Data Sheet - Alker · Eyeopener (CDR) Eyeopener (CDR) Th D / A TIA RF driver Digital10Gb/s...
Transcript of Data Sheet - Alker · Eyeopener (CDR) Eyeopener (CDR) Th D / A TIA RF driver Digital10Gb/s...
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Features • RoHS-6Compliant• Supports10.3Gb/sto11.3Gb/sbitrates• ComplianttoXFPMSA• Supports10Gb/sEthernetandFibreChannel - IEEE802.3ae10GBASE-LRfor10GbE,10.3125Gb/s - 10GFC1310nmSerialPMD,type1200-SM-LL-L,
10.51875Gb/s• AvagoTechnologies’uncooled1310nmDFBLaserand
PINPhotodiode• CompliantXFI10GSerialelectricalinterface• LCDuplexopticalconnectorinterfaceconformingto
ANSITIA/EIA604-10(FOCIS10)• 1.5Wtypicalpowerdissipation• NoReferenceClockrequired• Superior Thermal and EMI integrity performance to
supporthighportdensities• Customizableclip-onheatsinktosupportavarietyof
linecardenvironments• -5to+70°Ccaseoperatingtemperaturerange• SupportXFIloopback• 2-wireserialmanagementinterfaceprovidesrealtime
monitorsof: - TransmittedOpticalPower - ReceivedOpticalPower - LaserBiasCurrent - ModuleTemperature• LinkLengthsupto10kmwith9µmfiber• IEC60825-1Class1/CDRHClass1lasereyesafety.
DescriptionThe1310nmXFPtransceiverisahighperformance,costeffectivemoduleforserialopticaldatacommunicationsapplications specified for signal rates of 10.30 Gb/s to11.3Gb/s.ItiscomplianttoXFPMSARev4.5.Themod-uleisdesignedforsinglemodefiberandoperatesatanominal wavelength of 1310 nm. The transmitter sec-tionincorporatesAvagoTechnologies’uncooleddirectlymodulated 1310 nm distributed feedback laser (DFB).The receiver section uses Avago Technologies’ MOVPEgrown planar TEDET PIN photodetector for low darkcurrentandexcellentresponsivity.IntegratedTxandRxsignalconditionersprovidehighjitter-toleranceforfullXFI compliance.The internally AC coupled high speedserialI/Osimplifiesinterfacingtoexternalcircuitry.Theelectrical interface is made using an industry standard0.8mmpitch30-pinrightangleconnector.Opticalcon-nectionismadeviatheduplexLCconnector.
Applications• FibreChannelSwitches• HostBusAdapterCards• MassStorageSystemandServerI/O• EthernetSwitches• CoreRouters
Related Products• AFCT-711XPDZ:Multi-rate1310nmXFP10Gbit/sOptical
TransceiverforSONET/SDHOC-192,10GbE&10GFC• AFBR-720XPDZ: 10GbE 850nm XFP 10Gbit/s Optical
Transceiver
AFCT-721XPDZ10GbE/10GFC 1310 nm XFP 10 Gbit/s Optical Transceiver
Data Sheet
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Theproductalsooffersdigitaldiagnosticsusingthe2-wireserial interfacedefinedintheXFPMSA.Theprod-uctprovidesrealtimetemperature(moduleandlaser),supplyvoltage, laserbiascurrent, laseraverageoutputpowerandreceivedinputpower.Thedigitaldiagnosticinterfacealsoaddstheabilitytodisablethetransmitter(TX_DIS),powerdownthemodule,monitorformodulefaultsandmonitorforReceiverLossofSignal(RX_LOS).Transmitter disable, interrupt, power down/reset, re-ceiverlossofsignalandmodulenotreadyarealsohardwiredpinsonthe30-pinrightangleconnector.
InstallationTheAFCT-721XPDZcanbeinstalledinanyXFPportre-gardlessofhostequipmentoperatingstatus.TheAFCT-721XPDZ is hot-pluggable, allowing the module to beinstalledwhilethehostsystemisoperatingandon-line.The clip-on heatsink is designed to clip on to the XFPcagewithoutamodulepresent.
