Statement of Work (SOW) iNEMI Board TIG Connector...

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NOTE: All changes to SOW must be approved by the Technical Committee for version control

Statement of Work (SOW) iNEMI Board TIG

Connector Reliability Project, Phase 3

Version #3.1 Date: April 7, 2021

Project Leader: Jeff Toran Co-leader: TBD iNEMI Staff: Mark Schaffer

Project Overview The existing electrical connector reliability testing standards do not address the full range of connector applications nor have they the necessary detailed, defined test conditions and sequences. A standardized reliability test framework for evaluating electrical connectors across types and use cases would ease the current challenge of testing and identifying appropriate connectors for a given application.

Presently, the only general-purpose standard for connectors defined for a specific application class is the ANSI/EIA 364-1000B standard, for “Controlled Environments” or G1.2 as defined in ANSI/EIA 364.

This project would validate a set of test schedules for some of the harsher environments that many of today’s electronic devices are subjected to.

In the previous phase projects:

• The iNEMI Connector Reliability Test Phase 1 team developed a reliability test framework for connectors based on an industry consensus view of interconnect levels, a physics of failure approach, and a to be defined set of application classes, test levels, and tests. Results were presented at SMTAI 2016. The Interconnect levels are shown in table 1.

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Table 1 – Phase 1 Project: Interconnect levels

Level 1 On-chip Level 2 Chip-to-package

Level 3 Package-to-board/PCB mount

Level 4 Board-to-board

Level 5 Chassis-to-chassis & input/output (IO) Level 6 Intersystem cabling

Level 7 Long-haul telecom/datacom

Building on the Phase 1 work, the Phase 2 team defined a set of application classes (stress levels) and specific test conditions to be used to evaluate the expected degradation of connectors under different stress levels in the defined application classes. Results were presented at the Holm Conference 2019. The phase 2 project team focused on developing a reliability evaluation methodology based on Level 4, to include board to board connectors. The phase 2 project team further refined the description to explicitly include those connectors used for board to subassembly and subassembly to subassembly interconnection. The scope of phase 2 excluded non-metallic optical connectors used for mating of fiber optics, connectors intended for power supplies or AC power applications, or RF connectors.

Table 2 (below) is the Phase 2 project listing of recommended test sequences. The team used the test schedules in the ANSI/EIA 364-1000B standard as a basis for their work. The cells highlighted in grey color are the additional tests the Phase 2 team is recommending to be performed for application environments similar to class G1.3 or G2.0 or G 2.1 in ANSI/EIA 364. Annex A includes the tables from EIA 364 that defines the class definitions and Operating conditions.

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Table 2 – Phase 2 Project: Recommended Test Sequences

This phase 3 project proposes a proof of concept of the defined methodology, inclusive of defining a test vehicle and evaluating its response to the proposed test framework. Also, the project may include Literature searches in several areas for technical papers/information related to the proposed updates to the connector test schedule defined in Phase 2.

Test Orde

r Tests Required for All Connectors

Tests for Connectors with Noble

Metal Finish

Tests for Connectors

with Tin Plate (optional for

<0.38 um Gold plate)

Tests for Connectors with surface treatment or short wipe

length (<0.127mm)

Tests for Connectors with more

than 50 mate/unma

te cycles

Test Sequences

1 2 3 4 5 6 7

1 Contact Resistance

Contact Resistance

Contact Resistance

Contact Resistance

Contact Resistance

Contact Resistance

Dielectric Withstanding

Voltage

2

Mate/Unmate Cycles

(preconditioning)

Mate/Unmate Cycles

(preconditioning)

Mate/Unmate Cycles

(preconditioning)

Thermal Shock (preconditionin

g)

Thermal Shock (preconditionin

g)

Mate/Unmate Cycles

(preconditioning)

Contact Resistance

3 Temperature Life

Dust (preconditionin

g)

Temperature Life

(preconditioning)

Mate/Unmate Cycles

(preconditioning)

