TECHNOLOGY ROADMAP AND ITS PLACE IN...
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2011 iNEMI TECHNOLOGY ROADMAP AND ITS PLACE IN FULFILLING THE iNEMI MISSION Chuck Richardson, iNEMI CARTS International March 26, 2012 Bally’s Resort Las Vegas, Nevada
Transcript of TECHNOLOGY ROADMAP AND ITS PLACE IN...
2011 iNEMI TECHNOLOGY
ROADMAP AND ITS PLACE IN
FULFILLING THE iNEMI MISSION
Chuck Richardson, iNEMI
CARTS International
March 26, 2012
Bally’s Resort
Las Vegas, Nevada
Agenda
iNEMI Overview
Roadmap Methodology & Scope
Medical Product Highlights
Passive Component Highlights
Roadmap Summary
Summary Overall
Q & A
1
About iNEMI
2
International Electronics Manufacturing Initiative (iNEMI) is an
industry-led consortium of 99 global manufacturers, suppliers,
industry associations, government agencies and universities. Working
on advancing manufacturing technology since 1994. Visit us at www.inemi.org.
5 Key Deliverables:
• Technology Roadmaps
• Collaborative Deployment
Projects
• Research Priorities Documents
• Proactive Forums
• Position Papers
4 Major Focus Areas:
• Miniaturization
• Environment
• Energy
• Medical Electronics
Mission: Forecast and Accelerate improvements in the Electronics
Manufacturing Industry for a Sustainable Future.
Global Operations
• iNEMI is headquartered in Herndon, Virginia, USA.
• Opened an office in Shanghai and added a team member in Europe in 2007.
• Dr. Haley Fu is leading operations in Asia, based in Shanghai, China.
• Grace O’Malley is representing iNEMI in Europe from her base in Ireland.
Unique Attributes of the iNEMI Consortium
• Strong Global Membership accompanied by a mission that focuses on identifying global manufacturing challenges
• Delivery of a total industry set of priorities every two years:
– A Technical Plan that defines key collaborative opportunities and gaps in the 1-5 year horizon
– A set of Research priorities for the 5-10 year horizon
• A proven methodology for effective pre competitive collaboration.
• Ability to execute an integrated supply chain approach on solving complex manufacturing and systems integration issues.
• A growing reputation as a proactive, leading organization in the environment and sustainability arena.
4
5
Product
Needs
Technology
Evolution
GAP Analysis
Technology Plan
Research
Priorities
Research
Projects
Methodology
Competitive
Solutions
Roadmap
Industry Solution
Needed
Academia
Government
iNEMI
Members
Collaborate
No Work
Required
Available
to Market
Place
Global
Industry
Participation Disruptive
Technology
International Members
Across The Total Supply Chain (Q311)
6
Key Observations:
• New members joining to participate in Environmental and Packaging Projects and
in collaborative R&D opportunities
• 170% Growth in Europe Since 1/1/2010; 60% Industry Growth Overall
• 160% Growth in University/Research Institutes Since 1/1/2010
Total Global Supply Chain Integration
The International Membership Incorporated Location; Number of Members
INEMI Member Business Type North America
Asia Region
Europe Totals
OEM 14 2 2 18
ODM/EMS (inc. pkg. & test services) 4 7 11
Material Suppliers 8 14 11 33
Equipment Suppliers 8 1 2 11
Universities & Research Institutes 8 2 3 13
Organizations/consulting 10 1 2 13
Totals 52 27 20 99
Why Organizations Participate in iNEMI
7
• Opportunity to broaden your organization’s engagement in the
industry
• Better anticipate technology trends & inflexion points
• Collaborate with key players, industry experts, customers and
suppliers, globally – in all major markets
• Get access to learning and knowledge experts within iNEMI
members
• Help influence and create industry-standard solutions that lead to
competitive and best in class products and product attributes
• Help guide and benefit from industry innovation and funded
research
8
• Cost Reduction by leveraging resources – Typically in the 8X to
20x range on key projects and thrusts:
– Reduce resource demands and $ investments for each
company.
– Ensure technology readiness when required.
– Projects can result in cost reduction (ex. Copper wire bonding).
• Reduce risk of technology introduction
– Reliability – Hard to measure the negative impact of poor
reliability, but can be disastrous.
– Source of supply – Also hard to apply general cost impact
numbers to being late to market – Can also be huge.
