Semiconductor Key Environment Performance … Key Environment Performance Indicators . ... are the...

Semiconductor Key Environment Performance Indicators Guidance

International SEMATECH Manufacturing Initiative Technology Transfer #09125069A-ENG

© 2009 International SEMATECH Manufacturing Initiative, Inc.

Advanced Materials Research Center, AMRC, International SEMATECH Manufacturing Initiative, and ISMI are servicemarks of SEMATECH, Inc. SEMATECH and the SEMATECH logo are registered servicemarks

of SEMATECH, Inc. All other servicemarks and trademarks are the property of their respective owners.

Semiconductor Key Environment Performance Indicators Guidance Technology Transfer #09125069A-ENG

International SEMATECH Manufacturing Initiative December 18, 2009

Abstract: This report from the ESHI004 project describes a set of Key Environmental Performance Indicators (KEPIs) that quantitatively measures the environmental impact of semiconductor products. The KEPIs capture global warming, water use, chemical use, and waste generation impacts. When applied, they will provide the industry with a consistent set of product key environmental performance indicators.

Keywords: Chemicals; Environment, Safety, and Health; Materials; Global Climate Change; Waste Management; Water

Authors: Laurie Beu – Laurie S. Beu Consulting, Martha Montemayor-Rapier – Engineering Services

Approvals: Steve Trammell, Project Manager Ron Remke, Program Manager Joe Draina, Director Laurie Modrey, Technology Transfer Team Leader

iii

ISMI Technology Transfer #09125069A-ENG

Table of Contents

1 EXECUTIVE SUMMARY .....................................................................................................1

2 INTRODUCTION...................................................................................................................1 2.1 Definitions.......................................................................................................................4

3 GLOBAL WARMING IMPACT.............................................................................................4 3.1 Relevance ........................................................................................................................4 3.2 Emissions Definitions .....................................................................................................5 3.3 Compilation.....................................................................................................................6

3.3.1 KEPI Category – Direct GHG Emissions ...........................................................6 3.3.2 KEPI Category – Indirect GHG Emissions From Purchased Energy .................7

3.4 References .......................................................................................................................7

4 WATER RESOURCES............................................................................................................8 4.1 Relevance ........................................................................................................................8 4.2 Definitions.......................................................................................................................8 4.3 Compilation.....................................................................................................................9

4.3.1 KEPI Category – Total Input Water....................................................................9 4.3.2 KEPI Category – Total Recycled/Reused Water ..............................................10 4.3.3 KEPI Category – Total Wastewater Discharge.................................................10

4.4 References .....................................................................................................................11

5 CHEMICALS........................................................................................................................11 5.1 Relevance ......................................................................................................................11 5.2 Definitions.....................................................................................................................11 5.3 Compilation...................................................................................................................12

6 WASTE..................................................................................................................................12 6.1 Relevance ......................................................................................................................12 6.2 Definitions.....................................................................................................................13 6.3 Compilation...................................................................................................................17 6.4 References .....................................................................................................................18

7 NORMALIZATION FACTOR AND KEPI REPORTING ...................................................18 7.1 Relevance ......................................................................................................................18 7.2 Definitions.....................................................................................................................20 7.3 Compilation...................................................................................................................20 7.4 References .....................................................................................................................22

iv

Technology Transfer #09125069A-ENG ISMI

List of Figures

Figure 1 Fab KEPI Calculations .............................................................................................19

Figure 2 A/T KEPI Calculations.............................................................................................19

Figure 3 Combined Fab and A/T Calculations .......................................................................19

List of Tables

Table 1 List of KEPIs ..............................................................................................................3

Table 2 List of Waste Categories and Specific Waste Stream Names...................................14

v


Acknowledgments

The authors would like to acknowledge the contributions of the ISMI KEPI Working Group. Thank you for your efforts.

1


1 EXECUTIVE SUMMARY

Product stewardship, emerging regulations, and customer inquiries are compelling semiconductor manufacturers to more actively review and account for environmental impacts of their products. The International SEMATECH Manufacturing Initiative (ISMI) therefore initiated a project to establish a standard set of quantifiable, relevant, and comparable product-based environmental performance metrics; develop calculation methodologies; and perform metrics calculations. The resultant set of Key Environmental Performance Indicators (KEPIs), which quantitatively measures product environmental performance, can be used to respond to customer requests for environmental profiles of semiconductor products and to measure internal efficiencies as a basis for improving environmental impacts from manufacturing semiconductor products on a product type basis. When applied, they will provide the industry with a consistent set of product key environmental performance indicators.

The KEPIs are divided into four categories―global warming impact, water resources, chemicals, and waste―and 15 individual KEPIs, capturing global warming, water use, chemical use, and waste generation impacts.

KEPIs should be consistently quantified and used to track product environmental performance and drive improvements over time. Whenever possible, standard industry methods of calculation should be used; if no consistent standards exist, a new methodology should be developed.

2 INTRODUCTION

Scrutiny of natural resources consumption and the overall environmental impact of semiconductor facilities is increasing, as evidenced by emerging environmental stewardship regulations, trade association metrics, voluntary reporting and labeling initiatives, and customer requests for product environmental performance and specific ecological impact data.

It has become apparent that regulations, customer requests and sustainability goals drive the need for KEPIs. Tracking quantifiable, relevant, and comparable indicators is important for understanding and improving environmental performance of semiconductor products over time. As a result, in 2008, ISMI initiated a project to identify industry consensus KEPIs and develop KEPI guidance. The project included efforts to coordinate with industry associations to ensure that other metrics being developed were considered.

The project identified the main environmental drivers (KEPIs) in the semiconductor life cycle, determined which of these KEPIs can be influenced, provided guidance on quantifying KEPIs, and defined the unit of production used for normalizing on a per product basis.

