing, Rinsing , Drying
QuickStep System consisting of:
Spinner System for Coating, Developing, or cleaning Applications.
Wafers up to 200mm and substrates up to 150 x 150mm
Bench mounted or stand alone modules
Unlimited Programmable recipe steps
Programmable in speed and position
Prepared for up to 6 media lines / nozzles
New BCB Coating and Baking System
Enhanced system to ensure a more stable and controlled BCB coating
with a following bake process step.
This new technology enables tighter process control. The bake step is
optimized to make sure the oxygen inside the bake environment is re-
placed very quickly by nitrogen.
SiSTEM Technology Ltd 09
Supplies that meet your time, cost and quality expectations.
Photolithography (Cont)
The Microcluster series are designed for clean, reliable, high vol-ume throughput. The Microcluster is also a cost effective photo-lithographic processing tool with outstanding flexibility for different materials and processes. Modules include HMDS vapour prime, photoresist deposition, photoresist development, soft bake, hard bake, cool plate, smart EBR, wafer flipper, ergonomic wafer load and unload modules. The configuration can handle wafers from 50 mm up to 200 mm or substrates from 2” x 2” to 6” x 6”.
The QS-W series Single Wafer Cleaners are stand-alone tools with horizontal wafer processing for 50mm up to 300 mm wafers or substrates up to 9” x 9” featuring simultaneous treatment of top and bottom side of wafers
Automatic or manual handling
For higher throughput and clustered processing, the Multi-Cap Single Wafer Wet Processing System is featuring multi-ple process modules arranged in a horizontal configuration.
Clean - Develop - Etch - Strip - Lift-off
The SCM-750-DCH line serves for coating glass substrates used for the manufacture of OLEDS. A robot picks up the substrates from the carrier in the I/O Module and places them in the processing modules. The sequence of processing is defined in a flow recipe.
This System contains semi-automatic mod-ules which scale up to fully automated as-sembly groups.
SiSTEM Technology Ltd 10
Supplies that meet your time, cost and quality expectations.
Wet Benches
Simple PP acid etch bench
Bulk Chemical Dispense, Portable Chemical Handling Equipment, Chemical Dosing, Feed and Bleed
Chemical Delivery
SS Solvent wet bench Semi-Auto Rotary Robot wet bench
Fully-Automated Linear Robotic wet bench Semi-Auto Rotary Robot wet bench
Fresh Chemical Dispense cart
Solvent Dispense with CO2 fire suppression
Wet processing stations and ancillaries for batch or single wafer substrates and wafers.
From simple manual though semi-automated to fully automated C2C systems.
Materials of construction; PP, FRPP, PVDF, CPVC and Stainless Steel
International Standards - SEMI-S2, UL , CE.
Internal Components Solvent Unit Bulk Delivery Units with Day Tanks
Waste Removal Cart Custom Blending System
SiSTEM Technology Ltd 11
Supplies that meet your time, cost and quality expectations.
Megasonics
PROSYS Table Top System
Using high-frequency acoustic energy, our advanced megasonics technology enables
tighter control over substrate cleaning processes making them faster and more efficient.
Problems we solve include: FEOL and BEOL cleans
TSV process enhancement and residual glue removal
Thick resist develop such as SU-8™
Solar process enhancement
LIGA/MEMS process enhancements
Megasonic Tank Systems. Stainless Steel, Quartz or Kynar tanks with Direct mounted transducer arrays
MegPie Single Wafer Radial Megasonic MegBowl System Immersible Array
Various Custom Arrays
SiSTEM Technology Ltd 12
Supplies that meet your time, cost and quality expectations.
High Purity & DI water heaters
Designed for the ultra pure demands of high purity industries, Process Technology offers a full line of deionized water heaters designed for your most demanding applications. Sizes range
from 3,000 watts up to 260,000 watts. The patented designs incorporate unique
features for superior thermal response. All DI water heaters are available in quartz or
fluoropolymer wetted parts for the most demanding high purity applications.
High purity heaters are assembled in an ISO5 (Class 100) cleanroom.