Motivation to Participate in Collaborative Projects
Membership
3/2/12
OEM/ODM/EMS Members
10
Supplier Members
11
Supplier Members – PWB Supply Chain
12
Association/Consortium, Government, Consultant
& University Members
13
pinfa
iNEMI Areas of “Critical Mass” • Leading OEMs &
Semiconductors
– IBM
– HP
– Dell
– Lenovo
– Intel
– Microsoft
– Delphi
– RIM
– Cisco
– Huawei
– Alcatel Lucent
– Juniper Networks
– Many Medical OEM’s
• Packaging Firms
– STATS ChipPAC
– Amkor
– ASE Group
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• Laminate/substrate suppliers
– Ibiden
– Samsung Electro Mechanics Co
– NGK/NTK
– Rogers
– Doosan
– Multek
– ITEQ
– Nanya
– Shengyi Sci. Tech.
– Endicott Interconnect Tech.
– Elec & Eltek
– Dyconex
– AT&S
• ODM/EMS firms
– Celestica
– Quanta
– Sanmina SCI
– Plexus
– Flextronics
– Foxconn
• Test Firms
– Agilent
– Asset
– Corelis
– TRI
– Teradyne
• Chemical/Adhesives/Metals
- Dow -- Nippon
- Inventec -- Heraeus
- Henkel
- Indium
Board of Directors
Directors
Dr. Nasser Grayeli, Exec VP of TMG; Director of Corp Q & R, Intel– Chairman
Dr. Marc Benowitz, Director, Reliability & Eco-Env Eng, Alcatel-Lucent
Dr. B.J. Han, Exceutive VP & CTO, STATS ChipPAC
Kevin Keller Chief Engineer, Mfg. Eng & Customer Sat., Delphi
Kim Hyland, Sr. Director of Mfg. Operations Eng., Cisco Systems
Dr. Sundar Kamath, Senior VP – Customer Eng & Technology, Sanmina-SCI
Dr. Jean-Luc Pelissier, CEO, CBA Group LLC
Rob Shaddock, CTO, Senior VP, Tyco Electronics
Michael Toben, Director, Pkg. & Finishing Technology, Dow Electronic Mtls
Barbara Reed, VP, Worldwide ISC Engineering, IBM Integrated Supply Chain
Ex-officio Members
Bill Bader, CEO, iNEMI
Dr. James Olthoff, Deputy Director, EEE Laboratory, NIST
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Direct Roadmap Development
Opportunities to participate in iNEMI
Research Committee Stimulate research to
address gaps identified by iNEMI roadmaps
Technical Committee
Develop & integrate
technology strategies & plans
Drive/coordinate all technical
activities
Board of Directors Set strategic objectives &
priorities
Ensure financial ethics &
responsibility
Product Needs
6 Product Emulator Groups
Technology Needs
21 Technology Working Groups
Focus Area Steering Committees
Drive progress on key
priorities
Ensure membership support
Direct Collaborative R&D
Regional Steering Committees
Help ensure that iNEMI
addresses member needs in
Europe & Asia
The Technical Plan & Gaps are Defined By:
8 Technology Integration Groups
Gap Analysis
Workshop Identified Gaps
Member Identified Needs
Roadmap Process &
Scope
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Industry Led Teams
• Technical Working Group Teams
– Develops the roadmap technology chapters
– Presently 21 Teams and Chapters
• Product Emulator Group Teams
– “Virtual Product”: future product attributes plus key cost and
density drivers – Presently 6 Teams and Chapters
• Portable / Consumer
• Office Systems
• High-End Systems
• Medical Products
• Automotive
• Aerospace/Defense
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Product
Needs
Technology
Evolution
GAP
Analysis Research
Projects
Methodology
Competitive
Solutions
Roadmap
Industry Solution
Needed
Academia
Government
iNEMI
Members
Collaborate
No Work
Required
Available
to Market
Place
Global
Industry
Participation Disruptive
Technology
20 20
2011 Technology Working Groups (TWGs)
Organic PCB Board
Assembly Customer
RF Components &
Subsystems
Optoelectronics Large Area, Flexible Electronics
Energy Storage &
Conversion Systems
Modeling, Simulation,
and Design
Packaging
&
Component
Substrates
Semiconductor
Technology
Final
Assembly
Mass Storage (Magnetic & Optical)
Passive Components
Information
Management
Systems
Test, Inspection &
Measurement
Environmentally
Conscious
Electronics
Ceramic
Substrates
Thermal
Management
Connectors
MEMS/
Sensors
Red=Business Green=Engineering Purple=Manufacturing Blue=Component &
Subsystem
Solid State Illumination
Photovoltaics
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Roadmap Development
Product Emulator Groups TWGs
Semiconductor Technology
Design Technologies
Manufacturing Technologies
Comp./Subsyst. Technologies
Modeling, Thermal, etc.
