microTEC 2013 products and services

Copyright: microTEC Gesellschaft für Mikrotechnologie mbH

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Production Technologies and ApplicationsIndustry, Life Science and Consumer Products

Contents:Page 1 - 18 Overview and Applications in Fluidics and Communication Page 19 - 33 Three Dimensional Chip Size Packaging and ProductsPage 34 - 38 Technologies and MaterialsPage 39 - 40 microTEC locations and contact data

Please see also (attached or at www.microtec-d.com “download”) the documents “Design rules” and “StepbyStep2011”.

Don’t hesitate to contact us for any questions:Tel: +49 6322 650 220 , Tel: +49 203 306 2050 and [email protected] team customer care.

http://www.microtec-d.com/


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RMPD®

and 3D-CSP Technologies and Application

multimat mask

3D-CSP

stick2

nanoface

parallel batch production no tools

parallel

>300 materials

coating microFLUIDIC


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Input NLTL

THz die

Vivaldi antenna tan delta < 0.00001

Polymer packageRMPD ®

3D-CSP Package: THz-module

Coupling NLTL – Vivaldi

antenna

4,5 mm75 80 85 90 95 100 105 110

-85

-80

-75

-70

-65

-60

Frequency (GHz)

Rec

eive

d P

ower

(dBm

)

Floating0V-0.5V+0.5V


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High Precision, any Order Quantity


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Planetary Gear Wheel Components

• Diameter = 828µm/1200µm• Module = 0,06; n1 /n2 = 20/24; di = 400 µm• Lubricants integrated


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Desktop Production, flexible and fast: 10 parts or 1 Million Parts, all in 10 days

2,7 x 0,8 x 0,2 mm³, 40 µm wall thickness


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1997Anchor tube diameter 150 µmAnchor tube length 15.000 µmDistance between holes 70 µm

High Aspect Ratio

15mm

2006Anchor tube diameter 200 µmAnchor tube length 20.000 µmDistance between holes 50 µm


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5 inlets

5 coaxial outlets

Multi Channel Nozzle


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Microfluidics for Lifescience and Medical Technology: Dispenser Structures

Inner diameter: 150 µmLength: 3000 µm (3 mm) Volume: 52 nl

Self-filling by capillary force

Apply pressure to dispens

Fluidic-stoptransition from

hydrophilicto

hydrophobicmaterial

• Fluidic-stop solution for dispenser structures• Lab-on-a-chip applications• High-through-put screening

• Technology: RMPD®-mask


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RMPD®-Multimat Application

Bottom clearRMPD-polymere

Well 300x300µm,

dark RMPD polymere, no fluorescence

Wellplate 28x28

Well 300x300µm


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RMPD®-Mask Batch


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RMPD®-microFLUIDIC Sealing

• Sealing without gluing• Direct covalent binding

between structure and sealing

sealing

Loading box


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Fluidic Chip Successfully Tested at zero-g in SpaceLoading box

Reaction chambers for optical analysis Ventilation chamber

• Two different materials in vertical direction • Intrinsic hydrophilic and hydrophobic materials


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microFluidics for Flow Cytometry, with HydrodynamicFocusing Buffer Stream (Disposable)

Probe Connection

Buffer connectionover pressure

Waste connection

Sample stream

Buffer stream Bufferstream


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Ventilation chamber 1 Ventilation

chamber 2Ventilation chambers 3

Filter with cells

Lab-on-a-chip System Design Study for Water Analysis

20 Reaction Chambers for

optical or electrical analysis

Reaction chambers, e.g. PCR or hybridizationReaction chambers

to break open cell or PCR

Cavity to be filled with liquidIntegration of sensors, actuators,electrodes and interconnections

Electrical connectors

Change of cross sections => increase of capillary forcesSequential opening of chambers=> time controlled filling = valve function

Integration of micro fluidic and 3D-CSP

Time 1 Time 3Time 2


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Parallel Batch Production RMPD®


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3D-Coil Variations with RMPD® and 3D-CSP

Advantage: parallel direct integration pitch 50µm

Ferrite core possible

Application:Wireless energy supply

and communication


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Connector with Magnetic Beads

magnetic beads

female

male

2 magnetic inserts


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Substrate

5 inch, 9 inch, 14 inch, 350mm

3D-CSP Batch Process

RMPD®-mask

MetallisationMetal Layer structuring

Placement of inserts

4 Step Process to build MEMS1.2.3.4.


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bottom

RMPD®-mask




3D-CSP Batch: Bottom generation


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Cavities

RMPD®-mask




3D-CSP Batch: Cavity generation


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3D-CSP Batch: Die insertion

RMPD®-mask



4 Step Process to build MEMS

Dies

Pads

1.2.3.4.


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3D-CSP Batch: Covering

RMPD®-mask



Open holes over pad (vias) Vias 1



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3D-CSP Batch Metallisation

RMPD®-mask



Metallisation layer



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3D-CSP Batch: Structuring

RMPD®-mask



Interconnection layer



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3D- MOEMS, SMD Case Sizes 0603 and less

0,8 mm

<= compare with pencil diameter 0,5mm

Parallel batch production


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1 x 1 mmLED die

Al reflector

RMPD® housing

0,7 mm

Al reflectorOpen window for cooling

LED die

Blue LED die (460 nm) in 3D-CSP Package


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Courtesy of Designled Products Ltd.

