MXM Electro Spec

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Specification

MXM Graphics ModuleMobile PCI Express ModuleElectromechanical Specification

SP-01106-001_v1.0May 2004


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Document Change History

Version Date Reason for Change

1.0 05/14/04 Initial Release


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Table of Contents

Document Change History..............................................................................................iOverview .......................................................................................................................1

Key Features ..................................................................................................................... 1Configurations ................................................................................................................... 2Display Options ................................................................................................................. 2

MXM Display options...................................................................................................... 3IGP and MXM .................................................................................................................... 3

Mechanical Specifications .............................................................................................4Mechanical Description....................................................................................................... 4Mounting and Retention....................................................................................................12MXM Compatibility ............................................................................................................12Mechanical .......................................................................................................................12Keep Out Definitions.........................................................................................................12

Z-Height Restrictions ....................................................................................................13Surface Keep Outs........................................................................................................15

Mechanical Keep Out Drawings..........................................................................................16MXM Module Keep Outs................................................................................................17

Mechanical Requirements..................................................................................................30Backing Plate ...............................................................................................................30Thermal Solution Mounting ...........................................................................................30

Electrical Specifications...............................................................................................31PCI Express Support .........................................................................................................31Electrical Connector..........................................................................................................31Connector Pin Descriptions................................................................................................37Power Requirements.........................................................................................................39Power Throttling ...............................................................................................................40System Requirements .......................................................................................................40

Display Requirements ...................................................................................................40Other Requirements .....................................................................................................41

Additional Function Support...............................................................................................42


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Appendix: Support Information ..................................................................................43Configuring Notebook for MXM with IGP ............................................................................43

Configurable Option......................................................................................................43Upgradeable Option......................................................................................................44


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List of Figures

Figure 1. Display Options ................................................................................................. 3Figure 2. MXM Form Factor.............................................................................................. 5Figure 3. MXM-I Topside.................................................................................................. 6Figure 4. MXM-II Topside................................................................................................. 7Figure 5. MXM-II Backside ............................................................................................... 8Figure 6. MXM-III Topside ..............................................................................................10Figure 7. MXM-III Backside.............................................................................................11Figure 8. MXM Side View, Top and Backside Height Restrictions for MXM Modules..............16Figure 9. MXM-I Top Surface Keep Outs ..........................................................................17Figure 10. MXM-I Bottom Surface Keep Outs .....................................................................18Figure 11. MXM-II Top Surface Keep Outs .........................................................................19Figure 12. MXM-II Bottom Surface Keep Outs ....................................................................20Figure 13. MXM-III Top Surface Keep Outs........................................................................21Figure 14. MXM-III Bottom Surface Keep Outs...................................................................22Figure 15. MXM-I Z-Height Restriction Zones .....................................................................23Figure 16. MXM-II Topside Z-Height Restriction Zones........................................................24Figure 17. MXM-II Bottomside Z-Height Restriction Zones...................................................25Figure 18. MXM-III Topside Z-Height Restriction Zones ......................................................26Figure 19. MXM-III Topside Z-Height Restriction Zones (Continued)....................................27Figure 20. MXM-III Topside Z-Height Restriction Zones (Continued)....................................28Figure 21. MXM-III Bottomside Z-Height Restriction Zones .................................................29Figure 22. MXM Connector Motherboard Footprint..............................................................32Figure 23. MXM Connector Top Down and Side View..........................................................33Figure 24. MXM Card Edge Finger Pattern..........................................................................34Figure 25. Notebook Output Topology with IGP .................................................................44Figure 26. Notebook Output Topology with IGP .................................................................44


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List of Tables

Table 1. Board Configurations ......................................................................................... 2Table 2. MXM Display Options......................................................................................... 2Table 3. Height Restrictions ...........................................................................................15Table 4. Connector Pinout..............................................................................................35Table 5. Connector Pin Descriptions ...............................................................................37Table 6. Power Requirements ........................................................................................39


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Overview

The Mobile PCI Express Module (MXM) is a consistent graphics interface for PCIExpress notebooks. The specification describes the electromechanical interfacesincluding feature set, dimensions, connector pinouts and electrical interfaces foreach MXM Graphics Module. The MXM graphics modules consist of a standardsingle 230-pin edge connector in which all Input/Outputs are routed through.

Key Features

Low cost Small size Scalable performance 16 lane PCI Express support LVDS panel support Dual DVI support VGA support Video out support Upgradeable graphics


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MXM Electromechanical Specification

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Configurations

Table 1 lists the dimensions and maximum power for the three MXM graphicsmodule types.