One of the most popular high purity water
heaters in the world, the Lufran boasts
proven technology for UPDI heating
applications and is suitable for the most
stringent high purity specifications. It is
constructed with all PTFE and PVDF wetted
parts, and its patented “purged” resistive
element design offers exceptional MTBF of
ten years.
The Tytan™ brand represents the safest
and most reliable deionized water heater
on the market. Featuring a compact, self-
contained heater and control package for
ultra-fast heat up and superior tempera-
ture stability regardless of application,
Tytan™ is available in sizes up to 144kW,
wall-mounted up to 72kW. installation is
fast and easy, and the TytanTM requires
virtually no maintenance.
SiSTEM Technology Ltd 13
Supplies that meet your time, cost and quality expectations.
Chemical and Gas Heaters
Teflon In-line heater
Teflon Immersion heater
SH Gas/Solvent heater
HOTSHOT Quartz chemical Heater
High Temp Filter Hous-
ing
SmartOne® PTC Electric
Immersion Heaters
In-Line Fluoropolymer Heat
Exchanger
Inline chemical heaters are used in wet
process manufacturing applications where
Inline heating is preferred over immersion
heating methods.
Process Technology inline heaters are manufac-
tured in fluoropolymer and high purity quartz
materials with sizes up to 18,000 watts. A large
variety of standard and custom configurations
are available. Applications include temperatures
up to 180 degrees centigrade.
Process Technology electric immersion heaters
are designed for a spectrum of industrial applica-
tions - from water to the demands of corrosive
chemical heating, with a vast array of configura-
tions available such as open tank, screw plug and
flange. A wide variety of sheath materials ensure
heater longevity regardless of the chemistry,
including: fluoropolymer, quartz, titanium, 316
stainless steel, 304 stainless steel and plain steel.
Immersion heater sizes range from as small as
100 watts for laboratory environments to as large
as 54,000 watts (flange heaters up to 270,000
watts) for industrial applications.
SiSTEM Technology Ltd 14
Supplies that meet your time, cost and quality expectations.
Thermal Process
RCH Associates specializes in new LPCVD/Diffusion sys-
tems as well as replacement OEM gas systems (Thermco,
Bruce, Tempress, ACS, etc.) fully retrofittable into ex-
isting or remanufactured source cabinets.
RCH’s portfolio of products and capabilities extends from
basic Bench Top Furnaces or Research Grade systems to
high production, full capability horizontal stacks
Horizontal Diffusion Furnaces
The ASTRA CONTROL SYS-
TEM provides Ethernet-
linked, integrated controls
with touch screen graphical
simplicity.
Furnace Elements and Insulation Products
Electric Furnace Systems which operate in Air or Inert
Gas to 3000 F.
Heating Chambers for :
Wafer Processing Furnaces, Muffle Furnaces and In-dustrial Processing
Ceramic Vacuum Formed Fibrous Components in-cluding:
Heating Elements and Custom Shapes
High Temperature Gaskets & Seals for door jams, pillows etc.
Vestibule Blocks
Foundry Service: We offer a complete line of heating and insulation products
Vertical Furnace Element
Torch Element
Replacement Furnace Elements for TEL, ASM, SVG THERMCO, KOKUSAI, TEMPRESS and Others
SiSTEM Technology Ltd 15
Supplies that meet your time, cost and quality expectations.
Thermal Process
Solaris Rapid Thermal Annealing Systems 100/150/200mm Atmospheric RTA Systems
Applications Include:
-Pre Gate Oxidation Cleaning
-Pre-Epi Cleaning
-Photoresist Descum -Growth of Sacrificial Oxides
-Bond Pad Cleaning
-Cleaning of Critical Surfaces
-Hydrocarbon Removal
-High Temperature UV/Ozone Densification
-Hardened Resist Etch Rates>25-50 A/min at room temperature
The Solaris 150UV is an added option for the Solaris RTP System.
