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PMEG4010AESB40 V, 1 A low VF MEGA Schottky barrier rectifier6 October 2015 Product data sheet

1. General descriptionPlanar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier with anintegrated guard ring for stress protection in a leadless ultra small DSN1006-2 (SOD993)Surface-Mounted Device (SMD) package.

2. Features and benefits• Average forward current: IF(AV) ≤ 1 A• Reverse voltage: VR ≤ 40 V• Low forward voltage, typical: VF = 435 mV• Low reverse current, typical: IR = 325 µA• Package height typ. 270 µm

3. Applications• Low voltage rectification• High efficiency DC-to-DC conversion• Switch mode power supply• Low power consumption applications• Ultra high-speed switching• LED backlight for mobile application

4. Quick reference dataTable 1. Quick reference dataSymbol Parameter Conditions Min Typ Max Unit

IF(AV) average forwardcurrent

δ = 0.5 ; f = 20 kHz; Tsp ≤ 145 °C;square wave

- - 1 A

VR reverse voltage Tj = 25 °C - - 40 V

VF forward voltage IF = 1 A; tp ≤ 300 µs; δ ≤ 0.02 ;Tj = 25 °C

- 435 505 mV

VR = 20 V; tp ≤ 3 ms; δ ≤ 0.3 ;Tj = 25 °C

- 30 115 µAIR reverse current

VR = 40 V; tp ≤ 3 ms; δ ≤ 0.3 ;Tj = 25 °C

- 325 1250 µA

© Nexperia B.V. 2017. All rights reserved

Nexperia PMEG4010AESB40 V, 1 A low VF MEGA Schottky barrier rectifier

PMEG4010AESB All information provided in this document is subject to legal disclaimers.

Product data sheet 6 October 2015 2 / 14

5. Pinning informationTable 2. Pinning informationPin Symbol Description Simplified outline Graphic symbol

1 K cathode[1]

2 A anode

Transparent top view

21

DSN1006-2 (SOD993)

sym001

1 2

[1] The marking bar indicates the cathode.

6. Ordering informationTable 3. Ordering information

PackageType number

Name Description Version

PMEG4010AESB DSN1006-2 DSN1006-2, leadless ultra small package; 2 terminals;body 1.0 x 0.6 x 0.27 mm

SOD993

7. MarkingTable 4. Marking codesType number Marking code

PMEG4010AESB 4A





8. Limiting valuesTable 5. Limiting valuesIn accordance with the Absolute Maximum Rating System (IEC 60134).Symbol Parameter Conditions Min Max Unit

VR reverse voltage Tj = 25 °C - 40 V

IF forward current Tsp ≤ 140 °C; δ = 1 - 1.4 A

δ = 0.5 ; f = 20 kHz; Tamb ≤ 115 °C;square wave

[1] - 1 AIF(AV) average forward current

δ = 0.5 ; f = 20 kHz; Tsp ≤ 145 °C;square wave

- 1 A

IFRM repetitive peak forward current tp ≤ 1 ms; δ ≤ 0.25 - 4 A

IFSM non-repetitive peak forwardcurrent

tp = 8 ms; Tj(init) = 25 °C; square wave - 10 A

[2] - 0.525 W

[3] - 1 W

Ptot total power dissipation Tamb ≤ 25 °C

[1] - 1.78 W

Tj junction temperature - 150 °C

Tamb ambient temperature -55 150 °C

Tstg storage temperature -65 150 °C

[1] Device mounted on a ceramic Printed-Circuit Board (PCB), Al2O3, standard footprint.[2] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.[3] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for anode and cathode

1 cm2 each.

9. Thermal characteristicsTable 6. Thermal characteristicsSymbol Parameter Conditions Min Typ Max Unit

[1][2] - - 240 K/W

[1][3] - - 125 K/W

Rth(j-a) thermal resistancefrom junction toambient

in free air

[1][4] - - 70 K/W

Rth(j-sp) thermal resistancefrom junction to solderpoint

[5] - - 15 K/W

[1] For Schottky barrier diodes thermal runaway has to be considered, as in some applications the reversepower losses PR are a significant part of the total power losses.