Table 1. Board Configurations

MXM Type Width Length Power

MXM-I 70 mm 68 mm Up to 18 W

MXM-II 73 mm 78 mm Up to 25 W

MXM-III 82 mm 100 mm Up to 35 W

Display Options

Table 2 lists the MXM graphics boards display options.

Table 2. MXM Display Options

Display Options MXM Display Solutions

VGA Routed to either VGA or DVI-I connectors onmotherboard

Two single-link DVI orone dual-link DVI

DVI routed to connector on motherboardand/or through docking station

Video out Video out routed to connector on motherboard,

Supports Composite, S-Video and HDTV

Single dual-link LVDS LVDS routed to connector on the motherboard.


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MXM Display options

MXM is capable of supporting the following interfaces:

One dual-link LVDS panel display One TV output One VGA output One dual-link TMDS or two single-link TMDS outputs to DVIAll interfaces are routed through the MXMs connector to the motherboard(Figure 1).

LVDS

MXM

TVOut VGA

DVI (2 Single or 1 dualLink)

Figure 1. Display Options

IGP and MXM

The MXM platform has been designed to co-exist with Integrated GraphicsProcessors (IGP). An IGP notebook designed to support MXM graphics modulescan be populated with or without a MXM graphics card. If no MXM graphicsmodule is present, installation of a loop through card is required to complete circuitpaths for LVDS signals and enable panel operation.


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MechanicalSpecifications

Mechanical Description

The MXM-I and MXM-II form factors (Figure 2 through Figure 5) accommodate

GPUs up to 35 mm 35 mm in size. The four holes surrounding the GPU are usedto mount the thermal solution. The two holes on the far end of the board are forstand-offs to mount to the notebook.


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Figure 2. MXM Form Factor


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Figure 3. MXM-I Topside


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Figure 4. MXM-II Topside


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Figure 5. MXM-II Backside


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The MXM-III form factor (Figure 6 and Figure 7) will accommodate GPUs up to40 mm 40 mm in size. The four holes surrounding the GPU are used to mountthe thermal solution. The two holes on the far end of the board are for stand-offs tomount to the notebook.


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Figure 6. MXM-III Topside


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Figure 7. MXM-III Backside


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Mounting and Retention

The MXM mounts to the notebooks motherboard through a 230-pin right angle

edge connector. The connector on the MXM is a card-edge connector consisting ofonly the PCB with plated contacts. The MXM graphics module is inserted at a 20 to30 degree angle and then rotated towards the motherboard and then screwed intomechanical mounting stand-offs. The stand-offs will maintain separation from themotherboard and also assist in the retention of the MXM. The stand-off locationswill be the same for all MXM graphics modules to allow one motherboard tosupport the three MXM graphics module types.

MXM Compatibility

The MXM has been designed to allow for compatibility between the three MXM

graphics module types. The notebooks mounting holes for the MXM are in thesame location for all MXM graphics modules.

MXM-I can insert into all notebooks that support MXM graphics modules. MXM-II can insert into notebooks that support MXM-II and MXM-III modules. MXM-III modules only insert into notebooks that support a MXM-III module volumetrickeep outs.

MXM-III thermal solutions are incompatible with MXM-I and MXM-II. MXM-IIIaccommodates a maximum of a 40 mm 40 mm GPU package where as MXM-Iand MXM-II support a maximum of a 35 mm 35 mm GPU package.

Mechanical Keep OutDefinitions

Each of the three Mobile PCI Express modules (MXM) has distinct mechanicalkeep out zones. These keep out zones are a combination of z-height restrictions andsurface keep outs on the MXM PCB. The keep outs are necessary for system andthermal solution integration compatibility. These surface keep out volumes aredesigned to accommodate thermal solutions that dissipate the maximum power aparticular MXM graphics module is designed for and to allow mechanicalcompatibility between modules with an integrated thermal solution.

The rest of this section is devoted to defining the MXM-I, II, and III mechanical

restrictions in greater detail. The definitions provided are divided up into zoneson the MXM that define z-height restrictions, and surface keep outs. Writtendefinitions are followed by detailed mechanical drawings of each MXM with itsassociated restricted areas.


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Z-Height Restrictions

Topside Zone A: Maximum Z Height on Topside of PCB.

The maximum height from the surface of the MXM PCB that any surfacemounted component, or other attribute of the MXM may extend above thePCB surface. The thermal solution is not restricted by this blanket heightrestriction.

Zone C: GPU Spreader Plate.A thermal spreader plate is required to assist in cooling the GPU. Thisrestriction defines the maximum topside component height under this spreaderplate.

