VLSI Testing Class Introduction to VLSI Testing 李昆忠 Kuen-Jong Lee Dept. of Electrical...

VLSI Testing Class

Introduction to VLSI Testing

李昆忠 Kuen-Jong Lee

Dept. of Electrical EngineeringNational Cheng-Kung University

Tainan, Taiwan

VLSI Testing NCKUEE-KJLEEIntroduction.2

Problems to Think

How are you going to test

• A 32 bit adder

• A 32 bit counter

• A 32Mb cache memory

• A 107-transistor CPU

• A 109-transistor SOC


OUTLINE• Introduction

• Fault modeling

• Fault simulation

• Test generation

• Automatic test pattern generation (ATPG)

• Design for testability

• Built-in self test

• Synthesis for testability

• An example


Basic Concept of Testing

Related fields

Verification: To verify the correctness of a design

Diagnosis: To tell the faulty site

Reliability: To tell whether a good system will work

correctly or not after some time.

Debug: To find the faulty site and try to eliminate the fault

VDD

0/10

000

0

Testing: To tell whether a circuit is good or bad


Why Studying Testing?

• Economics! Reduce test cost (enhance profit)

Automatic test equipment (ATE) is extremely expensive

Shorten time-to-market Market dominating or sharing

Guarantee IC quality and reliabilityDefects detected in CostWafer 0.01 – 0.1Packaged chip 0.1 – 1Board 1 – 10System 10 – 100Field 100 – 1000

Rule of Ten: Cost to detect faulty IC increases by an order of magnitude


Principle of Testing

• Testing typically consists of Applying set of test stimuli (input patterns, test

vectors) to inputs of circuit under test (CUT), and Analyzing output responses

• The quality of the tested circuits will depend upon the thoroughness of the test vectors

Circuit under Test

(CUT)

-101111-00-0-1-01--00-101

1-0010011--11011001-01-11

ComparatorStoredCorrect

Response

Test Result

Input Patterns Output Response


Importance of testing

N = # transistors in a chip

p = prob. (a transistor is faulty)

Pf = prob. (the chip is faulty)

Pf = 1- (1- p) N

If p = 10-6

N = 106

Pf = 63.2%


Introduction• Integrated Circuits (ICs)

have grown in size and complexity since the late 1950’s Small Scale Integration (SSI) Medium Scale Integration

(MSI) Large Scale Integration (LSI) Very Large Scale Integration

(VLSI)

• Moore’s Law: scale of ICs doubles every 18 months Growing size and complexity

poses many and new testing challenges

VLSIVLSI

LSILSIMMSSII

SSSSII


Importance of Testing

• Moore’s Law results from decreasing feature size (dimensions) from 10s of m to 10s of nm for transistors and

interconnecting wires

• Operating frequencies have increased from 100KHz to several GHz

• Decreasing feature size increases probability of defects during manufacturing process A single faulty transistor or wire results in faulty

IC Testing required to guarantee fault-free products


Difficulties in Testing• Fault may occur anytime - Design - Process - Package - Field

• Fault may occur at any place

• VLSI circuit are large

- Most problems encountered in testing are NP-complete

• I/O access is limited

Vss

Vdd


How to do testing

• Circuit modeling• Fault modeling

• Logic simulation• Fault simulation• Test generation

• Design for test• Built-in self test

• Synthesis for testability

Modeling

ATPG

Testable design

From designer’s point of view:


Circuit Modeling

• Structural model--- collection of interconnected components or elements

• Functional model--- logic function - f(x1,x2,...)=... - Truth table

• Behavioral model--- functional + timing

- f(x1,x2,...)=... , Delay = 10

AB

E

0

CD F

G

1

1

0

0


Levels of Structural Description

• Switch level

• Higher/ System level

• Circuit level

• Gate level

B

E

C

1

C2C3

C

4

C

E

CD F

G

A

B

VDD VDD VDD


Fault Modeling• The effects of physical defects

• Most commonly used fault model: Single stuck-at fault

AB

CD

E

F

G

A s-a-1A s-a-0

E s-a-1E s-a-0

D s-a-1D s-a-0

C s-a-1C s-a-0

B s-a-1B s-a-0

F s-a-1F s-a-0

G s-a-1G s-a-0

14 faults

• Other fault models: - Break faults, Bridging faults, Transistor stuck-open faults, Transistor stuck-on faults, Delay faults


