Post on 11-Feb-2017
Preparación dispersiones
Normativa en Impresión Electrónica
Rakel Herrero www.cemitec.com
PRESENTE Y FUTURO DE LA IMPRESIÓN FUNCIONAL
Preparación dispersiones
ELECTRÓNICA IMPRESA
¿Qué es la electrónica impresa?
� Conjunto de técnicas de impresión.
� Técnicas tradicionales de artes gráficas� Flexografía, Inkjet, Serigrafía…
� Producto final: Dispositivos electrónicos� Tintas funcionales
� Resistencias, condensadores, iluminación…
Preparación dispersiones
Electrónica Impresa
Flexibilidad
Técnicas Consolidadas
Bajo coste
Bajo consumo energético
¿Qué ventajas tiene la electrónica impresa?
ELECTRÓNICA IMPRESA
Preparación dispersiones
FlexografíaFlexografíaFlexografíaFlexografía
R2R
S2STintas dieléctricas
VALIDACIÓNVALIDACIÓNVALIDACIÓNVALIDACIÓN
PLATAPLATAPLATAPLATA
FLAKESFLAKESFLAKESFLAKES
OLED
Preparación dispersiones
QUE HAY?
Preparación dispersiones
IPC PRINTED ELECTRONICS INITIATIVE
Preparación dispersiones
IPC PRINTED ELECTRONICS INITIATIVE
Preparación dispersiones
IPC PRINTED ELECTRONICS INITIATIVE
Preparación dispersiones
IPC PRINTED ELECTRONICS INITIATIVE
Preparación dispersiones
QUE HAY?
Preparación dispersiones
JEITA Japan Electronics and Information Technologies Association
Preparación dispersiones
QUE HAY?
Preparación dispersiones
IEC-TC 119
Preparación dispersiones
IEC-TC 119 WG-1 TERMINOLOGY
• Objetivo: Producir terminología para el campo de la electrónica impresa
• Miembros: 20 Miembros • Documentos de trabajo: 0
Preparación dispersiones
IEC-TC 119 WG-2 MATERIALS
• Objetivo: – Desarrollar métodos de medida y evaluación
para materiales como sustratos, tintas y otros materiales de PE.
– Analizar la efectividad de métodos existentes para PE
– Definir términos específicos, requerimientos y especificaciones para materiales de PE
• Miembros: 58 Miembros• Documentos de trabajo: 8 documentos
Preparación dispersiones
IEC-TC 119 WG-2 MATERIALS
Document number Title of document Summary
IEC 62899-20x-Part204PRINTED ELECTRONICS – Part 204: Materials -
Insulator ink
This part of the IEC 62899 defines terms, and specifies standard methods
for characterisation and evaluation of insulator inks and insulator layer
that is made from
insulator inks used for printed electronics
119/46/NPPrinted electronics - Materials - Part 10-100:
Silver wire ink (film resistance)
Provides a standardized method to evaluate the electrical performance of
transparent conductive films of networked Ag nanowires
119/73/NP
PRINTED ELECTRONICS — Part 202-3: MATERIALS
— Conductive ink —Measurement of sheet
resistance of conductive films (non-contact style)
This International Standard defines terms, and specifies a standard
method for measurement of sheet resistance of printed conductive films
using a noncontact eddy current method.
119/90/CDIEC 62899-203 Ed.1: Printed Electronics - Part 203:
Materials - Semiconductor ink
This International Standard defines terms, and specifies standard
methods for characterisation and evaluation. It is applicable to
semiconductor inks and semiconducting layers
that are made from semiconductor inks.