Zone D: Memory Area Opposite the Edge Connector.A restriction is defined on all three MXM graphics modules under memoryspreader plates. The memory spreader plates are broken into two separate keep

out regions because of unique geometric requirements for each. The D zoneis associated with the memory located directly opposite the PCBs edgeconnector. On the highest power consuming modules, the zone D memoryspreader plate will be an integral part of the GPU spreader. On the lowestpower MXM-I and II modules, the memory spreaders could be made designoptions or removable.

Zone D-IDefines the z-height restriction in the D-zone for MXM-I. This zone isdesigned to accommodate power supply components for configurations withtwo memories on the MXM PCB.

Zone D-IIDefines the z-height restriction in the D-zone for MXM-II and is equivalent

to Zone D-I in order to maintain thermal solution compatibility betweenMXM-I and MXM-II.

Zone D-IIIDefines the z-height restriction in the D-zone for MXM-III and isnotrequired to be compatible with the thermal solution for MXM-I or MXM-II,and has unique requirements.

Zone E: Memory Area on Topside to Right of the Edge ConnectorDefines the z-height restriction for all components except for memories. Thisarea is along the right-hand edge of the MCM PCB as viewed from the topsideof the MXM with the connector edge at the bottom position.

Zone F: Topside System Integration.There are two holes in each MXM graphics module set aside for mechanically

attaching the MXM to a notebook computer system. A cylindrically shaped zeroheight keep out region has been defined on the topside of the MXM in order toallow for an attachment feature from the notebook system to extend onto theMXM and in combination with a fastener to hold the MXM securely in place.


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Zone G: Topside Heat Pipe Exit RoutingIf a heat pipe(s) is (are) used as a portion of the cooling solution or some othersimilar means is used to transfer heat from the GPU spreader plate to a remoteheat exchanger, this height restriction defines the maximum component height

restriction in the three locations where the heat pipe may transition off of thePCB. The zones are oriented with the edge connector down in the 6 o-clockposition.

Zone G1Defines the maximum height of any board component in the area of theMXM and the restriction extends to the left/9-oclock of the GPU beyondthe GPU spreader plate.

Zone G2Defines the maximum height of any board component in the area of theMXM and the restriction extends to the top/12 o-clock of the GPUbeyond the memory or GPU spreader plate.

Zone G3Defines the maximum height of any board component in the area of theMXM and the restriction extends to the right/3 o-clock of the GPUbeyond the memory or GPU spreader plate.

Backside Zone B: Maximum Z-Height on Backside of the MXM PCB

The maximum height from the surface of the MXM PCB that any surfacemounted component and/or other attribute of the MXM may extend below theMXM surface with the exception of back side memory and that memory'sassociated thermal solution. Zone B defines the general z-height restriction. Forthe MXM-III only, the backing plate may exceed the 1.2 mm height restriction.

Zone H: Backside Memory Near the Edge ConnectorZ-height restriction under the thermal spreader centered on the memory on thebackside of the PCB opposite the edge connector.

Zone J: Backside Memory Opposite the Edge ConnectorZ-height restriction under the thermal spreader centered on the memory on thebackside of the PCB not opposite of the edge connector.


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Surface Keep Outs

Topside

Surface Keep Out 1: Thermal Solution Attach.Surface keep outs are defined surrounding the thermal integration through holesin the PCB in order to accommodate varied thermal solution designs andgrounding of the thermal solutions to reduce EMI.

Surface Keep Out 2: System Integration - Top.Holes in the MXM PCB have been defined for mechanical integration of theMXM into a notebook system. There are topside surface keep outs definedsurrounding these system integration through holes.

Surface Keep Out 3: Edge Connector.This is space reserved on the topside of the MXM for appropriate edgeconnector design and integration.

Backside Surface Keep Out 4: System Integration - Bottom.

Holes in the MXM PCB have been defined for mechanical integration of theMXM into a notebook system. There are bottomside surface keep outs definedsurrounding these system integration through holes

Surface Keep Out 5: Edge Connector.This is space reserved on the bottomside of the MXM for appropriate edgeconnector design and integration.

Table 3 defines the height restrictions and surface keep outs on the top and back ofMXM-I, MXM-II and MXM-III.

Table 3. Height Restrictions

MXM Z-Height Restriction Keep Out Zones

Topside (mm) Bottomside (mm)

A,F 3.5 B 1.2

C 1.84 H 0.66

D-I, D-II 2.00 J 0.66

D-III, E 0.66

G 2.64

Note: There is a 0.25 mm air gap maintained between the maximum allowed z-height from the backside of the MXM and the maximum z-height allowedon the topside of the motherboard directly under the MXM.