Upon insertion, the transceiver housing makes initialcontact with the host board XFP cage, mitigating po-tential damage due to Electro-Static Discharge (ESD).Once fully inserted into the XFP cage, the top surfaceof the XFP module makes contact with the heatsinkthroughacutoutinthetopofthecageensuringanef-fectivethermalpathformoduleheat.
Functional Description
Transmitter SectionThe transmitter section includes a 1310 nm DFB (Dis-tributed Feedback Laser) light source, a transmitterdrivercircuitandasignalconditionercircuitontheTXdata inputs. (see Figure 1) Optical connection to thetransmitter isprovidedviaaLCconnector. TheopticaloutputiscontrolledbyacustomICthatdetectsthela-seroutputviathemonitorphotodiode.ThisICprovidesbothDCandACcurrentdrivetothelasertoensurecor-rectmodulation,eyediagramandextinctionratioovertemperature,supplyvoltageandoperatinglife.
TX_DISAssertingpin5,TX_DIS,willdisablethetransmitteropti-caloutput.Thetransmitteroutputcanalsobedisabledandmonitoredviathetwo-wireserialinterface.
Eye Safety CircuitUndernormaloperatingconditionslaserpowerwillbemaintainedbelowClass1eye-safetylimits.
Figure 1. Transceiver Functional Diagram
PIN
Laser
CWdriver
Optic
alre
cept
acle
s
Elec
trica
lcon
nect
or
Mon. PIN
ROSA
Opticalisolator
TOSAEEPROM
Microcontroller
A/D
ESA
Heat sink
Anal
ogsig
nal
cond
ition
ers
Main housing
Digital low speedbus or signal
Powersupplycontrol +3.3V
Eye opener(CDR)
Eye opener(CDR)
Th
D/A
TIATIA
RFdriver
Digital 10 Gb/selectrical signal
Analog lowspeed signal
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Receiver SectionThe receiver section includes a PIN detector with am-plificationquantizationsignalconditionercircuits.(seeFigure1)OpticalconnectiontothereceiverisprovidedviaaLCopticalconnector.
RX_LOSThe receiver section contains a loss of signal (RX_LOS)circuit to indicatewhentheoptical inputsignalpowerisinsufficientforreliablesignaldetection.Ahighsignalindicateslossofmodulatedsignal,indicatinglinkfailuresuch as a broken fiber or nonfunctional remote trans-mitter.RX_LOScanalsobemonitoredviathetwo-wireserialinterface(byte110,bit1).
XFP Module
Host Board
OptionalHost +5 V
4.7 µH VCC5
0.1 µF 22 µF 0.1 µF
Host +3.3 V 4.7 µH VCC3
0.1 µF 22 µF 0.1 µF
OptionalHost +1.8 V
4.7 µH VCC2
0.1 µF 22 µF 0.1 µF
OptionalHost -5.2 V
4.7 µH VEE5
0.1 µF 22 µF 0.1 µF
GND
XFP
Con
nect
or
Figure 2. MSA recommended power supply filter
Electrical Pinout
GND
RD-
RD+
GND
VCC2
P_DOWN/RST
VCC2
GND
REFCLK+
REFCLK-
GND
GND
TD-
TD+
GND
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
GND
RX_LOS
MOD_NR
MOD_ABS
SDA
SCL
VCC3
VCC3
GND
VCC5
TX_DIS
INTERRUPT
MOD_DESEL
VEE5
GND
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
TOWARDASIC
TOWARDBEZEL
Figure 3. Host PCB XFP Pinout Top View
Functional Data I/OAvago Technologies’ AFCT-721XPDZ fiber-optic trans-ceiverisdesignedtoacceptindustrystandardelectricalinput differential signals. The transceiver provides AC-coupled, internally terminated data input and outputinterfaces. Bias resistors and coupling capacitors havebeenincludedwithinthemoduletoreducethenumberofcomponentsrequiredonthecustomer’sboard.