Fault Coverage (FC)

FC =# faults detected

# faults in fault list

ab

c 6 stuck-at faults( a0,a1,b0,b1,c0,c1 )

Test faults detected FC{(0,0)}{(0,1)}{(1,1)}

{(0,0),(1,1)}{(1,0),(0,1),(1,1)}

c1

a1,c1

a0,b0,c0

a0,b0,c0,c1

all

16.67%33.33%50.00%66.67%

100.00%

Example:

0 00

1 11

1 00


Wafer Yield (Chip Yield, Yield)

Wafer yield = 12/22 = 0.55 Wafer yield = 17/22 = 0.77

Wafer

Defects

Good Chip

Faulty Chip


Testing and Quality

• Quality of shipped parts is a function of yield Y and the test (fault) coverage T

• Defect level (DL, reject rate in textbook): fraction of shipped parts that are defective

ICFabrication

Testing

Yield:Fraction of good parts

Rejects

Shipped Parts

Quality:Defective parts

per million (DPM)


Defect Level, Yield & Fault Coverage

Yield (Y)50%75%90%95%99%

90%90%

90%90%

Fault Coverage (T)

90%90%

90%90%90%

95%90%

99%99.9%

DPM (DL)

28,00067,000

10,000 5,000 1,000

5,00010,000

1,000 100

DL: defect level

Y: yield

T: fault coverage

DL = 1 - Y (1-T)～


Logic simulation

• To determine how a good circuit should work

• Given input vectors, determine the normal circuit response

A

B

E

C

G

F

I

HD

C

E

CC

1

B RB

IR

IF

CC2

CDE CJE

A

B

EC

D

F


Fault simulation

0

• Given a test vector, determine all faults that are detected by this test vector.Example:

A

BC

Test vector (1 1) detects { a0, b0, c1}

• To determine the behavior of faulty circuits

F

D

B

CG

1/01/0

1

A 1

0

0

1

1

0

11

E s.a.0


Test generation

To detect D s-a-0, D must be set to 1. Thus A=B=1.

To propagate fault effect to the primary output E must be 1. Thus C must be 0.

Test vector: A=1, B=1, C=0

• Given a fault, identify a test to detect this fault

Example:A

D

B

EC

F

0 1/01

1

1

0

1/0


Automatic Test Pattern Generation

ATPG: Given a circuit, identify a set of test vectors to detect all faults under consideration.

Input circuit

Form fault list

More faults?

Select a fault

Test generation

Fault simulation

Exit

Faultdropping

No

Yes


Difficulties in Test Generation

E

B F

C

A

D

1. Reconvergent fanout

s-a-10/1

0

1

1

0

1

10

0/1

Cannot detect the fault

Fault detected


Difficulties in Test Generation (cont.)

2. Sequential test generation

JK

CK

Y

PIs POs

clk

Combinational part

Y


Testable Design

• Design for testability (DFT) • ad hoc techniques

• Scan design

• Boundary Scan • Built-In Self Test (BIST)

• Random number generator (RNG)

• Signature Analyzer (SA)

• Synthesis for Testability


Example of ad hoc Techniques

Insert test points

MUX

T/N


Scan Design

Combinationallogic

PIs POs

FF

FF

FF

Combinationallogic

PIs POs

SFF

SFF

SFF

SO

SIT/N

Original design Modified design


Scan Cell Design

DI

DI

D Q

CK

DI D QQ,SO

SI

MU

X

CKN/T(SE)

DIQ,SO

SI

T

T +

Q

Q

Most cell libraries now have scan cells!


Scan Register

DQ

SI

DQ

SI

DQ

SI

DQ

SISO

CLKSE

Combinational

Circuits


Boundary Scan

Instruction register

Bypass register

MUX

TAP

Misc. registers

TRST*

TMS

TCK

TDO

I/O Pad Boundary scan cell Boundary scan path

APPLICATION LOGIC

BIST register

Scan register

TRST*:Test rest (Optional)TDI: Test data inputTD0: Test data output TCK: Test clockTMS: Test mode select

TDISout

Sin


Boundary Scan (Cont.)