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Mechanical Keep OutDrawings

The mechanical drawings shown in this section explicitly define the z-heightrestricted zones and surface keep outs.

Figure 8 shows the general z-height restrictions for all MXM graphics modules.

Figure 8. MXM Side View, Top and Backside HeightRestrictions for MXM Modules


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MXM Module Keep Outs

Figure 9 through Figure 14 define the top and bottom surface keep outs for MXM-I, MXM-II and MXM-III.

Figure 9. MXM-I Top Surface Keep Outs


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Figure 10. MXM-I Bottom Surface Keep Outs


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Figure 11. MXM-II Top Surface Keep Outs


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Figure 12. MXM-II Bottom Surface Keep Outs


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Figure 13. MXM-III Top Surface Keep Outs


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Figure 14. MXM-III Bottom Surface Keep Outs


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Figure 15 through Figure 21 show the mechanical drawings of the top and back ofthe MXM-I, MXM-II, MXM-III and define the z-height restriction zones. In caseswhere z-height restriction zones overlap, the most restrictive of the overlappingzones will always take precedence.

Figure 15. MXM-I Z-Height Restriction Zones


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Figure 16. MXM-II Topside Z-Height Restriction Zones


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Figure 17. MXM-II Bottomside Z-Height Restriction Zones


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Figure 18. MXM-III Topside Z-Height Restriction Zones


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Figure 19. MXM-III Topside Z-Height Restriction Zones (Continued)


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Figure 20. MXM-III Topside Z-Height Restriction Zones (Continued)


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Figure 21. MXM-III Bottomside Z-Height Restriction Zones


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Mechanical Requirements

Backing Plate

Each MXM graphics module requires a mechanical backing plate design that shallbe implemented as needed to compensate for a warped board resulting fromthermal solution loading requirements. For MXM-I and MXM-II the backing plateis contained within the 1.2 mm universal z-height restriction. For MXM-III only, thebacking plate is allowed to exceed the 1.2 mm height restriction.

This backing plate can be unique for each MXM design. In MXM configurationsthat have memory on the backside of the PCB, the memory and the portion of thecooling solution covering the memory may exceed the Zone-C height restriction.

Thermal Solution Mounting

The thermal solution is mounted to the MXM with M2.5 screws from thebottomside of the PCB. A specific screw size is defined to ensure inter-boardcompatibility because the backing plates may be unique to each MXM.


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ElectricalSpecifications

PCI Express Support

The Mobile PCI Express Module (MXM) supports a link of up to sixteen bi-

directional PCI Express differential signaling lanes. It is compliant with PCI ExpressBase Specification 1.0a except for power delivery and power management.Notebook power requirements supercede PCI Express power specifications. TheMXM does not support Hot-Plug insertion.

Electrical Connector

The Mobile PCI Express Module (MXM) utilizes a 230 circuit card-edge connectionsystem. The contacts are rated for 0.5 A steady state current. The connectoraccommodates card thicknesses of 1.2 mm and will initially have three differentconnector height options. The connector heights are 5 mm, 2.7 mm and 1.5 mm

surface to surface spacing between the MXM and the motherboard. Differentconnector heights can be developed in the future.

All external and internal notebook interfaces are routed through the MXMsconnector and down to the motherboard. The motherboard will then connect thesesignals from the MXM to the appropriate circuitry.

Figure 22 through Figure 24 describe the MXM connector. Table 4 lists theconnector pinout.


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Figure 22. MXM Connector Motherboard Footprint


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Figure 23. MXM Connector Top Down and Side View


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Figure 24. MXM Card Edge Finger Pattern