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Table 1. Electrical Pin DefinitionsPin Name Logic Function/Description Notes1 GND ModuleGround 1
2 VEE5 -5.2Vpowersupply.(NotUsed)
3 Mod-Desel LVTTL-I ModuleDe-select;Whenheldlowallowsthemoduletorespondto2-wireSe-rialinterfacecommands
4
4 Interrupt LVTTL-O Interrupt;Indicatespresenceofanimportantconditionwhichcanbereadovertheserial2-wireinterface
2
5 TX_DIS LVTTL-I TransmitterDisable;TransmitterLaserSourceTurnedOff 4
6 VCC5 5Vpowersupply.(NotUsed)
7 GND ModuleGround 1
8 VCC3 +3.3VPowerSupply
9 VCC3 +3.3VPowerSupply
10 SCL LVTTL-I TwoWireInterfaceClock 2
11 SDA LVTTL-I/O TwoWireInterfaceDataLine 2
12 Mod_Abs LVTTL-O LVTTL-OMod_AbsIndicatesModuleisnotpresent.GroundedintheModule 2
13 Mod_NR LVTTL-O ModuleNotReady;IndicatingModuleOperationalFault 2
14 RX_LOS LVTTL-O ReceiverLossOfSignalIndicator 2
15 GND ModuleGround 1
16 GND ModuleGround 1
17 RD- CML-O ReceiverInvertedDataOutput
18 RD+ CML-O ReceiverNon-InvertedDataOutput
19 GND ModuleGround 1
20 VCC2 +1.8VPowerSupply.(NotUsed)
21 P_Down/RST LVTTL-I Powerdown:Whenhigh,themoduleisputintoalowerpowermode.Serialinterfaceisfunctionalinthelowpowermode.Reset:ThefallingedgeinitiatesacompleteresetofthemoduleincludingtheserialInterface,equivalenttoapowercycle.
4
22 VCC2 +1.8VPowerSupply.(NotUsed)
23 GND ModuleGround 1
24 RefCLK+ PECL-I ReferenceClockNon-InvertedInput,ACcoupledonthehostboard(NotUsed) 3
25 RefCLK- PECL-I ReferenceClockInvertedInput,ACcoupledonthehostboard(NotUsed) 3
26 GND ModuleGround 1
27 GND ModuleGround 1
28 TD- CML-I TransmitterInvertedDataInput
29 TD+ CML-I TransmitterNon-InvertedDataInput
30 GND ModuleGround 1
Notes:1. ModulegroundpinsGndareisolatedfromthemodulecaseandchassisgroundwithinthemodule.2. OpenCollectorshouldbepulledupwith4.7KWto10KWtoavoltagebetween3.15Vand3.6Vonthehostboard.3. RefCLK+/-areinternallyterminated(50W)4. PulleduptoVcc3via4.7-10KWresistorinsidethemodule
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Absolute Maximum RatingsParameter Symbol Minimum Typical Maximum Unit NotesStorageTemperature(non-operating) TS -40 +85 °C 1,2,3
AmbientOperatingTemperature TA -40 +85 °C 1,2,3
RelativeHumidity RH 10 90 % 1
SupplyVoltage VCC3 0 3.6 V 1,2
LowSpeedInputVoltage VIN -0.5 VCC+0.5 V 1
Recommended Operating Conditions [4]
Parameter Symbol Minimum Typical Maximum Unit NotesCaseOperatingTemperature TC -5 +70 °C 3
SupplyVoltage VCC3 3.135 3.465 V 5
DataRate 9.95 11.3 Gb/s
Transceiver Electrical Characteristics(TC=-5°Cto+70°C,VCC3=3.3V±5%)
Parameter Symbol Minimum Typical Maximum Unit NotesPowerSupplyNoiseRejection(peak-peak)under1MHz
PSNR 2%ofVCC mV 6
PowerSupplyNoiseRejection(peak-peak)1MHzto10MHz
