SS-S485 Main Memory Technology Direction

Main Memory Technology DirectionKevin KilbuckSenior Segment Marketing ManagerComputing and ServersMicron Technology, Inc.5/29/2007 2:02 PM 2007 Microsoft Corporation. All rights reserved. Microsoft, Windows, Windows Vista and other product names are or may be registered trademarks and/or trademarks in the U.S. and/or other countries.The information herein is for informational purposes only and represents the current view of Microsoft Corporation as of the date of this presentation. Because Microsoft must respond to changing market conditions, it should not be interpreted to be a commitment on the part of Microsoft, and Microsoft cannot guarantee the accuracy of any information provided after the date of this presentation. MICROSOFT MAKES NO WARRANTIES, EXPRESS, IMPLIED OR STATUTORY, AS TO THE INFORMATION IN THIS PRESENTATION.1AgendaDRAM Technology TrendsComputing Customer RequirementsIntroduction to DDR35/29/2007 2:02 PM 2007 Microsoft Corporation. All rights reserved. Microsoft, Windows, Windows Vista and other product names are or may be registered trademarks and/or trademarks in the U.S. and/or other countries.The information herein is for informational purposes only and represents the current view of Microsoft Corporation as of the date of this presentation. Because Microsoft must respond to changing market conditions, it should not be interpreted to be a commitment on the part of Microsoft, and Microsoft cannot guarantee the accuracy of any information provided after the date of this presentation. MICROSOFT MAKES NO WARRANTIES, EXPRESS, IMPLIED OR STATUTORY, AS TO THE INFORMATION IN THIS PRESENTATION.2DRAM Technology Trends5/29/2007 2:02 PM 2007 Microsoft Corporation. All rights reserved. Microsoft, Windows, Windows Vista and other product names are or may be registered trademarks and/or trademarks in the U.S. and/or other countries.The information herein is for informational purposes only and represents the current view of Microsoft Corporation as of the date of this presentation. Because Microsoft must respond to changing market conditions, it should not be interpreted to be a commitment on the part of Microsoft, and Microsoft cannot guarantee the accuracy of any information provided after the date of this presentation. MICROSOFT MAKES NO WARRANTIES, EXPRESS, IMPLIED OR STATUTORY, AS TO THE INFORMATION IN THIS PRESENTATION.3

Main Memory Data Rate TrendsDRAM bandwidth requirements typically double every 3 years

SDRAMDDRDDR2NGM DiffDDR3NGM SE5/29/2007 2:02 PM 2007 Microsoft Corporation. All rights reserved. Microsoft, Windows, Windows Vista and other product names are or may be registered trademarks and/or trademarks in the U.S. and/or other countries.The information herein is for informational purposes only and represents the current view of Microsoft Corporation as of the date of this presentation. Because Microsoft must respond to changing market conditions, it should not be interpreted to be a commitment on the part of Microsoft, and Microsoft cannot guarantee the accuracy of any information provided after the date of this presentation. MICROSOFT MAKES NO WARRANTIES, EXPRESS, IMPLIED OR STATUTORY, AS TO THE INFORMATION IN THIS PRESENTATION.4

Unit Interval (Bit-time) Trends30-40% of UI will be budgeted for RX circuits (jitter+S/H+static)SDRAMDDRDDR2NGM DiffDDR3156ps625psNGM SE313ps

5/29/2007 2:02 PM 2007 Microsoft Corporation. All rights reserved. Microsoft, Windows, Windows Vista and other product names are or may be registered trademarks and/or trademarks in the U.S. and/or other countries.The information herein is for informational purposes only and represents the current view of Microsoft Corporation as of the date of this presentation. Because Microsoft must respond to changing market conditions, it should not be interpreted to be a commitment on the part of Microsoft, and Microsoft cannot guarantee the accuracy of any information provided after the date of this presentation. MICROSOFT MAKES NO WARRANTIES, EXPRESS, IMPLIED OR STATUTORY, AS TO THE INFORMATION IN THIS PRESENTATION.5

Die Size Impact

Triple Metal5/29/2007 2:02 PM 2007 Microsoft Corporation. All rights reserved. Microsoft, Windows, Windows Vista and other product names are or may be registered trademarks and/or trademarks in the U.S. and/or other countries.The information herein is for informational purposes only and represents the current view of Microsoft Corporation as of the date of this presentation. Because Microsoft must respond to changing market conditions, it should not be interpreted to be a commitment on the part of Microsoft, and Microsoft cannot guarantee the accuracy of any information provided after the date of this presentation. MICROSOFT MAKES NO WARRANTIES, EXPRESS, IMPLIED OR STATUTORY, AS TO THE INFORMATION IN THIS PRESENTATION.6