Card Edge Finger Pattern, Topside

Card Edge Finger Pattern, Bottomside

MXM Card Edge Finger Pattern, Side View


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Table 4. Connector Pinout

Pin# Signal Name Pin# Signal Name

1 PWR_SRC 2 1V8RUN

3 PWR_SRC 4 1V8RUN

5 PWR_SRC 6 1V8RUN

7 PWR_SRC 8 1V8RUN

9 PWR_SRC 10 1V8RUN

11 PWR_SRC 12 1V8RUN

13 PWR_SRC 14 1V8RUN

15 PWR_SRC 16 RUNPWROK

17 GND 18 5VRUN

19 GND 20 GND

21 GND 22 GND

23 GND 24 GND

25 KEY 26 KEY

27 KEY 28 KEY

29 KEY 30 KEY

31 KEY 32 KEY

33 KEY 34 KEY

35 KEY 36 KEY

37 PEX_RX15# 38 PRSNT2#

39 PEX_RX15 40 PEX_TX15#

41 GND 42 PEX_TX15

43 PEX_RX14# 44 GND


47 GND 48 PEX_TX14

49 PEX_RX13# 50 GND51 PEX_RX13 52 PEX_TX13#

53 GND 54 PEX_TX13

55 PEX_RX12# 56 GND


59 GND 60 PEX_TX12

61 PEX_RX11# 62 GND


65 GND 66 PEX_TX11

67 PEX_RX10# 68 GND


71 GND 72 PEX_TX10

73 PEX_RX9# 74 GND


77 GND 78 PEX_TX9

79 PEX_RX8# 80 GND


83 GND 84 PEX_TX8

85 PEX_RX7# 86 GND



89 GND 90 PEX_TX7

91 PEX_RX6# 92 GND


95 GND 96 PEX_TX6

97 PEX_RX5# 98 GND


101 GND 102 PEX_TX5

103 PEX_RX4# 104 GND


107 GND 108 PEX_TX4



113 GND 114 PEX_TX3



119 GND 120 PEX_TX2



125 GND 126 PEX_TX1



131 GND 132 PEX_TX0

133 PEX_REFCLK# 134 PRSNT1#

135 PEX_REFCLK 136 TV_C/HDTV_Pr137 CLK_REQ# 138 GND

139 PEX_RST# 140 TV_Y/HDTV_Y

141 RSVD 142 GND

143 RSVD 144 TV_CVBS/HDTV_Pb

145 SMB_DAT 146 GND

147 SMB_CLK 148 VGA_RED

149 THERM# 150 GND

151 VGA_HSYNC 152 VGA_GRN

153 VGA_VSYNC 154 GND

155 DDCA_CLK 156 VGA_BLU

157 DDCA_DAT 158 GND

159 IGP_UCLK# 160 LVDS_UCLK#

161 IGP_UCLK 162 LVDS_UCLK

163 GND 164 GND

165 RSVD 166 LVDS_UTX3#

167 RSVD 168 LVDS_UTX3

169 RSVD 170 GND

171 IGP_UTX2# 172 LVDS_UTX2#


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173 IGP_UTX2 174 LVDS_UTX2

175 GND 176 GND



181 GND 182 GND



187 GND 188 GND

189 IGP_LCLK# /DVI_B_CLK#

190 LVDS_LCLK#

191 IGP_LCLK /DVI_B_CLK

192 LVDS_LCLK

193 DVI_B_HPD /GND

194 GND

195 RSVD 196 LVDS_LTX3#

197 RSVD 198 LVDS_LTX3

199 GND 200 GND

201 IGP_LTX2# /DVI_B_TX2#

202 LVDS_LTX2#

203 IGP_LTX2 /DVI_B_TX2

204 LVDS_LTX2

205 GND 206 GND



208 LVDS_LTX1#


210 LVDS_LTX1

211 GND 212 GND


214 LVDS_LTX0#


216 LVDS_LTX0

217 DVI_A_HPD 218 GND

219 DVI_A_CLK# 220 DDCC_DAT

221 DVI_A_CLK 222 DDCC_CLK

223 GND 224 LVDS_PPEN

225 DVI_A_TX2# 226 LVDS_BL_BRGHT

227 DVI_A_TX2 228 LVDS_BLEN

229 GND 230 DDCB_DAT

231 DVI_A_TX1# 232 DDCB_CLK

233 DVI_A_TX1 234 2V5RUN

235 GND 236 GND

237 DVI_A_TX0# 238 3V3RUN

239 DVI_A_TX0 240 3V3RUN

241 GND 242 3V3RUN


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Connector Pin Descriptions

Table 5 contains pin descriptions for each signal type. All Input/Outputclassifications are relative to the MXM graphics module.

Table 5. Connector Pin Descriptions

Signal Name Input/Output Description

DVI_A_TX0-2,

DVI_A_TX0-2#Output, 100 Ohm Diff TMDS output for either single link DVI or dual

link DVI

DVI_A_CLK,DVI_A_CLK#

Output, 100 Ohm Diff TMDS clock for either single link DVI or duallink DVI

DVI_A_HPD Input DVI hot plug detect for DVI_A

DVI_B_TX0-2,

DVI_B_TX0-2#Output, 100 Ohm Diff TMDS output for either single link DVI or dual

link DVI, upper bits for dual-link. Note:these pins are shared with IGP LVDS loopthrough pins

DVI_B_CLK,

DVI_B_CLK#Output, 100 Ohm Diff TMDS clock, only used for second single-link

DVI. Note: these pins are shared with IGPLVDS loop through pins

DVI_B_HPD Input/GND DVI hot plug detect for DVI_B. Tie to GNDon motherboard if notebook is configured forIGP LVDS pass through

DDCA_CLK Output, 3.3 V logic levels2.2K Pull-up required onMXM graphics module

Serial link, can connect to VGA, DVI_A or

DVI_B. Configuration needs to be stored inMXM system information.