Board Assy, Test, etc.
Packaging, Substrates, Displays, etc.
2013 Product Sector Needs Vs. Technology Evolution
Business Processes
Prod Lifecycle Information Mgmt.
Optoelectronics and
Optical Storage
Organic Printed
Circuit Boards
Magnetic and
Optical Storage
Supply Chain
Management
Semiconductors
iNEMI
Information
Management
TWG
iNEMI
Mass Data
Storage TWG
iNEMI / IPC / EIPC
/ TPCA
Organic PWB
TWG
iNEMI / ITRS /
MIG/PSMA
Packaging
TWG
iNEMI
Board
Assembly
TWG
Interconnect
Substrates—Ceramic
iNEMI Roadmap
iNEMI
Optoelectronics
TWG
Fourteen Contributing Organizations
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iNEMI / MIG
/ ITRS
MEMS
TWG
iNEMI
Passives
TWG
Statistics for the 2011 iNEMI Roadmap
• > 575 participants
• > 310 companies/organizations
• 18 countries from 4 continents
• Greater than 7 man years of resources in the development
• 21 Technology Working Groups (TWGs)
• 6 Product Emulator Groups (PEGs)
• > 1800 pages of information
• Roadmaps the needs for 2011-2021
• New roadmaps on:
– MEMS/Sensors
– Energy Storage & Conversion
– Aerospace & Defense
• Over 55 long term research priorities identified
• And 160 short to medium term key technical gaps
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Gap Analysis Leads to
Technical Plan (iNEMI
Projects) and Research
Priorities Documents
iNEMI Projects/Research
25
22 Projects and 25 Initiatives - Projects
in Definition
Typical Projects have 10-15 members
working pre competitive collaboration
The Project List can be viewed at:
http://www.inemi.org/inemi-projects The Research Priorities Document can
be downloaded at:
http://www.inemi.org/news/2011-inemi-
research-priorities
2011
Research
Priorities
Sample Market
Highlights of Product
Emulator Groups
310.INemi BES
Prismark LLC
ELECTRONICS PRODUCTION
2009 - 2021
Note: Total includes product categories not included in iNemi segmentation
$Bn 2009 2011 2013 2015 2021 CAAGR
‘09-‘15
CAAGR
‘15-‘21
Computers and Office $396 $433 $474 $500 $617 4.0% 3.6%
Communications Infrastructure Equipment $157 $174 $192 $213 $281 5.2% 4.7%
Consumer and Portable Electronics $298 $319 $341 $400 $479 5.0% 3.1%
Automotive Electronics $105 $129 $158 $161 $237 7.4% 6.6%
Medical Electronics $77 $85 $93 $103 $134 5.0% 4.5%
Military and Aerospace Electronics $118 $129 $140 $151 $189 4.2% 3.8%
Total Electronics Production $1,242 $1,382 $1,541 $1,679 $2,171 5.2% 4.4%
Medical Product
Sector Highlights
Chairs: Fred Sporon-Fiedler, Tony Primavera, Micro Systems Eng.
Medical Market Background
• Global
– 65+ year old population will triple by 2050 .. from
516M (2009) to 1.53B (2050)
– 80+ year old population will increase from 40M
(2009) to 219M (2050)
• Currently, the U.S. (for example) spends 1.75 Trillion
dollars … 15% of 2009 GDP … 25% of GDP 2015
• It is estimated that current annual spending on
medical devices / electronics is 70 to 100 Billion
dollars
• The market opportunities are large and are growing
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2013 Key Attribute Spreadsheet Template
30
31
Medical Products Were Grouped Into Three Major Market Segments
1) Implanted products (devices implanted in a human body)
– Strict regulatory procedures
– Driven by battery life (low power loss) – this limits the use of certain
components such as DRAM due to high energy consumption
– Validation and traceability required
– Long term reliability paramount
– Long development cycles, primary assembly and design by OEMs
2) Portable products (devices that are easily transported)
– Cost parity with consumer / portables
– Dynamic market, needs fast response, 9 to 24 month product cycle time
– Mixed regulatory environment
– Mostly outsourced assembly and design
– Higher Volume; Lower Cost – example – diagnostic ultrasound in PDA size ..
