Photovoltaic Energy Conversion Status and Research Directions · Solar thermal 0.4 GW Ocean power...
Transcript of Photovoltaic Energy Conversion Status and Research Directions · Solar thermal 0.4 GW Ocean power...
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Photovoltaic Energy Conversion Status and Research Directions
Siva Sivoththaman
Centre for Advanced Photovoltaic Devices and SystemsElectrical and Computer Engineering
University of Waterloo
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Outline of the Talk
Energy consumption and environmentImpact of PV technologyTechno-economics of PVGrowth predictionsCurrent Applications (space, terrestrial)Fa
cts
& F
igs
Bulk crystals for PVThin film PV materialsDevice architecturesLosses and Theoretical Limitations
New technologiesAdvanced conceptsNano-structured materialsNew device architectures
Centre for Advanced Photovoltaic Devices and SystemsResearch strategyCurrent Research
Tech
nolo
gyR
esea
rch
UW
CA
PD
S
.
1973 2005
4700
Mtoe
7912
Mtoe
68%
1973 2005
27136
15661
Mt
Mt
73%
13.1%
48.2%
14.3%
13.5%9.3%
1.6%
8.3%
43.4%
15.6%
12.9%
16.3%
3.5%
coal
oil
gas
waste
electricity
other
increase in world energy use CO2 emission
1973 2005
World energy consumption and the environment
OECD OECD
nonOECD
nonOECD
700
445
Qua
drill
ion
BTU
s
world energy usage prediction
2004 2030
200
400
600
800
1980 1990 2000 2010 2020 2030
Qua
drilli
on B
tu
year
634
773high growth
low growthCO2 capture and storage (CSS) activities of future
post combustion CSSpre combustion CSSoxyfuel combustionindustrial processes
-electricity sector can take the highest share of CSS
Wind Biomass Geo PV
59 GW 44 GW 9.3 6.2 GW
Hydro 800GW
Solar thermal 0.4 GWOcean power 0.3 GW
Sustainable Energy - Existing electricity generation capacity ( 2005)
(num
bers
IEA
)
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Photovoltaics today: facts and figures
0 0.5 1 1.5 2 2.5 3
1995
1996
1997
1998
1999
2000
2001
2002
2003
2004
2005
2006
Annual PV production
Gigawatts
2005
2006 com m ercial grid res idential grid
res idential grid
rem ote
rem otecom m ercial grid consum er
25% 56% 15% 4%
43% 42% 13% 2%
major application areas of PV
crys tallines ilicon
thinfilm s
7%
93%34%
56%
3%
4%
2%
1%
single crystalline Si
multi crystalline Si
Si ribbons
Siliconthin films
CdTethin films
CIGSthin films
Base semiconductors for PV – 2005 market share
0 1 2 3 4 5 6 7 8 9
1995
1996
1997
1998
1999
2000
2001
2002
2003
2004
2005
2006
PV priceevolution
$ / Watt
.
Photovoltaics tomorrow: growth predictions
0
2
4
6
8
10
12
2006 2007 2008 2009 2010 2011
conservative
accelerated
year
Gig
awat
tspredicted PV growth scenarios
55%
10%
9%
9%
17%
50%
20%
30%
PV module
back-endelectronics
installation costs
BOS
other
silicon material
cell processing
module processing
PV cost breakdownCurrent Technology (crystalline silicon)
SYSTEM MODULE
0.E+00
1.E+08
2.E+08
3.E+08
4.E+08
5.E+08
6.E+08
7.E+08
2005 2010 2015 2020 2025
MWh
year0.E+00
5.E+05
1.E+06
2.E+06
2.E+06
3.E+06
3.E+06
4.E+06
2005 2010 2015 2020 2025
jobs
year
estimated PV electricity production
estimated PV jobs
Eur
opea
n C
omm
issi
on, A
Vis
ion
for P
V 2
005)
.
Photovoltaics tomorrow: growth predictions
(Ger
man
Adv
isor
y C
ounc
il on
Glo
bal C
hang
e)
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Photovoltaics tomorrow: environmental impact
energy used in PV production
300 MJ/kgdirect metallurgic process
500 MJ/kgfluidized bed reactor process
1070 MJ/kgimproved Siemens process
process energy used in poly-silicon production
energy input: process energy, material consumption
energy embedded in materialslaminates, frames, mg-Si..
poly-Si process energy is nearly 30% of total primary energy input for a multicrystalline Si PV module
ingot growing, wafering..
overhead facilitiesprocess area climate control, de-ionized water plant, compressed air,..
