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Arab Academy for Science & Technology & Maritime Transport

College of Engineering & technologyElectronics & Communication Engineering Department

Course: MEMS Course Code: EC 530

Instructor: Prof. Hazem H. Ali GTA: Eng. Hesham H. Gaber

7th

Week Exam(DSAFG)

Choose the most proper answer:

1. ......... is considered as the most expensive

micromechanical process:

a) Lithography

b) Lift-off technique

c) Etching

d) Masking

2. The silicon diaphragm is the basic structure used

in:

a) Microengineered pressure sensor.

b) Voltage sensor.

c) Actuators.

d) Relays.

3. Types of etching are...........:a) Wet isotropic

b) Wet anisotropic

c) Dry

d) All of the above

4. Applications of Piezoelectric materials :(a) High voltage sources

(b) Sensors

(c) a & b

(d) None of the above

5. In X-ray lithography, the X-ray absorber is usually:

a) Silver

b) Gold

c) Aluminum

d) None of the above

6. Methods of dry etching are:

a) Physical sputter etching

b) Chemical plasma etching

c) Combined chemical/physical etching

d) All of the above

7. The electron gun is used in lithography because it

is........ :a) Inexpensive

b) Accurate

c) Doesnt require high voltage

d) None of the above

8. Lithography is used for:

a) Forming resist layers on the substrateb) Cutting tool

c) Forming electric bonds

d) None of the above

9. Frequency of oscillation in Microultrasonic

Machining is:

a) 20GHz

b) 20MHz

c) 20KHz

d) None of the above

10. .........method removes material through erosive

action:

a) Diamond milling

b) Soft lithography

c) Micro-electro discharge machining

d) Powder blasting

11. The most advantage for the sensor array design is

:-

a) Decrease sensor size.

b) Increase the system reliability and a failure of

single sensor is not exist.

c) Help in monolithic IC fabrication.

d) All of the above.

12. particle speed of powder blasting is in the range of:

a) 80200 ms

b) 80400 ns

c) 80200 ns

d) 80200 s

13. .......... is a material removal method

a) Surface micromachining

b) Micro stereo Lithography

c) LIGA

d) None of the above

14. is the most used in silicon micromachining:

a) Laser micromachining.

b) Micro Electro-Discharge machining.

c) Bulk machining.

d) Powder Blasting.

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15. ................process is also called spark erosion

a)U ultrasonic machining

b) Powder blasting

c) Soft lithography

d) Micro electro discharge machining

16. Telemicrosurgery is

a) surgical operation used in special hospitals.

b) surgical operation using controlled microrobots.

c) surgical operation using stereo microscope with

special microstructured tools.

d) surgical operation using network protocols.

17. One of the most used kinds of lasers in

microfabrication is:

a) Excimer

b) Diamond milling

c) Bulk micromachining

d) None of the above

18. Combination of........... is used to form sharp

points:

a) Dry and isotropic wet etching

b) Dry and anisotropic wet etching

c) a&b

d) None of the above

19. From the advantages of RF MEMS:

a) Very wide coverage area

b) Ultra high RF loss

c) Low power consumption

d) All of the above

20. First application for piezoelectric device

was................:

a) SONAR.

b) Radar.

c) Antenna.

d) None of the above.21. Most of RF components are :

a) Sensors.

b) Actuators.

c) A/D converter

d) All of the above.

22. RF MEMS switches are than diode switches:

a) Lower power consumption

b) higher power consumption

c) used for high switching speed.

d) a and c

23. We use Silicon in MEMS Fabrication because:

a) well understood and controllable electrical

properties.

b) Availability of existing tools

c) Its desirable mechanical properties.

d) All of the above.

24. CZOCHRALSKI process is used for:

a) Prepared single crystal semiconductor ingots

b) prepared amorphous crystalline shape for

semiconductor.

c) doping.

d) a and c

25. Piezoelectric Ultrasonic transducers work as:

a) Sensors

b) Actuators

c) a & b

d) none of the above

26. Evaporation Method used for :

a) Chemical layer deposition,

b Physical Layer Deposition.

c) Doping

d) All of the above.

27. From the properties of Wheatstone bridge:

a) Good sensitivity

b) Temperature independent

c) Simple implementation

d) All of the above

28. Excimer stands for:

a) Excellent dimer

b) Excelled dimer

c) Excited dimer

d) None of the above

29. focused ion beam milling is............ process

a) Anisotropic

b) Wet isotropic

c) Electromechanical

d) X-ray lithography

30. System Techniques based on:

a) Information Techniques

b) Interconnection Technology

c) Packaging

d) All of the above

31. Metals such as nickel titanium aluminum, gold, etc

and their alloys are used in MEMS technology

because of:

a) Good conductivity and ability for deposit.

b) Light weight polymers they have.

c) Mechanical properties.d) All of the above.

