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PMEG6030ELP60 V, 3 A low leakage current Schottky barrier rectifier7 May 2015 Product data sheet

1. General descriptionPlanar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier with anintegrated guard ring for stress protection, encapsulated in a SOD128 small and flat leadSurface-Mounted Device (SMD) plastic package.

2. Features and benefits• Extremely low leakage current IR = 340 nA• Average forward current: IF(AV) ≤ 3 A• Reverse voltage: VR ≤ 60 V• Low forward voltage VF = 600 mV• High power capability due to clip-bonding technology• High temperature Tj ≤ 175 °C• Small and flat lead SMD plastic package• AEC-Q101 qualified

3. Applications• Low voltage rectification• High efficiency DC-to-DC conversion• Switch mode power supply• Reverse polarity protection• Low power consumption applications

4. Quick reference dataTable 1. Quick reference dataSymbol Parameter Conditions Min Typ Max Unit

IF(AV) average forwardcurrent

δ = 0.5; f = 20 kHz; Tsp ≤ 155 °C;square wave

- - 3 A

VR reverse voltage Tj = 25 °C - - 60 V

VF forward voltage IF = 3 A; tp ≤ 300 µs; δ ≤ 0.02;Tj = 25 °C

- 600 670 mV

IR reverse current VR = 60 V; tp ≤ 300 µs; δ ≤ 0.02;Tj = 25 °C

- 340 1000 nA

© Nexperia B.V. 2017. All rights reserved

Nexperia PMEG6030ELP60 V, 3 A low leakage current Schottky barrier rectifier

PMEG6030ELP All information provided in this document is subject to legal disclaimers.

Product data sheet 7 May 2015 2 / 15

5. Pinning informationTable 2. Pinning informationPin Symbol Description Simplified outline Graphic symbol

1 K cathode[1]

2 A anode1 2

SOD128sym001

1 2

[1] The marking bar indicates the cathode.

6. Ordering informationTable 3. Ordering information

PackageType number

Name Description Version

PMEG6030ELP SOD128 plastic surface-mounted package; 2 leads SOD128

7. MarkingTable 4. Marking codesType number Marking code

PMEG6030ELP DH





8. Limiting valuesTable 5. Limiting valuesIn accordance with the Absolute Maximum Rating System (IEC 60134).Symbol Parameter Conditions Min Max Unit

VR reverse voltage Tj = 25 °C - 60 V

IF forward current Tsp = 150 °C; δ = 1 - 4.2 A

δ = 0.5; f = 20 kHz; Tamb ≤ 75 °C;square wave

[1] - 3 AIF(AV) average forward current

δ = 0.5; f = 20 kHz; Tsp ≤ 155 °C;square wave

- 3 A

IFSM non-repetitive peak forwardcurrent

tp = 8 ms; Tj(init) = 25 °C; square wave - 70 A

[2] - 750 mW

[3] - 1250 mW

Ptot total power dissipation Tamb ≤ 25 °C

[1] - 2500 mW

Tj junction temperature - 175 °C

Tamb ambient temperature -55 175 °C

Tstg storage temperature -65 175 °C

[1] Device mounted on a ceramic Printed-Circuit Board (PCB), Al2O3, standard footprint.[2] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.[3] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2.

9. Thermal characteristicsTable 6. Thermal characteristicsSymbol Parameter Conditions Min Typ Max Unit

[1][2] - - 200 K/W

[1][3] - - 120 K/W

Rth(j-a) thermal resistancefrom junction toambient

in free air

[1][4] - - 60 K/W

Rth(j-sp) thermal resistancefrom junction to solderpoint

[5] - - 12 K/W

[1] For Schottky barrier diodes thermal runaway has to be considered, as in some applications the reversepower losses PR are a significant part of the total power losses.

[2] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.[3] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2.[4] Device mounted on a ceramic PCB, Al2O3, standard footprint.[5] Soldering point of cathode tab.





aaa-016490

10

1

102

103

Zth(j-a)(K/W)

10-1

tp (s)10-3 102 10210110-2 10-1

duty cycle = 1

0

0.010.02

0.750.5

0.10.05

0.25

0.330.2

FR4 PCB, standard footprint

Fig. 1. Transient thermal impedance from junction to ambient as a function of pulse duration; typical valuesaaa-016491

10

1

102

103

Zth(j-a)(K/W)