emissions in PV productionCO2 emission in silica reductionfluorinated gases – cell processingNOx gasesvolatile organic compounds
energy pay-back time (EPBT) =energy input
energy saved / year(years)
energy input: manufacturing, installation, operation, decommissioning(for whole life-cycle)
energy saved: annual energy savings due to generated PV electricity
energy return factor (ERF) = energy input(energy saved / year) * lifetime
8.713.83.102.02Los Angeles
7.09.33.742.9Oslo
7.711.93.442.32Vancouver
8.813.13.062.13Ottawa
10.117.92.711.59Perth
FacadeRoof-topFacadeRoof-top
ERFEPBT (years)
0.E+00
5.E+07
1.E+08
2.E+08
2.E+08
3.E+08
3.E+08
4.E+08
4.E+08
2006 2010 2014 2018 2022
tons
year
Predicted CO2 emission reduction by PV
(EP
IA, S
elec
ted
envi
ronm
enta
l ind
icat
ors)
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photovoltaic cells: basic operation
hν1 hν2 hν3photons
e- h+
e- h+
p-type semiconductor
n-type
valence band
conduction band
EG
E1
E2
photon absorption
valence band
conduction band
EG
E1
E2
photon absorption
phonon absorption
emission
photon absorption in semiconductors
direct bandgap indirect bandgap
(over)simplified schematic of a solar cell
voltage
curre
nt
VOC
JSC
JP, VP
maximumpower point
rs
rshJph
d1 d2V
Iin
tern
al q
uant
um e
ffici
ency
, IQ
E (%
)
wavelength, λ
efficiency (η) = JSC * VOC *FF
∑ P(λ) dλ
IQE ≈JSC(λ)
q [1 – R(λ)] f(λ) [exp(-αλ)WOPT] – 1]
Internal quantum efficiency
emitter
base
electrodes
.
photovoltaic cells and interconnection
glass
encapsulant
solar cell
back layer
frame
interconnector
cellmodule
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Technology: bulk crystals for photovoltaics
0.E+00
2.E+04
4.E+04
6.E+04
8.E+04
1.E+05
1.E+05
2005 2006 2007 2008 2009 2010
PV indus try
Electronic Indus try
tons
polysilicon feedstockSiO2 or quartzite
metallurgical grade silicon
chlorosilanes
high purity SiHCl3
polycrystalline silicon
SiO2 + C Si + CO2
99% pure
Si + HCl SiHxCly
reduction with H2
(≈ $2 / kg)
(≈ $50 / kg)
separation and purification
process sequence for semiconductor grade silicon
99.999999999% pure
PV requires “6N” pure (>99.9999%)
material purity and PV device performance
(J R Davis et al, IEEE Trans. Elect. Dev., 1980)
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Technology: bulk crystals for photovoltaics
seed
crystal ingot
neck
Si melt
d1
d2
V2
V1
crucible
V2 d22 = V1 d1
2
melt
d1
d2
seed
V1
V2
RF coil
crystal ingot
poly-siliconfeed rod
V2 d22 = V1 d1
2
Czochralski Process Float Zone Process
growth speed: 1- 2 mm / minute
uses crucible
long heat-up and cool-down duration
high oxygen content ( > 1018 / cm3)
high carbon content (> 1017 / cm3)
carrier lifetime in microseconds range
ingot diameter up to 200 mm
Si feed can be in any form.
growth speed: 3- 5 mm / minute
no crucible
relatively short heat-up and cool-down
low oxygen content ( < 1016 / cm3)
low carbon content (< 1016 / cm3)
carrier lifetime in milliseconds range
ingot diameter up to 150 mm
Si feed must be crack-free rod.
PV devices based on FZ-Si result in 10% - 20% superior performance compared to Cz Si.
Direct Cast Process – multicrystalline silicon
melt
ingot
Random, columnar grains
Dislocations, impurities
Simplicity compared to Cz or FZ
Relatively lower cost process
Mainly used for PV applications
Performance inferior to FZ, Cz
Czochralski reactorat UW-CAPDS
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Technology: bulk crystals for photovoltaics
molten silicon
crucible
silicon ribbon
meniscus capillary slot
die
dendrite seed
button
silicon melt
webbounding dendrite
bounding dendrite
substrateribbon transport
silicon melt
silicon ribbon
casting die crystalgrowth
Dendritic web technique (WEB) Edge-defined film-fed growth (EFG)
Ribbon growth on substrate (RGS)
When lowered into the
melt, the seed spreads to
form the button.