[2] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.[3] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for anode and cathode

1 cm2 each.[4] Device mounted on a ceramic PCB, Al2O3, standard footprint.[5] Soldering point of anode tab.





aaa-016800

tp (s)10-3 102 10310110-2 10-1

102

10

103

Zth(j-a)(K/W)

1

duty cycle =

10.75

0.50.33

0.25 0.2

0.1 0.05

0.020.01

0

FR4 PCB, standard footprint

Fig. 1. Transient thermal impedance from junction to ambient as a function of pulse duration; typical valuesaaa-016801

tp (s)10-3 102 10310110-2 10-1

102

10

103

Zth(j-a)(K/W)

1

duty cycle =1

0.750.5

0.250.330.2

0.10.05

0.020.010

FR4 PCB, mounting pad for anode and cathode 1 cm2 each

Fig. 2. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values





aaa-016802

tp (s)10-3 102 10310110-2 10-1

10

102

Zth(j-a)(K/W)

1

duty cycle =1

0.75

0.50.33

0.250.2

0.10.05

0.020.010

Ceramic PCB, Al2O3, standard footprint

Fig. 3. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values

10. CharacteristicsTable 7. CharacteristicsSymbol Parameter Conditions Min Typ Max Unit

V(BR)R reverse breakdownvoltage

IR = 10 mA; tp = 300 µs; δ = 0.02 ;Tj = 25 °C

40 - - V

IF = 1 mA; tp ≤ 300 µs; δ ≤ 0.02 ;Tj = 25 °C

- 145 - mV

IF = 10 mA; tp ≤ 300 µs; δ ≤ 0.02 ;Tj = 25 °C

- 205 - mV

IF = 100 mA; tp ≤ 300 µs; δ ≤ 0.02 ;Tj = 25 °C

- 275 330 mV

IF = 200 mA; tp ≤ 300 µs; δ ≤ 0.02 ;Tj = 25 °C

- 305 - mV

IF = 500 mA; tp ≤ 300 µs; δ ≤ 0.02 ;Tj = 25 °C

- 365 425 mV

IF = 700 mA; tp ≤ 300 µs; δ ≤ 0.02 ;Tj = 25 °C

- 395 - mV

VF forward voltage

IF = 1 A; tp ≤ 300 µs; δ ≤ 0.02 ;Tj = 25 °C

- 435 505 mV

VR = 5 V; tp ≤ 3 ms; δ ≤ 0.3 ; Tj = 25 °C - 10 - µA

VR = 10 V; tp ≤ 3 ms; δ ≤ 0.3 ;Tj = 25 °C

- 15 60 µA

IR reverse current

VR = 20 V; tp ≤ 3 ms; δ ≤ 0.3 ;Tj = 25 °C

- 30 115 µA





Symbol Parameter Conditions Min Typ Max Unit

VR = 40 V; tp ≤ 3 ms; δ ≤ 0.3 ;Tj = 25 °C

- 325 1250 µA

VR = 1 V; f = 1 MHz; Tj = 25 °C - 75 - pFCd diode capacitance

VR = 10 V; f = 1 MHz; Tj = 25 °C - 22 - pF

trr reverse recovery time IF = 0.5 A; IR = 0.5 A; IR(meas) = 0.1 A;Tj = 25 °C

- 3.1 - ns

aaa-015579

VF (V)0.0 0.90.60.3

10-2

10-3

1

10-1

10IF(A)

10-4

(1)(2)

(3) (4) (5)

pulsed condition(1) Tj = 150 °C(2) Tj = 125 °C(3) Tj = 85 °C(4) Tj = 25 °C(5) Tj = −40 °C

Fig. 4. Forward current as a function of forwardvoltage; typical values

aaa-01558010-1

10-2

10-3

10-4

10-5

10-6

10-7

IR(A)

10-8

VR (V)0 403010 20

(1)

(2)

(3)

(4)

pulsed condition(1) Tj = 125 °C(2) Tj = 85 °C(3) Tj = 25 °C(4) Tj = −40 °C

Fig. 5. Reverse current as a function of reversevoltage; typical values





VR (V)0 403010 20

aaa-015581

80

40

120

160

Cd(pF)