Mate/Unmate Cycles

(preconditioning) Dust

Mate/Unmate Cycles

4 Contact Resistance Thermal Shock

Dust (preconditionin

g)

Temperature Life

(preconditioning)

Temperature Life

(preconditioning)

Contact Resistance

Contact Resistance

5 Reseating (mate/unmate)

Contact Resistance Vibration

Contact Resistance

Contact Resistance

Thermal Cycling

(disturbance)

Dielectric Withstanding

Voltage

6 Contact Resistance

Temp/Humidity Cycling

Mechanical Shock

Mixed Flowing Gas

Thermal Cycling

Contact Resistance

7 Contact

Resistance Contact

Resistance Contact

Resistance Contact

Resistance Reseating

(mate/unmate)

8

Reseating (mate/unmate)

Thermal Cycling

(disturbance) Reseating

(mate/unmate) Contact

Resistance

9 Contact

Resistance Contact

Resistance Contact

Resistance

10 Reseating

(mate/unmate)

11 Contact

Resistance

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The Phase 3 project would select connectors that meet the above criteria. Candidate Level 4 connectors may include:

• backplane & mezzanine style connectors,

• board-to-board,

• FFC & FPC style connectors,

• DIMM connectors,

• PCIe, SATA, and SAS style connectors.

In addition to selecting Level 4 connectors for testing, the Phase 3 project team has agreed to include a Level 5 connector (USB-C) to the list.

Annex B includes the Stress Level tables from the Phase 2 project that will be used to define many of the test parameters (e.g. temperatures, duration) used in this project.

Project Scope Define, build, and apply to a new test vehicle the defined methodology

developed in the Phase 1 and 2 Projects. Considering connectors used in fixed equipment (e.g. desktop computer, blade server, other) and portable equipment (e.g. laptop computer, tablet, other).

Specifically:

• Define and design the Test Vehicle (TC) which will include the connectors to test while concurrently developing the project Test Strategy / Design for Experiment.

• Identify connectors that are known to be susceptible to detrimental degradation by the types of environments use (testing) would expose them to.

• Prepare a time and cost matrix to build Test Vehicle

• Prepare a time and cost matrix to complete Tests

• Develop Go/No Go Criteria regarding building and testing

• If Go: Build TVs, conduct testing and report out

• If No Go: Develop recommendations for next steps

• Collect information about selected technical topics related to electronic equipment reliability for the application environment selected for this project (see Project goals below).

• Communicate results to relevant stakeholders including but not limited to iNEMI members, standards bodies such as ECIA, OEMs

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and connector manufacturers.

Project Purpose Objective:

Define and develop a test vehicle on which to apply the defined Phase 1 and 2 methodology of the Connector Standard Reliability Test Recommendations Program. Enabling the industry to reliably qualify new connectors and existing connectors for a broader range of applications.

Ideally, build or identify existing Test Vehicle(s) to demonstrate Phase 1 and 2 methodology.

Project Goals:

• Design and develop a test vehicle capable of testing the methodologies defined in Phase 2 of the Connector Reliability Project. Develop an applicable test plan.

• Develop criteria for a Go/No Go decision to proceed beyond the design stage of the test vehicle. Project participants will then decide -

o If Go:

§ Build and Test the Test Vehicle in accordance with methodology from Phase 2 and per the test groups in table 2.

§ Analyze and Report on results of testing and capability of test vehicle

o If No Go:

§ Develop next steps for where/how building and testing should be conducted

§ Report on board design, capability and next steps

• Collect information about the following topics related to electronic equipment reliability for the application environment selected for this project.

o Failure root causes for tier 4 and USB-C connectors.

o Dust, fibers, and other debris typically found in the equipment including details of size, composition etc.

o Mixed Flowing Gas corrosion severity with respect to current levels of atmospheric pollutant levels

o Lubricant effects/impact

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The information may come from project team members or published technical papers. The team may also assess linkage between the above technical topics and the failure root causes.

• Share relevant information from this project with the EIA CE 2.0 Connector standards committee for them to consider developing a standard.