10-1

tp (s)10-3 102 10310110-2 10-1

duty cycle = 1

0.1

0.25

0.50.75

0.02

0

0.01

0.05

0.20.33

FR4 PCB, mounting pad for cathode 1 cm2

Fig. 2. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values





aaa-016492

tp (s)10-3 102 10310110-2 10-1

10

1

102

10-1

Zth(j-a)(K/W)

0.02

0.01

0

0.05

0.1

0.20.33

0.25

0.50.75duty cycle = 1

Ceramic PCB, Al2O3, standard footprint

Fig. 3. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values





10. CharacteristicsTable 7. CharacteristicsSymbol Parameter Conditions Min Typ Max Unit

V(BR)R reverse breakdownvoltage

IR = 1 mA; Tj = 25 °C; tp = 300 µs;δ = 0.02

60 - - V

IF = 0.1 A; tp ≤ 300 µs; δ ≤ 0.02;Tj = 25 °C

- 440 500 mV

IF = 0.5 A; tp ≤ 300 µs; δ ≤ 0.02;Tj = 25 °C

- 495 555 mV

IF = 0.7 A; tp ≤ 300 µs; δ ≤ 0.02;Tj = 25 °C

- 505 565 mV

IF = 1 A; tp ≤ 300 µs; δ ≤ 0.02;Tj = 25 °C

- 525 585 mV

IF = 1.6 A; tp ≤ 300 µs; δ ≤ 0.02;Tj = 25 °C

- 550 620 mV

IF = 2 A; tp ≤ 300 µs; δ ≤ 0.02;Tj = 25 °C

- 570 640 mV

IF = 3 A; tp ≤ 300 µs; δ ≤ 0.02;Tj = 25 °C

- 600 670 mV

VF forward voltage

IF = 3 A; tp ≤ 300 µs; δ ≤ 0.02;Tj = 125 °C

- 510 630 mV

VR = 10 V; tp ≤ 300 µs; δ ≤ 0.02;Tj = 25 °C

- 20 - nA

VR = 40 V; tp ≤ 300 µs; δ ≤ 0.02;Tj = 25 °C

- 80 - nA

VR = 60 V; tp ≤ 300 µs; δ ≤ 0.02;Tj = 25 °C

- 340 1000 nA

IR reverse current

VR = 60 V; tp ≤ 300 µs; δ ≤ 0.02;Tj = 125 °C

- 440 2100 µA

VR = 1 V; f = 1 MHz; Tj = 25 °C - 315 - pF

VR = 4 V; f = 1 MHz; Tj = 25 °C - 190 - pF

Cd diode capacitance

VR = 10 V; f = 1 MHz; Tj = 25 °C - 125 - pF

trr reverse recovery time IF = 0.5 A; IR = 0.5 A; IR(meas) = 0.1 A;Tj = 25 °C

- 12 - ns

VFRM peak forward recoveryvoltage

IF = 0.5 A; dIF/dt = 20 A/µs; Tj = 25 °C - 560 - mV





aaa-017365

10-2

10-3

1

10-1

10IF(A)

10-4

VF (V)0.0 0.80.60.2 0.4

(1)

(2)

(3)

(5)(4) (6)

(1) Tj = 175 °C(2) Tj = 150 °C(3) Tj = 125 °C(4) Tj = 85 °C(5) Tj = 25 °C(6) Tj = −40 °C

Fig. 4. Forward current as a function of forwardvoltage; typical values

10-2

10-3

10-4

10-5

10-7

10-6

10-8

10-9

10-10

10-11

IR(A)

10-12

VR (V)0 604020

aaa-017366(1)

(2)

(3)

(5)

(4)

(6)

(1) Tj = 175 °C(2) Tj = 150 °C(3) Tj = 125 °C(4) Tj = 85 °C(5) Tj = 25 °C(6) Tj = −40 °C

Fig. 5. Reverse current as a function of reversevoltage; typical values

aaa-017369

VR (V)0 604020

200

300

100

400

500Cd

(pF)

0

f = 1 MHz; Tamb = 25 °C

Fig. 6. Diode capacitance as a function of reversevoltage; typical values

aaa-017370

IF(AV) (A)0.0 4.53.01.5

0.8

1.2

0.4

1.6

2.0PF(AV)

(W)

0.0

(1)

(2)

(3)

(4)

Tj = 175 °C(1) δ = 0.1(2) δ = 0.2(3) δ = 0.5(4) δ = 1

Fig. 7. Average forward power dissipation as afunction of average forward current; typicalvalues





aaa-017371

VR (V)0 604020

40

60

20

80

100PR(AV)(mW)