PSNR 3%ofVCC mV 6
Modulesupplycurrent ICC 425 605 mA
PowerDissipation PDISS 1410 2100 mW
Low Speed Outputs:MOD_NR,RX_LOS,MOD_ABS,INTERRUPT
VOHVOL
Host_VCC-0.50.0
Host_VCC+0.30.4
VV
78
Low Speed Inputs:TX_DIS,MOD_DESEL,P_DOWN/RST
VIHVIL
2.0-0.5
VCC3+0.30.8
VV
109
Notes:1. AbsoluteMaximumRatingsarethosevaluesbeyondwhichdamagetothedevicemayoccuriftheselimitsareexceededforotherthanashort
periodoftime.SeeReliabilityDataSheetforspecificreliabilityperformance.2. BetweenAbsoluteMaximumRatingsandtheRecommendedOperatingConditionsfunctionalperformanceisnotintended,devicereliability
isnotimplied,anddamagetothedevicemayoccuroveranextendedperiodoftime.3. TheAmbientOperatingTemperaturelimitationsarebasedontheCaseOperatingTemperaturelimitationsandaresubjecttothehostsystem
thermaldesign.4. RecommendedOperatingConditionsarethosevaluesforwhichfunctionalperformanceanddevicereliabilityisimplied5. VccconditionappliestosupplyvoltageattheXFPmodule6. PowerSupplyfilteringonhostboardrequiredasperXFPMSAspecification.7. 4.7KWto10KW resistorpull-uptohost_VCC,measuredatthehostsideofconnector.IOH(max)=-2mA.8. 4.7KWto10KW resistorpull-uptohost_VCC,measuredatthehostsideofconnector.IOL(max)=2mA.9. 4.7KWto10KW resistorpull-uptohost_VCC,measuredatthehostsideofconnector.IIL(max)=10µA.10.4.7KWto10KW resistorpull-uptohost_VCC,measuredatthehostsideofconnector.IIH(max)=-10µA.
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Transmitter Electrical Input Characteristics(TC=-5°Cto+70°C,VCC3=3.3V±5%)
Parameter Symbol Minimum Typical Maximum Unit NotesDifferentialInputImpedance Zd 100 W
TerminationMismatch DZM 5 %
DifferentialInputAmplitude DVQDO 120 820 mV peaktopeak(1)
DifferentialInputReturnLoss SDD11 20 dB 0.05to0.1GHz
DifferentialInputReturnLoss SDD11 8 dB 0.1to5.5GHz
DifferentialInputReturnLoss SDD11 8-20.66log10(f/5.5)finGHz
dB 5.5-12GHz
CommonModeInputReturnLoss SCC11 3 dB 0.1to12GHz
DifferentialtoCommonModeCon-version
SCD11 10 dB 0.1to12GHz
JitterandEyeMask XFPMSACompliant
Receiver Electrical Output CharacteristicsParameter Symbol Minimum Typical Maximum Unit NotesDifferentialInputImpedance Zd 100 W
TerminationMismatch DZM 5 %
DifferentialOutputAmplitude DVQDO 340 850 mV peaktopeak(1)
DCCommonModePotential Vcm 0 3.6 V
OutputACCommonModeVoltage 15 mV RMS
OutputRise/Falltime(20%to80%)
tr,tf 24 ps
Commonmodeoutputreturnloss SCC22 3 dB 0.1to12GHz
Differentialoutputreturnloss SDD22 20 dB 0.05to0.1GHz
Differentialoutputreturnloss SDD22 8 dB 0.1to5.5GHz
Differentialoutputreturnloss SDD22 8-20.66log10(f/5.5)finGHz
dB 5.5-12GHz
JitterandEyeMask XFPMSACompliant
Note:1. ThedifferentialinputandoutputamplitudesareperXFPMSARev4.5maskatpointsB’andC’.