IS / IS NOT Analysis

This Project IS: This Project IS NOT:

Connector Reliability Phase 3

Defining and Developing a test vehicle Development of a standard

Developing a test plan / Design of Experiment based on Phase 1 and Phase 2 methodologies and the defined test vehicle

Repeat of prior or existing work

Identification of Go/No Go conditions for building and testing the test vehicle

Biased towards specific suppliers, geographies, or market segments

Focused on Tier 4 Internal Connectors (see Background Section) and USB-C.

I/O Connectors (Except USB-C)

Collect information related to electronic equipment reliability:

• Failure root causes for tier 4 connectors and USB-C

• Dust, fibers, and other debris typically found in the equipment including details of size, composition etc.

• Mixed Flowing Gas corrosion severity with respect to current levels of atmospheric pollutant levels

• Lubricant effects/impacts

An attempt to document or infringe upon supplier specific IP

Sharing relevant information with the EIA CE 2.0 Connector standards committee for them to consider developing a standard.

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Business Impact This project will provide the following benefits to participating companies and the industry in general:

• Wider acceptance of data from various connector suppliers through transparency of the validation process.

• Validate the test parameters and test sequences developed in Phase 2, which could enable more effective industry-wide testing of connectors.

• Facilitate the understanding between socket and/or connector suppliers, customers and the electronics industry as a whole.

• Minimizing the amount of user-specific testing through use of an accepted core testing protocol

• May lead to the development of an industry standard by the ECIA CE 2.0 Connector Standards committee

Participating Organizations in SOW Development

Amphenol Keysight Technologies

Dell Nokia Bell Labs

ECIA TE Connectivity

HP

Project Outcomes • Definition of a verification process for the phase 2 testing protocols • Verification of phase 2 proposed test schedule • Publish report on verification process • Recommend appropriate Test vehicle requirements • Collection and reporting of environmental information and data relevant to

the electronics industry, including standards bodies such as the ECIA committees, as determined by the project team

Previous Related Work • Phase 1 results presented in the publication “iNEMI Connector

Reliability Test Recommendations Project Report,” (https://www.inemi.org/connector-reliability-whitepaper-2016) and presentation at SMTAI 2016

• Phase 2 results presented at the Holm conference September 2019, Milwaukee. “A Standardized Reliability Evaluation Framework for Connectors

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- Stress Levels and Test Recommendations”

o Presentation (http://thor.inemi.org/webdownload/2019/IEEE_Holm2019-Connector_Rel-presenta.pdf) and

o Paper (http://thor.inemi.org/webdownload/2019/IEEE_Holm2019-Connector_Rel-paper.pdf):

Potential Project Participants Participants on this project may include:

• OEMs

• Connector Suppliers

• Material suppliers to the connector companies

• EIA CE 2.0 Connector standards committee

• Commercial Testing Labs

• Academic Institutions

• Test Vehicle Fabricator

Project Plan - Schedule with Milestones

Months 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18

Develop Test Strategy

Develop Test Vehicle Design

Go/No Go Decision Build Test Vehicle Conduct Testing

Data Review

Information collections and Literature search

Communications

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Resources needed Area Resources Needed

Materials Connectors for testing Design & test PCBs for low-level contact resistance (LLCR) and also discontinuity measurements. PCB design may also be needed. Cables may be needed to be prepared to connect from the PCBs to the measuring equipment.

Design & fabricate fixture(s) for vibration, mechanical shock tests Dust (EIA 364-91 Benign dust composition)

Test vehicle assembly

Connector attach to test PCBs; may require hydraulic press for compliant pins or SMT reflow, wave or hand-soldering for ‘soldered’ pcb / cable termination styles

Measurement/Test LLCR, discontinuity micro-second, Insulation resistance, Dielectric withstanding voltage measuring equipment Mechanical force (mate/unmate), dry heat chamber, temperature-Humidity chamber, Thermal Shock chamber, Dust chamber, Vibration, Mechanical shock, Mixed Flowing Gas corrosion

Failure analysis capability

Others Other suggested task with associated resource contribution

Risk The project will require the donation of connectors and having testing facilities to allow verification of the full testing protocol under consideration.