A review of existing semiconductor product life cycle assessments (LCAs) revealed that LCA methodologies are not consistent. Different LCAs looked at different aspects of the semiconductor life cycle (i.e., wafer manufacturing, assembly/test (A/T), product use, end-of-life). Little data was available on impacts of semiconductor raw material acquisition and end-of-life. Additionally, significant variability in semiconductor product uses result in difficulties characterizing product use impacts for the wide variety of semiconductor products. Most semiconductor LCAs show that energy use (climate change) and water use associated with semiconductor product manufacturing are high environmental impact areas.

2


A comparison of existing environmental metrics across the industry found that metrics and definitions are different depending on countries and regions. For example, the definition of hazardous and non-hazardous wastes varies significantly by region.

Even within ISMI’s member companies, manufacturing facilities are very different. Some facilities are fab only, some fab/A/T, and some A/T only. Air emissions and wastewater treatment and discharge vary based on facility type and infrastructure, while environmental regulatory requirements vary geographically and by country. Among member companies, air abatement, wastewater treatment and discharge, and solid and liquid waste handling operations differ. Additionally, member companies source their electrical needs through a variety of providers that use a variety of methods to generate electricity. These differences result in varying climate change impacts.

After extensive discussions on defining the KEPIs, product-based normalization factors, and KEPI calculations, ISMI determined that KEPIs should focus on product rather than manufacturing operations, with an initial focus on those aspects of the semiconductor product life cycle under the control of the semiconductor product manufacturers (i.e., fab and A/T facilities).

KEPI boundaries were determined to include the following:

Direct greenhouse gas (GHG) emissions resulting from manufacturing and support operations including from fuel burned for onsite energy generation and in boilers and process GHG emissions

Indirect GHG emissions associated with electricity consumption and other purchased energy

Total water resources withdrawn to be used and consumed for any purpose at the facility

Total water recycled and reused onsite

Total wastewater discharged from the facility

Total chemicals used in the fab, A/T and in reverse osmosis (RO), ultrapure water (UPW) operations, and wastewater treatment.

Total hazardous and non-hazardous waste recycled, re-used, and reclaimed

Total hazardous and non-hazardous waste that is landfilled

Total hazardous and non-hazardous waste disposed of and treated

KEPI boundaries were determined to exclude the following:

Raw material acquisition and subsequent material and chemical manufacture

Product use

Product end-of-life phase

Employee commute

Business travel

Product transport

The KEPIs that were identified, defined, and calculated are listed in Table 1.

3


Table 1 List of KEPIs

Category KEPI

Category

KEPIFab

Normalized [unit] per

Product Type

KEPIA/T Normalized[unit] per Product

Type

KEPI Reported

Unit

References Data Source and

Calculation Methods

Direct GHG Emissions

kg CO2 Eq / (cm2* # mask

layers)

kg CO2 Eq / (units * days)

kg CO2 Eq References

Data Sources and Calculations Global

Warming Impact

Indirect GHG Emissions

(Purchased Energy Usage)

kg CO2 Eq / (cm2* # mask

layers)

kg CO2 Eq / (units * days)

kg CO2 Eq References

Data Sources and Calculations

Total Input Water Liters / ( cm2* #

mask layers) Liters / (units * days) liters

Total Recycled/Reused Water

Liters / (cm2* # mask layers)

Liters / (units * days) liters Water Resources

Total Wastewater discharged from manufacturing and support operations

Liters / (cm2* # mask layers)

Liters / (units * days) liters

References


Chemicals Total Chemicals Kg / (cm2* # mask layers)

Kg / (units * days)) Kg References


Total Waste Kg / (cm2* # mask layers)

Kg / (units * days) Kg

Total Haz Waste Recycled/ Re-used/ Re-claimed

Kg / (cm2* # mask layers)

Kg / (units * days)) Kg

Total Haz Waste Disposed/Treated

kg / (cm2* # mask layers)


Total Haz Waste Landfilled



Total Non-Haz Waste Recycled/ Re-used/ Re-claimed



Total Non-Haz Waste Disposed/Treated



Waste

Total Non-Hazardous Waste Landfilled

Kg / (cm2 * # mask layers)

Kg / (units * days)) Kg References


4


2.1 Definitions

Key Environmental Performance Indicators (KEPIs)

A set of environmental performance metrics for semiconductor products that quantify the key environmental impacts from manufacturing a semiconductor product on a product type basis. KEPIs are intended to help build the environmental profile of the final product that contains semiconductor components. KEPIs track aspects of semiconductor product manufacturing that have the greatest environmental impact. KEPIs account for major direct and indirect environmental impacts from manufacturing a semiconductor product and take into account operational efficiency and yield. KEPIFab refers to fab KEPIs; KEPIA/T refers to assembly and test KEPIs.

Environmental Impacts

Any change to the environment, whether adverse or beneficial, wholly or partially resulting from actions related to the manufacture of a semiconductor, such as greenhouse gas emissions from energy generation or from the manufacturing process, the use of water, the discharge of wastewater, the use of chemicals, and the generation and treatment of waste.

Semiconductor Product

The output of the semiconductor manufacturing factory/facility/site that is sold to a customer (e.g., an assembled component, packaged unit, individual device or chip, or a finished wafer). The semiconductor product is a component of what will be a saleable product, a final use product at some future time. Semiconductor products offer a variety of different functionalities.

Product Type Wafers run on similar manufacturing processes or assembled packages with a similar number of die and pins.

3 GLOBAL WARMING IMPACT

3.1 Relevance

The global warming impact KEPIs quantify the major global warming impacts of direct and indirect GHG emissions associated with semiconductor manufacturing facilities and provide consistent data for tracking respective efficiencies over time.