Idd Impact

X32X162.5Gpbs1.6Gpbs1.33Gpbs800Mpbs400Mpbs5/29/2007 2:02 PM 2007 Microsoft Corporation. All rights reserved. Microsoft, Windows, Windows Vista and other product names are or may be registered trademarks and/or trademarks in the U.S. and/or other countries.The information herein is for informational purposes only and represents the current view of Microsoft Corporation as of the date of this presentation. Because Microsoft must respond to changing market conditions, it should not be interpreted to be a commitment on the part of Microsoft, and Microsoft cannot guarantee the accuracy of any information provided after the date of this presentation. MICROSOFT MAKES NO WARRANTIES, EXPRESS, IMPLIED OR STATUTORY, AS TO THE INFORMATION IN THIS PRESENTATION.7

Power Dissipation TrendsX16 devices at nominal Vdd

5/29/2007 2:02 PM 2007 Microsoft Corporation. All rights reserved. Microsoft, Windows, Windows Vista and other product names are or may be registered trademarks and/or trademarks in the U.S. and/or other countries.The information herein is for informational purposes only and represents the current view of Microsoft Corporation as of the date of this presentation. Because Microsoft must respond to changing market conditions, it should not be interpreted to be a commitment on the part of Microsoft, and Microsoft cannot guarantee the accuracy of any information provided after the date of this presentation. MICROSOFT MAKES NO WARRANTIES, EXPRESS, IMPLIED OR STATUTORY, AS TO THE INFORMATION IN THIS PRESENTATION.8

Voltage ScalingHistoricalEnthusiast01234567199019952000200520105/29/2007 2:02 PM 2007 Microsoft Corporation. All rights reserved. Microsoft, Windows, Windows Vista and other product names are or may be registered trademarks and/or trademarks in the U.S. and/or other countries.The information herein is for informational purposes only and represents the current view of Microsoft Corporation as of the date of this presentation. Because Microsoft must respond to changing market conditions, it should not be interpreted to be a commitment on the part of Microsoft, and Microsoft cannot guarantee the accuracy of any information provided after the date of this presentation. MICROSOFT MAKES NO WARRANTIES, EXPRESS, IMPLIED OR STATUTORY, AS TO THE INFORMATION IN THIS PRESENTATION.9Historical DRAM Price-Per-Bit Decline ~35%/yearDRAM Market Price-per-bit Decline(Normalized- Millicent/bit)Historicalprice-per-bit decline hasaveraged 35.5%(1978 - 2002)Price per Bit (Millicents)110010,0001,000,000100,000,000Cumulative Bit Volume (1012)19791980198119821983198419851986198719881989199019911992199319941995199619971998199920002001200220032004F2005F2006F2007F2008F5/29/2007 2:02 PM 2007 Microsoft Corporation. All rights reserved. Microsoft, Windows, Windows Vista and other product names are or may be registered trademarks and/or trademarks in the U.S. and/or other countries.The information herein is for informational purposes only and represents the current view of Microsoft Corporation as of the date of this presentation. Because Microsoft must respond to changing market conditions, it should not be interpreted to be a commitment on the part of Microsoft, and Microsoft cannot guarantee the accuracy of any information provided after the date of this presentation. MICROSOFT MAKES NO WARRANTIES, EXPRESS, IMPLIED OR STATUTORY, AS TO THE INFORMATION IN THIS PRESENTATION.10

Industry Analyst DRAMDensity forecastSource: IDC, Isuppli, Gartner, Micron Q107

5/29/2007 2:02 PM 2007 Microsoft Corporation. All rights reserved. Microsoft, Windows, Windows Vista and other product names are or may be registered trademarks and/or trademarks in the U.S. and/or other countries.The information herein is for informational purposes only and represents the current view of Microsoft Corporation as of the date of this presentation. Because Microsoft must respond to changing market conditions, it should not be interpreted to be a commitment on the part of Microsoft, and Microsoft cannot guarantee the accuracy of any information provided after the date of this presentation. MICROSOFT MAKES NO WARRANTIES, EXPRESS, IMPLIED OR STATUTORY, AS TO THE INFORMATION IN THIS PRESENTATION.11