and smaller .. form factors
3) Diagnostic imaging devices and large scale equipment, e.g., MRI, CT
– Larger scale (often similar to servers or telecom equipment)
– Challenging thermal management and heat sinking
– Utilizes commercial off-the-shelf components, when available
– Development cycle is shorter than implantable
– Application and design well suited to EMS environment
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Market Drivers in Implantable Medical • Implantable therapy device modalities increasing
– New therapies in Cardiac Devices (4 chamber pacing/shocks)
– Implantable monitoring
– Neurostimulation therapies
– Opthalmic devices, deep brain stimulation etc…
• The average YoY growth rate for implantable products has been between 15-18% for the last 10 years , but slowing in U.S. due to regulatory shifts.
• Remote monitoring is becoming defacto standard. Increased demand for “external wireless telemetry”
Example: >250,000 patients are currently enrolled in
home / remote monitoring system.
These systems are communication devices that interact
with the implanted device and a host network system.
Source: S. Kelly, MIT
Leverage off Other Market Segments
• Implantable market reliability methods can learn from…
– Auto & Military – Learning on harsh environment reliability
in shock, impact and long term low level fatigue
• Portables – wireless medical device systems now becoming
standard
– Personal data device transmits to medical monitoring
facility and physician – communication must be flawless
– SIP and POP in consumer products- Some learning but
additional work needed to better correlate with medical
product needs
• Imaging Systems rely heavily on high end telecom system
components
– Displays, mass storage, wireless and hard-wire data transfer
systems
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Critical Gaps and Challenges
• Connector technologies that are highly reliable
– Ultra small for implantable products with automated wire attach.
Also require ultra high fidelity signal properties
– Large geometry connectors for imaging systems with superior
contact quality – zero electron loss
• Safety and efficacy in RF traffic wireless telemetry.
– Different frequencies, pulse widths, etc. in medical device
settings are not thoroughly addressed in international standards
• High reliability (10 year life minimum) PCB technologies to
support high density high performance silicon in implantable –
major research need
• High performance energy storage methodologies
– Includes researching and refining energy harvesting the bodies
thermal and motion attributes
• Addressing critical business issues for the medical market:
– Conversion to lead free solder attach technologies
– Simplifying regulatory and time to market challenges
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Medical MEMS Applications Spread Rapidly
MEMS enable dramatic new possibilities for detecting, analyzing, and
manipulating biomaterials, from proteins to bacteria to blood:
– Disposable blood pressure and home use blood pressure monitors
– Implantable pressure sensors for all types of monitoring (blood, respiration,
intestinal, bowel, etc)
– Flow Sensors for respiratory equipment, dose monitoring.
– Sleep apnea monitoring
– Silicon microphones
– Optical MEMS and Image sensors
– Micro dispensers for targeted and intelligent drug delivery
– Infrared temperature sensors
– Strain sensors, Energy Harvesting
– Accelerometers for hospital beds, pacemakers, defibrillators
– ……and many more!!
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Passive Component
Background / Highlights
Chair: Ed Mikoski, ECIA
Co-chair: Open
Connectivity is the Key to Consumer Growth
37
Source: 2009 Estimates Morgan Stanley
Ease of Use Improvements Drive Growth
User Interface + Smaller Form Factor + Lower Prices + New Services
38
The Consumer dominates the Market and
The Market makes the decisions
What does the Consumer want?
– Lower cost
– Higher performance
– Longer battery life
– Innovative features
– Connectivity (wireless)
– Smaller size
– Lighter weight
– Less heat generation
– Rapid availability
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3D Integration Roadmap
3D
Packaging
(No TSV)
3D IC Integration C2C/C2W/W2W; microbump bonding; 5 ≤ TSV ≤ 30μm;
20 ≤ memory stack ≤ 50μm; 100 ≤ interposers ≤ 200μm
3D Si Integration W2W pad-pad bonding
(TSV ≤ 1.5μm)
3D Stacking
(wirebonds)
PoP
CMOS image
sensor with TSV
Memory (50μm) with
TSV and microbump
Passive TSV interposer
to support high-
performance chips
CMOS image
sensor with
DSP and TSV
32 memory (20μm)
stacked
Active TSV Interposer
(e.g., Memory on Logic
with TSVs)
Mass
Production
Low Volume
Production 2008 2010 2012 Don’t care
to guess! Mass
Production 2011-13 2013-15 2015-17 Low volume production = only a handful of companies are SHIPPING it; Mass production = many companies are SHIPPING it.