0

(1)

(2)

(3)

(4)

Tj = 150 °C(1) δ = 1 (DC)(2) δ = 0.5; f = 20 kHz(3) δ = 0.2; f = 20 kHz(4) δ = 0.1; f = 20 kHz

Fig. 8. Average reverse power dissipation as afunction of reverse voltage; typical values

Tamb (°C)0 20015050 100

aaa-017372

1

2

3

IF(AV)(A)

0

(1)

(2)

(3)

(4)

FR4 PCB, standard footprintTj = 175 °C(1) δ = 1; DC(2) δ = 0.5; f = 20 kHz(3) δ = 0.2; f = 20 kHz(4) δ = 0.1; f = 20 kHz

Fig. 9. Average forward current as a function ofambient temperature; typical values

Tamb (°C)0 20015050 100

aaa-017373

1.5

3.0

4.5

IF(AV)(A)

0.0

(1)

(2)

(3)

(4)

FR4 PCB, mounting pad for cathode 1 cm2

Tj = 175 °C(1) δ = 1; DC(2) δ = 0.5; f = 20 kHz(3) δ = 0.2; f = 20 kHz(4) δ = 0.1; f = 20 kHz


Tamb (°C)0 20015050 100

aaa-017374

1.5

3.0

4.5

IF(AV)(A)

0.0

(1)

(2)

(3)

(4)

Ceramic PCB, Al2O3, standard footprintTj = 175 °C(1) δ = 1; DC(2) δ = 0.5; f = 20 kHz(3) δ = 0.2; f = 20 kHz(4) δ = 0.1; f = 20 kHz






Tsp (°C)0 20015050 100

aaa-017375

1.5

3.0

4.5

IF(AV)(A)

0.0

(1)

(2)

(3)

(4)

Tj = 175 °C(1) δ = 1; DC(2) δ = 0.5; f = 20 kHz(3) δ = 0.2; f = 20 kHz(4) δ = 0.1; f = 20 kHz

Fig. 12. Average forward current as a function of solder point temperature; typical values

11. Test information

time

IF

IR

trr

IR(meas)

006aad022

Fig. 13. Reverse recovery definition





001aab912

time

time

VFRM

VF

IF

VF

Fig. 14. Forward recovery definition

tptcy

P

t006aac658

duty cycle δ =

tp

tcy

Fig. 15. Duty cycle definition

The current ratings for the typical waveforms are calculated according to the equations:IF(AV) = IM × δ with IM defined as peak current, IRMS = IF(AV) at DC, and IRMS = IM × √δ withIRMS defined as RMS current.

11.1 Quality informationThis product has been qualified in accordance with the Automotive Electronics Council(AEC) standard Q101 - Stress test qualification for discrete semiconductors, and issuitable for use in automotive applications.





12. Package outline

07-09-12Dimensions in mm

1.10.9

0.220.10

0.60.3

5.04.4

4.03.6

1.91.6

2.72.3

1

2

Fig. 16. Package outline SOD128

13. Soldering

solder lands

solder resist

occupied area

solder paste2.53.4 2.1

(2×)1.9(2×)

4.4

4.2

6.2

1.2(2×)1.4(2×) sod128_fr

Dimensions in mm

Fig. 17. Reflow soldering footprint for SOD128





14. Revision historyTable 8. Revision historyData sheet ID Release date Data sheet status Change notice Supersedes

PMEG6030ELP v.2 20150507 Product data sheet - PMEG6030ELP v.1

Modifications: • Product status changed

PMEG6030ELP v.1 20150320 Preliminary data sheet - -





15. Legal information

15.1 Data sheet statusDocumentstatus [1][2]

Productstatus [3]

Definition

Objective[short] datasheet

Development This document contains data fromthe objective specification for productdevelopment.

Preliminary[short] datasheet

Qualification This document contains data from thepreliminary specification.

Product[short] datasheet

Production This document contains the productspecification.

[1] Please consult the most recently issued document before initiating orcompleting a design.

[2] The term 'short data sheet' is explained in section "Definitions".[3] The product status of device(s) described in this document may have

changed since this document was published and may differ in case ofmultiple devices. The latest product status information is available onthe Internet at URL http://www.nexperia.com.

15.2 DefinitionsPreview — The document is a preview version only. The document is stillsubject to formal approval, which may result in modifications or additions.Nexperia does not give any representations or warranties as tothe accuracy or completeness of information included herein and shall haveno liability for the consequences of use of such information.