Industry Analyst DRAMInterface forecastSource: IDC, iSuppli Q107

DDR3 becomes mainstream in 20095/29/2007 2:02 PM 2007 Microsoft Corporation. All rights reserved. Microsoft, Windows, Windows Vista and other product names are or may be registered trademarks and/or trademarks in the U.S. and/or other countries.The information herein is for informational purposes only and represents the current view of Microsoft Corporation as of the date of this presentation. Because Microsoft must respond to changing market conditions, it should not be interpreted to be a commitment on the part of Microsoft, and Microsoft cannot guarantee the accuracy of any information provided after the date of this presentation. MICROSOFT MAKES NO WARRANTIES, EXPRESS, IMPLIED OR STATUTORY, AS TO THE INFORMATION IN THIS PRESENTATION.12Computing Customer Requirements5/29/2007 2:02 PM 2007 Microsoft Corporation. All rights reserved. Microsoft, Windows, Windows Vista and other product names are or may be registered trademarks and/or trademarks in the U.S. and/or other countries.The information herein is for informational purposes only and represents the current view of Microsoft Corporation as of the date of this presentation. Because Microsoft must respond to changing market conditions, it should not be interpreted to be a commitment on the part of Microsoft, and Microsoft cannot guarantee the accuracy of any information provided after the date of this presentation. MICROSOFT MAKES NO WARRANTIES, EXPRESS, IMPLIED OR STATUTORY, AS TO THE INFORMATION IN THIS PRESENTATION.13You Cant Have It AllPick two (maybe three if youre really lucky!)QualityDRAM Design & Process ConstraintsCostPowerDensityBandwidthLatency5/29/2007 2:02 PM 2007 Microsoft Corporation. All rights reserved. Microsoft, Windows, Windows Vista and other product names are or may be registered trademarks and/or trademarks in the U.S. and/or other countries.The information herein is for informational purposes only and represents the current view of Microsoft Corporation as of the date of this presentation. Because Microsoft must respond to changing market conditions, it should not be interpreted to be a commitment on the part of Microsoft, and Microsoft cannot guarantee the accuracy of any information provided after the date of this presentation. MICROSOFT MAKES NO WARRANTIES, EXPRESS, IMPLIED OR STATUTORY, AS TO THE INFORMATION IN THIS PRESENTATION.14

What ComputingCustomers Care About

5/29/2007 2:02 PM 2007 Microsoft Corporation. All rights reserved. Microsoft, Windows, Windows Vista and other product names are or may be registered trademarks and/or trademarks in the U.S. and/or other countries.The information herein is for informational purposes only and represents the current view of Microsoft Corporation as of the date of this presentation. Because Microsoft must respond to changing market conditions, it should not be interpreted to be a commitment on the part of Microsoft, and Microsoft cannot guarantee the accuracy of any information provided after the date of this presentation. MICROSOFT MAKES NO WARRANTIES, EXPRESS, IMPLIED OR STATUTORY, AS TO THE INFORMATION IN THIS PRESENTATION.15

What ComputingCustomers Care About

5/29/2007 2:02 PM 2007 Microsoft Corporation. All rights reserved. Microsoft, Windows, Windows Vista and other product names are or may be registered trademarks and/or trademarks in the U.S. and/or other countries.The information herein is for informational purposes only and represents the current view of Microsoft Corporation as of the date of this presentation. Because Microsoft must respond to changing market conditions, it should not be interpreted to be a commitment on the part of Microsoft, and Microsoft cannot guarantee the accuracy of any information provided after the date of this presentation. MICROSOFT MAKES NO WARRANTIES, EXPRESS, IMPLIED OR STATUTORY, AS TO THE INFORMATION IN THIS PRESENTATION.16Windows Vista System RequirementsMinimumsupportedMinimum recommended by SKUHome basicAll other SKUsCPUAn 800MHz x86 or x64 processor3A 1GHz x86 or x64 processor3System memory512MB1GBGPUSVGA (800x600)DX9 Capable Aero CapableGraphics memory32MB128MB 1, 2HDD20GB40GBHDD free space15GBOptical driveCD-ROM4DVD-ROM4NetworkingInternet Access CapableAudioAudio Output Capability5/29/2007 2:02 PM 2007 Microsoft Corporation. All rights reserved. Microsoft, Windows, Windows Vista and other product names are or may be registered trademarks and/or trademarks in the U.S. and/or other countries.The information herein is for informational purposes only and represents the current view of Microsoft Corporation as of the date of this presentation. Because Microsoft must respond to changing market conditions, it should not be interpreted to be a commitment on the part of Microsoft, and Microsoft cannot guarantee the accuracy of any information provided after the date of this presentation. MICROSOFT MAKES NO WARRANTIES, EXPRESS, IMPLIED OR STATUTORY, AS TO THE INFORMATION IN THIS PRESENTATION.17Density MattersGive Windows Vista as much memory as you can, and it will thank you by serving you quicker.Toms Hardware, Windows Vista's SuperFetch and ReadyBoost Analyzed, January 31, 2007, http://www.tomshardware.com/2007/01/31/windows-vista-superfetch-and-readyboostanalyzed/index.html