0

f = 1 MHz; Tamb = 25 °C

Fig. 6. Diode capacitance as a function of reversevoltage; typical values

IF(AV) (A)0.0 1.51.00.5

aaa-0168030.7PF(AV)

(W)

0.0

0.1

0.2

0.3

0.4

0.5

0.6

(1)

(2)

(3)

(4)

Tj = 150 °C(1) δ = 0.1(2) δ = 0.2(3) δ = 0.5(4) δ = 1

Fig. 7. Average forward power dissipation as afunction of average forward current; typicalvalues

VR (V)0 403010 20

aaa-016804

0.50

0.25

0.75

1.00

PR(AV)(W)

0.00

(1)

(2)(3)

(4)

Tj = 125 °C(1) δ = 1(2) δ = 0.9(3) δ = 0.8(4) δ = 0.5

Fig. 8. Average reverse power dissipation as afunction of reverse voltage; typical values

Tamb (°C)0 50 100 150 1751257525

aaa-016805

0.5

1.0

1.5

IF(AV)(A)

0.0

(1)

(2)

(3)

(4)

FR4 PCB, standard footprintTj = 150 °C(1) δ = 1; DC(2) δ = 0.5; f = 20 kHz(3) δ = 0.2; f = 20 kHz(4) δ = 0.1; f = 20 kHz

Fig. 9. Average forward current as a function ofambient temperature; typical values





Tamb (°C)0 50 100 150 1751257525

aaa-016806

0.5

1.0

1.5

IF(AV)(A)

0.0

(1)

(2)

(3)

(4)

FR4 PCB, mounting pad for anode and cathode 1

cm2 eachTj = 150 °C(1) δ = 1; DC(2) δ = 0.5; f = 20 kHz(3) δ = 0.2; f = 20 kHz(4) δ = 0.1; f = 20 kHz


Tamb (°C)0 50 100 150 1751257525

aaa-016807

0.5

1.0

1.5

IF(AV)(A)

0.0

(1)

(2)

(3)

(4)

Ceramic PCB, Al2O3, standard footprintTj = 150 °C(1) δ = 1 (DC)(2) δ = 0.5; f = 20 kHz(3) δ = 0.2; f = 20 kHz(4) δ = 0.1; f = 20 kHz


Tsp (°C)0 50 100 150 1751257525

aaa-016808

0.5

1.0

1.5

IF(AV)(A)

0.0

(1)

(2)

(3)

(4)

Tj = 150 °C(1) δ = 1 (DC)(2) δ = 0.5; f = 20 kHz(3) δ = 0.2; f = 20 kHz(4) δ = 0.1; f = 20 kHz

Fig. 12. Average forward current as a function of solder point temperature; typical values





11. Test information

time

IF

IR

trr

IR(meas)

006aad022

Fig. 13. Reverse recovery definition; step recovery

t1t2

P

t006aaa812

duty cycle δ =

t1

t2

Fig. 14. Duty cycle definition

The current ratings for the typical waveforms are calculated according to the equations:IF(AV) = IM × δ with IM defined as peak current, IRMS = IF(AV) at DC, and IRMS = IM × √δ withIRMS defined as RMS current.

12. Package outline

14-10-24Dimensions in mm

1.050.950.65

0.650.55

0.300.24 0.03

max

0.510.49

0.260.24

0.260.24

1

2

Fig. 15. Package outline DSN1006-2 (SOD993)





13. Soldering

SOD993

sod993_fr

occupied area

solder paste

solder resist

solder lands

Dimensions in mm15-02-2015-03-05

0.5(2x)

0.6(2x)

0.7(2x)

1.2

0.3

0.25(2x)0.20.35(2x)0.45(2x)

0.65

0.8

Fig. 16. Reflow soldering footprint for DSN1006-2 (SOD993)

14. MountingSOD993 is an ultra small Discretes Silicon No-leads (DSN) package allowing maximizedutilization of the package area for active silicon. Due to the special product design, Nexperiainvestigated the board assembly process parameters. In order to have an optimumsoldering quality, Nexperia advises following the assembly recommendations explained inAN11689.

