Samsung’s Galaxy S7 Processor Packages: Qualcomm & Shinko’s MCeP vs. Samsung’s PoP 2016...

DISCLAIMER : System Plus Consulting provides cost studies based on its knowledge of the manufacturing and selling prices of electronic components and systems. The given values are realistic estimates which do not bind System Plus Consulting nor the manufacturers quoted in the report. System Plus Consulting is in no case responsible for the consequences related to the use which is made of the contents of this report. The quoted trademarks are property of their owners.

© 2016 by SYSTEM PLUS CONSULTING, all rights reserved. 1

Reverse Costing Analysis

Electronic Costing & Technology Experts

www.systemplus.fr21 rue la Nouë Bras de Fer44200 Nantes – France Phone : +33 (0) 240 180 916 email : [email protected]

June 2016 – Version 1 – Written by Stéphane ELISABETH

Samsung’s Galaxy S7 Processor Packages: Qualcomm Snapdragon 820 with Shinko’s MCeP

vs. Samsung Exynos 8 in standard TMV PoP

http://www.systemplus.fr/index.php?lang=ge&page=home.php

mailto:[email protected]

Qualcomm Snapdragon 820 PoP

Return to TOC


Table of contentsGlossary1. Overview / Introduction4

– Executive Summary– Reverse Costing Methodology

2. Company Profile7– Qualcomm– Snapdragon 820 Chipset– Snapdragon 820/810 vs. Exynos 7/8

3. Physical Analysis14– Physical Analysis Methodology– Samsung Galaxy S7 Teardown16

– Exynos Die removal– Snapdragon Die removal

– Snapdragon 820 Package-on-Package Analysis23– Snapdragon Package View, Dimensions & Marking– Snapdragon Package Cross-Section– Snapdragon MCeP Details cross-Section

– Exynos 8 Package-on-Package Analysis36– Exynos 8 Package View, Dimensions & Marking– Exynos Package Cross-Section

– Package-on-Package Comparison46– Packages Comparison Overview– Summary of physical Data– Snapdragon Package Opening– Exynos Package Opening

– Snapdragon 820 Die Analysis 51– Snapdragon Die View, Dimensions & Marking– Snapdragon Die Cross-Section– Snapdragon Process Characteristics

– Exynos 8 Die Analysis 58– Exynos Die View, Dimensions & Marking– Exynos Die Cross-Section– Exynos Die Process Characteristics

– Comparison with previous generation 65– Exynos 7 vs. Exynos 8 PoP– Snapdragon 810 vs. 820 PoP– Exynos 7 vs. Exynos 8 Process– Snapdragon 810 vs. 820 Process

4. Manufacturing Process Flow 72– Chip Fabrication Unit– Packaging Fabrication Unit– MCeP Reconstitution Flow

5. Cost Analysis 88– Synthesis of the cost analysis– Main steps of economic analysis– Yields Hypotheses– Die Cost Analysis (Snapdragon/Exynos) 93

– Wafer Cost– Die Cost

– Packaging Cost Analysis (Snapdragon/Exynos) 97– Packaging Panel Cost– Packaging Cost per process Steps

– Component Cost– Snapdragon/Exynos Component Cost Comparison

6. Estimated Price Analysis110

– Manufacturer Financial Ratios– Estimated Selling Price

Contact113


Return to TOC


Executive Summary• This full reverse costing study has been conducted to provide insight on technology data,

manufacturing cost and selling price of Samsung Galaxy S7 Application Processors, the Qualcomm Snapdragon 820 (MSM8996) and the Samsung Exynos 8 (Octa 8890).

• Located under the DRAM chip on the main board, the two processors are packaged using PoP technology. Depending on the region, the Galaxy S7 integrates the Exynos 8 with classic Package-on-Package (PoP) packaging or the Snapdragon 820, with Molded Core Embedded Package (MCeP) technology.

