BAT165A · BAT165A AoSoCnw((57(RccCnIetECoEoCroh Nexperia BAT165A 40 V, 0.75 A medium power...

BAT165A40 V, 0.75 A medium power Schottky barrier rectifier2 May 2016 Product data sheet

1. General descriptionMedium power Schottky barrier rectifier with an integrated guard ring for stressprotection, encapsulated in a very small SOD323 (SC-76) Surface-Mounted Device(SMD) plastic package.

2. Features and benefits• Forward current: IF ≤ 0.75 A• Reverse voltage: VR ≤ 40 V• Low forward voltage typ. VF = 640 mV• Low reverse current typ. IR = 1.5 µA• Very small SMD plastic package• AEC-Q101 qualified

3. Applications• Low voltage rectification• High efficiency DC-to-DC conversion• Switch mode power supply• Reverse polarity protection• Low power consumption application• Automotive applications

Table 1. Quick reference dataSymbol Parameter Conditions Min Typ Max Unit

IF forward current Tsp ≤ 93 °C; δ = 1 - - 0.75 A

VR reverse voltage Tj = 25 °C - - 40 V

VF forward voltage IF = 750 mA; tp ≤ 300 µs; δ ≤ 0.02 ;Tj = 25 °C

- 640 740 mV

VR = 40 V; pulsed; Tj = 25 °C - 1.5 8 µAIR reverse current

VR = 40 V; pulsed; Tj = 65 °C - 30 900 µA

© Nexperia B.V. 2017. All rights reserved

Nexperia BAT165A40 V, 0.75 A medium power Schottky barrier rectifier

BAT165A All information provided in this document is subject to legal disclaimers.

Product data sheet 2 May 2016 2 / 13

4. Pinning informationTable 2. Pinning informationPin Symbol Description Simplified outline Graphic symbol

1 K cathode

2 A anode

21

SOD323sym001

1 2

5. Ordering informationTable 3. Ordering information

PackageType number

Name Description Version

BAT165A SOD323 plastic surface-mounted package; 2 leads SOD323

6. MarkingTable 4. Marking codesType number Marking code

BAT165A 2G

7. Limiting valuesTable 5. Limiting valuesIn accordance with the Absolute Maximum Rating System (IEC 60134).Symbol Parameter Conditions Min Max Unit

VR reverse voltage Tj = 25 °C - 40 V

IF forward current Tsp ≤ 93 °C; δ = 1 - 0.75 A

IF(AV) average forward current 50 Hz ≤ f ≤ 60 Hz; Tamb ≤ 93 °C; pulsedsinusoidal

- 0.5 A

IFSM non-repetitive peak forwardcurrent

tp = 8 ms; Tj(init) = 25 °C; square wave - 8 A

[1] - 380 mWPtot total power dissipation Tamb ≤ 25 °C

[2] - 555 mW

Tj junction temperature - 150 °C

Tamb ambient temperature -55 150 °C

Tstg storage temperature -65 150 °C

[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.[2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2.





8. Thermal characteristicsTable 6. Thermal characteristicsSymbol Parameter Conditions Min Typ Max Unit

[1][2] - - 330 K/WRth(j-a) thermal resistancefrom junction toambient

in free air

[1][3] - - 225 K/W

Rth(j-sp) thermal resistancefrom junction to solderpoint

[4] - - 45 K/W

[1] For Schottky barrier diodes thermal runaway has to be considered, as in some applications the reversepower losses PR are a significant part of the total power losses.

[2] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.[3] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2.[4] Soldering point of cathode tab.

aaa-022350

10-5 1010-210-4 10210-1tp (s)

10-3 1031

102

10

103

Zth(j-a)(K/W)

1

duty cycle = 1

0.750.5

0.330.25

0.2

0.1

0.05

0.02 0.01

0

FR4 PCB, standard footprint

Fig. 1. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values





aaa-022351

10-5 1010-210-4 10210-1tp (s)

10-3 1031

102

10

103

Zth(j-a)(K/W)

1

duty cycle = 1

0.750.5

0.330.25

0.2

0.10.05

0.02 0.01

0

FR4 PCB, mounting pad for cathode 1 cm2

Fig. 2. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values

9. CharacteristicsTable 7. CharacteristicsSymbol Parameter Conditions Min Typ Max Unit

V(BR)R reverse breakdownvoltage

IR = 1 mA; tp ≤ 300 µs; δ ≤ 0.02;Tj = 25 °C; pulsed

40 - - V

IF = 10 mA; tp ≤ 300 µs; δ ≤ 0.02 ;Tj = 25 °C

- 300 380 mV

IF = 100 mA; tp ≤ 300 µs; δ ≤ 0.02 ;Tj = 25 °C

- 390 470 mV

IF = 250 mA; tp ≤ 300 µs; δ ≤ 0.02 ;Tj = 25 °C

- 455 540 mV

IF = 500 mA; tp ≤ 300 µs; δ ≤ 0.02 ;Tj = 25 °C

- 550 640 mV

VF forward voltage

IF = 750 mA; tp ≤ 300 µs; δ ≤ 0.02 ;Tj = 25 °C

- 640 740 mV

VR = 30 V; pulsed; Tj = 25 °C - 1 5 µA

VR = 40 V; pulsed; Tj = 25 °C - 1.5 8 µA

VR = 40 V; pulsed; Tj = 65 °C - 30 900 µA

VR = 5 V; pulsed; Tj = 125 °C - 290 700 µA

IR reverse current

VR = 40 V; pulsed; Tj = 125 °C - 1 8 mA

Cd diode capacitance VR = 10 V; f = 1 MHz; Tj = 25 °C - 9 12 pF





aaa-022352

10-3

10-2

10-1

1

IF(A)