http://www.nexperia.com/documents/application_note/an11689.pdf





15. Revision historyTable 8. Revision historyData sheet ID Release date Data sheet status Change notice Supersedes

PMEG4010AESB v.3 20151006 Product data sheet - PMEG4010AESB v.2

Modifications: • Changed status to "Product data sheet"

PMEG4010AESB v.2 20150430 Preliminary data sheet - PMEG4010AESB v.1

PMEG4010AESB v.1 20141128 Objective data sheet - -





16. Legal information

16.1 Data sheet statusDocumentstatus [1][2]

Productstatus [3]

Definition

Objective[short] datasheet

Development This document contains data fromthe objective specification for productdevelopment.

Preliminary[short] datasheet

Qualification This document contains data from thepreliminary specification.

Product[short] datasheet

Production This document contains the productspecification.

[1] Please consult the most recently issued document before initiating orcompleting a design.

[2] The term 'short data sheet' is explained in section "Definitions".[3] The product status of device(s) described in this document may have

changed since this document was published and may differ in case ofmultiple devices. The latest product status information is available onthe Internet at URL http://www.nexperia.com.

16.2 DefinitionsPreview — The document is a preview version only. The document is stillsubject to formal approval, which may result in modifications or additions.Nexperia does not give any representations or warranties as tothe accuracy or completeness of information included herein and shall haveno liability for the consequences of use of such information.

Draft — The document is a draft version only. The content is still underinternal review and subject to formal approval, which may result inmodifications or additions. Nexperia does not give anyrepresentations or warranties as to the accuracy or completeness ofinformation included herein and shall have no liability for the consequencesof use of such information.

Short data sheet — A short data sheet is an extract from a full data sheetwith the same product type number(s) and title. A short data sheet isintended for quick reference only and should not be relied upon to containdetailed and full information. For detailed and full information see therelevant full data sheet, which is available on request via the local Nexperiasales office. In case of any inconsistency or conflict with theshort data sheet, the full data sheet shall prevail.

Product specification — The information and data provided in a Productdata sheet shall define the specification of the product as agreed betweenNexperia and its customer, unless Nexperia andcustomer have explicitly agreed otherwise in writing. In no event however,shall an agreement be valid in which the Nexperia productis deemed to offer functions and qualities beyond those described in theProduct data sheet.

16.3 DisclaimersLimited warranty and liability — Information in this document is believedto be accurate and reliable. However, Nexperia does not giveany representations or warranties, expressed or implied, as to the accuracyor completeness of such information and shall have no liability for theconsequences of use of such information. Nexperia takes noresponsibility for the content in this document if provided by an informationsource outside of Nexperia.

In no event shall Nexperia be liable for any indirect, incidental,punitive, special or consequential damages (including - without limitation -lost profits, lost savings, business interruption, costs related to the removalor replacement of any products or rework charges) whether or not suchdamages are based on tort (including negligence), warranty, breach ofcontract or any other legal theory.

Notwithstanding any damages that customer might incur for any reasonwhatsoever, Nexperia’s aggregate and cumulative liability towardscustomer for the products described herein shall be limited in accordancewith the Terms and conditions of commercial sale of Nexperia.

Right to make changes — Nexperia reserves the right tomake changes to information published in this document, including withoutlimitation specifications and product descriptions, at any time and withoutnotice. This document supersedes and replaces all information supplied priorto the publication hereof.

Suitability for use — Nexperia products are not designed,authorized or warranted to be suitable for use in life support, life-critical orsafety-critical systems or equipment, nor in applications where failure ormalfunction of a Nexperia product can reasonably be expectedto result in personal injury, death or severe property or environmentaldamage. Nexperia and its suppliers accept no liability forinclusion and/or use of Nexperia products in such equipment orapplications and therefore such inclusion and/or use is at the customer’s ownrisk.

Quick reference data — The Quick reference data is an extract of theproduct data given in the Limiting values and Characteristics sections of thisdocument, and as such is not complete, exhaustive or legally binding.