DDCA_DAT BI-Directional

3.3 V logic levels2.2K Pull-up required onMXM graphics module,

Serial link, can connect to VGA, DVI_Aor

DVI_B. Configuration needs to be stored inMXM system information.

DDCB_CLK Output, 3.3 V logic levels2.2K Pull-up required onMXM graphics module

Serial link, can connect to VGA, DVI_AorDVI_B. Configuration needs to be stored inMXM system information.

DDCB_DAT BI-Directional3.3 V logic levels2.2K Pull-up required onMXM graphics module

Serial link, can connect to VGA, DVI_AorDVI_B. Configuration needs to be stored inMXM system information.

LVDS_PPEN Output, 3.3 V logic levels LVDS Panel Power enable

LVDS_BLEN Output, 3.3 V logic levels LVDS Panel backlight enable

LVDS_BL_BRGHT PWM Output, 3.3 V logic

levels

LVSD Panel brightness control, duty cycle

determines output levelLVDS_UTX0-3,

LVDS_UTX0-3#

Output, 100 Ohm Diff LVDS output for dual link

IGP_UTX0-2,

IGP_UTX0-2#Input, 100 Ohm Diff LVDS input that loops back to LVDS_UTX0-

2, LVDS_UTX0-2#to provide path for LVDSwith IGP only.

LVDS_UCLK,

LVDS_UCLK#Output, 100 Ohm Diff LVDS clock for dual link


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IGP_UCLK,IGP_UCLK#

Input, 100 Ohm Diff LVDS input that loops back toLVDS_UCLK,LVDS_UCLK#to provide path for LVDS withIGP only.

LVDS_LTX0-3,LVDS_LTX0-3#

Output, 100 Ohm Diff LVDS output for either single link or dual link

IGP_LTX0-2,

IGP_LTX0-2#Input, 100 Ohm Diff LVDS input that loops back to LVDS_LTX0-

2, LVDS_LTX0-2#to provide path for LVDSwith IGP only. Note: these pins are shared

with DVI_Bpins

LVDS_LCLK,

LVDS_LCLK#Output, 100 Ohm Diff LVDS clock for either single link or dual link

IGP_LCLK,

IGP_LCLK#

Input, 100 Ohm Diff LVDS input that loops back toLVDS_LCLK,LVDS_LCLK#to provide path for LVDS withIGP only. Note: these pins are shared withDVI_B pins

TV_Y/HDTV_Y Output, 37.5 Ohm +/- 2

Ohms

TV_OUTLuma/HDTV_OUT Luma

TV_C/HDTV_Pr Output, 37.5 Ohm +/- 2Ohms

TV_OUTChroma/HDTV_OUTChroma Red

TV_CVBS/HDTV_Pb Output, 37.5 Ohm +/- 2Ohms

TV_OUTComposite/HDTV_OUTChroma Blue

DDCC_CLK Output, 3.3 V logic levels2.2K pull-up required onmotherboard

Serial link, connect to EDID LVDS Panel andto MXM System Information ROM. This link isnot to be used for external interfaces

DDCC_DAT BI-Directional2.2K pull-up required onmotherboard

Serial link, connect to EDID LVDS Panel andto MXM System Information Rom. This link isnot to be used for external interfaces

VGA_BLU Output, 37.5 Ohm +/- 2Ohms

VGA Blue Output

VGA_RED Output, 37.5 Ohm +/- 2Ohms

VGA Red Output

VGA_GRN Output, 37.5 Ohm +/- 2Ohms

VGA Green Output

VGA_HSYNC Output, 3.3 V logic levels VGAHorizontal Sync

VGA_VSYNC Output, 3.3 V logic levels VGAVertical Sync

SMB_CLK Input, 5 V tolerant Serial link for thermal sensor on GPU.Connect to motherboard's SMBus Clocksignal.

SMB_DAT Bi-Dir, 5 V tolerant Serial link for thermal sensor on GPU.Connect to motherboard's SMBus Data signal.