Project Communication • Open lines of communication among participants will be

maintained by the chair and the iNEMI project manager assigned to the project.

• Project requirements will be reviewed with participants before the project begins.

• Project participants will meet regularly to review the progress of the project and make plans for any additional phases of the project (if deemed necessary).

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• Results will be reported and reviewed at the team meetings.

• Meeting minutes will be provided through MS Teams and e-mail (as necessary.

• Follow-up with individuals on an as-needed basis can occur.

• Workshops and face-to-face meetings will be held as determined by the project team.

• Progress reports will be provided upon request for presentation at regularly scheduled iNEMI meetings (e.g., a short series of PowerPoint slides showing the work in progress at Technical Committee and member council meetings).

• External publications must be approved by a majority vote of the team members.

• Any changes to the plan can be approved by a majority vote of the team members, iNEMI VP of Technical and Project Operations and the iNEMI Technical Committee.

General and Administrative iNEMI project manager will be assigned to the projects to facilitate the communications, data exchange, meetings and project plan. Project details and data will be available to the project team member on-line e.g. through Microsoft Teams. Guidelines for this project and all other iNEMI Projects are documented at: htp://thor.inemi.org/webdownload/join/gen_guidelines.pdf.

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Annex A

Table A1 – Definition of Class

Class number

Definition

General G1.0 Year-round filtered air conditioning with humidity control G1.1 Year-round air conditioning (non-filtered) with humidity control G1.2

(see note) Air conditioning (non-year-round) with no humidity control

G1.3 Without air conditioning or humidity control but with normal heating and ventilation

G2.0 With normal ventilation but uncontrolled heating and humidity G2.1 Year-round exposure to heat, cold, moisture, industrial

pollutants, and fluids G3.0 Outdoor environment with moisture, marine and/or weathering conditions Application specific

A1.0 Aircraft environment (uncontrolled) A2.0 Automotive (uncontrolled) A3.0 Test sockets A4.0 Burn-in sockets A5.0 Space applications

NOTE ��For specific environmental test methodology to assess the performance of electrical connectors and sockets used in business office applications that are no more severe than class number G1.2; see EIA-364-1000. Excerpted from ANSI/EIA 364 standard, (revision F).

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Table A2 – Environmental conditions of the Class

Class number Temperature (see note 1)

Relative humidity (see note

3)

Marine atmosphere

Harsh environment

G1.0 +25 �C to +65 �C 40% to 60% No No G1.1 +25 �C to +65 �C 40% to 75% No Possible G1.2

(see note 2) +25 �C to +85 �C 85% maximum No Yes

G1.3 +15 �C to +85 �C 95% maximum No Yes G2.0 +5 �C to +85 �C 95% maximum No Yes G2.1 -40 �C to +100 �C 95% maximum Possible Yes G3.0 -55 �C to +125 �C 95% maximum Yes Yes A1.0 -65 �C to +200 �C 95% maximum Yes Yes A2.0 -55 �C to +150 �C 95% maximum Yes Yes A3.0 +15 �C to +35 �C 85% maximum No Possible A4.0 -65 �C to +200 �C 85% maximum No Possible A5.0 -65 �C to +200 �C No No Possible

NOTES 1 The temperature limits as shown above are considered maximum limits. If the application within

a classification requires limits other than those shown, said limits shall be specified in the referencing document.

2 For specific environmental test methodology to assess the performance of electrical connectors and sockets used in business office applications that are no more severe than class number G1.2; see EIA-364-1000.

3 The values indicated are test conditions and not operating conditions.

Excerpted from ANSI/EIA 364 standard, (revision F).

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Annex B

Stress Level Tables

Temperature Life: EIA 364-17

Proposed Testing Matrix: Phase 2

Level Op.

