Laser Lift-Off System - ipgphotonics.comLaser+Lift-Off... · Laser Lift-Off System IX-6655 System...
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The IX-6655 is optimized for high repetition rate Laser Lift-Off (LLO) process that is indepen- dent of die size, with additional capability for multi-purpose UV laser micromachining. The system combines a Class-1 workstation with an externally mounted laser, select grade homog- enizer optics to provide uniform beam size adjustable to 500 x 500µm, dual beam profilom- etry, pulse-to-pulse energy monitor with data logging and wafer map. The IX-6655 is optimized for demanding 24/7 high volume production applications. Featuring optional automation with cassette load/unload ports, robotics, wafer pre-aligner, and machine vision the system is capable of multiple wafer sizes up to 200mm. The laser system provides high throughput with the lowest Cost Of Ownership (COO) resulting from extended lifetimes and cleaning intervals. Laser Liſt-Off System IX-6655 System Features LLO Benefits Opmized for high throughput LLO (Laser Liſt-Off) applicaons. Homogenous beam size adjustable to 500 x 500µm. 248nm or 193nm laser opons available Dual Magnificaon, vision system with sub-micron part alignment High accuracy: linear air bearing stages provide accuracies to <3µm Die-size independent Increased Process Window Reduced Cost Of Ownership Fully Auotmated Opons +1 (603) 518-3200 [email protected] www.ipgphotonics.com Legal noces: All product informaon is believed to be accurate and is subject to change without noce. Informaon contained herein shall legally bind IPG only if it is specifically incorporated into the terms and condions of a sales agreement. Some specific combinaons of opons may not be available. The user assumes all risks and liability whatsoever in connecon with use of a product or its applicaon. IPG, IPG Photonics, The Power to Transform and IPG Photonics’ logo are trademarks of IPG Photonics Corporaon. © 2014 IPG Photonics Corporaon. All rights reserved. +1 (603) 518-3200 [email protected] www.ipgphotonics.com Legal noces: All product informaon is believed to be accurate and is subject to change without noce. Informaon contained herein shall legally bind IPG only if it is specifically incorporated into the terms and condions of a sales agreement. Some specific combinaons of opons may not be available. The user assumes all risks and liability whatsoever in connecon with use of a product or its applicaon. IPG, IPG Photonics, The Power to Transform and IPG Photonics’ logo are trademarks of IPG Photonics Corporaon. © 2014 IPG Photonics Corporaon. All rights reserved. Laser Liſt-Off System IX-6655 Moon Control Electronics Up to 12-axes of Servo or Step Motor Control, integrated into a single interface for all motorized components as well as the laser fire mechanism Part Handling X-Y Stage Specificaons Travel: Up to 200 mm diameter processing area Oponal Stages: Compable up to 300mm wafer processing Resoluon: 0.1 µm Accuracy: <3 µm over 125 mm x 125 mm area Repeatability: <1 µm (bidireconal) Z-axis Specificaons Travel: 10 mm Resoluon: 0.25 µm Accuracy: 5.0 µm Repeatability: 1.5 µm (bidireconal) Theta-axis Specificaons Travel: ±175 ° Resoluon: 3.6 µrad Accuracy: 300 µrad overall. 25 µrad/per ° Repeatabiility: ±5.0 µrad Programmable Rectangular Variable Aperture Enabling connuously adjustable size of rectangular shaped beam. Standard Openining: 0-15mm Vision System and Alignment Dual Camera MicroTech Vision System with 8.3 and 0.12 µm/pixel process and inspecon cameras Programmable Illuminaon Programmable lighng intensity control for automated opmizaon of imaging and alignment Oponal Equipment Automated Cassee Load/Unload System Wafer Pre-aligner Features Vision System Database Connecvity Soſtware Laser Calibraon Power Meter/Beam Stop Debris Management System Frame and Enclosure Fully enclosed Class 1 laser system, heavy duty weldment frame with integrated beam delivery system and control electronics in a 1.7 m x 2 m footprint with an externally mounted laser (included in foot print). Beam Delivery System All Granite Beam Delivery Support Structure; Vibraon isolang mounng plaorm for wafer stages and beam delivery opcs; Siffness and large thermal mass of granite structure prevent changes in beam delivery system alignment over me; Pnuemac, 2 posion laser beam stop; Precision opc mounts for stability and ease of adjustment; select grade UV Homogenizer opcs. System Specificaon IX-6655 Laser Lift-Off System with Automation Sapphire Picker Dual Beam Profilometry On-Target Power Meter Pulse Energy Monitor Motorized Mask Changer Lathe Stage Oponal Features
Transcript of Laser Lift-Off System - ipgphotonics.comLaser+Lift-Off... · Laser Lift-Off System IX-6655 System...
The IX-6655 is optimized for high repetition rate Laser Lift-Off (LLO) process that is indepen-dent of die size, with additional capability for multi-purpose UV laser micromachining. The system combines a Class-1 workstation with an externally mounted laser, select grade homog-enizer optics to provide uniform beam size adjustable to 500 x 500µm, dual beam profilom-etry, pulse-to-pulse energy monitor with data logging and wafer map.
The IX-6655 is optimized for demanding 24/7 high volume production applications. Featuring optional automation with cassette load/unload ports, robotics, wafer pre-aligner, and machine vision the system is capable of multiple wafer sizes up to 200mm. The laser system provides high throughput with the lowest Cost Of Ownership (COO) resulting from extended lifetimes and cleaning intervals.