Draft — The document is a draft version only. The content is still underinternal review and subject to formal approval, which may result inmodifications or additions. Nexperia does not give anyrepresentations or warranties as to the accuracy or completeness ofinformation included herein and shall have no liability for the consequencesof use of such information.

Short data sheet — A short data sheet is an extract from a full data sheetwith the same product type number(s) and title. A short data sheet isintended for quick reference only and should not be relied upon to containdetailed and full information. For detailed and full information see therelevant full data sheet, which is available on request via the local Nexperiasales office. In case of any inconsistency or conflict with theshort data sheet, the full data sheet shall prevail.

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Notwithstanding any damages that customer might incur for any reasonwhatsoever, Nexperia’s aggregate and cumulative liability towardscustomer for the products described herein shall be limited in accordancewith the Terms and conditions of commercial sale of Nexperia.

Right to make changes — Nexperia reserves the right tomake changes to information published in this document, including withoutlimitation specifications and product descriptions, at any time and withoutnotice. This document supersedes and replaces all information supplied priorto the publication hereof.

Suitability for use in automotive applications — This Nexperiaproduct has been qualified for use in automotiveapplications. Unless otherwise agreed in writing, the product is not designed,authorized or warranted to be suitable for use in life support, life-critical orsafety-critical systems or equipment, nor in applications where failure ormalfunction of a Nexperia product can reasonably be expectedto result in personal injury, death or severe property or environmentaldamage. Nexperia and its suppliers accept no liability forinclusion and/or use of Nexperia products in such equipment orapplications and therefore such inclusion and/or use is at the customer's ownrisk.

Quick reference data — The Quick reference data is an extract of theproduct data given in the Limiting values and Characteristics sections of thisdocument, and as such is not complete, exhaustive or legally binding.

Applications — Applications that are described herein for any of theseproducts are for illustrative purposes only. Nexperia makes norepresentation or warranty that such applications will be suitable for thespecified use without further testing or modification.

Customers are responsible for the design and operation of theirapplications and products using Nexperia products, and Nexperiaaccepts no liability for any assistance with applications orcustomer product design. It is customer’s sole responsibility to determinewhether the Nexperia product is suitable and fit for thecustomer’s applications and products planned, as well as for the plannedapplication and use of customer’s third party customer(s). Customers shouldprovide appropriate design and operating safeguards to minimize the risksassociated with their applications and products.

Nexperia does not accept any liability related to any default,damage, costs or problem which is based on any weakness or defaultin the customer’s applications or products, or the application or use bycustomer’s third party customer(s). Customer is responsible for doing allnecessary testing for the customer’s applications and products using Nexperiaproducts in order to avoid a default of the applicationsand the products or of the application or use by customer’s third partycustomer(s). Nexperia does not accept any liability in this respect.

Limiting values — Stress above one or more limiting values (as defined inthe Absolute Maximum Ratings System of IEC 60134) will cause permanentdamage to the device. Limiting values are stress ratings only and (proper)operation of the device at these or any other conditions above thosegiven in the Recommended operating conditions section (if present) or theCharacteristics sections of this document is not warranted. Constant orrepeated exposure to limiting values will permanently and irreversibly affectthe quality and reliability of the device.

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Export control — This document as well as the item(s) described hereinmay be subject to export control regulations. Export might require a priorauthorization from competent authorities.

Translations — A non-English (translated) version of a document is forreference only. The English version shall prevail in case of any discrepancybetween the translated and English versions.

15.4 TrademarksNotice: All referenced brands, product names, service names andtrademarks are the property of their respective owners.





16. Contents1 General description ............................................... 12 Features and benefits ............................................13 Applications ........................................................... 14 Quick reference data ............................................. 15 Pinning information ...............................................26 Ordering information .............................................27 Marking ................................................................... 28 Limiting values .......................................................39 Thermal characteristics .........................................310 Characteristics .......................................................611 Test information ..................................................... 911.1 Quality information ............................................. 1012 Package outline ................................................... 1113 Soldering .............................................................. 1114 Revision history ...................................................1215 Legal information .................................................1315.1 Data sheet status ............................................... 1315.2 Definitions ...........................................................1315.3 Disclaimers .........................................................1315.4 Trademarks ........................................................ 14

© Nexperia B.V. 2017. All rights reservedFor more information, please visit: http://www.nexperia.comFor sales office addresses, please send an email to: [email protected] Date of release: 07 May 2015

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