5/29/2007 2:02 PM 2007 Microsoft Corporation. All rights reserved. Microsoft, Windows, Windows Vista and other product names are or may be registered trademarks and/or trademarks in the U.S. and/or other countries.The information herein is for informational purposes only and represents the current view of Microsoft Corporation as of the date of this presentation. Because Microsoft must respond to changing market conditions, it should not be interpreted to be a commitment on the part of Microsoft, and Microsoft cannot guarantee the accuracy of any information provided after the date of this presentation. MICROSOFT MAKES NO WARRANTIES, EXPRESS, IMPLIED OR STATUTORY, AS TO THE INFORMATION IN THIS PRESENTATION.18Windows Vista RTM Test ResultsMemory utilization is minimized with more system memory installedSuperFetch exhausts DRAM memory before using NAND memory 2GB appears to be optimal DRAM density for Windows VistaLower number means your system has more resources available for additional tasksMultiple programs runningTwo Web browsers, Windows Media Player, Adobe Photoshop with 445MB file open, and Trend Virus ProtectionSystem SpecificationsInspiron 6000 Intel 915GM/PM Windows Vista RC2Intel Pentium M 1.7Ghz ATI Mobility Radeon X300 80GB Fujitsu ATA5/29/2007 2:02 PM 2007 Microsoft Corporation. All rights reserved. Microsoft, Windows, Windows Vista and other product names are or may be registered trademarks and/or trademarks in the U.S. and/or other countries.The information herein is for informational purposes only and represents the current view of Microsoft Corporation as of the date of this presentation. Because Microsoft must respond to changing market conditions, it should not be interpreted to be a commitment on the part of Microsoft, and Microsoft cannot guarantee the accuracy of any information provided after the date of this presentation. MICROSOFT MAKES NO WARRANTIES, EXPRESS, IMPLIED OR STATUTORY, AS TO THE INFORMATION IN THIS PRESENTATION.19Windows Vista ReadyBoost C&P Lab ResultsWith 2x CT3264AA667 512MB of DRAM installed:Ready Boost disabled Ready Boost enabled1:20.0438.23 sec1:09.4833.23 sec1:15.56 29.81 sec1:06.0644.46 sec

With 2x CT6464AA667 1024MB of DRAM installed:Ready Boost disabled Ready Boost enabled8.39 sec7.43 sec8.18 sec7.29 sec8.56 sec6.50 sec7.81 sec7.51 sec

5/29/2007 2:02 PM 2007 Microsoft Corporation. All rights reserved. Microsoft, Windows, Windows Vista and other product names are or may be registered trademarks and/or trademarks in the U.S. and/or other countries.The information herein is for informational purposes only and represents the current view of Microsoft Corporation as of the date of this presentation. Because Microsoft must respond to changing market conditions, it should not be interpreted to be a commitment on the part of Microsoft, and Microsoft cannot guarantee the accuracy of any information provided after the date of this presentation. MICROSOFT MAKES NO WARRANTIES, EXPRESS, IMPLIED OR STATUTORY, AS TO THE INFORMATION IN THIS PRESENTATION.20Windows Vista ReadyBoost C&P Lab ResultsWith 2x CT12864AA667 2048MB of DRAM installed:Ready Boost disabled Ready Boost enabled6.73 sec5.57 sec5.93 sec5.14 sec

With 4x CT12864AA667 4096MB of DRAM installed:Ready Boost disabled Ready Boost enabled8.01 sec7.08 sec5.48 sec6.29 sec2GB DRAM achieves the peak performance gain for DRAM density in Windows Vista systems using Ready Boost5/29/2007 2:02 PM 2007 Microsoft Corporation. All rights reserved. Microsoft, Windows, Windows Vista and other product names are or may be registered trademarks and/or trademarks in the U.S. and/or other countries.The information herein is for informational purposes only and represents the current view of Microsoft Corporation as of the date of this presentation. Because Microsoft must respond to changing market conditions, it should not be interpreted to be a commitment on the part of Microsoft, and Microsoft cannot guarantee the accuracy of any information provided after the date of this presentation. MICROSOFT MAKES NO WARRANTIES, EXPRESS, IMPLIED OR STATUTORY, AS TO THE INFORMATION IN THIS PRESENTATION.21DRAM Density Increases CPU EfficiencyAs memory density increases, memory utilization decreases As memory density increases, processor utilization goes up More memory drastically increases the efficiency of your processorSystem Specifications Motherboard: Evga NF68 Chipset: nVidia 680i SLI Processor: Intel Pentium 4 2.8GHZ Video: ATI Radeon X1900XTX PCIE 512MB Hard Drive:WD 80GB OS: Windows Vista Ultimate DRAM: Crucial DDR2 6400 Real World Test Processes running to generate utilization: Nero Recode, ADOBE WITH 445 MEG FILE OPEN, 2 WEBSITES OPEN