THERM# Open Collector Output,active low, 5 V tolerant

Indicates a thermal alert. Connect tomotherboard's SMBus Alert signal.

PRSNT1# GND Card present detect, indicates if MXMgraphics module is present. Tie to pull-up onmotherboard. If high then MXM is notpresent. If low then MXM is present. Can beused to control IGP upgrade multiplexers

PRSNT2# GND Tied to Ground on both motherboard andMXM. Reserved for future functionality.


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CLK_REQ# Output, active low Indicates need forPEX_REFCLK

PEX_RST# Input, active low PCI_Express reset

PEX_REFCLK,PEX_REFCLK#

Input, 100 Ohm Diff PCI Express reference clock.

PEX_TX0-15,

PEX_TX0-15#Input, 100 Ohm Diff PCI Express 16 lanes, output from

northbridge. DC blocking capacitiors need tobe placed on the motherboard.

PEX_RX0-15,

PEX_RX0-15#Output, 100 Ohm Diff PCI Express 16 lanes, input to northbridge.

DC blocking capacitors need to be placed onthe MXM graphics module.

RUNPWROK Input Indicates that all power to the MXM is withinthe specified tolerances

3V3RUN Power input 3.3 V run power

5VRUN Power input 5 V run power



PWR_SRC Power input Battery power

Power Requirements

The Mobile PCI Express Module (MXM) requires the following power to beprovided by the notebook (Table 6).

Table 6. Power Requirements

Voltage Rail Voltage Current Power Notes

3V3RUN 3.3 V +/- 5% 1.5 Amps 4.95 W 3.3 V run

5VRUN 5 V +/- 5% 0.5 Amps 2.5 W 5 V run

2V5RUN 2.5 V +/- 5% 0.5 Amps 1.25 W 2.5 V run

1V8RUN 1.8 V +/- 5% 3.5 Amps 6.3 W 1.8 V run

PWR_SRC 7.5 V*to 22 V Up to 4 Amps 8.9 W to 38.9 W Battery, store power capability inMXM system information.

*For a platform MXM input budget greater than 30 W, the minimum PWR_SRCvoltage is inputbudget/4A. For example, an input budget of 35 W, the PWR_SRCVmin = 8.75 V


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Power Throttling

The MXM will automatically detect power supply limitations and thermal limitationsof the notebook platform and will automatically throttle its clocks to stay within thepower and thermal limits. If the notebook platforms power supply and MXMthermal cooler are equal too or exceeds the MXMs power requirements, the MXMwill run at full speed. The MXM system information data contains the necessaryinformation for MXM throttling. This data is stored in either the SBIOS or theMXM system information ROM on the Notebooks motherboard.

System Requirements

Display Requirements

Panel Type

The MXM system only supports EDID Panels.

LVDS Panel Power

The motherboard shall provide power to the notebooks LVDS panel. The power isoptionally controlled by LVDS_PPEN.

VGA, TV_Out Impedance

The motherboard shall route all RGB signals and TV_OUTsignals with 37.5 Ohmsimpedance. A 75 Ohm termination resistor shall be placed at the end of the trace asclose as possible to the output filters which should be as close as possible to theoutput connectors. For notebooks configured to support TV_Out, 75 Ohmtermination resistors are required on any unused TV_Outsignals.

The MXM graphics module shall route all RGB signals and TV_OUTsignals with37.5 Ohms.

Output Filters

The motherboard is required to have output filters on all VGA output lines and onall TV output lines. These filters should be placed as close as possible to the externalconnectors.


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Other Requirements

MXM System Information ROM

The motherboard is required to store the MXM System Information in either theSBIOS or in the MXM System Information ROM. The implementation is a designdecision left to the system providers discretion. Information regarding the datastored in the MXM System Information is found in the MXM SoftwareSpecification.

For MXM System Information ROM implementations, the Motherboard is requiredto place a 256 Byte serial ROM that connects to DDCC_CLKand DDCC_DATwith adevice address of 0xAC. The ROM must be compatible to an Atmel 24C02 andoperate with 3.3 V signaling

5 V Tolerance

The motherboard shall provide back drive isolation and level shifting for all DDClines,VGA_HSYNCandVGA_VSYNC. The MXM graphics modules do not driveoutput signals at 5 V output levels and its inputs are not 5 V tolerant unlessspecifically stated.