Applications — Applications that are described herein for any of theseproducts are for illustrative purposes only. Nexperia makes norepresentation or warranty that such applications will be suitable for thespecified use without further testing or modification.

Customers are responsible for the design and operation of theirapplications and products using Nexperia products, and Nexperiaaccepts no liability for any assistance with applications orcustomer product design. It is customer’s sole responsibility to determinewhether the Nexperia product is suitable and fit for thecustomer’s applications and products planned, as well as for the plannedapplication and use of customer’s third party customer(s). Customers shouldprovide appropriate design and operating safeguards to minimize the risksassociated with their applications and products.

Nexperia does not accept any liability related to any default,damage, costs or problem which is based on any weakness or defaultin the customer’s applications or products, or the application or use bycustomer’s third party customer(s). Customer is responsible for doing allnecessary testing for the customer’s applications and products using Nexperiaproducts in order to avoid a default of the applicationsand the products or of the application or use by customer’s third partycustomer(s). Nexperia does not accept any liability in this respect.

Limiting values — Stress above one or more limiting values (as defined inthe Absolute Maximum Ratings System of IEC 60134) will cause permanentdamage to the device. Limiting values are stress ratings only and (proper)operation of the device at these or any other conditions above thosegiven in the Recommended operating conditions section (if present) or theCharacteristics sections of this document is not warranted. Constant orrepeated exposure to limiting values will permanently and irreversibly affectthe quality and reliability of the device.

Terms and conditions of commercial sale — Nexperiaproducts are sold subject to the general terms and conditions of commercialsale, as published at http://www.nexperia.com/profile/terms, unless otherwiseagreed in a valid written individual agreement. In case an individualagreement is concluded only the terms and conditions of the respectiveagreement shall apply. Nexperia hereby expressly objects toapplying the customer’s general terms and conditions with regard to thepurchase of Nexperia products by customer.

No offer to sell or license — Nothing in this document may be interpretedor construed as an offer to sell products that is open for acceptance or the

http://www.nexperia.com/profile/terms





grant, conveyance or implication of any license under any copyrights, patentsor other industrial or intellectual property rights.

Export control — This document as well as the item(s) described hereinmay be subject to export control regulations. Export might require a priorauthorization from competent authorities.

Non-automotive qualified products — Unless this data sheet expresslystates that this specific Nexperia product is automotive qualified,the product is not suitable for automotive use. It is neither qualified nortested in accordance with automotive testing or application requirements.Nexperia accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications.

In the event that customer uses the product for design-in and use inautomotive applications to automotive specifications and standards,customer (a) shall use the product without Nexperia’s warrantyof the product for such automotive applications, use and specifications, and(b) whenever customer uses the product for automotive applications beyondNexperia’s specifications such use shall be solely at customer’sown risk, and (c) customer fully indemnifies Nexperia for anyliability, damages or failed product claims resulting from customer design anduse of the product for automotive applications beyond Nexperia’sstandard warranty and Nexperia’s product specifications.

Translations — A non-English (translated) version of a document is forreference only. The English version shall prevail in case of any discrepancybetween the translated and English versions.

16.4 TrademarksNotice: All referenced brands, product names, service names andtrademarks are the property of their respective owners.





17. Contents1 General description ............................................... 12 Features and benefits ............................................13 Applications ........................................................... 14 Quick reference data ............................................. 15 Pinning information ...............................................26 Ordering information .............................................27 Marking ................................................................... 28 Limiting values .......................................................39 Thermal characteristics .........................................310 Characteristics .......................................................511 Test information ..................................................... 912 Package outline ..................................................... 913 Soldering .............................................................. 1014 Mounting ...............................................................1015 Revision history ...................................................1116 Legal information .................................................1216.1 Data sheet status ............................................... 1216.2 Definitions ...........................................................1216.3 Disclaimers .........................................................1216.4 Trademarks ........................................................ 13

© Nexperia B.V. 2017. All rights reservedFor more information, please visit: http://www.nexperia.comFor sales office addresses, please send an email to: [email protected] Date of release: 06 October 2015

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