Cu-Cu bonding
SiO2-SiO2 bonding
3D MEMS; 3D LED
Lau, 3D IC Integration PDC
Bumpless
Bumpless
2011 Roadmap - Passive Component
Chapter Table of Contents
41
COMPONENT/SUBSYSTEM TECHNOLOGIES
Contents
Passive Components ................................................................................................................... 1
1 Executive Summary .................................................................................................... 1
2 Introduction ................................................................................................................. 3
2.1 Definition of Passive Configurations ........................................................................ 3
2.2 Types of Passive Components .................................................................................. 4
3 Situation Analysis ....................................................................................................... 8
3.1 World Market Sizes For Passive Components.......................................................... 8
3.2 Business Issues.......................................................................................................... 9
4 Roadmap of Quantified Key Attribute Needs ........................................................... 10
4.1 Cross-Cutting Issues ............................................................................................... 10
4.2 Requirements for Portable Products ....................................................................... 18
4.3 Requirements for Office / Large Business Systems ............................................... 19
4.4 Requirements for Netcom Products ........................................................................ 25
4.5 Requirements for Automotive Products.................................................................. 26
4.6 Requirements for Medical Products........................................................................ 29
4.7 Requirements for System In Package (SiP) ............................................................ 31
4.8 Assembly of Small Footprint Components ............................................................. 31
4.9 Design, Procurement, and Manufacturing Channels .............................................. 32
5 Technology Trends and Needs.................................................................................. 33
5.1 Capacitors ............................................................................................................... 33
5.2 Resistors .................................................................................................................. 62
5.3 Magnetics ................................................................................................................ 65
5.4 Circuit Protection Components ............................................................................... 66
5.5 Integrated Passives .................................................................................................. 67
6 Gaps and Showstoppers ............................................................................................ 67
7 Recommendations on Potential Alternative Technologies ....................................... 71
7.1 Embedded Passives ................................................................................................. 71
7.2 Embedded Capacitors ............................................................................................. 72
7.3 Embedded Resistors ................................................................................................ 78
7.4 Embedded Magnetics .............................................................................................. 78
8 Contributors .............................................................................................................. 80
9 Glossary .................................................................................................................... 80
10 Terminology .............................................................................................................. 84
11 Bibliography ............................................................................................................. 85
Passives Chapter Situation Analysis
• Passive components, resistors–capacitors, inductors, and circuit
protection–are the highest volume components in electronic devices.
• These components support power management, signal conditioning,
and protection of active devices.
• Sales of these devices are greater than $30 billion per year. The
development and use of passive components are driven by cost,
regulatory, and technical requirements in customer segments.
• Shifts in business patterns have also altered the way passive
components are developed and used.
