SS16-D

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© Semiconductor Components Industries, LLC, 2001

August, 2001 – Rev. 1

1 Publication Order Number:

SS16/D

SS16

Surface MountSchottky Power Rectifier

SMA Power Surface Mount Package. . . employing the Schottky Barrier principle in a large area

metal–to–silicon power diode. State of the art geometry features

epitaxial construction with oxide passivation and metal overlay

contact. Ideally suited for low voltage, high frequency rectification, or

as free wheeling and polarity diodes in surface mount applications

where compact size and weight are critical to the system.

• Small Compact Surface Mountable Package with J–Bent Leads

• Rectangular Package for Automated Handling

• Highly Stable Oxide Passivated Junction

• Very Low Forward Voltage Drop

• Guardring for Stress Protection

Mechanical Characteristics:

• Case: Epoxy, Molded

• Weight: 70 mg (approximately)

• Finish: All External Surfaces Corrosion Resistant and Terminal

Leads are Readily Solderable

• Lead and Mounting Surface Temperature for Soldering Purposes:

260°C Max. for 10 Seconds

• Shipped in 12 mm tape, 5000 units per 13 inch reel

• Polarity: Cathode Lead Indicated by Polarity Band

• ESD Ratings: Machine Model = C

ESD Ratings: Human Body Model = 3B

• Marking: SS16

MAXIMUM RATINGS

Rating Symbol Value Unit

Peak Repetitive Reverse Voltage

Working Peak Reverse Voltage

DC Blocking Voltage

VRRM

VRWM

VR

60 V

Average Rectified Forward Current

(At Rated VR, TC = 105°C)

IO 1.0 A

Non–Repetitive Peak Surge Current

(Surge Applied at Rated Load

Conditions Halfwave, Single

Phase, 60 Hz)

IFSM 30 A

Storage/Operating Case

Temperature

Tstg, TC –55 to +150 °C

Operating Junction Temperature TJ –55 to +125 °C

Voltage Rate of Change

(Rated VR, TJ = 25°C)

dv/dt 10,000 V/ ms

Device Package Shipping

ORDERING INFORMATION

http://onsemi.com

SS16 SMA 5000/Tape & Reel

SCHOTTKY BARRIERRECTIFIER

1.0 AMPERES60 VOLTS

MARKING DIAGRAM

SS16 = Device Code

SMA

CASE 403D

PLASTIC

SS16

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THERMAL CHARACTERISTICS

Characteristic Symbol Value Unit

Thermal Resistance – Junction–to–Lead (Note 1.)

Thermal Resistance – Junction–to–Ambient (Note 1.)

RθJL

RθJA

35

86

°C/W

ELECTRICAL CHARACTERISTICS

Maximum Instantaneous Forward Volta e Note 2.VF TJ = 25°C TJ = 125°C Volts

.

(IF = 1.0 A) 0.510 0.475

Maximum Instantaneous Reverse CurrentIR TJ = 25°C TJ = 125°C mA

(VR = 60 V) 0.2 10

1. Mounted on 2″ Square PC Board with 1″ Square Total Pad Size, PC Board FR4.2. Pulse Test: Pulse Width ≤ 250 µs, Duty Cycle ≤ 2.0%.

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Figure 1. Typical Forward Voltage

0.1 0.3 0.4 0.70.2 0.5

10

0.1

1

I F , I N S T A N

T A N E O U S F O R W A R D

C U R R E N T ( A M P S )

VF, INSTANTANEOUS FORWARD VOLTAGE (VOLTS)

Figure 2. Maximum Forward Voltage

0.1 0.80.4 0.60.3 0.5

10

0.1

1

VF, INSTANTANEOUS FORWARD VOLTAGE (VOLTS)

I F , I N S T A N

T A N E O U S F O R W A R D

C U R R E N T ( A M P S )

Figure 3. Typical Reverse Current

10 300 20 40

1E–05

1E–04

I R , I N S T A N T A N E O U S R E V E R S E

V O L T A G E ( V )

VR, REVERSE VOLTAGE (VOLTS)

Figure 4. Typical Capacitance

75°C

25°C

1E–03

1E–02

125°C

75°C

25°C

10 30 700 20 4020

30 C , C A P A C I T A N C E ( p F )

VR, REVERSE VOLTAGE (VOLTS)

40

50

1E–06

0.6 0.8

125°C

6050 50 60

60

70

80

Figure 5. Current Derating – Junction–to–Lead

20 600 40 80

0.8

TL, LEAD TEMPERATURE (°C)

Figure 6. Forward Power Dissipation

1.2

1.6

1.8

SQUARE WAVE

dc

0.2 0.6 1.80 0.4 0.80

0.1

P F O , A V E R A G E P O W E R D I S S I P A T I O N ( W )

IO, AVERAGE FORWARD CURRENT (AMPS)

0.2

0.4

120100 160 1 1.2

0.5

0.8

0.9

I F , A V

E R A G E F O R W A R D C U R R E N T ( A )

75°C

25°C125°C

0.2 0.7

25°C

1.4

1

0.6

140

0.4

0.2

01.4 1.6

0.3

0.6

0.7

SQUARE WAVE

dc

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PACKAGE DIMENSIONS

SMAPLASTIC PACKAGE

CASE 403D–01ISSUE O

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.2. CONTROLLING DIMENSION: INCH.

S

A

D B

K J

C

H

DIM MIN MAX MIN MAX

MILLIMETERSINCHES

A 0.160 0 .180 4. 06 4.57

B 0.090 0. 115 2 .29 2.92

C 0.075 0 .105 1. 91 2.67

D 0.050 0 .064 1. 27 1.63

H 0.004 0 .008 0. 10 0.20

J 0.006 0 .016 0. 15 0.41

K 0.030 0 .060 0. 76 1.52

S 0.190 0 .220 4. 83 5.59

MINIMUM SOLDER PAD SIZES

mm

inches

0.157

4.0

0.0787

2.0

0.0787

2.0

ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changeswithout further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particularpurpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability,including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/orspecifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must bevalidated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others.SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applicationsintended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury ordeath may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold

SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonableattorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claimalleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer.

PUBLICATION ORDERING INFORMATION

JAPAN: ON Semiconductor, Japan Customer Focus Center4–32–1 Nishi–Gotanda, Shinagawa–ku, Tokyo, Japan 141–0031Phone: 81–3–5740–2700Email: [email protected]

ON Semiconductor Website: http://onsemi.com

For additional information, please contact your localSales Representative.

SS16/D

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