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Transmitter Optical Characteristics 10 GbE/10GFC(TC=-5°Cto+70°C,VCC3=3.3V±5%)
Parameter Symbol Minimum Typical Maximum Unit NotesOpticalOutputPower Pout -5.2 dBmOMA 1,2
AverageOpticalOutputPower Pout -8.2 0.5 dBm 1,2
ExtinctionRatio ER 3.5 dB 1,2
SpectralWidth-rms s,rms 0.2 nmRMS 3
CenterWavelength λC 1260 1310 1355 nm
Transmitteranddispersionpenalty TDP 3.2 dB 1,2
Sidemodesuppressionratio 30 dB 1
Opticaloutputpower(min)inOMA-TDP
-6.2 dBmOMA 1,2
RIN12(OMA) RIN -128 dB/Hz 1
OpticalEyeMask CompliantwithIEEE802.3ae10GBASE-LR
Receiver Optical Characteristics 10 GbE/10GFC(TC=-5°Cto+70°C,VCC3=3.3V±5%)
Parameter Symbol Minimum Typical Maximum Unit NotesAverageReceivepower -14.4 0.5 dBmmean 1
Stressedreceiversensitivity -10.3 dBmOMA 1
Receiversensitivity PIN -12.6 dBmOMA 3
MaxReceiverReflectance -12 dB 1
Wavelength λC 1260 1310 1355 nm
Notes:1. 10GFC1200-SM-LL-L/IEEE802.3ae10BASE-LRcompliant2. Theseparametersareinterrelated:seeIEEE802.3ae3. Forinformationonly
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Transceiver Timing Characteristics(TC=-5°Cto+70°C,VCC3=3.3V±5%)
Parameter Symbol Minimum Typical Maximum Unit Notes
TX_DISAssertTime t_off 20 µs TimefromrisingedgeofTX_DIStowhentheopticaloutputfallsbelow10%ofnominal.
TX_DISNegateTime t_on 2 ms TimefromfallingedgeofTX_DIStowhenthemodulatedopticaloutputrisesabove90%ofnominal.
Timetoinitialize t_init 300 ms Frompoweronorhotplugaftermeetingpowersupplyspecs
Interruptassertdelay
Interrupt_on 200 ms Fromoccurrenceoftheconditiontriggeringinterrupt
Interruptnegatedelay
Interrupt_off 500 us Fromclearonreadinterruptflags
P_Down/RSTassertdelay
P_Down/RST_on 100 us FromPowerdowninitiation
P-Downnegatedelay
P_Down/RST_off
300 ms Maxdelayfromnegatetocompletionofpowerupandreset
Mod_NRassertdelay
Mod_nr_on 1 ms FromOccurrenceoffaulttoassertionofMOD_NR
Mod_NRnegatedelay
Mod_nr_off 1 ms FromOccurrenceofsignaltonega-tionofMOD_NR
Mod_DeSelasserttime
T_Mod_DeSel 2 ms MaximumdelaybetweenassertionofMod_DeSelandendofmoduleresponseto2-wireinterfacecommu-nications
Mod_DeSelde-asserttime
T_Mod_Sel 2 ms Maximumdelaybetweende-asser-tionofMod_DeSelandpropermod-uleresponseto2-wireinterfacecommunications
P_Downresettime t_reset 10 µs MinlengthofP-Downasserttoinitialreset
RX_LOSAssertdelay T_loss_on 100 µs FromOccurrenceoflossofsignaltoassertionofRX_LOS
RX_LOSnegatedelay T_loss_off 2.3 100 µs FromOccurrenceofpresenceofsignaltonegationofRX_LOS
SerialIDClockRate f_serial_clock 0 400 kHz
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Digital Diagnostic Interface and Serial IdentificationThe 2-wire serial interface is explicitly defined in theXFP MSA Rev 4.0. 2-wire timing specifications and thestructureofthememorymapareperXFPMSARev2.0.The normal 256 Byte I2C address space is divided intolower and upper blocks of 128 Bytes.The lower blockof128Bytes isalwaysdirectlyavailableandisusedfordiagnostic information providing the opportunity forPredictive Failure Identification, Compliance Predic-tion, Fault Isolation and Component Monitoring. Theupperaddressspacetablesareusedforlessfrequentlyaccessed functionssuchasserial ID,userwriteableEE-PROM, reserved EEPROM and diagnostics and controlspacesforfuturestandardsdefinition,aswellasAvagoTechnologies-specificfunctions.
Predictive Failure IdentificationThe diagnostic information allows the host system toidentifypotentiallinkproblems.Onceidentified,a“failover”techniquecanbeusedtoisolateandreplacesus-pectdevicesbeforesystemuptimeisimpacted.