GHGs are the main cause of climate change. Direct GHG emissions include those from stationary and process sources at the semiconductor facility, which are reported in kilogram carbon dioxide equivalents (kg CO2 Eq.) per product type. Process emissions include fluorinated greenhouse gases (F-GHGs) used in plasma etch and chamber cleaning, nitrous oxide (N2O), fluorinated heat transfer fluids (F-HTFs), and refrigerant GHG emissions. Indirect greenhouse gas emissions are reported by two indicators representing the amount of energy (electricity, heat, steam) purchased from offsite sources and used at the facility for any activity. These indirect GHG emissions are reported in kilo-watt hours (KWH) of energy purchased from offsite sources and carbon dioxide equivalents emitted by the offsite energy source in the production of the energy purchased by the facility to be used onsite, per product type.

5


3.2 Emissions Definitions

Direct GHG emissions: Emissions from sources that are owned or controlled by the reporting semiconductor manufacturing site. Direct GHG emissions are reported in kg CO2 Eq. Direct GHG emissions include

Manufacturing process emissions of F-GHG, N2O, and F-HTF

Emissions from the combustion of fuels such as natural gas and fuel oils of all types and grades combined such as CO2, N2O, and CH4 emissions from the combustion

Emissions from combustion of diesel in emergency generators

Direct GHG emissions do not include

De minimis emissions of F-GHG, N2O, and refrigerants

De minimis GHG emissions: A level of direct emissions from a source or source type that is excluded from direct GHG emissions compilations.

Any fluorinated greenhouse compound that comprises less than 5% of the total usage of fluorinated greenhouse compounds where

– The de minimis amount of the F-GHG used in etch comprises less than 5% of the total usage of all F-GHG compounds in etch

– The de minimis amount of the F-GHG used in chemical vapor deposition (CVD) chamber cleaning comprises less than 5% of the total usage of all F-GHG compounds in CVD chamber cleaning

The de minimis amount of the F-HTF used comprises less than 5% of the total usage of all F-HTF compounds

The de minimis amount of N2O used is 1% of all GHG emissions

The de minimis amount of refrigerant is 23 kilograms per refrigerant system

Fluorinated greenhouse gas (F-GHG): CF4, C2F6, C3F8, c-C4F8, c-C4F8O, C4F6, C5F8, CHF3, CH2F2, SF6, NF3.

Fluorinated heat transfer fluids (F-HTF): Heat transfer fluids as defined in the U.S. Environmental Protection Agency (EPA) final green house gas emissions reporting rule.

Indirect GHG emissions: GHG emissions that result from the energy demand of onsite activities generated offsite by the provider of that energy. Indirect emissions are those associated with the generation of electricity, heat, cooling, steam, and other energy purchases. Indirect GHG emissions are calculated based on the amount of energy purchased and the characteristics of the energy provider. GHG emissions generated in the production of the energy from an offsite source for onsite use are reported in both KWH and kg CO2 Eq per product type.

Carbon dioxide equivalent (kg CO2 Eq): A unit of measure used to compare the emissions of the different greenhouse gases based upon their 100 year global warming potential (GWP).

Refrigerant: Any global warming refrigerant having a documented IPCC 4th Assessment Report GWP.

6


Refrigerant system: Any appliance and/or contained system that contains a global warming refrigerant with a charge of 23 kilograms or greater of refrigerant.

Stationary combustion related emissions: Emissions from the production of electricity, heat, or steam. Emissions from systems used to thermally destroy process emissions.

The site/semiconductor manufacturing facility: All activities that take place at the site location including wafer fabrication (front end operations); test, assembly and packaging (back end operations); facilities; ultrapure water (UPW) generation; steam generation, waste treatment; wastewater treatment; offices; cafeteria; etc.

3.3 Compilation

3.3.1 KEPI Category – Direct GHG Emissions

Direct GHG emissions are reported in kg CO2 Eq per product type. In processes in which GHG emissions are abated, abatement efficiency must be accounted for when calculating direct emissions. The abatement equipment manufacturer may need to be contacted to provide abatement efficiency information.

( (GHG from stationary sources (kg CO2 Eq)) i Total direct GHG emissions = + (GHG from process sources (kg CO2 Eq)) i)

( (PFC GHG emissions (kg CO2 Eq)) i + (N2O GHG emissions (kg CO2 Eq)) i) GHG from process sources = + (F-HTF GHG emissions (kg CO2 Eq)) i) + (refrigerant GHG emissions i(kg CO2 Eq)) i)

a) Identify all stationary combustion GHG emission sources onsite.

b) Calculate GHG emissions from stationary combustion sources by component. Contact the fuel provider to obtain emission factors. If this data is not available, the EPA Climate Leaders Cross-Sectional Guidance; World Resource Institute Semiconductor Inventory Guidance can be used.

c) Identify all process GHG emissions sources onsite and calculate GHG emissions by component from process emissions sources. Exclude de minimis GHG emissions.

d) Calculate F-GHG process emissions using the Intergovernmental Panel on Climate Change (IPCC) Tier 2 or 3 methods as outlined in the 2006 IPCC Guidelines for National Greenhouse Gas Inventories, Volume 3, Chapter 6.

e) Calculate N2O process emissions by using company-specific emission factors or contacting the process equipment manufacturer to obtain baseline N2O process emission factors. If this data is not available, use 100% as the emission factor if the equipment operates with N2O flowing continuously. If N2O runs only when required by the process, use 60% as the emission factor.

http://www.epa.gov/stateply/resources/cross-sector.html

http://www.epa.gov/stateply/resources/cross-sector.html

http://www.ghgprotocol.org/calculation-tools/semiconductors


7


f) Calculate F-HTF and refrigerant emissions using mass balance data; i.e., the quantity of F-HTF or refrigerant added to systems minus the quantity of F-HTF or refrigerant disposed or recycled. If data is not available to conduct a mass balance, assume 100% of the quantity purchased is emitted.

g) Convert non-CO2 emissions into kg CO2 Eq emissions using the 100-year global warming potentials found in the current IPCC Assessment Report.

h) Once all GHGs emissions have been calculated by component [steps b), d), e), f) and converted to CO2 Eq. emissions in g)], add all the components together to determine direct GHG emissions KEPI category value.

i) Convert the direct GHG emissions KEPI category value into a KEPI per product type (see Section 7).