5/29/2007 2:02 PM 2007 Microsoft Corporation. All rights reserved. Microsoft, Windows, Windows Vista and other product names are or may be registered trademarks and/or trademarks in the U.S. and/or other countries.The information herein is for informational purposes only and represents the current view of Microsoft Corporation as of the date of this presentation. Because Microsoft must respond to changing market conditions, it should not be interpreted to be a commitment on the part of Microsoft, and Microsoft cannot guarantee the accuracy of any information provided after the date of this presentation. MICROSOFT MAKES NO WARRANTIES, EXPRESS, IMPLIED OR STATUTORY, AS TO THE INFORMATION IN THIS PRESENTATION.22Density Mattersvideo

15/29/2007 2:02 PM 2007 Microsoft Corporation. All rights reserved. Microsoft, Windows, Windows Vista and other product names are or may be registered trademarks and/or trademarks in the U.S. and/or other countries.The information herein is for informational purposes only and represents the current view of Microsoft Corporation as of the date of this presentation. Because Microsoft must respond to changing market conditions, it should not be interpreted to be a commitment on the part of Microsoft, and Microsoft cannot guarantee the accuracy of any information provided after the date of this presentation. MICROSOFT MAKES NO WARRANTIES, EXPRESS, IMPLIED OR STATUTORY, AS TO THE INFORMATION IN THIS PRESENTATION.23Dual Die Stacking TechnologyTypical monolithic FBGA packages utilize BOC (Board-On-Chip) technology

Typical dual die FBGA packages utilize COB (Chip-On-Board) technology

Supports DDR3 data rates1.2mm thick5/29/2007 2:02 PM 2007 Microsoft Corporation. All rights reserved. Microsoft, Windows, Windows Vista and other product names are or may be registered trademarks and/or trademarks in the U.S. and/or other countries.The information herein is for informational purposes only and represents the current view of Microsoft Corporation as of the date of this presentation. Because Microsoft must respond to changing market conditions, it should not be interpreted to be a commitment on the part of Microsoft, and Microsoft cannot guarantee the accuracy of any information provided after the date of this presentation. MICROSOFT MAKES NO WARRANTIES, EXPRESS, IMPLIED OR STATUTORY, AS TO THE INFORMATION IN THIS PRESENTATION.24Dual Die Package ConstructionMaximum Thickness = 1.35mmRDL = Re-distribution layer; center wire bond pads are re-distributed to perimeter of die through a metal layer to facilitate stackingDieDieSubstrateWire Bonds

Top view of a typical RDL layer5/29/2007 2:02 PM 2007 Microsoft Corporation. All rights reserved. Microsoft, Windows, Windows Vista and other product names are or may be registered trademarks and/or trademarks in the U.S. and/or other countries.The information herein is for informational purposes only and represents the current view of Microsoft Corporation as of the date of this presentation. Because Microsoft must respond to changing market conditions, it should not be interpreted to be a commitment on the part of Microsoft, and Microsoft cannot guarantee the accuracy of any information provided after the date of this presentation. MICROSOFT MAKES NO WARRANTIES, EXPRESS, IMPLIED OR STATUTORY, AS TO THE INFORMATION IN THIS PRESENTATION.25Dual Die PhotoTwo die complete with wire bond prior to encapsulation

5/29/2007 2:02 PM 2007 Microsoft Corporation. All rights reserved. Microsoft, Windows, Windows Vista and other product names are or may be registered trademarks and/or trademarks in the U.S. and/or other countries.The information herein is for informational purposes only and represents the current view of Microsoft Corporation as of the date of this presentation. Because Microsoft must respond to changing market conditions, it should not be interpreted to be a commitment on the part of Microsoft, and Microsoft cannot guarantee the accuracy of any information provided after the date of this presentation. MICROSOFT MAKES NO WARRANTIES, EXPRESS, IMPLIED OR STATUTORY, AS TO THE INFORMATION IN THIS PRESENTATION.26Power ConsumptionPower estimates reflect a maximum DRAM utilization of 67% with a BL=4 and register/PLL power of 1.5W4X density increase with little to no power increase