Compliance PredictionThe real-timediagnosticparameterscanbemonitoredtoalertthesystemwhenoperatinglimitsareexceededandcompliancecannotbeensured.Asanexample,therealtimeaveragereceiveopticalpowercanbeusedtoassess the compliance of the cable plant and remotetransmitter.
Fault IsolationThe diagnostic information can allow the host to pin-pointthelocationofalinkproblemandacceleratesys-temservicingandminimizedowntime.
Component MonitoringAs part of host system qualification and verification,real time transceiver diagnostic information can becombinedwithsystemlevelmonitoringtoensureper-formance and operating environment are meeting ap-plicationrequirements.
Transceiver Module TemperatureThe transceiver module temperature represents themodule case temperature. It is a calibrated value fromaninternalPCBtemperaturemeasuredusingasensingcircuitry.
Transmitter Laser DC Bias CurrentLaser bias current is measured using sensing circuitrylocatedonthetransmitterlaserdriverIC.Normalvaria-tionsinlaserbiascurrentareexpectedtoaccommodatethe impact of changing transceiver temperature andsupply voltage operating points. The AFCT-721XPDZuses a closed loop laser bias feedback circuit to main-tain constant optical power over time at a given tem-perature. This circuit compensates for normal laserparametric variations in quantum efficiency, forwardvoltage and lasing threshold due to changing trans-ceiveroperatingpoints.
Transmitted Average Optical Output PowerVariations in average optical power are not expectedunder normal operation because the AFCT-721XPDZuses a closed loop laser bias feedback circuit to main-tain constant optical power. This circuit compensatesfornormal laserparametricvariationsduetochangingtransceiver operating points. Only under extreme laserbias conditions will significant drifting in transmittedaverageopticalpowerbeobservable.Thereforeitisrec-ommendedTxaverageopticalpowerbeused for faultisolation,ratherthanpredictivefailurepurposes.
Received Average Optical Input Power Received average optical power measurements are avaluableassetforinstallerstoverifycableplantcompli-ance.Driftsinaveragepowercanbeobservedfromthecableplantandremotetransmitterforpotentialpredic-tivefailureuse.Receivedaverageopticalpowercanbeusedforfaultisolation.
Auxiliary MonitorsThere are two auxiliary monitors implemented in theAFCT-721XPDZ.Oneisthe+3.3Vsupplyvoltagereport-edasAuxiliaryMeasurement2.TheotheristheModulePCB Temperature reported as Auxiliary Measurement1.AsthereisnoauxiliarytypedefinedforModulePCBTemperature, the auxiliary type for Laser Temperature(0100b)isusedinthiscase.
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Figure 4b. Module Drawing
Mechanical Specifications
Package Dimensions
Figure 4a. Module Drawing
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Figure 5. XFP host board mechanical layout
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Figure 6. XFP Assembly Drawing
Clip
Host Board
Heat Sink
Cage Assembly
Module
Bezel
EMI Gasket(not shown)
Connector
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Application SupportAn Evaluation Kit and Reference Designs are availabletoassistinevaluationoftheAFCT-721XPDZ.Pleasecon-tactyour localFieldSalesrepresentativeforavailabilityandorderingdetails.
Regulatory ComplianceThe transceiver Regulatory Compliance performanceis provided inTable 2 as a figure of merit to assist thedesigner.Theoverallequipmentdesignwilldeterminethecertificationlevel.
Electrostatic Discharge (ESD)There are two conditions in which immunity to ESDdamage is important. Table 2 documents the ESD im-munitytobothoftheseconditions.
Thefirstconditionisstaticdischargetothetransceiverduringhandlingsuchaswhenthetransceiverisinsert-edintothetransceiverport.Toprotectthetransceiver,itisimportanttousenormalESDhandlingprecautionsincludingtheuseofgroundedwriststraps,workbench-es,andfloormatsinESDcontrolledareas.TheESDsen-sitivityoftheAFCT-721XPDZiscompatiblewithtypicalindustryproductionenvironments.
Thesecondconditionisstaticdischargetotheexteriorofthehostequipmentchassisafterinstallation.Totheextent that the duplex LC optical interface is exposedtotheoutsideofthehostequipmentchassis,itmaybesubjecttosystem-levelESDrequirements.