3.3.2 KEPI Category – Indirect GHG Emissions From Purchased Energy

Indirect GHG emissions from purchased energy are to be reported in two ways: KWH and kg CO2 per product type.

Total indirect GHG emissions = ( (GHG from indirect sources i (kg CO2 Eq)) i

a) Identify sources of indirect GHG emissions and energy sources brought in from offsite sources.

b) Determine the site’s total demand for energy brought onsite from offsite sources in KWH. This data should be available from the purchasing department.

c) Determine the GHG emissions from the generation of the offsite energy sources identified in a) in kg CO2 Eq. Contact the energy provider and obtain supplier-specific emission factors for purchased energy. If this data is not available, use regional or grid emission factors (Carbon Monitoring for Action; U.S. EPA’s eGRID website; World Resource Institute Semiconductor Inventory Guidance).

d) Once the site’s total demand for energy brought onsite is identified, sum to calculate the indirect GHG emissions KEPI category value.

e) Convert the indirect GHG emissions KEPI category value into a KEPI per product type (see Section 7).

3.4 References

The Greenhouse Gas Protocol Initiative – A corporate accounting and reporting standard (Revised Edition, 2004) of the World Resources Institute (WRI) and the World Business Council for Sustainable Development (WBCSD)

Intergovernmental Panel on Climate Change, 2006 IPCC Guidelines for National Greenhouse Gas Inventories, Volume 3, Chapter 6

Intergovernmental Panel on Climate Change 4th Assessment Report, Climate Change 2007, Working Group I: The Scientific Basis

Carbon Monitoring For Action

http://carma.org/

http://www.epa.gov/egrid



http://carma.org/

8


U.S. EPA’s eGRID website

World Resource Institute Semiconductor Inventory Guidance EN16

4 WATER RESOURCES

4.1 Relevance

Water resource indicators quantify the total input of water, total recycled/reused water, and wastewater discharge from a semiconductor manufacturing facility and provide consistent data for tracking total input water, wastewater generation, and respective efficiencies over time.

Total input water is the water withdrawn from all water sources including public water suppliers, surface waters, and ground water. Total input water is water used and consumed for any purposes at the facility including sanitary and domestic uses, UPW generation, utility generation use (cooling tower make-up, boiler feed and make-up), emissions abatement, and non-contact cooling. Total recycled/reused water includes all sources of water either recycled or reused by a semiconductor manufacturing facility. Total wastewater discharge includes all wastewater discharges from a facility.

Quantifying and tracking total input water, total recycled/reused water, and wastewater discharge on a per product basis provides consistent performance and efficiency data for reporting and managing potential environmental impacts associated with water use and wastewater generation. The rate of water reuse and recycling can be a measure of efficiency and can demonstrate success in reducing total water withdrawals and discharges. Increased reuse and recycling can reduce water consumption, treatment, and disposal costs. Environmental impacts from the use of water or generation of wastewater will vary by organization depending on particular constraints.

4.2 Definitions

Ground water: Water within the earth that supplies wells and springs.

Process wastewater: Any water that, during manufacturing or processing, comes into direct contact with or results from the production or use of any raw material, intermediate product, finished product, byproduct, or waste product.

The site/semiconductor manufacturing facility: All activities that take place at the site location including wafer fabrication (front-end operations); A/T (back-end operations); facilities; UPW generation; steam generation, waste treatment; wastewater treatment; offices; cafeteria; etc.

Recycled/reused water: Water and wastewater that is processed through another cycle of use before being discharged to final treatment and/or discharged to the environment.

Surface waters: Water that is naturally open to the atmosphere such as water from estuaries, lakes, ponds, reservoirs, rivers, seas, etc.

Total input water: The total amount of water that is used and consumed at the site for manufacturing and support operations, including water withdrawn from sources including public water suppliers, surface waters, and ground water (onsite and offsite wells and springs). Total input water does not include the following:

Recycled and reused water

Rain water collected for use at the site

http://www.epa.gov/egrid


9


Water used for steam, chilled water (process cooling water), or heated water provided to the site by an external entity (<50% owned by the site) that is returned to the external entity

Unprocessed water that is supplied to an external entity (<50% owned by the site) even if the external entity directly services the site with utilities (cogeneration facility, N2 plant, deionized (DI) water plant, etc.). Exception: water that the site processes and then distributes to an external entity should be reported.

Water produced as a reaction byproduct of onsite combustion or other production processes.

Water received from air dehumidification.

Total wastewater discharge: The sum of all wastewater generated onsite and discharged from the site to an entity or the environment (subsurface waters, surface waters, sewers that lead to rivers, oceans, lakes, wetlands, treatment facilities, ground water) either through a defined discharge point, over land in a dispersed or undefined manner, or removed from the site by a vehicle (truck, tank car, etc). The total wastewater discharge does not include recycled or reused water at the site.

Wastewater: Water that is spent, used, or deemed unusable at the semiconductor manufacturing facility. Wastewater includes treated or untreated process water, sanitary wastewater, kitchen wastewater, and utilities-related wastewater including boiler and cooling tower blow down.

Wastewater effluent: Wastewater, treated or untreated, that leaves the site to an entity or the environment.

Water utilization and consumption: Water used for all purposes at the site including sanitary uses; domestic uses (cafeteria, exercise facility, irrigation); building and process heating and cooling; ultra-pure water generation; emission abatement equipment; non-contact cooling, etc.

4.3 Compilation

4.3.1 KEPI Category – Total Input Water

Total input water is reported in liters per product type. Direct measurement is the preferred method of measuring this metric. Data for total input water is to be obtained from water meters and water bills. If data is incomplete, calculations can be based on a water mass balance.

Total Input Water = (water sources (liters)) i

a) Identify the total number of sources where water is withdrawn.