Temp. App. Type

Operating hrs ≤8,760

Operating hrs >8,760 to 87,600

1 ≤ 30 oC Typical

61 hrs, 60 oC 115 hr, 60 oC Critical

2 31 oC to 55 oC

Typical 220 hrs, 70 oC 51 hrs, 80 oC

421 hrs, 70 oC 96 hrs, 80 oC

Critical 787 hrs, 70 oC 177 hrs, 80 oC

1527 hrs, 70 oC 337 hrs, 80 oC

3

56 oC to

80 oC


1115 hrs, 90 oC 269 hrs, 100 oC


3767 hrs, 90 oC 879 hrs, 100 oC

4

81 oC to

105 oC


1331 hrs, 115 oC 676 hrs, 120 oC


4159 hrs, 115 oC 2082 hrs, 120 oC

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Dust Test: EIA 364-91

Dust Type anticipated (select types anticipated in the

environment) Levela Benignb Corrosivec

Pre-

Condition Dust Test Pre-Condition Dust Test

Level 1 Optional Optional Example

applications Business Office,

Data Center Warehouse,

Industrial environment Level 2 Recommend Recommend Example

applications Ground-Based, Portable Electronics,

Transportation vehicles - cabin Level 3d Recommend Recommend Example

applications To be defined

Thermal Shock: EIA 364-32 Stress Level Temperatures Use Case

1 -55 °C to +85 °C Portable equipment; equipment mounted in weather protected & movable enclosure. Equipment mounted in a non-weather

protected environment.

2 -65 °C to +105 °C

3 -65 °C to +125 °C

4 Custom More severe environments requiring harsher testing than those above.

Stress Level Temperatures Use Case

1 -55 °C to +85 °C Portable equipment; equipment mounted in weather protected & movable enclosure. Equipment mounted in a non-weather

protected environment.

2 -65 °C to +105 °C

3 -65 °C to +125 °C

4 Custom More severe environments requiring harsher testing than those above.

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Vibration: EIA 364-28

Stress Level

(Amplitude Category)

Frequency / Type

Low Frequency Sine

Mid Frequency Random

High Frequency Random

Level 1 (Light)

Example Application

Industrial Rotating Machinery - Light Vibration

or Equipment Mounted Adjacent to

Heavy Rotating Machinery

Business Office, Data Center -

Light Vibration

Transportation Vehicles - Passenger Cabin

Test Condition

IEC 60068-2-6 [17] 10-55 Hz, 0.015-inch DA, 2 hrs /

axis

EIA-364-28 [18] TC VII, Letter B

1.6 g, 15 min / axis 20-500 Hz

EIA-364-28 TC V, Letter A

5.4 g, 3 hrs / axis 50-2000 Hz

Level 2 (Moderate)

Example Application

Industrial Rotating Machinery - Moderate Vibration

Business Office, Data Center

Transportation Vehicles - Moderate Vibration

Test Condition

IEC 60068-2-6 10-55 Hz, 0.03-inch DA, 2 hrs /

axis

EIA-364-28 TC VII, Letter D 3.1 g, 15 min / axis

20-500 Hz

EIA-364-28 TC V, Letter C

9.3 g, 3 hrs / axis 50-2000 Hz

Level 3 (Severe)

Example Application

Industrial Rotating Machinery - Severe Vibration

Ground-Based, Portable Electronics, Rough Service -

Commercial

Transportation Vehicles - Engine Compartmenta

Test Condition

IEC 60068-2-6 10-55 Hz, 0.06-inch DA, 2 hrs /

axis

EIA-364-28 TC VII, Letter E 4.9 g, 1 hrs / axis

20-500 Hz

EIA-364-28 TC V, Letter G

23.9 g, 4 hrs / axis 50-2000 Hz

Level 4 (Extremely

Severe)