119/87/FDISIEC 62899-201 Ed.1: Printed electronics – Part 201:
Materials – Substrates
This part of IEC 62899 defines the terms and specifies the evaluation
method for substrates used in the printing process to form electronic
components/devices. This international standard is also applied to the
substrates which make surface treatment in order to improve their
performance
119/88/FDISIEC 62899-202 Ed.1: Printed electronics – Part 202:
Materials – Conductive ink
This part defines the terms and specifies the standard methods for
characterisation and evaluation. It is applicable to conductive inks and
conductive layer that are
made from conductive inks
119/103/NP
Printed electronics — Part 202-1: Materials —
Measurement method of dispersion property in
silver ink
This International Standard provides a standardized method to evaluate
the dispersion property of silver ink. The method described in this
document offers a measurement method of dispersion property of silver
ink solution keeping the original concentration
119/104/DTR
IEC/TR 62899-250 Ed.1: Material technologies
required in Printed Electronics for Wearable
Smart Devices
This Technical Report (TR) explores a new technological field to establish
standardization activities in TC119 (Printed Electronics) particularly, and
to contribute in Wearable Smart Devices (WSD) technology development
and market expansion.
Preparación dispersiones
IEC-TC 119 WG-3 EQUIPMENT
• Objetivo: Estandarización de equipos de impresión y recubrimiento, herramientas, sub-unidades y partes para producción de PE
• Miembros: 38 Miembros• Documentos de trabajo: 6 documentos
Preparación dispersiones
IEC-TC 119 WG-3 EQUIPMENTDocument number Title of document Summary
119/64/CDIEC 62904 Ed.1: Printed electronics - Equipment - Inkjet - Measurement method of jetting spedd
Provides the method for determining inkjet jetting speed based on visualized droplet images obtained by the drop visualization system.
119/68/NPPrinted Electronics - Equipment - Inkjet-head - Measurement method of drop volume
This specif ies the method for determining inkjet drop volume based on visualized droplet images obtained by drop visualization systems
119/82/CDVIEC 62899-301-1 Ed.1: Printed Electronics - Part 301-1: Equipment - Contact printing - Rigid master - Measurement method of plate master external dimension
This document def ines measurement terms and methods related to the external dimension of a rigid plate master.
119/83/CDVIEC 62899-301-2 Ed.1: Printed Electronics - Part 301-2: Equipment - Contact printing - Rigid master - Measurement method of plate master pattern dimension
This document def ines measurement terms and methods related to the critical dimension of features and the registration accuracy of features on rigid plate master.
119/98A/CDVIEC 62899-302-1: Printed electronics - Part 302-1: Equipment – Inkjet - Imaging based measurement of jetting speed
This International Standard specif ies the method for determining inkjet drop speed based on visualized droplet images obtained by a drop analysis system. This measurement standardization is limited to drop on demand type of inkjet and may not applicable to continuous inkjet. It includes the test process, image processing softw are algorithm, and analysis of jetting behavior
119/109/NPPrinted Electronics - Part 303-1: Equipment - Roll-to-roll printing - Mechanical dimensions of roll-to-roll printing equipment
This international standard defines the mechanical dimensions related to the printing equipement especially for roll-to-roll printing equipment. Although 'Printed Electronics' is getting popular, and the requrement of having printing equipment for this applicaion is increasing accordingly, because of the nature of printed electronics, unlike conventional printers for conventional printed matter, such as printed paper, that has w ell defined output matters, w hich is called paper, that mechanical dimensions are defined by ISO standards,equipment for printed electronics does not have any standard for its mechanical dimensions or output dimensions. Unlike printed paper, printed electronics is not stuitable to have standard output size, because printed electronic may have any shapes. For equipment suppiliers, lack of standardmechanical dimensions causes lots of trouble. The purpose of this standard is going to define the mechanical dimensions that quipment may follow
Preparación dispersiones
IEC-TC 119 WG-4 PRINTABILITY
• Objetivo: Las mediciones o los requisitos tantode las cualidades de los patrones impresoscomo la reproducibilidad de los diseños dedebido a la interacción de medios de impresión,tintas, sustratos, y las condiciones ambientales.Los medios de impresión incluyen las partesinvolucradas en el proceso de impresión, talescomo placa, cliché, manta, la boquilla, etc., conexclusión de tintas y sustratos.
• Miembros: 42 Miembros• Documentos de trabajo: 5 documentos
Preparación dispersiones
IEC-TC 119 WG-4 PRINTABILITY
Document number Title of document Scope
119/106/NP
IEC 62899-402-2: Printed Electronics – Part 402-2:
Printability - Measurement of qualities -
Edge waviness
This International Standard specifies the measurement method of the edge waviness of the
printed
patterns in printed electronics.