• Business patterns have continued to shift since the last roadmap driven
by:
– Movement of manufacturing from original equipment manufacturers (OEMs)
to electronics manufacturing services (EMS),
– Movement of end device design from OEMs to original design manufacturers
(ODMs)
– Movement of component manufacturing and end device manufacturing from
North America, Europe, and Japan to Asia
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Medical Product Sector Needs
43
Passive Components Typical Product Family
Passive Devices: State of the Art (production volume) Type/Size 0201 case 0201 case M0402 M0402 1005 case
Embedded PassivesPassives fabricated into the substrate # per sq. cm
0 0 4 8 16
Max. Ohms State of the Art (production volume) ohms / sq. 400 600 700 1M 1.2M
Max. Capacitance State of the Art (production volume) μF / sq. 0.1 0.1 0.2 0.3 0.5
Min. % tolerance State of the Art (production volume) % 5% 5% 4% 3% 2%
RF Components Typical Product Family
Quality Factor State of the Art (production volume) Q
1000 2000 3000 5000 10000
Capacitance density State of the Art (production volume) nF/sq. cm0.3 1 10 100 500
Inductance req. State of the Art (production volume) nH15 30 300 1000 1000
Insertion loss maximum State of the Art (production volume) db/cm/GHz
0.05 0.008 0.0025 0.001 0.0002
Parameter Descriptions Metric 2009 2011 2013 2015 2021
Ultra thin capacitors (Murata)
• Available in 2 sizes: ‘0402’ and ‘0201’
• Enables placement below ICs
– Typical applications: Modules (SiP), mobile phones
– Very thin ultra low placement force
• Market introduction: April 2010
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Dimensions 0.6×0.3mm 1.0×0.5mm
Thickness 0.05mm 0.05mm
Capacitance
(@1kHz) 0.01μF 0.1μF
Insulation
resistance
(@4V)
≧10MΩ ≧1MΩ
Nominal
voltage 4V 4V
Temperature
characteristics X5R X5R
45
TWG Status Issues
• 2011 Issues
– New issues not in previous roadmap that may impact other
TWGs:
– Stacked Multi-Layer Ceramic Capacitors for Power Supplies
– Ultra-Thin Discrete Capacitors for Emerging Embedded Technology
– Large Size Multi-Layer Ceramic Capacitors
– High Voltage, High Energy, High Current Film Capacitors
– SMD Tantalum Caps at 200°C Continuous Operation
– Heavy Duty Capacitors for High Humidity Conditions
– Aluminum Electrolytic Capacitors for Inverter Reliability
– Additional detail on UltraCapacitors (Super Capacitors)
Passive TWG Major Issue
• Fraudulent and counterfeit parts are increasing
– Confounds product reliability and warrantee issues
– Even sub-penny parts are not immune
– Fear of the phenomena has altered the supply chain
46
Passive Component Issues • Component size reduction – to facilitate placing closer to
semiconductor die
• Ability of components to meet mounting profiles for lead-
free solders
• Ability of components to meet increased temperature,
voltage, and power levels required during use
• The ability for current technologies to continue to drive
capacitance per volume increases in discrete devices
– continuing ability of ceramic capacitor manufacturers to
reduce dielectric thickness
– tantalum capacitor manufacturers to increase charge per
gram without fundamental paradigm shifts in technology.
• The ability to decrease parasitics (ESR and ESL for
capacitors) at the system level
– reductions of parasitics at the component level
– how these components are interconnected with the circuit
47
Passive Component Issues (Continued)
• Counterfeit Components Proliferation / Mediation
• Increasing Regulatory Environment (REACH, etc)
• Demands For “Fail Safe” Failure Modes
• Continued Demand For “Cost Effective” Embedded
Components
• Reporting Requirements for Conflict Materials Tracking
• Rare Earth Material Shortages
• Increased Reliability in Electrolytic Capacitors for inverters
48
Pushing the Envelope
• All of these new technologies are moving very
quickly.
• In today's world the effectiveness of an integrated
supply chain approach is key
• Multiple nodes on the supply chain covering all
aspects of design, materials, assembly, test, etc, etc
• Cooperative roadmap efforts of groups (such as,
ECIA, MIG, iNEMI, IPC, TPCA and ITRS) are key to
clarify timing and needs
• There are many/many opportunities for collaborative
R&D
– An iNEMI Strength and Core Capability
49
Summary
Situation Analysis
• Convergence of markets is gaining speed
– Medical-Consumer
– Automotive-Entertainment
– Communication-Entertainment
• Growth of MEMs applications will escalate – consumer, automotive, medical
• Rapid evolution of 3D packaging led by consumer markets
• Proactive Rare Earth Metals and Conflict Materials management are required
• Trends on environmental regulation growth globally
• Energy Storage criticality increasing:
– Miniaturization & battery life in consumer & medical
– Improvements in Automotive affects the total supply chain
– Growing opportunity for smart grid, solar, wind system storage
51
The iNEMI Deliverables Are Key
• Technology continues to move at a faster rate of
change
• Driven in many cases by short life cycle, low cost, high
volume product