10-4

VF (V)0.0 0.80.60.2 0.4

(1)

(2)

(3)

(4)

(5)

pulsed condition(1) Tj = 150 °C(2) Tj = 125 °C(3) Tj = 85 °C(4) Tj = 25 °C(5) Tj = -40 °C

Fig. 3. Forward current as a function of forwardvoltage; typical values

aaa-02235310-2

10-3

10-4

10-5

10-6

10-7

10-8

10-9

10-10

IR(A)

10-11

VR (V)0 403010 20

(1)

(2)

(3)

(4)

(5)

(6)

pulsed condition(1) Tj = 150 °C(2) Tj = 125 °C(3) Tj = 85 °C(4) Tj = 65 °C(5) Tj = 25 °C(6) Tj = −40 °C

Fig. 4. Reverse current as a function of reversevoltage; typical values

VR (V)0 403010 20

aaa-022354

20

30

10

40

50Cd

(pF)

0

f = 1 MHz; Tamb = 25 °C

Fig. 5. Diode capacitance as a function of reversevoltage; typical values

IF(AV) (A)0 0.80.60.2 0.4

aaa-022355

0.2

0.3

0.1

0.4

0.5PF(AV)

(W)

0

(1)

(2)

Tj = 150 °C(1) δ = 0.5 sinusoidal(2) δ = 1

Fig. 6. Average forward power dissipation as afunction of average forward current; typicalvalues





VR (V)0 403010 20

aaa-022356

0.02

0.01

0.03

0.04

PR(AV)(W)

0

(1)

(2)

(3)

(4)

Tj = 125 °C(1) δ = 1; DC(2) δ = 0.9; f = 20 kHz(3) δ = 0.8; f = 20 kHz(4) δ = 0.5; f = 20 kHz

Fig. 7. Average reverse power dissipation as afunction of reverse voltage; typical values

Tamb (°C)17512525 150100500 75

aaa-022357

0.4

0.2

0.6

0.8

IF(AV)(A)

0

(1)

(2)

FR4 PCB, standard footprintTj = 150 °C(1) δ = 1; DC(2) δ = 0.5; f = 50 Hz/60 Hz; pulsed sinusoidal

Fig. 8. Average forward current as a function ofambient temperature; typical values

Tamb (°C)17512525 150100500 75

aaa-022358

0.4

0.2

0.6

0.8

IF(AV)(A)

0

(1)

(2)

FR4 PCB, mounting pad for cathode 1 cm2

Tj = 150 °C(1) δ = 1; DC(2) δ = 0.5; f = 50 Hz/60 Hz; pulsed sinusoidal

Fig. 9. Average forward current as a function ofambient temperature; typical values

Tsp (°C)17512525 150100500 75

aaa-022359

0.4

0.2

0.6

0.8

IF(AV)(A)

0

(1)

(2)

Tj = 150 °C(1) δ = 1; DC(2) δ = 0.5; f = 50 Hz/60 Hz; pulsed sinusoidal

Fig. 10. Average forward current as a function of solderpoint temperature; typical values





10. Test information

tptcy

IM

taaa-022900

duty cycle δ =

tp

tcy

Fig. 11. Duty cycle definition: sinusoidal

The current ratings for the sinusoidal waveforms are calculated according to theequations: IF(AV) = IM × 0.3183 with IM defined as peak current, IRMS = IF(AV) at DC, andIRMS = IM × √(δ/2) with IRMS defined as RMS current.

tptcy

P

t006aac658

duty cycle δ =

tp

tcy

Fig. 12. Duty cycle definition: square wave

10.1 Quality informationThis product has been qualified in accordance with the Automotive Electronics Council(AEC) standard Q101 - Stress test qualification for discrete semiconductors, and issuitable for use in automotive applications.





11. Package outline

03-12-17Dimensions in mm

0.250.10

0.450.15

2.72.3

1.81.6

0.400.25

1.10.8

1.351.15

1

2

Fig. 13. Package outline SOD323

12. Soldering

0.951.65

2.2

2.1

3.05

solder lands

solder resist

occupied area

solder paste

0.5(2×)0.6(2×)

0.6 (2×)0.5 (2×)

sod323_fr

Dimensions in mm

Fig. 14. Reflow soldering footprint for SOD323





1.5 (2×)

2.9

5

1.2(2×)2.75

sod323_fw

solder lands

solder resist

occupied area

preferred transportdirection during soldering

Dimensions in mm

Fig. 15. Wave soldering footprint for SOD323





13. Revision historyTable 8. Revision historyData sheet ID Release date Data sheet status Change notice Supersedes

BAT165A v.1 20160502 Product data sheet - -





14. Legal information

14.1 Data sheet statusDocumentstatus [1][2]

Productstatus [3]

Definition

Objective[short] datasheet

Development This document contains data fromthe objective specification for productdevelopment.