• The Qualcomm Snapdragon 820 is an embedded die package with Shinko’s packaging technology, using Copper Core Solder ball to replace the well-known Through Molded Via (TMV) technology. In the previous generation of the 800 series Qualcomm used Shinko’s MCeP packaging. In this report, we will show the differences and the innovations of this package, including copper pillar flip-chip and a coreless substrate with embedded trace substrate technology. The detailed comparison with the Exynos 8 will give the pros and the cons of the MCeP technology compared to standard PoP.

• Thanks to this MCeP process, Qualcomm is able to offer a very thin PoP with a high number of I/O pads. The result is a very cost-effective component that can compete with a standard PoP. The report compares the costs of the different approaches.

• This report also includes a technical comparison with the previous Qualcomm CPU, the Snapdragon 810 and the previous Samsung CPU, the Exynos 7.


Return to TOC


Exynos Die Removal

• The Exynos processor is under the SDRAM chip in PoP mode (Package on Package).

Exynos 8 & LPDDR4 SDRAM from Samsung

Samsung S7 Edge European Version Main Board view

Samsung S7 Edge European Version Main Board (Top view)

Samsung S7 Edge European Version Main Board (Bottom view)


Return to TOC


Snapdragon Die removal

Samsung S7 US Version Main Board (Top view)

Samsung S7 US Version Main Board (Bottom view)

Samsung S7 US Version Main Board view

• The Snapdragon 820 Microprocessor is under the DRAM chip in PoP mode (Package on Package).

Snapdragon 820 & LPDDR4 SDRAM from SK Hynix

Snapdragon 820 (MSM8996) vs. Exynos 8 (8890)

Return to TOC


Snapdragon Package Views & Dimensions


Return to TOC


Snapdragon Package Cross-Section


Return to TOC


Exynos Package Views & Dimensions


Return to TOC


Exynos Package Cross-Section


Return to TOC


Summary of Physical Data


Return to TOC


Snapdragon Die Dimensions


Return to TOC


Exynos Die Dimensions


Return to TOC


Exynos 7 vs. Exynos 8 PoP


Return to TOC


Snapdragon 810 vs. Snapdragon 820 PoP


Return to TOC


Exynos 7 vs. Exynos 8 process


Return to TOC


MCeP – Reconstitution Flow (1/3)


Return to TOC


Wafer Front-End Cost


Return to TOC


Die Cost


Return to TOC


MCeP Panel Cost


Return to TOC


Component Cost


Return to TOC


Estimated Manufacturer Price


Return to TOC


Contact• Reverse costing analysis represents the best cost/price evaluation given the publically available data, and estimates completed by industry experts.

• Given the hypothesis presented in this analysis, the major sources of correction would lead to a +/- 10% correction on the manufacturing cost (if all parameters are cumulated)

• These results are open for discussion. We can reevaluate this circuit with your information. Please contact us:o Consulting and Specific Analysis

– North America: Steve LaFerriere, Director of Northern America Business Development, Yole Inc.Email: [email protected]

– Europe: Lizzie Levenez, Europe Middle East and Africa Business Development Manager, Yole DéveloppementEmail: [email protected]

– Japan: Yutaka Katano, General Manager, Yole Japan & President, Yole K.K.Email: [email protected]

– RoW: Jean-Christophe Eloy, President & CEO, Yole DéveloppementEmail: [email protected]

o Report business

– North America: Steve LaFerriere, Director of Northern America Business Development, Yole Inc.Email: [email protected]

– Europe: Fayçal El Khamassi, Headquarter Sales Coordination & Customer Service Email: [email protected]

– Japan & Asia: Takashi Onozawa, Sales Asia & General Manager, Yole K.K.Email: [email protected]

– Korea: Hailey Yang, Business Development Manager, Korean OfficeEmail: [email protected]

o Financial services

– Jean-Christophe Eloy, CEO & PresidentEmail: [email protected]

o General: Email: [email protected]

Samsung’s Galaxy S7 Processor Packages: Qualcomm & Shinko’s MCeP vs. Samsung’s PoP 2016...

Technology

Transcript of Samsung’s Galaxy S7 Processor Packages: Qualcomm & Shinko’s MCeP vs. Samsung’s PoP 2016...