• Many of these “cool new things” don’t port well or
quickly to high reliability markets such as automotive,
medical, or high end networking
• We have numerous collaborative R&D projects working
challenging supply chain wide issues
• Key deliverables from iNEMI were the 2011 Technical
Plan (available only to members) and the 2011 Research
Priorities
52
14 Existing Projects at End of 2011
Project name Status
Copper Wire Bonding Reliability - Phase 2 TV build, start test in April
Advanced Si-node Pb-free Underfill Reliability White paper & test plan developing
Eco-Impact Evaluator for ICT Equipment - Phase 2 Ongoing
Pb-Free Early Failure - Phase 2 Closing
Creep Corrosion - Phase 3 2nd experiment done, doing FA
HFR-Free PCB Materials - Phase 2 Closing, discussing future opportunity
Connector Particle Thickness Ongoing
Rare Earth Metals Assessment and Supply Chain Actions Ongoing
Boundary Scan - Structural Test of External Memory Starting a new phase
Wiring Density for Organic Packaging Substrates Summarizing survey outputs
Pb-Free Rework Optimization, Phase 3 (Reliability Evaluation) On going
Characterization of Pb-Free Alloy Alternatives Test ongoing
Halogen-Free (BFR) High-Reliability PCB Closing
Pb-Free Component & Board Finish Reliability Closing
6 New Projects – Launched in 2012
• Board Assembly TIG – Counterfeit Components Assessment
• Medical TIG – Reliability Requirements for Implantable Medical Devices
– Qualification Methods for Portable Medical Products
– Component Specifications for Medical Products
• Test TIG – Structural Test of External Memory Devices – Addendum
• Manufacturing Strain Guidance for PCBAs
• Improving UL Certification of Laminates and PCBs
• Warpage Characteristics of Organic Packages
5 Active Initiatives – Under Formation
• Packaging Equipment Working Group
• SOW in final development
• MEMS Initiatives
• MEMS Reliability Methodologies
• MEMS Test Methods and Capabilities
• Medical Initiatives
• Supply Chain Support for Medical Devices
• MRI/X-Ray Compatibility with Implantable Devices
At least 8 Other Proposed Initiatives
• Material Evaluation for Low-Loss, High Reliability
Applications
• Rework of ultra small components, PoP
• Surface finish evaluations by market segment
• Molding Compounds for packages
• Underfill Materials
• Side to side registration of PCBs
• Delamination and Pad Cratering of PWBs
• Medical Flex
Summary
• We have 20 active projects with typically 10-15 companies
participating.
• We have:
– 5 initiatives in formation
– 8 initiatives proposed as potential new projects
– 6 research proposals
• To participate in initiatives you do not need to be an iNEMI
member.
• To participate in projects you must be an iNEMI member
57
Example of a Roadmap Driven Solution
• The 2009 iNEMI Environmentally Conscious
Electronics Roadmap Chapter identified a need to be
proactive in identifying opportunities for the
electronics industry.
• This resulted in a project proposal to remove
potentially harmful halide additives from PCBs – prior
to having to react to legislation mandating action.
• This issue was clarified in the 2009 Technical Plan. A
project proposal came forward from the iNEMI
membership.
• The project is called the “HFR-Free Technology
Leadership Program” and was divided into two
subprojects:
– “HFR- Free Materials”
– “HFR-Free Signal Integrity”.
Example of a Roadmap Driven Solution-Continued • The Signal Integrity and phase 1 of the Materials projects ran for
approximately 18 months.
• Results were shared with the supply chain via papers and webinars.
• The results verified that substitute materials for halogen fire
retardants are available.
• Offer a “drop in” replacement for many high frequency applications at
a competitive cost.
• This team also provided a specific test specification for HFR-free
laminate materials
• Worked to ensure that sufficient volume capability was being brought
on line by the supply chain to effect a smooth transition
• There are many more examples of iNEMI projects that have been
completed for the purpose of facilitating the unimpeded growth of the
electronics supply chain.
• iNEMI typically has 20 active collaborative R&D projects at all times
– Each with 10-15 companies working together focused on targeted
results.
The iNEMI Roadmap Availability And Development • 2011 iNEMI Roadmap Availability
– The 2011 iNEMI Roadmap CD is available for order at
www.inemi.org
– Individual roadmap chapters are also available as a PDF
document at www.inemi.org
• 2013 iNEMI Roadmap Development Cycle
– Formal start was October 21st, 2011 at SMTAI
– Please contact Chuck Richardson @ [email protected] for
opportunities to participate
We encourage you to contribute!
It is a global, full supply chain, industry wide look at future
technology metrics & gaps
– Not a requirement to be an iNEMI member
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Be Involved!!
Q&A
Thank You!
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www.inemi.org Email contacts:
Grace O’Malley (Europe)
Haley Fu (Asia)
Chuck Richardson (Roadmap)
Bob Pfahl (V.P. Operations)
Bill Bader (CEO)