Municipal water supplies or other water utilities

Surface water, including water from wetlands, rivers, lakes, and oceans

Ground water, including wells

b) Collect direct measurement data for the volume of water withdrawn from all sources from meters and water bills. Collect volume data in liters. Convert volume data to liters if data is provided in another unit.

10


c) Add all volumes collected in b) in liters to calculate the total input water KEPI category.

d) Convert the total input water KEPI category value into a KEPI per product type (see Section 7).

4.3.2 KEPI Category – Total Recycled/Reused Water

Total recycled and reused water is reported in liters per product type. Direct measurement is the preferred method of measuring this metric. If data is incomplete, calculations can be based on a water mass balance.

Total Reused/Recycled Water = (reused/recycled water (liters)) i

a) Identify all operations in which reused and recycled water is used as a source of water at the site. Calculate the volume of recycled/reused water based on the volume of the water demand satisfied by recycled/reused water rather than further withdrawals. For example, if the organization has a production cycle that requires 200 liters of water per cycle, the organization withdraws 200 liters of water for one production process cycle and then reuses it for an additional three cycles, the total volume of water recycled/reused is 600 liters.

b) Collect direct measurement data for total volume of water reused and recycled at the site from meters. Collect all volume data in liters. Convert all volume data to liters if data is provided in other units.

c) Add all volumes collected in b) in liters to calculate the total recycled/reused water KEPI category value.

d) Convert the total recycled/reused water KEPI category value into a KEPI per product type (see Section 7).

4.3.3 KEPI Category – Total Wastewater Discharge

Total wastewater discharge is reported in liters per product type. Direct measurement is the preferred method of measuring this metric. Data for total wastewater discharge is to be obtained from water meters and shipment records. If data is incomplete, calculations may be based on a water mass balance.

Total Wastewater Discharged = (wastewater discharged (liters))i

a) Identify the total streams of wastewater discharged by the site.

Point source discharges

Treated or partially treated sources of wastewater

Untreated sources of wastewater

Wastewater that was shipped offsite

Planned and unplanned wastewater discharges

Do not include run-off from uncollected rainwater by the site

11


b) Collect direct measurement data for all volumes of wastewater discharged from meters, invoices for water treatment, and shipment records. Collect all volume data in liters. Convert all volume data to liters if data is provided in other units.

c) Add all volume data collected in b) to find the total wastewater KEPI category value.

d) Convert the total wastewater KEPI category value into a KEPI per product type (see Section 7).

4.4 References

EN08, EN10, EN21. See Global Reporting Initiative G3 Guidelines, Indicator Protocols Set Environment (EN) Version 3, 2000-2006, GRI

5 CHEMICALS

5.1 Relevance

The chemicals indicator quantifies the total chemicals required to produce the semiconductor product on a unit of production basis. All chemicals used to manufacture the product, produce RO and UPW for the manufacturing process, and used to treat wastewater generated by the manufacturing process are to be included. This indicator provides a baseline for tracking chemical use and monitoring efficient use over time.

Quantifying and tracking total chemicals on a normalized basis provides consistent performance and efficiency data for reporting and for managing potential environmental impacts associated with the chemical use. Environmental impacts from chemicals will vary depending on the manufacturing technology being used at the semiconductor manufacturing site and disposal and/or treatment for spent and unused chemical related waste.

5.2 Definitions

Chemicals: Any solid, liquid, or gas used in or in support of semiconductor product manufacturing, unless otherwise excluded. Chemicals do not include the following:

Research and development chemicals

Laboratory chemicals

Facilities support chemicals (paints, lubricants, glues, sealants, janitorial, landscape maintenance chemicals, etc.)

Equipment maintenance chemicals such as greases and lubricants

Chemicals manufactured onsite for semiconductor manufacturing process use

Byproducts generated onsite

Manufacturing process: Refers to wafer fabrication (front-end) and A/T (back-end) operations.

Total chemicals: Chemicals used for manufacturing, producing RO water and UPW to manufacture the product, and treating wastewater generated by the manufacturing process.

http://www.globalreporting.org/NR/rdonlyres/D2BC0DF8-FF2C-4BAB-B2B4-27DA868C2A5F/2800/smallG3_IP_EN_ENG_andcov.pdf

12


5.3 Compilation

The total chemicals KEPI is reported in kilogram per product type. Data sources include purchasing and inventory systems records. Whenever possible, the actual initial and final inventory levels should be used for the reporting period for specific chemicals; otherwise, assume that initial and final inventory levels are equal for the reporting period for specific chemicals.

Total Chemicals = (chemicals used (kilograms)) i

a) Identify all chemicals used in the manufacturing process, the production of RO water and UPW, and the onsite treatment of wastewater. Use purchasing and chemical inventory tracking systems.

b) Identify total quantity of chemicals used in part a). Use purchasing records and inventory tracking reports from supply management. When possible, consider beginning and ending chemical inventory levels when metrics are compiled. Convert quantity data to kilograms if data is provided in other units.

c) Add all quantities collected in b) in kilograms to calculate the total chemicals used KEPI category value.

d) Convert the total chemicals used KEPI category value into a KEPI per product type (see Section 7).

6 WASTE

6.1 Relevance

These waste indicators quantify the total waste generated to manufacture a semiconductor product and provide a baseline for tracking waste generation in the production of the semiconductor product over time by type and disposition method.

Total waste consists of hazardous and non-hazardous waste types. This waste is further categorized into one of three disposition methods:

1. Recycled, re-used, or reclaimed

2. Disposed or treated

3. Landfilled

Both hazardous and non-hazardous waste may be dispositioned by any of the three methods.

Quantifying and tracking total waste generated per product provides consistent performance and efficiency data for reporting and managing potential environmental impacts associated with waste generation. Environmental impacts will vary by organization based on waste type and amount of waste generated and may include constraints placed by waste handlers or availability of waste treatment or disposition options. Organizations should consider environmental impacts as part of their waste minimization strategies.