512Mb-based 1GB and 2GB RDIMMsConverting from 512Mb to 1Gb-based reduces power by over 50%5/29/2007 2:02 PM 2007 Microsoft Corporation. All rights reserved. Microsoft, Windows, Windows Vista and other product names are or may be registered trademarks and/or trademarks in the U.S. and/or other countries.The information herein is for informational purposes only and represents the current view of Microsoft Corporation as of the date of this presentation. Because Microsoft must respond to changing market conditions, it should not be interpreted to be a commitment on the part of Microsoft, and Microsoft cannot guarantee the accuracy of any information provided after the date of this presentation. MICROSOFT MAKES NO WARRANTIES, EXPRESS, IMPLIED OR STATUTORY, AS TO THE INFORMATION IN THIS PRESENTATION.27Estimated WC PowerUsing (1Gb) datasheet valuesReflects a sustained channel bandwidth of 65% maximum DRAM, 2x READs to WRITEs distributed evenly through all ranks, closed page, single slot populated, PLL/Register package included

DDR2-400DDR2-533DDR2-667DDR2-800DDR2 (DR x4)DDR3 (DR x4)DDR3-1333 is slightly higher than DDR2-800 and about 2.2W more than DDR2-667DDR3-1067 is about equal to DDR-6675/29/2007 2:02 PM 2007 Microsoft Corporation. All rights reserved. Microsoft, Windows, Windows Vista and other product names are or may be registered trademarks and/or trademarks in the U.S. and/or other countries.The information herein is for informational purposes only and represents the current view of Microsoft Corporation as of the date of this presentation. Because Microsoft must respond to changing market conditions, it should not be interpreted to be a commitment on the part of Microsoft, and Microsoft cannot guarantee the accuracy of any information provided after the date of this presentation. MICROSOFT MAKES NO WARRANTIES, EXPRESS, IMPLIED OR STATUTORY, AS TO THE INFORMATION IN THIS PRESENTATION.28More energy efficient architecture~25% better TDP power over DDR2Fewer thermal throttling conditions~15% platform power reduction in sleep modeAdded platform margin for Energy Star

Increased Performance~10% perf gain DDR3-1333 versus DDR2-800 (SPECrateFP) Expect more gains from overclockingIncreased memory compliment increased CPU performance and provide better system performance

Performance tests and ratings are measured using specific computer systems and/or components and reflect the approximate performance of Intel products as measured by those tests. Any difference in system hardware or software design or configuration may affect actual performance. Buyers should consult other sources of information to evaluate the performance of systems or components they are considering purchasing. For more information on performance tests and on the performance of Intel products, visit Intel Performance Benchmark Limitations. Source: Intel Labs, Q1, 2007Source: Intel Labs, Q1, 2007DDR3 Energy Efficient Performance For Client5/29/2007 2:02 PM 2007 Microsoft Corporation. All rights reserved. Microsoft, Windows, Windows Vista and other product names are or may be registered trademarks and/or trademarks in the U.S. and/or other countries.The information herein is for informational purposes only and represents the current view of Microsoft Corporation as of the date of this presentation. Because Microsoft must respond to changing market conditions, it should not be interpreted to be a commitment on the part of Microsoft, and Microsoft cannot guarantee the accuracy of any information provided after the date of this presentation. MICROSOFT MAKES NO WARRANTIES, EXPRESS, IMPLIED OR STATUTORY, AS TO THE INFORMATION IN THIS PRESENTATION.29Introduction To DDR35/29/2007 2:02 PM 2007 Microsoft Corporation. All rights reserved. Microsoft, Windows, Windows Vista and other product names are or may be registered trademarks and/or trademarks in the U.S. and/or other countries.The information herein is for informational purposes only and represents the current view of Microsoft Corporation as of the date of this presentation. Because Microsoft must respond to changing market conditions, it should not be interpreted to be a commitment on the part of Microsoft, and Microsoft cannot guarantee the accuracy of any information provided after the date of this presentation. MICROSOFT MAKES NO WARRANTIES, EXPRESS, IMPLIED OR STATUTORY, AS TO THE INFORMATION IN THIS PRESENTATION.30DDR2 To DDR3 ComparisonStandard featuresFeatures/OptionsDDR2DDR3CommentsPin-out/Package60-ball; x4, x884-ball; x16FBGA only78-ball; x4, x896-ball; x16FBGA onlyIndependent pin-out for x4/x8 and x16 (simplifies module design)Voltage1.8V1.8V I/O1.5V1.5V I/OReduces memory system power demandDensities256Mb-4Gb 512Mb8Gb