The ESD performance of the AFCT-721XPDZ exceedstypicalindustrystandards.
Table 2. Regulatory Compliance
Feature Test Method Performance
ElectrostaticDischarge(ESD)totheexterioroftheXFPmodule
JEDECJESD22-A114-B 500Voltstothehighspeedpins,2000Voltstothelowspeedpins
ElectrostaticDischarge(ESD)totheDuplexLCReceptacle
VariationofIEC61000-4-2 Typically,nodamageoccurswith25kVwhentheduplexLCconnectorreceptacleiscon-tactedbyaHumanBodyModelprobe.
ElectrostaticDischarge(ESD)totheOpticalConnector
GR1089 10contactsof8KVontheelectricalfaceplatewithdeviceinsertedintoapanel.
ElectrostaticDischarge(ESD)totheOpticalConnector
VariationofIEC801-2 Airdischargeof15kV(min)contacttoconnectorw/odamage
ElectromagneticInterference(EMI)
FCCClassBCENELECEN55022ClassB(CISPR22A)VCCIClass1
Systemmarginsaredependentoncustomerboardandchassisdesign.
Immunity VariationofIEC61000-4-3 Lessthan0.5dBofRxsensitivitydegradationandlessthan10%marginre-ductionofTxmaskat10V/m,10MHZto1GHzw/ochassisenclosure
LaserEyeSafetyandEquipmentTypeTesting
USFDACDRHAELClass1US21CFR,SubchapterJperParagraphs1002.10and1002.12.
(IEC)EN60825-1:1994+A11+A2(IEC)EN60825-2:1994+A1(IEC)EN60950:1992+A1+A2+A3+A4+A11
CDRHaccession#951220TUVcertificate#R72071466
ComponentRecognition UnderwritersLaboratoriesandCanadianStandardsAssociationJointComponentRecognitionforInformationTechnologyEquipmentIncludingElectricalBusinessEquipment
ULfile#E173874
ImmunityThe transceivers have a shielded design to provide ex-cellent immunity to radio-frequency electromagneticfieldswhichmaybepresentinsomeoperatingenviron-ments.
Electromagnetic Interference (EMI)Most equipment designs using the AFCT-721XPDZ aresubject to the requirements of the FCC in the UnitedStates,CENELECEN55022(CISPR22)inEuropeandVCCIinJapan.ThemetalhousingandshieldeddesignoftheAFCT-721XPDZ minimizes EMI and provides excellentEMIperformance.
Eye SafetyThe AFCT-721XPDZ transceivers provide Class 1 eyesafety by design. Avago Technologies has tested thetransceiver design for regulatory compliance, undernormal operating conditions and under single faultconditions.SeeTable2.
FlammabilityTheAFCT-721XPDZiscomplianttoUL94V-0.
CautionThe AFCT-721XPDZ contains no user serviceable parts.Tampering with or modifying the performance ofthe AFCT-721XPDZ will result in voided product war-ranty. It may also result in improper operation of theAFCT-721XPDZ circuitry, and possible overstress ofthe laser source. Device degradation or product fail-ure may result. Connection of the AFCT-721XPDZ toa non-approved optical source, operating above therecommended absolute maximum conditions may beconsidered an act of modifying or manufacturing alaser product. The person(s) performing such an actis required by law to recertify and reidentify the laserproductunder theprovisionsofU.S.21CFR (Subchap-terJ)andtheTUV.
Ordering InformationPleasecontactyour localfieldsalesengineeroroneofAvago Technologies franchised distributors for order-ing information. For technical information,pleasevisitAvagoTechnologies’WEBpageatwww.avagotech.comor contact Avago Technologies Semiconductor Prod-uctsCustomerResponseCenterat1-800-235-0312.Forinformation related to XFP MSA documentation visitwww.xfpmsa.org
For product information and a complete list of distributors, please go to our web site: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.Data subject to change. Copyright © 2005-2008 Avago Technologies. All rights reserved. AV02-1080EN - November 26, 2008