Laser Lift-Off SystemIX-6655
System Features
LLO Benefits
��Optimized for high throughput LLO (Laser Lift-Off) applications.
��Homogenous beam size adjustable to 500 x 500µm.
��248nm or 193nm laser options available
��Dual Magnification, vision system with sub-micron part alignment
��High accuracy: linear air bearing stages provide accuracies to <3µm
��Die-size independent
�� Increased Process Window
��Reduced Cost Of Ownership
��Fully Auotmated Options
+1 (603) [email protected] notices: All product information is believed to be accurate and is subject to change without notice. Information contained herein shall legally bind IPG only if it is specifically incorporated into the terms and conditions of a sales agreement. Some specific combinations of options may not be available. The user assumes all risks and liability whatsoever in connection with use of a product or its application. IPG, IPG Photonics, The Power to Transform and IPG Photonics’ logo are trademarks of IPG Photonics Corporation. © 2014 IPG Photonics Corporation. All rights reserved.
+1 (603) [email protected] notices: All product information is believed to be accurate and is subject to change without notice. Information contained herein shall legally bind IPG only if it is specifically incorporated into the terms and conditions of a sales agreement. Some specific combinations of options may not be available. The user assumes all risks and liability whatsoever in connection with use of a product or its application. IPG, IPG Photonics, The Power to Transform and IPG Photonics’ logo are trademarks of IPG Photonics Corporation. © 2014 IPG Photonics Corporation. All rights reserved.
Laser Lift-Off SystemIX-6655
Motion Control Electronics Up to 12-axes of Servo or Step Motor Control, integrated into a single interface for all motorized components as well as the laser fire mechanism
Part HandlingX-Y Stage Specifications Travel: Up to 200 mm diameter processing area
Optional Stages: Compatible up to 300mm wafer processingResolution: 0.1 µmAccuracy: <3 µm over 125 mm x 125 mm areaRepeatability: <1 µm (bidirectional)
Z-axis Specifications Travel: 10 mmResolution: 0.25 µm Accuracy: 5.0 µmRepeatability: 1.5 µm (bidirectional)
Theta-axis Specifications Travel: ±175 °Resolution: 3.6 µradAccuracy: 300 µrad overall. 25 µrad/per °Repeatabiility: ±5.0 µrad
Programmable Rectangular Variable Aperture Enabling continuously adjustable size of rectangular shaped beam. Standard Openining: 0-15mm
Vision System and Alignment
Dual Camera MicroTech Vision System with 8.3 and 0.12 µm/pixel process and inspection cameras Programmable Illumination Programmable lighting intensity control for automated optimization of imaging and alignment
Optional Equipment Automated Cassette Load/Unload SystemWafer Pre-aligner Features Vision SystemDatabase Connectivity SoftwareLaser Calibration Power Meter/Beam StopDebris Management System
Frame and Enclosure Fully enclosed Class 1 laser system, heavy duty weldment frame with integrated beam delivery system and control electronics in a 1.7 m x 2 m footprint with an externally mounted laser (included in foot print).
Beam Delivery System All Granite Beam Delivery Support Structure; Vibration isolating mounting platform for wafer stages and beam delivery optics; Siffness and large thermal mass of granite structure prevent changes in beam delivery system alignment over time; Pnuematic, 2 position laser beam stop; Precision optic mounts for stability and ease of adjustment; select grade UV Homogenizer optics.
System Specification
IX-6655 Laser Lift-Off System with Automation
Sapphire PickerDual Beam ProfilometryOn-Target Power MeterPulse Energy Monitor Motorized Mask ChangerLathe Stage
Optional Features
User Interface:
• Fully-integrated laser and system control with single user interface
• Vision system for easy and automated part alignment and process inspection
• IPG project management software and intuitive macro building utility for fast programming
• DXF and CSV file interface for complex pattern input
Metrology Options:
• Dual Beam Profilometer: Mask and On-Target viewing of beam energy profile for easy alignment
Laser Type:
• Externally Mounted MicroX Laser• Available in 193nm or 248nm configurations• Pulse rate from 1 Hz to 1,000 Hz • Pulse length typically 10 ns• Footprint with MicroX Laser 1.7m x 2m
System Achitecture:
• All granite beam delivery and stage support structure for vibration isolation
• Front door with laser-safe viewing window• Single system control software with ergo-arm
mounted user interface• Externally mounted laser for easy access.
Laser Lift-Off SystemIX-6655The IX-6655 LLO Workstation
Automation Options:
• Fully automated with dual load/unload ports for unattended operation
• Programmable Illumination• Automated Part Aligner• IAP with Dual End-Effectors and load/unload ports• Sapphire Picker for automated removal from the
epi wafer
Cost of Ownership for MicroX vs. Traditional Excimer laser:• MicroX tube life time >2x • MicroX optics life time >3x • Fewer optics (½) cleaning with MicroX • Gas fills happen every 2.5x pulses with MicroX
compared with traditional excimer
IX-6655 Laser Lift-Off System with Externally Mounted MicroX
and Chiller
IX-6655 Internal Configuration: BDS, Cameras, Stages Built around
Granite Support Structure
• Pulse-to-Pulse Energy Monitor: Captures real-time data of pulse energy
• On-Targe Power Meter