Preliminary[short] datasheet

Qualification This document contains data from thepreliminary specification.

Product[short] datasheet

Production This document contains the productspecification.

[1] Please consult the most recently issued document before initiating orcompleting a design.

[2] The term 'short data sheet' is explained in section "Definitions".[3] The product status of device(s) described in this document may have

changed since this document was published and may differ in case ofmultiple devices. The latest product status information is available onthe Internet at URL http://www.nexperia.com.

14.2 DefinitionsPreview — The document is a preview version only. The document is stillsubject to formal approval, which may result in modifications or additions.Nexperia does not give any representations or warranties as tothe accuracy or completeness of information included herein and shall haveno liability for the consequences of use of such information.

Draft — The document is a draft version only. The content is still underinternal review and subject to formal approval, which may result inmodifications or additions. Nexperia does not give anyrepresentations or warranties as to the accuracy or completeness ofinformation included herein and shall have no liability for the consequencesof use of such information.

Short data sheet — A short data sheet is an extract from a full data sheetwith the same product type number(s) and title. A short data sheet isintended for quick reference only and should not be relied upon to containdetailed and full information. For detailed and full information see therelevant full data sheet, which is available on request via the local Nexperiasales office. In case of any inconsistency or conflict with theshort data sheet, the full data sheet shall prevail.

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Quick reference data — The Quick reference data is an extract of theproduct data given in the Limiting values and Characteristics sections of thisdocument, and as such is not complete, exhaustive or legally binding.

Applications — Applications that are described herein for any of theseproducts are for illustrative purposes only. Nexperia makes norepresentation or warranty that such applications will be suitable for thespecified use without further testing or modification.

Customers are responsible for the design and operation of theirapplications and products using Nexperia products, and Nexperiaaccepts no liability for any assistance with applications orcustomer product design. It is customer’s sole responsibility to determinewhether the Nexperia product is suitable and fit for thecustomer’s applications and products planned, as well as for the plannedapplication and use of customer’s third party customer(s). Customers shouldprovide appropriate design and operating safeguards to minimize the risksassociated with their applications and products.

Nexperia does not accept any liability related to any default,damage, costs or problem which is based on any weakness or defaultin the customer’s applications or products, or the application or use bycustomer’s third party customer(s). Customer is responsible for doing allnecessary testing for the customer’s applications and products using Nexperiaproducts in order to avoid a default of the applicationsand the products or of the application or use by customer’s third partycustomer(s). Nexperia does not accept any liability in this respect.

Limiting values — Stress above one or more limiting values (as defined inthe Absolute Maximum Ratings System of IEC 60134) will cause permanentdamage to the device. Limiting values are stress ratings only and (proper)operation of the device at these or any other conditions above thosegiven in the Recommended operating conditions section (if present) or theCharacteristics sections of this document is not warranted. Constant orrepeated exposure to limiting values will permanently and irreversibly affectthe quality and reliability of the device.

Terms and conditions of commercial sale — Nexperiaproducts are sold subject to the general terms and conditions of commercialsale, as published at http://www.nexperia.com/profile/terms, unless otherwiseagreed in a valid written individual agreement. In case an individualagreement is concluded only the terms and conditions of the respectiveagreement shall apply. Nexperia hereby expressly objects toapplying the customer’s general terms and conditions with regard to thepurchase of Nexperia products by customer.

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Export control — This document as well as the item(s) described hereinmay be subject to export control regulations. Export might require a priorauthorization from competent authorities.

Translations — A non-English (translated) version of a document is forreference only. The English version shall prevail in case of any discrepancybetween the translated and English versions.

14.4 TrademarksNotice: All referenced brands, product names, service names andtrademarks are the property of their respective owners.





15. Contents1 General description ............................................... 12 Features and benefits ............................................13 Applications ........................................................... 14 Pinning information ...............................................25 Ordering information .............................................26 Marking ................................................................... 27 Limiting values .......................................................28 Thermal characteristics .........................................39 Characteristics .......................................................410 Test information ..................................................... 710.1 Quality information ............................................... 711 Package outline ..................................................... 812 Soldering ................................................................ 813 Revision history ...................................................1014 Legal information .................................................1114.1 Data sheet status ............................................... 1114.2 Definitions ...........................................................1114.3 Disclaimers .........................................................1114.4 Trademarks ........................................................ 12

© Nexperia B.V. 2017. All rights reservedFor more information, please visit: http://www.nexperia.comFor sales office addresses, please send an email to: [email protected] Date of release: 02 May 2016

BAT165A · BAT165A AoSoCnw((57(RccCnIetECoEoCroh Nexperia BAT165A 40 V, 0.75 A medium power...

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