Secondary dendrites
propagate from the ends
of the button, forming the
frame.
slotted graphite die controls the geometry of the ribbon.silicon is fed via capillary action and gets in touch with the seed crystal.
direction of crystallization and growth are perpendicularAfter cooling, the Si foil is separated from the substrate, which is re-usable.
≈ 12 cmup to 1000 cm/minRGS
≈ 12 cmup to 2 cm/minEFG
≈ 8 cmup to 2 cm/minWEB
WidthPull speed
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Technology: thin films for photovoltaics
amorphous silicon
Van
ecek
et a
l., J
. Non
-Cry
stal
line
Sol
ids,
199
8.
photon energy (eV)
abso
rptio
n co
effic
ient
(cm
-1 )
amorphous silicon deposition methods
high deposition rates, uniformity not excellent50 angs / secondμ-wave PECVD
high deposition rates, uniformity not excellent50 angs / secondHotwire CVD
high quality, uniform films, slow1 angs / secondPhoto CVD
high deposition rates, uniformity not excellent15 angs / secondVHF PECVD
high quality, uniform films, slow3 angs / secondRF PECVD
high quality, uniform films, slow3 angs / secondDC PECVD
very poor quality, slow3 angs / secondSputtering
Generally observed propertiesTypical maximum deposition rates
RF
film is deposited by de-composition of silane
Typical RF-PECVD system
optical absorption property of a-Si
1.72 eV
Donor-like tail states
Acceptor-like tail states
density of gap states in a-Si
VHF and HW CVD have potential for future, high throughput manufacture for PV.
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Technology: thin films for photovoltaics
copper indium (gallium) selenide, Cu(InGa)Se2 cadmium teluride (CdTe)
deposition methods
A uniform film is first obtained by low temperature deposition of Cu, In, and Ga.The film is then annealed in a Se atmosphere, in the 400 - 600ºC range.Cheaper options available.
Two-step process(selenization)
The constituents, Cu, In, Ga, Se, etc., are co-evaporated onto the substrate.Substrate temoerature: 400 - 600ºCType of evaporation: thermalThis can described as a single step deposition process.
co-evaporation
energy gap ≈ 1.02 eV
high absorption coefficient: 105/cm at 1.4 eV
reported mobilities: 200 cm2/Vs for
Cu(InGa)Se2 with about 1017/cm3 hole
concentration; electron mobilities in single
crystals 90 -900 cm2/V-s
some properties
some deposition methods
From CdTe target, 10-4 torr, substrate temperature 200ºCRate: 0.1 μm/min
Sputter deposition
evaporation of stoichiometric CdTe results in a stoichiometric composition of the vapor. High quality material can be deposited at very high rates(1-5 μm/min) at substrate temperatures of 450–600 ºC.
Close spaced sublimation (CSS)
some properties
optical bandgap: 1.5 eV +/- 0.01 eVabsorption coefficient: 6 x 104 cm-1 at 600 nmelectron mobility: 500 – 1000 cm2/V-shole mobility: 50-80 cm2/V-s
CSS process
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Technology: materials and performance
(Goe
tsbe
rger
, Mat
. Sci
. Eng
., 20
03)
Effi
cien
cy (%
)
Semiconductor bandgap, eV
Semiconductor properties and PV device performance
bandgap
type of semiconductor: direct or indirect
solar spectrum (AM 1.5)
controllability (defects, doping,..)
device design
technological feasibility
9 – 12%17%CdTe
32%GaInP/GaAs/Ge multi junction
9% - 13%19%CuIn(Ga)Se2
6% - 7%Amorphous Silicon (single junction)
9% - 10%13%Amorphous silicon (multi-junction)
13% - 17%24.7%Single crystalline silicon
Efficiency – industrialEfficiency - LaboratoryPV material
some typical numbers on current technology
terre
stria
l
space
material availabilitytoxicity issues
large scale manufacturabilitylong term stability
.
(M. G
reen
, UN
SW
)
high efficiency devices based on single crystalline silicon
“passivated emitter and rear cell”(PERC)
“passivated emitter, rear locally diffused” cell(PERL)
locally diffused back surface fieldminimal metal contact area
deeper emitter under metal contactsshallow junctions
inverted pyramid structure for optical confinementoxide passivation to reduce surface recombination
Technology: photovoltaic device architectures
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Technology: photovoltaic device architectures
amorphous silicon / crystalline silicon heterojunctions
high efficiency devices with amorphous/crystalline Si heterojunction
(Tag
uchi
et a
l., P
rog.
