SUSS MicroTec
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SUSS MicroTec Spray Coating
description
SUSS MicroTec. Spray Coating. M arkets. Compound Semiconductor. MEMS. Source: CIS. Source: Intel. Source: Süss MicroOptics. Advanced Packaging. MOEMS. Types of Resist. Clariant AZ1500, AZ4000, AZ9000, AZ520D Rohm HaasShipley 1818 TOK PMER-P, TELR-N - PowerPoint PPT Presentation
Transcript of SUSS MicroTec
SUSS MicroTec
Spray Coating
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Markets MEMS
Source: CIS
Source: Süss MicroOptics
MOEMS Advanced Packaging
Compound Semiconductor
Source: Intel
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Types of Resist
Clariant AZ1500, AZ4000, AZ9000, AZ520D
Rohm Haas Shipley 1818
TOK PMER-P, TELR-N
Dow Chemicals BCB 3000 / 4000
Asahi Cytop CTL 107 M
Dow Corning Silicone
ALLRESIST e-beam PMMA
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Not all curves lead to success
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Coating Challenges
Resist film tends to tear at the topography edges
Limited control of resist thickness at the bottom of the topography
Goal: Uniform coating of topography
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In Principal
X – Y stage Not a spin process (no striations or comet tails) Multi-flexible nozzle movement
Process Flow
X-Stage
Y-Stage
Spray Nozzle
Meander Path
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Coating Topography AZ4620
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Coating Topography AZ9260
4µm Top
300µm Step3 µm resist
on top of the edge
3µm Bottom
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Coating Topography AZ9260
4µm on Top
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Coating Topography Shipley1818
4µm on Top
Bottom 2,8µm
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Coating Topography Shipley 1818
4µm
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Coating Topography BCB 3000
5µm
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Coating Topography BCB 4000
300µm Step
7µm Top
3µm Bottom
5µm on top of the edge
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Coating Vertical Topography Goal: Protective coating in
trenches without filling
50 µm trench depth Modified Clariant AZ4620 Reliable edge coverage
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Exposure Results
6µm of modified AZ 9260 across 300µm deep KOH etched trenches (no edge treatment)
coated with SUSS spray coating technology, exposed with SUSS large exposure gap optics
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Lines across topography step
150 µm step height Good resist profiles throughout
Top view of printed lines
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Manual: AltaSpray
wafer sizes from pieces up to 200mm round
& 6” square programmable spray pattern adjustable nozzle heights EBR / BSR / nozzel + chuck
cleaning function 2 nozzel option with
seperate lines for different resist sorts
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Automated: Gamma
integrated modules for vapor priming, spining, spray-coating, baking, developing
cassette to cassette handling parallel spin and spray
processing wafer sizes
2” to 200mm round 2” to 6” square
EBR / BSR / nozzel + chuck cleaning function
2 nozzel option with seperate lines for different resist sorts
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Thank you for your attention
