Plymouth Electron Microscopy Centre Multi-Scale ...Carl Zeiss Microscopy 5. Live Imaging High...
Transcript of Plymouth Electron Microscopy Centre Multi-Scale ...Carl Zeiss Microscopy 5. Live Imaging High...
Plymouth Electron Microscopy CentreMulti-Scale Characterization for Multi-Scale Research
ZEISS Crossbeam
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Diverse Fields of Application…
Materials Research
• Task: Understand and tailor physical properties of materials. Develop new materials.
• Examples: Steels, Alloys, Polymers, Ceramics, Composites
• Image: Manganese sulfide inclusions in steel. Courtesy of Georgsmarienhütte GmbH, Germany
Earth & Planetary Sciences
• Task: find new profitable deposits of natural resources
• Examples: Oil&Gas (sedimentary rocks, shale), Mining
• Image: Pyrites and voids in shale rock. Courtesy of NanoFUN, Poland
Electronics / Semiconductors
• Task: Design better and more efficient electronic devices. Failure Analysis.
• Examples: Semiconductors, Polymer Electronics, Photonics
• Image: Cross-Section of IC with Intel 22nm-Tri-Gate-technology. Courtesy of UBM TechInsights, Canada
Advanced Manufacturing
• Task: quality control of material systems used in different industries (e.g. automotive)
• Examples: Coatings, Oxidation, Corrosion, Irradiation
• Image: Crack in steel sheet. Courtesy of AUDI AG, Germany
Materials Development
• Task: Design materials and functional nanostructureswith improved or new physical properties
• Examples: Metamaterials, MEMS, Biomaterials
• Image: Focused-Ion-Beam Nanofabrication of Near-Infrared Magnetic Metamaterials, Enkrich et al. Adv. Mater. 17 (2005)
Life Sciences
• Task: understand structure and function of biological material
• Examples: Cell biology, Neurobiology, Histology, Zoology, Botany
• Image: drosophila larval brain. Courtesy of C. Shan Xu, HHMI, USA
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ZEISS CrossbeamAn essential tool for materials science
Imaging &
Analytics
Tomography
Sample
Prep
Nanopatterning
Maximum useable SEM and FIB FOV
Ag / Ni / Cu sample
Sample courtesy of D. Willer, MPA StuttgartImaging with Quad mode
…more information in less time
InLens
EsB
SE2
InLens + SE2
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Live ImagingHigh throughput SEM imaging while milling
FIB patterning of a spiral in Si.
Spiral pitch and line width are
150 nm and 20 nm, respectively.
Frames of a movie, InLens signal Same structure, ETSE signal
Multi-Scale Characterization of LIB Cathode Imaging & Analysis in the FIB-SEM
2 µm
InLens SE
2 µm
InLens EsB
2 µm Mn La
EDS
FIB-SEM
Preparation and Analysis of STEM SamplesHigh Resolution STEM and EDS Study of Cr Depletion in Stainless Steel
(A) STEM image of a grain boundary (GB) of heat affected a X2CrNi18-10 steel sample showing corrosion
(B) Chromium carbides form at the GB and cause chromium depletion of the matrix
(C,D) EDS analysis (15 kV) shows high spatial resolution and allows to quantify the extent of chromium depletion
Cr Fe
Pillars for Compression Tests High entropy alloy
Array milling = 13.5 h
(~33 min per pillar)
• Preparation of pillars for compression testing experiments
• Lathe milling was used to obtain perfectly perpendicular pillar walls.
• The lathe milling step was automatized using the API of the Crossbeam instrument.
FIB Direct Patterning
Array of annular shapes
Each shape is 450 nm in
diameter with 1 μm spacing
(pitch) between shapes
Nano-channels
FOV = 59 µm
3D Milling
3D structure milled into silicon
using Atlas 5 Nanopatterning
3D-Profiler tool
FOV = 30 µm
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FIB Direct Patterning
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Tomography with ZEISS Crossbeam
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FIBMilling
SEMImaging
=+ Nanotomography
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Sample: Resin-Embedded B. subtilis bacteriaCourtesy of Kedar Narayan, Subramaniam Group, NIH NCI, USA
High Resolution in 3DApplication to Biological Sciences
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High Resolution in 3DApplication to Biological Sciences
Aluminum Alloy 7075-T651
SEM @ 1.5kV, 5nA
820 slices
Voxel size = (10 x 10 x 10) nm³
Sample courtesy of N. Chawla and S. Singh, Arizona State University
High Resolution in 3DApplication to Materials Science
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courtesy of M. Cantoni, EPFL Lausanne
High Resolution in 3Dwith combined Imaging & Chemical Analysis
1.8 kV, Inlens SE
Voxel = (10 x 10 x 10) nm³
6 kV, EDS
Voxel = (40 x 40 x 100) nm³
Ag
Cu
5 µm
Lead free solder contains Sn,
Ag, and Cu.
High Resolution in 3DApplication to Earth & Planetary Science
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High Resolution in 3Dwith combined imaging, EDS & Structural Analysis…