13


6.2 Definitions

The site/semiconductor manufacturing facility: All activities that take place at the site location including wafer fabrication (front-end operations); A/T and packaging (back-end operations); facilities; UPW generation; waste treatment; wastewater treatment; offices; cafeteria; etc.

Total waste: The sum of hazardous and non-hazardous wastes. Wastes generated through all activities taking place on the site and removed from the site for the reporting period are included (e.g., cafeteria, site vegetation, process, treatment, packaging, and office consumption waste). Total waste does not include the following:

The mass of wastewater and its constituents

The mass of air emissions

Waste re-used/recycled/reclaimed internally on the site that is used again on the site

Materials that are not classified as waste and are beneficially re-used onsite or offsite

Hazardous waste: Any solid, liquid, or gas waste generated by the site and designated by the legal jurisdiction at the point of generation as hazardous waste is considered a hazardous waste.

Non-hazardous waste: Any solid, liquid, or gas waste generated by the site that is not designated by the legal jurisdiction as a hazardous waste is considered a non-hazardous waste.

Waste types: Wastes are designated as either hazardous or non-hazardous. Both hazardous and non-hazardous wastes may be referred to as waste when specificity is not required.

Waste disposition methods: Disposition is the final placement or destruction of a waste. Disposition includes one of three methods:

Re-use/recycle/reclaim

Dispose/treat

Landfill

Re-used/recycled/reclaimed waste: Re-used, recycled, or reclaimed waste is waste that is not disposed of but is otherwise used or reused with either no additional processing or with additional processing before the final disposition. This waste can include materials used for fuel blending; hazardous waste burned for energy recovery; recycled construction and demolition debris; food waste used for compost; waste processed for metal reclaim; materials sent for new process use; materials sent for reprocessing; plastic, metal, cardboard paper, etc. recycled by the site or private contractor. This waste is generated onsite but may be re-used, recycled, or reclaimed on- or offsite.

Disposed/treated waste: Waste generated onsite that is disposed of or treated either onsite or offsite is waste, but landfilled waste is not included in this category. Waste treated/disposed includes waste that may be stored or treated for eventual disposal. Waste disposal methods include deep well injection, incineration, etc. Waste treatment is any method, technique, or process designed to remove pollutants from solid or liquid waste, to minimize volume, or to reduce or eliminate potential harm to humans and the environment, excluding recycle or reclamation.

14


Landfilled waste: Waste that is disposed of in a landfill. Landfilling is a method of disposing of waste by spreading in layers, solidifying, and/or compacting to the smallest practical volume and covering. Landfills can be used to dispose of non-hazardous or hazardous waste.

Total hazardous waste re-used/recycled/reclaimed: The sum of all of the hazardous waste that is re-used/recycled/reclaimed.

Total non-hazardous waste re-used/recycled/reclaimed: The sum of all of the non-hazardous waste that is re-used/recycled/reclaimed.

Total hazardous waste disposed/treated: The sum of all of the hazardous waste that is disposed or treated.

Total non-hazardous waste disposed/treated: The sum of all of the non-hazardous waste that is disposed or treated.

Total hazardous waste landfilled: The sum of all of the hazardous waste that is landfilled.

Total non-hazardous Waste landfilled: The sum of all of the non-hazardous waste that is landfilled.

Total hazardous waste: The sum of all of the hazardous waste that is re-used/recycled/reclaimed, disposed/treated, and landfilled.

Total Non-hazardous Waste: Sum of all of the non-hazardous waste which is re-used/recycled/reclaimed, disposed/treated, and landfilled.

Process waste: All wastes linked to the wafer fabrication, A/T, and supporting operations.

Treatment waste: All wastes originating from the wastewater treatment plant (except wastewater), air abatement systems (such as activated carbon or other adsorbers), grease traps, etc.

Packaging waste: All waste items generated from packaging raw material; equipment from suppliers; and internal movement of material and equipment including cardboard, paper, glass, plastic, steel, aluminum, wood and composite materials.

Office consumption: All paper waste both from the office and manufacturing as well as other office wastes.

Cafeteria waste: All waste generated by the cafeteria.

Vegetation waste: All waste from landscaping activities.

Table 2 List of Waste Categories and Specific Waste Stream Names

General Waste Category Specific Waste Stream Name

Waste Activated Carbon Activated carbon

Chemical drums

Chemical totes

Contaminated containers

Glass chemical container/packaging

Packaging containing residues of or contaminated by dangerous substances

Contaminated Package Material and Empty Containers

Spray cans

15



All contaminated rags and gloves, etc.

Arsenic contaminated solid waste

Contaminated wipes/cloth

Solvent contaminated solid waste

Absorbents, filter materials (including oil filters not

otherwise specified), wiping cloths, protective clothing contaminated by dangerous substances

Contaminated filter

Solvent debris

Contaminated Rags, Personal Protective Clothing, Filters, Spill clean-up, etc.

Solids with petroleum

Non-hazardous waste landfilled

Non-hazardous waste recycled

General trash

General waste (dry)

Household waste

Mixed municipal waste

Municipal wastes not otherwise specified

Municipal Waste

Urban house refuse

Scrap metal including aluminum, brass, iron, copper, steel, stainless steel, zinc

Leadframes

Scrap Metal

Precious metals

Biodegradable kitchen and canteen waste

Edible oil and fat

Grease and oil mixture from grease trap

Kitchen and Cafeteria Waste

Kitchen waste (wet)