In P
V, 2
000)
low temperature process
good interfacial passivation can be obtained
emitter and back surface field are formed in non-diffusion
processes
a-Si layers are thin, contribute little to the power generation, so
stability problems (Staebler Wronski effect) are minimal.
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Technology: photovoltaic device architectures
amorphous silicon thin film cells
glass
p-type a-SiC:HSnO2:F
intrinsic a-Si:H
n-type a-Si:HTCO (ZnO or ITO)Al or Ag
simple p-i-n cell structure
+ -few hundred nm
p
i
n+
-
EF
p i n
schematic band diagram
a-Si:H
(i)
a-Si:H/a-SiGe:H
(i)
a-SiGe:H
(i)
p p pn n n
ITO Zn
O
Ag
triple junction device
tunneljunction
tunneljunction
hν
hν
1.8 eV 1.6 eV 1.4 eV
Rec
h, A
ppl.
Phy
s. A
, 199
9)
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Technology: photovoltaic device architectures
copper indium (gallium) selenide devices
cadmium teluride (CdTe) devices
high lab efficiencies approaching 19% have been reported.
commercial modules have reached 13% efficiency.
heterojunction is achieved by chemical deposition of a CdSlayer from a solution containing Cd-ions
due to the intermixing of the CdS and the CdTe layer, not an abrupt heterojunction but a graded gap structure is formed.
Goe
tzbe
rger
, Mat
. Sci
. Eng
. 200
3
.
Technology: photovoltaic device architectures
space cells, high conversion efficiency
( tend to reach 40% conversion efficiencies under concentrated light)
http://www.spectrolab.com/prd/prd.asp
current 1-Sun efficiency ≈ 31%
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Photovoltaic devices: performance limits
thermallization
transmission loss
junction loss
recombination
contact loss
loss mechanisms in a single junction device
(Noz
ik, A
nn. R
ev. P
hys.
Che
m.,
2001
)
carrier relaxation/cooling dynamics
*h
*e
Ge
mmEhE
+
−=Δ
1
ν ( ) eGh EEhE Δ−−=Δ ν
future advanced research approach tend to minimize the losses, make maximal usage of available photons, and, to break what has so far been considered as theoretical performance limits of the technology.
.
crystalline silicon based photovoltaics and thin films
the market share of these technologies will continue for the foreseeable period
R&D on PV-specific bulk crystals continue to be carried out successfully (MG-grade, feedstock refinement, ribbons)
high efficiency device designs and advanced fabrication technologies will contribute to enhanced device performance
Improved a-Si based techniques and CIGS technology will also continue to grow
future R&D approaches for ultra-high performance
theoretically proven concepts, many yet to be demonstrated
considered to be topics of medium to long term research
research efforts are still small and definitely need growth
some examples are:
intermediate band photovoltaic devicesquantum dot devicesspectrally engineered devicesmultiple junction approaches
Photovoltaic devices: approaches for increased cost performance
.
Advanced approaches: intermediate band photovoltaic devices
conduction band
valence band
intermediateband
the intermediate band concept exploits the two-step absorption of subbandgap photons via a half filled intermediate band (IB) located within the semiconductor gap.
electrons can be excited by a single high energy photon, or in 2 steps using two lower energy photons.
theoretical efficiency limit is > 80% !
semiconductor base with intermediate band
p-emittern-emitter
metal contacts
Practical implementation is challenging.
Use of quantum dots is a possibility. Quantum dots can produce an
electron level within the host semiconductor, therefore a quantum
dot superlattice can lead to intermediated band.
schematic of a semiconductor base with intermediate band and absorption processes.
the intermediate band base material should be placed between two “regular” semiconductors, one n-doped, the other p-doped.
n pbase
.
Advanced approaches: quantum dot photovoltaic devices
(Noz
ik, P
hysi
caE
, 200
2)
one photon creates two electron hole pairs
impact ionization
theoretical efficiency limit >80%
example configuration
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Advanced approaches: spectral engineering
λ1λ2
λ2
λ3λ4
λ3 λ3 > λ4
λ2 > λ1solar cell
solar cell
down conversion layer
isolation
metal contact
isolation
up conversion layer
metal contact orbifacial structure
“peripheral approach” - without changing much the core structure of the device
broaden the range of harvestable photons in the solar spectrum.