Example Application

Unbalanced Rotating Machinery Ground-Based, Portable Electronics, Rough Service

– Militarya

High Performance Military Aircrafta

Test Condition

IEC 60068-2-6 10-55 Hz, 0.12-inch DA or 10 g's,

whichever is less, 2 hrs / axis

EIA-364-28 TC VII. Letter F 6.9 g, 2 hrs / axis

20-500 Hz

EIA-364-28 TC VI, Letter J

43.9 g, 8 hrs / axis 50-2000 Hz

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Mixed Flowing Gas Corrosion : EIA 364-65

Stress Level Test Comment

1 Not applicable No test needed because no corrosive degradation from gaseous contaminants such as H2S, SO2, NO2 is expected

2 EIA 364-65 [21] Class 2a

MFG testing required for: a) Gold finishes irrespective of the underplate. b) Pd, PdNi: though not included in the Battelle study Pd has similar nobility to gold and Pd alloy plating systems have similar corrosion mechanisms

Re Ag: EIA test conditions are derived from those developed by Battelle Columbus Laboratories to replicate corrosion processes of contacts with gold plating systems. No correlation has been demonstrated between the corrosion of Ag plating systems in these MFG tests and the corrosion expected in typical application environments where Ag platings will be directly attacked by any Cl2 or H2S in the use environment.

3 EIA 364-65 Class 3a

4 Custom Contacts unlikely to survive this environment and protective measures required; test recommendations depend on the measures selected.

Field Life 5 yr 10 yr

Class 2A test time (hrs) (From EIA 364-1000) 168 336

Class 3A test time (hrs) [24] 240 480

Cyclic Temperature / Humidity: EIA 364-110

Stress Level and Description Recommended Test Level 1: Equipment located in an indoor environment (ex: office) with good control on the overall environment. Located in noncondensing environments with <65%RH

EIA-364-31, Method VIII, (24 cycles)

Level 2: Equipment located in an indoor/outdoor environment (more of an industrial environment) where there may be some environmental controls but not tightly maintained. Probably no direct exposure to moisture. Located in noncondensing environments with ≥65%RH

EIA-364-31, Method VII, Test Condition G (500 hrs)

Level 3: Equipment located in an outdoor environment with no temp/humidity controls. Wide ranges of temperature and humidity. Possible direct exposure to condensation moisture. Located in condensing environments

EIA-364-34, Test Condition C (504 hrs)

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Durability cycles : EIA 364-09

Level Number of Mate/Un-mate cycles

Level 1 25

Level 2 200

Level 3 >200a a. number of test cycles to be determined by the expected application.

Preconditioning: 5 cycles should be used for level 1, 20 cycles for level 2, and 50 cycles for level 3. Reseating should use 3 cycles for all levels.

Reseating: Should use 3 cycles for all levels.

Additional details about the test procedure, equipment, test specimen preparation, and test fixtures can be found in EIA documents.

Thermal cycling: EIA 364-110

Temperature (°C)

Application Level Comments

1 2 3 4 500 cycles min Temperature profile per standards such as EIA/ECA-364-110

Lower Temperature 15 -15 -40 -40

Upper Temperature 85 85 105 125

ΔT 70 100 145 165

Mechanical Shock : EIA 364-27

Level Acceleration Example Use Case

1 10-30g Stationary Computer and Communications Equipment in Office, Data Equipment Closet

2 >30-50g General Purpose Industrial, General Purpose Land Transport and Land-Based Equipment; portable computers and communications equipment

3 >50-100g Heavy Industrial, Harsh Transportation, Other Harsh Environment

4 >100g More severe environments requiring harsher testing than those above

Stress Level

Test condition

Comment

1 H Test condition H = 30 g acceleration maximum; 1 m-sec pulse; 18 shocks total (3 positive & negative in each of 3 perpendicular axis).

2 A Test Condition A = 50 g acceleration; 11 m-sec pulse; 18 shocks total, (3 positive & negative in each of 3 perpendicular axis).

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3 C Test condition C = 100 g acceleration; 11 m-sec pulse; 18 shocks total, (3 positive & negative in each of 3 perpendicular axis).

4 Custom To be defined in the referenced connector specification, customer specification or industry association specification.

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