Paper and cardboard packaging Cardboard and Paper Waste

Office paper waste

Wooden packaging and pallets Other Packaging Waste

Empty shipping containers

Construction and demolition debris

Furniture

Glass

Scrap wood

Wood

Construction and Demolition Waste

Asbestos waste

Plastic

Plastic compound

Plastic packaging

Plastic Waste

Polypropylene plastic

16



Fluorescent tubes and other mercury-containing waste

Waste lead-acid storage battery and mercuric oxide cell and waste tube

Waste thermometer and sphygmomanometer

Mercury-Containing Waste

Ballasts and capacitors

Batteries and accumulators

Lead acid battery waste

Spent Batteries

Waste of batteries containing Cd, Ni, Hg, or Li

Components removed from discarded equipment

Cathode ray tubes

Discarded electrical and electronic equipment

Electric cables

Electric motors

Parts and equipment

Waste Electrical and Electronic Equipment and Parts

Waste PCB board

Expired medicine

Biohazardous clinical waste

Medical Wastes

Sharps

Hydraulic oil

Lubricant oil

Mineral-based non-chlorinated engine, gear and lubricating oils

Mineral-based non-chlorinated hydraulic oils

Waste Oil

Synthetic engine, gear and lubricating oils

Water Treatment Waste Waste ion exchange resin

Ammonium sulfate

Calcium fluoride or other wastewater treatment filter cake

Concentrated copper waste (CCW)

Concentrated metal waste (CMW) (acid)

Heavy metal sludge

Metal hydroxide sludge

Wastewater Treatment Waste

Silica sludge

Compressed gases

Expired or unused chemicals, epoxies, lubricants, mold compounds

Un-used/Expired Chemicals and Laboratory Wastes

Obsolete laboratory chemicals

Corrosive solvent waste (CSW)

Flammable solid

Flammable liquid

General solvent waste

Mixed solvent waste

Photolithography bulk solvent waste

Flammable and Solvent Waste

Polyimide bulk solvent waste

17



Corrosive liquid

Corrosive solid

Hydrofluoric, phosphoric or other spent acid

Corrosive Waste

Waste alkalis

Lead contaminated/containing materials

Solutions containing cyanides

Toxic slurry

Toxic solids

Waste solder (paste, dross, etc.)

Toxic and Heavy Metal Waste

Pesticide/biocide

Epoxy

IC high-temperature tray, etc.

Lead frame with chip and mold

Leadframes

Mold compound, cured or uncured

Solder flux

Assembly/Test Waste

Solder waste

Desiccant

Inorganic wastes containing dangerous substances

Landscaping waste

Miscellaneous liquids

Miscellaneous solids

Sandblast slurry

Silica gel

Sludges from paint

Solid oxidizer

Debris

Miscellaneous Waste

Scrap wafers

6.3 Compilation

Waste indicators are reported in kilogram per product type. Data sources include waste manifests, records from disposal contractors, bills of lading, or other accounting methods. If weight data is not available, estimate the weight using information on volume and waste density.

( (hazardous waste stream (kilograms)) i) Total Waste = + ( (non-haz waste stream (kilograms)) i )

Total Hazardous Waste (by method) = (hazardous waste stream (kilograms)) i

Total Non-hazardous Waste (by method) = (non-hazardous waste stream (kilograms)) i

18


a) Identify all individual waste streams generated at the site. Use Table 2 as a tool for identification.1 Do not include excluded waste.

b) Categorize all identified individual waste streams as either hazardous or non-hazardous waste.

c) Categorize all individual waste streams by disposition method.

d) Quantify the amount of waste in each waste stream in kilograms using waste manifests, bills of lading, or other accounting methods. If weight data is not available, estimate the weight using information on volume and waste density.

e) Aggregate the amount of each waste stream in kilograms by waste type and disposition method to calculate the KEPI category value. Aggregating by waste type and disposition may result in up to six aggregated values in kilograms.

f) Convert the KEPI category value for each waste type and disposition method into a KEPI per product type (see Section 7) to calculate the following:

Total hazardous waste re-used/recycled/reclaimed per product type

Total non-hazardous waste re-used/recycled/reclaimed per product type

Total hazardous waste disposed/treated per product type

Total Non-Hazardous Waste Disposed/Treated per product type

Total hazardous waste landfilled per product type

Total non-hazardous waste landfilled per product type

6.4 References

EN22

World Semiconductor Council Quantitative Targets

Semiconductor Industry Association Metrics Program

7 NORMALIZATION FACTOR AND KEPI REPORTING

7.1 Relevance

KEPIs measure environmental impacts and performance of products. Normalization adjusts environmental performance measurements to account for changes in production efficiency over time. ISMI considered normalization factors that would take into account differences in technologies, product types, and member company factory; however, KEPIs are not meant to be facility environmental metrics (which companies are already tracking), but rather metrics that quantify the environmental performance of a product. KEPIs can be used to compare technology advancements within a product type (i.e., generational comparisons) but they are not suitable to make cross-product comparisons (i.e., analog devices to memory devices to microprocessor devices).

1 Information in this comprehensive list was compiled using member company survey data.

http://www.globalreporting.org/ReportingFramework/ReportingFrameworkDownloads/#1

19

The KEPIs were designed to quantify resources used to manufacture a product. New technologies may use more or less resources. If increased device complexity requires additional process steps, KEPI values may increase with new technology generations. On the other hand, the increase could be mitigated by factors such as increased yield and throughput, optimized processes and improved process control, use of higher performing chemicals that decrease chemical consumption, etc.

KEPIs indirectly account for factors including product technology, process tool types (energy and other resource consumption), process optimization/process efficiencies, product yield, factory loads, market fluctuations, etc. The KEPIs were not developed to capture the environmental impact of any one of these individual factors.

Fab KEPIs are calculated using the equations in Figure 1. A/T KEPIs are calculated using the equations in Figure 2. Combined fab and A/T KEPIs are calculated using the equations in Figure 3.