down conversion
up conversion
quantum dots
silicon nanostructures, nanowires
erbium-doped up-converters
nanostructured materials doped with ions
transition metal-based
organic materials
(strumpel et al., Sol. Mat. Sol. Cells., 2007)
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Advanced approaches: multiple junction approaches
multi-junction (tandem) solar cells - high efficiencies for spaces and terrestrial applications
over 30% one-sun efficiencies achieved
InGaP/InGaAs/Ge and InGaP/GaAs/InGaAs triple-junction devices
(Yamaguchi, Physica E, 2002)
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CAPDS Research: Current activities within the group
Semiconductor feedstock, crystal growth, and characterization
Flexible spherical silicon PV technology
Technology for silicon based thin films
Silicon nanostructures and quantum dots for future PV
Theoretical modeling of advanced devices
Photovoltaic device fabrication and testing
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CAPDS Research: silicon feedstock, crystals, and characterization
Research on low-cost silicon materials for PV
200 μm
Fused silicon from powder Recrystallized silicon
150 μm
piriform silicon granular silicon
0
0.2
0.4
0.6
0.8
1
500 510 520 530 540 550
Wavenumber (1/cm)
Ram
an S
igna
l (a.
u.)
G-Si Cz-SiP-Si G-Sph P-Sph
Raman shift spectrum for different Si particles
0.003
0
0.2
0.4
0.6
0.8
1
B P Al
Con
cent
ratio
n R
atio Ideal
SIMSimpurity concentrations before and after recrystallization
Annealed 925 ºC
P-DiffusedDenudedRecrystalliz-ed
Annealed 850 ºC
Annealed 850 ºC
0
0.5
1
1.5
2
2.5
Life
time
(µs)
crystallization of of powdered silicon
crystal defect analysis
crystal quality
doping
electronic properties – minority carrier lifetime
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CAPDS Research: flexible spherical silicon PV technology
500 μm500 μmrs
rsh
iph
rsrsh
iph
p
n+
original emitter
p
n+
original emitter
From basic materials to devices
advanced device designsanalysis
testing
Material improvement techniques
Selective emitter devices
Surface-passivated devices
Technological implementation
.
CAPDS Research: silicon thin film technology for photovoltaics
Transmission electron micrograph
Electrical conductivitycrystallinity
Development of low-temperature Si films with high crystal quality
Compatibility with temperaturte-sensitive, low-cost Sisubstrates
Dopant control,and activation linked crystallinity
Technology leads to a new, low temperature process sequence
as-deposited films after rapid opto-thermal processing
New technology for planar photovoltaic devices
.
CAPDS Research: nano-structures for future advanced PV
upright silicon nanopillarsPhotoluminescence – Si nanowires
oxide/nitride coated Si nanowiresCdSe quantum dots
Photoluminescence – CdSe quantum dots
Simple fabrication technologies for silicon nanopillars
Nanowires with diameter is further reduced by post-process opto-thermal oxidation
Nanowires detachable, substrate re-usable
Deployment of nanowires and quantum-dots in photovoltaic devices as photon shifting as well as active components in advanced devices.
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CAPDS Research: PV device fabrication technologies
Low-T epitaxial pn junctions
Junction formation by RTP-annealed amorphous Si films
Shallow boron diffused junctions by RTP
“pyramidal” texturing for optical confinement pyramidal structures wit upright nanowires
Low-thermal budget techniques for formation of device quality pn junctions
Develop processes that are compatible with low-cost, temperature substrates
Advanced design and optical confinement features for performance enhancement.
Practically abrupt junctions are obtainable by the new low-T epitaxial process.
High process yields possible
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CAPDS Research: PV device fabrication technologies
New technology
A new technology has been developed recently, resulting in a simple low-temperature process.
The technology employs quasi-epitaxialfilms on silicon substrates.
Compatibility with low-cist siuliconsubstrates.
Technology was demonstrated on low-lifetime multicrystalline silicon substrates and performance independently confirmed.
Process will yield high conversion efficiencies when applied to single crystalline silicon.
.
SUMMARY
An overview of the current world energy situation and the place of photovoltaics as an energy source has been presented.
Future growth predictions has been outlined for photovoltaic technology.
While the current growth rate will be maintained for a foreseeable future, new PV technologies players will be slowly introduced, ultimately changing the market share in the long-run.
Some key areas for further research in PV materials and devices has been presented.
Some current PV research activities at Waterloo has been presented.
.
ACKNOWLEDGEMENT
The contributions of my current and recent-past graduate students are highly appreciated.
Ms. Hua BaiProf. Mahdi Farrokh BaroughiDr. Stella ChangDr. Majid GharghiMr. Hassan El-GoharyMs. Bahareh SadeghimakkiMs. Cherry ChengMr. Roohollah Samadzadeh TarighatMr. Behzad EsfandyarpourMr. Abdulla Bin Ishaq