32. the full wafer thickness range is:

a) 100 to 300 um

b) 600 to 800 um

c) 200 to 500 um

d) 200 to 500 mm

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51. The invention of a transistor in the end of..

started the microelectronics revolution:

a) 1950

b) 1940

c) 1960

d)1905

52. One of the challenges which faces MEMS

technology is/are:

a) Lower detection signals.

b) Impurities.

c) Effects of environment.

d) all of the above.

53. Airbag system is based on . sensor.

a) Pressureb) IR

c) Accelerometer

d) None of the above

54. Rf MEMS switches are used in picosatellites for:

a) communication with ground based Antennas.b) Under water navigation.

c) control satellites horizontal and vertical locations.

d) none of the above.

55. Surface Acoustic Wave filter (SAW) can work

from:

a) 10MHz to 300 MHz.

b) 10MHz to 3 GHz.

c) 10 KHz to 300 kHz

d) 10 Hz to 2 GHz.

56. In Moore's Law semiconductor devices shrink to:

a) mille scale.

b) micro scale.

c) nano scale.

d) none of the above.

57. Packaging concerns so that it can be used for

practical applications

a) the encasing of the microsystemb) the software

c) the lithography technique.

d) None of the above.

58. .. crystals produce the most piezoelectricity:

a) Quartz & Topaz

b) Rochelle salt & Tourmalinec) Rochelle salt & Quartz

d) Topaz & Tourmaline

59. MEMS used in the trend of the inkjet printer

technology to :

a) enhance the paper quality.

b) increase printing quality and speed.

c) increasing the cost.

d) none of the above.

60. In some new digital cameras, MEMS tilt sensor is

used to ...when a photo is taken.

a) light .

b) monitor how the camera is held.

c) measure the distance between the camera and

target.

d) none of the above

61. Applications of microassembly:

a) Wrist watches

b) Micromotors and gearsc) Microrobots

d) All of the above

62. ........ crystalline semiconductor is used also as

substrate:

a) Germaniumb) magnesium

c) SiO2

d) GaAr

63. In hearing aids, to protect ear from loud sounds

we use ................

a) Attenuator

b) Insulator

c) Automatic gain control device

d) Non of the above

64. A complete micro system should:-

a) Detect process and evaluate external signals.

b) Make decisions based on obtained information.

c) Convert decisions into corresponding actuator

commands.

d) All of the above.

65. The restrictions of the anodic bonding are:

a) Glass slightly conductive

b) Surface roughness 1 micro meter

c) Thermal expansion coefficients of both materials

d) All of the above

66. Actuators are subdivision of :

a) Capacitors

b) Transducers

c) Piezoelectric

d) Transistors

67. is a disadvantage of electromechanical

films:

a) Light weight

b) Easy to cut

c) Large deformation

d) Low volume

68. Piezoelectric transformer is a type of ............

multiplier:

a) AC voltage.

b) DC voltage.

c) a & b.

d) None of the above.

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69. are based on the thermal effects of a

current flowing into a conductor:

a) Inductive voltage sensors

b) Thermal voltage sensors

c) Capacitive voltage sensors

d) Semiconductor voltage sensors

70. .................. is/are thermal energy measurement

sensor:

a) Infrared sensors

b) Thermocouples

c) Semiconductor temperature sensors

d) All of the above

71. Physical layer deposition is a type of......

a) Thick film techniques

b) Deposition from a liquid phasec) Thin film techniques

d) Masking

72. Piezoresistive materials have the property of

changing their ............... under physical pressure or

mechanical work.a) Resistance.

b) Capacitance.

c) Impedance.

d) None of the above.

73. The disadvantages of active suspension includes:

a) Price

b) Complexity

c) Weight and high power consumption

d) All of the above

74. From the challenges that face MEMS technology:

a) High investment costs

b) Small-volume production has not been profitable

c) Early stage of development

d) All the above

75. The advantages of the Lab-On-a-Chip are:

a) Inexpensiveb) Fluid volume is very small (samples)

c) Carry out DNA analysis

d) All of the above

76. ESP stands for:

a) Electronic stability programb) Electric stability program

c) Electronic slip program

d) None of the above

77. Active suspension system consists of :

a) ECU

b) Adjustable shocks

c) Springs

d) All of the above

78. ......... from the Properties of capacitive sensors:

a) High Pressure Sensitivity.

b) No-Hystersis.

c) a&b.

d) None of the Above.

79. The main disadvantages of piezoelectric actuation

include.........................

a) Complexity of fabrication.b) High price.

c) Bad performance.

d) None of the above.

80 . EMFI stands for...................

a) Electromechanical film.

b) Electromagnetic film.c) a & b.

d) None of the above