2

2

Normalized KEPI

* #

Reported KEPI * *

fabx

total product at fabx

specific product type

categorical KEPI

good wafer cm mask layers

Normalized KEPI good wafer cm layer

FabKEPI by Product Type

Figure 1 Fab KEPI Calculations

/

/

Normalized KEPI*

Reported KEPI * *

A Tx

total product at A Tx

specific product type

categorical KEPI

ideal process time days units out

Normalized KEPI ideal process time days units out

FabKEPI by Product Type

Figure 2 A/T KEPI Calculations

Fab/A/T /Reported KEPI Fab A TKEPI KEPI per product type x Fab/A/TCombined KEPI, KEPI by Product Type :

Figure 3 Combined Fab and A/T Calculations


20


In these equations,

good wafer (cm2) – the area of good die on the wafer in cm2 units for a product type

# mask layers – the number of mask layers on the wafer for a product type

fabx – the fab(s) that manufactures a product type(s)

ideal process time (days) – the ideal process duration or minimum theoretical cycle time in days for a product type

units out – good package, system, or gross unit of a final product out of an A/T manufacturing facility for product type(s)

KEPIFab – fab KEPI

KEPIA/T – assembly/test KEPI

KEPIFab/A/T – combined fab and A/T KEPI

7.2 Definitions

Normalization: Adjusting of environmental performance measurements to account for increases or decreases in production over time. Normalization allows trends to be studied to assess whether facilities are reducing their environmental impact from resources and waste generation per unit of production.

Good wafer area: Area in cm2 that represents the area of good die on the wafer. The good wafer area accounts for die yield.

Units out: Good packaged units out, which captures the product of the A/T facility. The package may consist of one die or several die packaged to be sold. Manufacturing typically provides this data.

Ideal process time: The A/T process time in days, which captures the theoretical minimum amount of time a product type spends in assembly/test.

Product type: Wafers run on similar manufacturing processes, or assembled packages similar in die and pins.

7.3 Compilation

Member companies may choose to normalize and report KEPIs by one or two methods:

1. All Fabs Method/All A/Ts Method

At a high level where aggregated data is used for categorical KEPIs and for normalization. KEPIs are reported as product-specific KEPIs for the entire company, not distinguishing between the fab or A/T where the product type is manufactured.

2. Fabx Method/A/Tx Method

At a fab/A/T level where KEPIs are calculated and reported for either one fab/A/T site or a group of fab/A/Ts. KEPIs are reported as product-specific KEPIs by (fab/A/T)x, where “x” designates the total number of fab/A/T sites included.

21


Steps in calculating KEPIs are as follows:

a) Sum the overall categorical KEPI

b) Normalize the overall categorical KEPI for product types included in a)

c) Calculate the reporting KEPI by multiplying the normalized KEPI in b) by specific product type data

KEPI calculation spreadsheet tools were developed for both methods of normalization and reporting: ‘KEPI Tool_All FabsATs Method and KEPI Tool_FabxATx Method. For example, if a member company has several fabs that manufacture the same product type, the KEPI by product type can be reported for all fabs that manufacture that specific product type using KEPI Tool_FabxATx Method.

1. KEPIFab – All Fabs Method (use the spreadsheet KEPI Tool_All FabsATs Method)

a) Calculate categorical KEPIs for the facilities using this guidance document

b) Sum all categorical KEPIs for all fabs

c) Sum all “cm2 * # of mask layers” for all product types manufactured.

d) Calculate the normalized KEPI by dividing b) by c)

e) Calculated reported KEPI by multiplying d) by the specific product type “cm2 times # of mask layers” being reported

2. KEPIFab – Fabx Method (use the spreadsheet KEPI Tool_FabxATx Method)

a) Identify which product types will be reported for the reporting period

b) Identify which manufacturing facilities manufacture the product types to be reported

c) Identify which manufacturing facilities will report

d) Calculate categorical KEPIs for the facilities that will report using the guidance outlined in this document

e) Sum the categorical KEPIs identified in d)

f) For each product type identified, calculate “cm2 * # of mask layers”

g) Sum the product type “cm2 * # of mask layers” data in f)

h) Calculate the normalized KEPI by dividing e) by g)

i) Calculate reported KEPI for x fab(s) by multiplying g) by the specific product type “cm2 times # of mask layers”

3. KEPIA/T – All A/Ts Method (use the spreadsheet KEPI Tool_All FabsATs Method)

a) Calculate categorical KEPIs for the facilities using this guidance document

b) Sum all categorical KEPIs for all A/Ts

c) Sum all “ideal process time (days) * units out” for all product types manufactured

d) Calculate the normalized KEPI by dividing b) by c)

e) Calculated reported KEPI by multiplying d) by the specific product type “ideal process time (days) * units out” being reported

22


4. KEPIA/T – A/Tx Method (use the spreadsheet KEPI Tool_FabxATx Method)

a) Identify which product types will be reported for the reporting period

b) Identify which manufacturing facilities manufacture the product types to be reported

c) Identify which manufacturing facilities will report

d) Calculate categorical KEPIs for the facilities that will report using this guidance document

e) Sum the categorical KEPIs identified in d)

f) For each product type identified, calculate “ideal process time (days) * units out”

g) Sum the product type “ideal process time (days) * units out” data in f)

h) Calculate the normalized KEPI by dividing e) by g)

i) Calculate reported KEPI for x A/T(s) by multiplying g) by the specific product type “ideal process time (days) * units out”

5. KEPIFab/ A/T – Combined KEPIs

a) Identify the different product types across all member company fabs and A/T locations where there is data for both front-end and back-end operations for the reporting period.

b) Calculate a reported KEPI for each product type identified using the following formula:

Reported KEPIFab/A/T = (KEPIFab + KEPIA/T ) per product type x

7.4 References

World Semiconductor Task Force, ESH Taskforce

Guidance for Normalizing Environmental Performance Results, EPA

http://www.sia-online.org/cs/issues/world_semiconductor_council_esh_task_force

http://www.epa.gov/performancetrack/apps/PTNormalization_3_7_04.pdf

International SEMATECH Manufacturing Initiative Technology Transfer

2706 Montopolis Drive Austin, TX 78741

http://ismi.sematech.org e-mail: [email protected]

Semiconductor Key Environment Performance … Key Environment Performance Indicators . ... are the...

Documents

Transcript of Semiconductor Key Environment Performance … Key Environment Performance Indicators . ... are the...