DVI_B/IGP_LVDS Pin Sharing

The MXM must not power up DVI_Binterfaces until it has verified that thenotebook is configured for DVI_B. This information will be stored in the MXMsystem information ROM. IGP LVDS pass through and DVI_Bcan not co-exist inthe same notebook, they are mutually exclusive. When configured for IGP LVDSpass through, DVI_B_HPDmust be tied to GNDon the motherboard.

DVI Detection Circuitry

The motherboard is required to have input filters on both DVI_HPDlines. TheMXM graphics module is required to provide level shifting and clamping for thesesignals.

MXM Cooling Fan

If it is necessary for the MXM graphics module to have its own dedicated fan in thenotebooks chassis, the motherboard is required to provide power and speed controlfor the fan.

MXM GroundingThe MXM graphics module is grounded through the MXM connector and the twomounting holes. The thermal solution will be grounded through the thermalmounting holes and the landing area around the holes.


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Power Up Sequencing

There is no requirement for power up sequencing on the motherboard to supportMXM graphics modules. If power up sequencing is required, each MXM graphicsmodule is responsible for its own power up sequencing.

Additional FunctionSupport

In order to facilitate additional functions implemented with GPIOs not supportedin this specification, such as Japan-D connector or multiplexing TV out to separateconnectors for Component out and S-Video, the motherboard is required to place aserial link GPIO Expander that connects to DDCC_CLKand DDCC_DATwith adevice address of 0x4C. This address allows the motherboard designer to utilizeGPIO and ROM combination devices to reduce overall implementation costs. The

specific function of each GPIO shall be stored in the MXM System InformationStructure. The MXM System Information Structure is found in the MXM SoftwareSpecification.


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Appendix:Support Information

Configuring Notebook forMXM with IGP

Configurable Option

Use of the MXM platform will allow maximum flexibility in configuring differentgraphics capabilities all with the same motherboard. Through the use of zero Ohmstuffing resistors the manufacturer can easily decide if the notebook will beconfigured with an IGP or a MXM graphics module all with the same motherboardplatform.

Refer to Figure 25 for the notebook output topology with IGP.


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Figure 25. Notebook Output Topology with IGP

Upgradeable Option

To facilitate possible upgrades to the notebook a LVDS pass through feature wasadded to the MXM system. This pass through capability was needed since activedevices that work at LVDS data rates are very expensive. To support LVDS passthrough, the IGPs LVDS output signals will need to be routed over to the MXMconnector and connect to the IGP_LVDSsignals. An extremely low cost passivePCB will be inserted into the MXM connector that will complete the circuit pathbetween the IGPs output signals and the LVDS panel input signals. VGA andTV_outsignals are switched by an active device between the IGP and MXM. Whena MXM is installed at a later date the Mux will switch over to the MXM outputsignals and the MB_LVDSsignals will be interrupted by the MXM card. IfPRSNT#1is low then the MUX will connect the VGA and TV circuit paths to the MXM.

If DVI is supported on an IGP platform, the TMDS transmitter will reside on the

LVDS pass through card and drive TMDS outputs on DVI_Asignals. The IGPwould need to multiplex TMDS data over PCI Express lines. See Figure 26

Figure 26. Notebook Output Topology with IGP


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Notice

ALL NVIDIA DESIGN SPECIFICATIONS, REFERENCE BOARDS, FILES, DRAWINGS,DIAGNOSTICS, LISTS AND OTHER DOCUMENTS (TOGETHER AND SEPARATELY, "MATERIALS")ARE BEING PROVIDED "AS IS." NVIDIA MAKES NO WARRANTIES, EXPRESSED, IMPLIED,STATUTORY OR OTHERWISE WITH RESPECT TO THE MATERIALS, AND EXPRESSLY DISCLAIMSALL IMPLIED WARRANTIES OF NONINFRINGEMENT, MERCHANTABILITY AND FITNESS FOR A

PARTICULAR PURPOSE.

Information furnished is believed to be accurate and reliable. However, NVIDIA Corporationassumes no responsibility for the consequences of use of such information or for any

infringement of patents or other rights of third parties that may result from its use. No license isgranted by implication or otherwise under any patent or patent rights of NVIDIA Corporation.Specifications mentioned in this publication are subject to change without notice. Thispublication supersedes and replaces all information previously supplied. NVIDIA Corporationproducts are not authorized for use as critical components in life support devices or systemswithout express written approval of NVIDIA Corporation.

Trademarks

NVIDIA, the NVIDIA logo and MXM Graphics Module, are trademarks of NVIDIA Corporation inthe United States and other countries. Other company and product names may be trademarks ofthe respective companies with which they are associated.

Copyright

2004 by NVIDIA Corporation. All rights reserved

MXM Electro Spec

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