119/75/CDV
IEC 62899-402-1 Ed.1: Printed Electronics – Part 402-
1: Printability -Measurement of Qualities –
Pattern width
This International Standard specifies the measurement methods of the widths of the printed
patterns in printed electronics. They are treated as two dimensional on a substrate. When the
patterns are definitely affected by three dimensional configurations,these are specified in
measurement methods for thickness in printed electronics
119/76/CDIEC 62899-401 Ed.1: Printed Electronics - Part 401:
Printability – Guideline
This part of IEC 62899 specifies guideline concerned with the measurements and the
requirements for the printability in the printed electronics.
119/99A/CDVIEC 62899-401 Ed.1: Printed Electronics - Part 401:
Printability - Overview
This part of IEC 62899 provides an introduction to the rest of the IEC 62899-400 subseries and
explains its modular structure. It specifies the measurements and the requirements of both
the qualities and the reproducibility of printed patterns as the result of the interaction of
printing media, inks, substrate, and environmental conditions
119/92/NP
Future IEC 62899-403-1: Printed Electronics - Part
403-1: Printability - Requirments for
reproducibility - Basic patterns for evaluation of
printing machine
This part specifies commonly-utilized basic designed patterns to evaluate printing machines
by the reproducibility of the patterns from the view point of the printability in the field of
printed electronics. These basic patterns are consisting of several evaluation patterns and
register marks.
Preparación dispersiones
IEC-TC 119 WG-5 QUALITY ASSESMENT
• Objetivo: Definir métodos de ensayo yprocedimientos para las medidas de parámetrosespecíficos en diversos productos. Evaluaciónde ciclo de vida y pruebas de fiabilidad decomponentes o productos electrónicos impresosy/o flexibles
• Miembros: 28 Miembros• Documentos de trabajo: 3 documentos
Preparación dispersiones
IEC-TC 119 WG-5 QUALITY ASSESMENT
119/71/CD
IEC 62899-502-1 Ed.1: Printed Electronics - Part 502-1: Quality
assessment -OLED elements -Mechanical stress testing of OLED
elements formed on flexible substrates
This part of IEC 62899-502 specifies mechanical stress test methods
for reliability assessment . There are applicable to flexible OLED
(Organic light emitting diode)
elements formed on flexible substrates by printed electronics
technology
119/86/NP
IEC 62899-503: Printed Electronics – Part 503 : Quality Assessment –
Test method for the channel properties of the printed thin-film
transistor
This document first describes an evaluation protocol for channel
charge trapping and channel capacitance to test the function of fully
printed thin film transistors (TFTs) and describes a method for
characterizing fully printed TFTs including measurement techniques
and testing conditions
119/105/CDV
IEC 62899-502-1 Ed.1: Printed Electronics – Part 502-1 Quality
assessment – OLED elements -Mechanical stress testing of OLED
elements formed on flexible substrates
This part of IEC 62899 specifies quality assessment methods,
especially mechanical stress test methods, for reliability
assessment.It is applicable to flexible OLED (Organic light emitting
diode) elements formed on flexible substrates by printed
electronics technology.
IEC 62899-501-1 ED. 1 Printed Electronics – Quality assessment – Part
501-1: Failure modes and mechanical testing – Flexible and/or
bendable primary or secondary cells
This standard specifies failure modes and mechanical stress test
methods for the determination of reliability characteristics of
bendable and/or flexible printed primary cells and secondary cells
and batteries as defined in IEC 60050, IEV ref. 482-01-01, -02, -03, -04
and -05, respectively.
Preparación dispersiones
IEC-TC 119 OBJETIVOS ESTRATEGICOS
Preparación dispersiones
IEC-TC 119 OBJETIVOS ESTRATEGICOS
Preparación dispersiones
Normativa en Impresión Electrónica
Rakel Herrero www.cemitec.com
PRESENTE Y FUTURO DE LA IMPRESIÓN FUNCIONAL