Bypass register

MUX

TAP

Misc. registers

TRST*

TMS

TCK

TDO

APPLICATION LOGICTDI Sout

Sin


Bypass register

MUX

TAP

Misc. registers

TRST*

TMS

TCK

TDO

APPLICATION LOGIC

Scan register

TDI Sout

Sin


Bypass register

MUX

TAP

Misc. registers

TRST*

TMS

TCK

TDO

APPLICATION LOGIC

BIST register

Scan register

TDI Sout

Sin


Bypass register

MUX

TAP

Misc. registers

TRST*

TMS

TCK

TDO

APPLICATION LOGIC

BIST register

Scan register

TDI Sout

Sin

BIST register

Scan register

BIST register


Places the job of device testing inside the device itself

Generates its own stimulus and analyzes its own response

circuit under test

muxfrom system

pat

tern

gen

erat

or

BISTController

biston

Res

po

nse

An

alyz

er

to system

good/fail

bistdone

Built-In-Self Test (BIST)


Built-In-Self Test (BIST) (Cont.)

F/F

• Two major tasks

- Test pattern generation

- Test result compaction • Usually implemented by linear feedback shift register

F/F F/F


Random Number Generator (RNG)

000110000100001010011100

011010110101101011011110

1. Generate “pseudo” random patterns

2. Period is 2n - 1

1111 0111 0011 0001 (repeat)

F/F F/F F/F F/F


Signature Analyzer (SA)

5421 xxxxP

Input sequence 10101111 (8 bits) 1 2 3 4 5+ Z

Remainder Quotient

Time Input stream Register contents Output stream01..5678

1 0 1 0 1 1 1 1 0 0 0 0 0 Initial state 1 0 1 0 1 1 1 1 0 0 0 0 . . . . 1 0 1 0 1 1 1 1 1 0 0 0 0 1 0 1 1 0 0 0 0 1 0 1 0 0 1 0 1 1 0 1

++

42 xxxR 21 x

765421 xxxxxxG


Signature Analyzer (SA) (cont.)

• A LFSR performs polynomial division

• Probability of aliasing error = 1/2n (n: # of FFs)

1:

1: 2

245

xxQ

xxxxP

1

1567

2452467

xxx

xxxxxxx

xGxxxxxxRxQxP 124567


Memory BIST Architecture

MemoryModule

di

addr

wen

data

sys_disys_addrsys_wen

MemoryModulerst_l

clkhold_l

test_hsise

data

q

so

Before After


Memory BIST Architecture (Cont.)

BIST Circuitry

MemoryModule

Alg

ori

thm

-Bas

edP

att

ern

Ge

ne

rato

r

Co

mp

ress

or

diaddrwen

data

compress_h

sys_addrsys_disys_wen

rst_lclk

hold_l

test_h

q

so

clkrstsise


CPU Test Control Architecture

TDI

TCK

compressor

Scan_i

Scan_en

Bist

control

Memory

logic

Scan_oScan path

clkrst_l

TAP Controller

IR

scandecoder

MU

X

decoder

bistdecoder

mbistint_scan

bist_se

test_h

hold_l

bist_so

TMS

TDO

bis

t_si


Problems re-thinking

• A 32-bit adder --- ATPG

• A 32-bit counter --- Design for testability + ATPG

• A 32MB Cache memory --- BIST

• A 107-transistor CPU --- All test techniques

• An SOC


Conclusions

• Testing is becoming a major factor in design optimization• Conventionally, the designer often optimize one of the three

attributes: speed, area, and power.• At present, a fourth attribute is considered: Testability. • Two major fields in testing

ATPG

--- Fault simulation

--- Test generation

Testable design

--- Design for testability

--- Built-in self-test

--- Synthesis for testability

VLSI Testing Class Introduction to VLSI Testing 李昆忠 Kuen-Jong Lee Dept. of Electrical...

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Transcript of VLSI Testing Class Introduction to VLSI Testing 李昆忠 Kuen-Jong Lee Dept. of Electrical...