Highdensity components enable large capacity memory subsystemsInternal Banks4 (256,512Mb)8 (1Gb,2Gb,4Gb)8 (512Mb, 1Gb, 2Gb, 4Gb, 8Gb)Larger density per monolithic package, 8-banks is standardPrefetch(MIN READ burst)4-bits(2 clocks)8-bits(4 clocks)Reduced core speed dependency for better yieldtCK DLL enabled125MHz to 400MHz300MHz to 800MHzSupport higher data rates 5/29/2007 2:02 PM 2007 Microsoft Corporation. All rights reserved. Microsoft, Windows, Windows Vista and other product names are or may be registered trademarks and/or trademarks in the U.S. and/or other countries.The information herein is for informational purposes only and represents the current view of Microsoft Corporation as of the date of this presentation. Because Microsoft must respond to changing market conditions, it should not be interpreted to be a commitment on the part of Microsoft, and Microsoft cannot guarantee the accuracy of any information provided after the date of this presentation. MICROSOFT MAKES NO WARRANTIES, EXPRESS, IMPLIED OR STATUTORY, AS TO THE INFORMATION IN THIS PRESENTATION.31DDR2 To DDR3 Comparison Standard featuresFeatures/OptionsDDR2DDR3CommentsBurst lengthBL4, BL8BC4, BL8BC4 provides relief from some BL8 requirements Burst typeFixed, via LMR(1) Fixed, via MRS (2) OTF, on-the-flyOTF allows switching between BC4 and BL8 without MRS command Speed (data pin)400, 533, 667, 800 Mb/s800, 1066, 1333, 1600 Mb/sMigration to higherspeed I/OAdditive Latency {AL}(Posted CAS)AL options(0,1,2,3,4)AL options0, CL-1, CL-2Mainly used in server applications to improve command bus efficiencyREAD LatencyAL + CL CL = 3,4,5,6AL + CL CL = 5,6,7,8,9,10,

800(-25E) 5-5-5 1333(-15F) 8-8-8 800(-25) 6-6-6 1333(-15E) 9-9-91066(-187E) 7-7-7 1600(-125E) 9-9-91066(-187) 8-8-8 1600(-125) 10-10-10WRITE LatencyRL - 1AL + CWL CWL = 5,6,7,8 Reduces Latency combinations, one latency per tCK range5/29/2007 2:02 PM 2007 Microsoft Corporation. All rights reserved. Microsoft, Windows, Windows Vista and other product names are or may be registered trademarks and/or trademarks in the U.S. and/or other countries.The information herein is for informational purposes only and represents the current view of Microsoft Corporation as of the date of this presentation. Because Microsoft must respond to changing market conditions, it should not be interpreted to be a commitment on the part of Microsoft, and Microsoft cannot guarantee the accuracy of any information provided after the date of this presentation. MICROSOFT MAKES NO WARRANTIES, EXPRESS, IMPLIED OR STATUTORY, AS TO THE INFORMATION IN THIS PRESENTATION.32DDR2 To DDR3 ComparisonStandard featuresFeatures/OptionsDDR2DDR3CommentsData StrobesSingle-ended or DifferentialDifferential OnlyReduce data strobe crosstalkData Bus Termination Rttondie (ODT) opt. on MBondie (ODT) opt. on MBOptimized for higher data ratesRtt Values50, 75, 150 ohm120, 60, 40, 30, 20 ohmSupport higher data rates Rtt AllowedRead, Writes, standbyWrites, standbyDDR3 does not allow during Reads Dynamic ODTnone120, 60 ohmSupport 2-slots; Writes only DQ Driver Impedance18 ohm 34 ohm Optimized for 2-slot and pt-to-pt systemsDriver / ODT Calibrationnone External ResistorImproves accuracy over voltage and temperature5/29/2007 2:02 PM 2007 Microsoft Corporation. All rights reserved. Microsoft, Windows, Windows Vista and other product names are or may be registered trademarks and/or trademarks in the U.S. and/or other countries.The information herein is for informational purposes only and represents the current view of Microsoft Corporation as of the date of this presentation. Because Microsoft must respond to changing market conditions, it should not be interpreted to be a commitment on the part of Microsoft, and Microsoft cannot guarantee the accuracy of any information provided after the date of this presentation. MICROSOFT MAKES NO WARRANTIES, EXPRESS, IMPLIED OR STATUTORY, AS TO THE INFORMATION IN THIS PRESENTATION.33DDR2 To DDR3 ComparisonStandard featuresFeatures/OptionsDDR2DDR3CommentsMPR {Multi-Purpose Register}noneFour registers 2 Defined, 2 RFUProvides specialty readoutsWrite LevelingnoneDQS captures CK, DQ drives out CKs state De-skews fly-by layout used by modulesRESET#noneDedicated input Disable outputs, Resets DRAMModules240pin UDIMM, RDIMM, FBDIMM;200pin SODIMM240pin UDIMM; RDIMM and FBDIMM TBD; 204pin SODIMM Similar dimensions as DDR25/29/2007 2:02 PM 2007 Microsoft Corporation. All rights reserved. Microsoft, Windows, Windows Vista and other product names are or may be registered trademarks and/or trademarks in the U.S. and/or other countries.The information herein is for informational purposes only and represents the current view of Microsoft Corporation as of the date of this presentation. Because Microsoft must respond to changing market conditions, it should not be interpreted to be a commitment on the part of Microsoft, and Microsoft cannot guarantee the accuracy of any information provided after the date of this presentation. MICROSOFT MAKES NO WARRANTIES, EXPRESS, IMPLIED OR STATUTORY, AS TO THE INFORMATION IN THIS PRESENTATION.34DDR2 To DDR3 ComparisonOptional featuresFeatures/OptionsDDR2DDR3CommentsASR (Automatic Self Refresh)noneOptionalAutomatically adjust refresh rate during Self Refresh modetCK DLL disabledUndefined(optional)128KHz to 125MHz(optional)Provides some guidance for DLL disabled mode, if supported ODTS, via MPR(On Die Temp Sensor)none2 readout points(3 states 1X, 2X, >2X refresh rate), Optional ODTS to trip at Refresh points, with 2C grace margin. 85C, 95C5/29/2007 2:02 PM 2007 Microsoft Corporation. All rights reserved. Microsoft, Windows, Windows Vista and other product names are or may be registered trademarks and/or trademarks in the U.S. and/or other countries.The information herein is for informational purposes only and represents the current view of Microsoft Corporation as of the date of this presentation. Because Microsoft must respond to changing market conditions, it should not be interpreted to be a commitment on the part of Microsoft, and Microsoft cannot guarantee the accuracy of any information provided after the date of this presentation. MICROSOFT MAKES NO WARRANTIES, EXPRESS, IMPLIED OR STATUTORY, AS TO THE INFORMATION IN THIS PRESENTATION.35DDR3 Performance TimelineDDR3 data rate and latency timeline