Solaris Rapid Thermal
Processes
Ion Implant Activation
Polysilicon Annealing
BPSG/PSG Reflow
Silicide Formation
Ti/Au Nanotube Ohmic Contact Formation
Contact Alloying
Oxidation and Nitridation
III-V Processing
GaAs and III-V Ohmic Alloying
Dual Side Heating Reduces within Die Non-Uniformities
SiSTEM Technology Ltd 16
Supplies that meet your time, cost and quality expectations.
Thermal Process
Vacuum and Convection Ovens
Fortrend-YES have partnered to develop the SIO-300-450 series of High Temperature, Air Cooled, Controlled Process Gas Composition, Laminar Cross Flow, Vertical Vacuum Ovens— the result of many years experience in the design of low particle and Oxygen Concentration systems.
The SIO-450-250 system incorporates the 450mm version of a state-of-the-art thermal curing chamber developed by Fortrend. The SIO-450-250 is offered for either vertical or horizontal wafer orientation to meet the process requirements. The system can have either one curing chamber with two FOUP’s or two chambers with Four FOUP’s to double the through put at lower cost.
The SunRay FLO-10C-12W Thermal Chamber is a high performance ISO Class 4 (Federal class-10) Cleanliness oven for wafers up to 300mm and temperatures up to 250C . It is highly reliable and easy to operate. It offers both horizontal and vertical cassettes ideal for applications such as;
Moisture removal Re-flow Single layer thermal processing
With its proprietary multi-zone coordinated heating control tech-nology, the temperature uniformity is better than ± 3.5°C under wide operation temperature with gas consumption programmable from 0 to 50 litre per minutes. Its superior ISO Class 4 cleanness is suitable for baking processes of semiconductor wafers, MEMS, LED and touch panels.
SiSTEM Technology Ltd 16
Supplies that meet your time, cost and quality expectations.
Thermocouples RTD’s and Sensors
SiSTEM Technology Ltd 17
Profile and Control Spike Thermocouples, RTD’s
Insulated Wire thermocouples, Custom Designs
FOUR & FIVE JUNCTION PROFILE THERMOCOUPLE
FOUR & FIVE JUNCTION PROFILE THERMOCOUPLES QUARTZ & SIC SHEATHS
MULTI-POINT TYPE S THERMOCOU-PLE INCONEL SHEATH
CUSTOM DESIGNS PROFILE THERMOCOUPLE
“TRADITIONAL” TRI -JUNCTION PRO-FILE THERMOCOUPLE
SINGLE JUNCTION CONTROL SPIKE THERMOCOUPLE
TYPE K CONTROLSPIKE THERMOCOU-PLE
RTD’s TEFLON COATED FOR ACID BATHS
RTP PLATINUM BAYONET STYLE
ASM SUSCEPTOR THERMOCOUPLES
Programs we offer
Calibration & Repair: Evaluation of Thermocouple with an as-received calibration report.
Refurbish (special cases): Applicable to designs with longer platinum wire leads than the chamber probe end
Reclaim Service: One-stop service; instant credit with no refining charges for the precious metal profile and spike thermocouples.
SiSTEM Technology Ltd 18
Supplies that meet your time, cost and quality expectations.
Probe and Test
Cantilever Probe Cards
Probe Cleaning Materials
Test Socket Cleaning Materials
Chuck Cleaning Wafer
“On-Line” Test Socket Cleaning for
Increased Yield with Reduced Rescreen
Compliant Edge Ring Wafer Handler Arm
Compliant Surface Eject Features for ESC Chuck
Compliant Spoke Features Pin Chuck and Handler Arm
Probe Clean
Probe Polish
Probe Scrub
Probe Lap
Probe Form From flat contaminated tips To Cleaned and re-shaped tips
Engineered Cleaning Solutions for Wafer Handling Tools and Wafer Chuck
Epoxy : Mainstream Applications and fine pitch down to 44
μm. Multi-die Testing. Fine pitch Shelf cards.
Blade: Hybrid devices testing, special applications.
Parametric Technology: Parametric testing, low leakage
and ultra low leakage down to 1 FemtoAmp/Volt for Keithley/
Agilent and others.
SiSTEM Technology Ltd 19
Supplies that meet your time, cost and quality expectations.