Research and development of modular based production units for the seamless, high throughput manufacture of micro-structured,

polymer based components and microsystems.

Funded by European Community's Seventh Framework Programme under Grant Agreement n° CP-TP 228686


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sensor

capacitordie

Connected PCB flex circuitinterconnection

layer

3D-CSP System

Pressure sensor with 24-Bit Capacitance – to Digital Converter

Technology: 3D-CSP with RMPD®, special sensor adaptation with low interferences

Two wire serial interface (I2C- compatible)Temperatur sensor on chip resolution 0.1°C

1,2mm


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Processing Unit

12 x 12 x 2 mm

2 layers with elementsDSPDDR2FlashQuartz83 passive elements


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3D-CSP application:Memory Card with encryption chip and NANDs


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Technology 3D-CSP 3D-CSP 3D-CSP 3D-CSP 3D-CSP 3D-CSP

Dies stacked 2 4 6 8 10 12

Controller 1 1 1 1 1 1

Die Thicknesses (um) 260 120 70 50 45 40

Gap between Dies (um) 40 30 30 30 25 20

Border outside bottom (µm) 100 100 100 80 50 40

Border outside top (µm) 100 100 100 80 50 40

Card Thickness (µm) 800 800 800 800 800 800

Stacked Dies 7 x 9 x 0,05 mm


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3D-CSP RF Test Structures, RF-Parameter available for Development of Baluns and Antennas

25µm

Full selected 3D CAD structure

Frequency range: 100 MHz … 8,5 GHz

4 interconnection and shielding layers, 6 isolation layers


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From CAD directly into high volume series production: Reality for small parts and MEMS (Micro Electro Mechanical Systems)

From CAD directly into high volume series production: reality now for MEMS (Micro Electro Mechanical Systems). RMPD® is an internationally patented family of technologies designedto generate microparts, microstructures, and microsystems in a parallel batch process.

Photo sensitive monomer, oligomer and hybrid materials (sol-gel) are polymerized by UV-light to generate the products. Today more then 300 suitable UV curable materials are on the market, price per litre is in a wide range between 30 Euros and 2500 Euros. Several material properties can be chosen with respect to, eg, mechanical, optical, electrical etc. parameters. FDA approved materials are available, too!

The technologies used at microTEC are: •

RMPD®-mask (parallel batch production at high volumes by UV light sources with micrometer precision), • RMPD®-direct write system (building freeform parts by parallel laser beams), • RMPD®-multimat (volume specific material properties), • RMPD®-stick2 (parts directly built on a foil, wafer, glass or other materials), • RMPD®-nanoface (surface roughness in sub-nm range),• 3D-CSP (Three Dimensional Chip Size packaging.

The challenge to achieve high productivity is solved by fast parallel batch production.


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1. 2. 3. ...n

Best accuracies• Fast• Limitations on geometric design• Costs and delivery time for mask

light curable acrylate or epoxy

micro-structures after polymerisation

mask

Parallel laser beams

light curable acrylate or epoxy

Parallel production by RMPD®Generative Processes for Production of Microstructures

Structures by RMPD®-mask


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RMPD®-stick2

Interfacing other materials

• Growth of microstructures on substrates• Glass, silicon, metal, ...

• Examples: - tube connectors on silicon/glass wafers - sealing rings - fluidic polymer channels on glass slides- fiber holder over pin diodes

=>building up microstructures directly on silicon wafer with micro electronics


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different materialsvertical

RMPD®-multimat Background

Freedom of choice to grow materials

• Substitute materials vertically or horizontally

• Layer thickness of up to 200 µm (depending on the polymer)

• Examples: - waveguides with two refractive indices - dispenser systems with different

chemical properties depending on tip height - different mechanical properties

• Outlook:- p and n doping- photon collecting- photon radiation

different materialshorizontal


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Selection of Material Parameters of RMPD®-Polymers

Epoxide, Acrylate, Urethane, Methacrylic Acid,

Hybrid Materials e. g. Acrylate with Al or Si

Minimum Maximum

Temperature resistance [°C] long termshort term

-50-50

250285

Refractive index 1,33 1,54

Tensile strength [Mpa] 2 80Elongation (at break) [%] 2 590Tensile modulus [Mpa] 7 11700

Thermal conductivity [W/m *K] 0,2 0,7

Surface tension [degree] 20° 120°

Dielectrical permittivity 2 5

tan δ 0,02 0,3

Sterillizable and parts conform to FDA USP 23 ClassVI


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Duisburg

Customer Idea + microTECConsultingR&D, SimulationPrototypingDirect Mass ProductionTraining/Licensing

=Customer Product Innovation

microTEC LocationsBad Dürkheim


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Visit us – You are welcome:

microTECGesellschaft für

Mikrotechnologie mbH

Bismarckstraße 142b47057 Duisburg

Tel: +49 203 306 2050Fax: +49 203 306 2069

Kaiserslauterer 35367098 Bad DürkheimTel: +49 6322 650 220Fax: +49 6322 650 221

http://www.microTEC-D.com

microTEC 2013 products and services

Technology

Transcript of microTEC 2013 products and services