Fastest speed grade driven by high-end desktopMainstream will not pay for speedNotebook and server segments tend to follow mainstream desktop15ns latencies not expected to be required for 1333 and aboveSpeedLatencytAA (ns)SpeedLatencytAA (ns)SpeedLatencytAA (ns)2007CL713.125CL8121600CL1012.5CL815CL913.5CL812CL512.51067CL713.125CL913.5CL615800CL512.51067CL713.125106780013331333200920085/29/2007 2:02 PM 2007 Microsoft Corporation. All rights reserved. Microsoft, Windows, Windows Vista and other product names are or may be registered trademarks and/or trademarks in the U.S. and/or other countries.The information herein is for informational purposes only and represents the current view of Microsoft Corporation as of the date of this presentation. Because Microsoft must respond to changing market conditions, it should not be interpreted to be a commitment on the part of Microsoft, and Microsoft cannot guarantee the accuracy of any information provided after the date of this presentation. MICROSOFT MAKES NO WARRANTIES, EXPRESS, IMPLIED OR STATUTORY, AS TO THE INFORMATION IN THIS PRESENTATION.36Chart27893115nm115nm5862688878nm425078nm

DDRDDR2DDR3GDDR4Process NodeDie SizeDie Size vs. Technology

Chart17893115nm115nm5862688878nm426278nm

DDRDDR2DDR3GDDR4Process NodeDie SizeDie Size vs Technology

Sheet1256Mb256Mb256Mb115nm95nm78nmSDRAMDDR463528DDR251DDR3GDDR3512Mb512Mb512Mb115nm95nm78nmDDR7858DDR2936242DDR36850GDDR488DDRDDR2DDR3GDDR4115nm789395nm5862688878nm4262

Sheet1000000000000

DDRDDR2DDR3GDDR4Process NodeDie SizeDie Size vs Technology

Sheet2

Sheet3

Chart2210215480275295370300395570130013001900110011002000

Idd4RIdd4WIdd7Idd (mA)Idd vs. Technology

Sheet1256Mb256Mb256Mb115nm95nm78nmSDRAMDDR463528DDR251DDR3GDDR3512Mb512Mb512Mb115nm95nm78nmDDR7858DDR2936242DDR36862GDDR488DDRDDR2DDR3GDDR4115nm789395nm5862688878nm4262X8x16512Mb512Mb512Mb512Mb512Mb512MbIdd4RIdd4WIdd7Idd4RIdd4WIdd7DDR190195450DDR210215480DDR2205195300DDR2275295370DDR3205240335DDR3300395570GDDR3130013001900GDDR3130013001900GDDR4150015002000GDDR4110011002000

Sheet1

DDRDDR2DDR3GDDR4Process NodeDie SizeDie Size vs Technology

Sheet2

Idd4RIdd4WIdd7Idd (mA)Idd vs Technology

Sheet3