Vacuum Traps
High Capacity, High Efficiency, Vacuum Inlet Trap
Removes corrosive and abrasive particles that can destroy your vacuum pump
Extends Pumping System Preventative Maintenance periods by up to 2 times or more.
Common Applications are; LPCVD, PECVD, METAL ETCH, MOCVD, ION IMPLANT, HVPE,
MV Multi-Trap®
MV Posi-Trap® Foreline Trap Ensures positive flow with no “blow-by”
All stainless steel construction
Straight-thru and right-angle styles offered
Wide variety of filter elements to choose from
Midi-Mist™ & Maxi-Mist™ Stainless steel construction resists corrosion
Protects environment from vacuum pump exhaust
Drain plug for recovering pump fluids
Simple disassembly and cleaning
High-capacity coalescing filters drain
oil into a large reservoir for easy recovery
Designed for large capacity vacuum pumps
VisiTrap® Visi®Flow Vacuum Inlet trap with transparent Sump
Select inserts for trapping particles, water, oil, or corrosive chemicals
Transparent sump shows when to change insert with-out removing from vacuum system
A compact, portable,
self-contained system
for continuously filter-
ing mechanical vacuum
pump fluid
SiSTEM Technology Ltd 20
Supplies that meet your time, cost and quality expectations.
Handling and Automation
Mass Wafer Transfer
Systems .
PLM-C1™, Pod Lift Mechanism
PLUS 500R Pod Load/
Unload System
Four cassette transfer robot
types -> flexible combinations
450mm FOUP Opener, FO-4500
Fortrend PLM-200 EUV SMIF Pod Opener
Fortrend PIS 200 EUV Dual Pod Open-
er & Inner Box
SiSTEM Technology Ltd 21
Supplies that meet your time, cost and quality expectations.
Handling and Automation
Reticle Storage Systems
InforTrac® Hardware Solutions for Lot ID Tracking System
LED Sorters and EFEMs
50mm – 200mm Open Cassette Wafers
The LED Sorter is based on Fortrend’s success-
ful200 and 300mm wafer sorters used in the
Semi-conductor FABS.
Lamina-203 – Three load port
configuration
Fortrend’s eRack system
Three Protocols are availa-ble for all InforTrac® RFID Reader/Writer (4) SEMI SECS-II (5) ASYST TAG Messages (6) Custom messages
Reader RFT-200Ox-LCD
SiSTEM Technology Ltd 22
Supplies that meet your time, cost and quality expectations.
Photovoltaics
Automated PV Cell Load/Unload Transfer System for Tray TLS6030
For tray type PV carriers. This
improved version offers back side
contact only and PV cell transfers at
the lowest cost of ownership to OEM
customers. It is also equipped with
advanced features like Fortrend
proprietary on-the-fly cell breakage
inspection system, broken cell
recovery robot, empty cassette
buffers, tray preheat cycles and
manual tray load/unload port, and
flexible tool interfaces for PECVD and
RIE tool makers.
Ion implantation is a technique that has been demonstrated to
improve solar cell efficiency and eliminate process steps in
standard and advanced cell designs. Fortrend has developed a
high efficiency PV cell load/unload transfer system, RCT-0602,
for PV ion implanters. This system transfers 6 cells in a batch to
vacuum chamber from a single cassette and returns the cells
back automatically. It is also equipped with advanced features
like Fortrend proprietary on-the-fly cell breakage inspection
system, broken cell recovery robot, and SCARA robot for
transferring cells in and out of vacuum chamber.
Automated PV Cell Load/Unload Transfer
System for Ion Implantation System
RCT– 0602
SiSTEM Technology Ltd
www.sistemtechnology.com
Supplying Capital equipment to the
high technology sector since 2004
SiSTEM Technology Ltd
www.sistemtechnology.com
Sales Office : Grafton Suite
Caswell Science & Technology Park Towcester Northants
NN12 8EQ UK Tel: +44 1327 317621
Registered Office : Grafton Suite
Caswell Science & Technology Park Towcester Northants
NN12 8EQ UK Tel +44 (0)1327 317624