Interconnect Substrates Ceramic

SMT/Hybrid/Packaging 2007 Conference

April 26, 2007Nuremberg, Germany

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Interconnect SubstrateInterconnect Substrate--Ceramic ’06’TWGCeramic ’06’TWG• Chair: Howard Imhof, Metalor Technologies • Co-Chair: Ton Schless, MIDAS Vision Systems, Inc.• Contributors:• Aleksandra Djordjevic Delphi Electronics and Safety• Aziz Shaikh Ferro• D.H.R. Sarma Delphi Delco Electronics Systems• Dan Amey DuPont • Dave Malanga Heraeus Circuit Materials Division• Dough Mathews TDK• Franz Bechtold Via Electronik• Glenn Oliver Dupont• Jens Mueller Technical University Ilmenau• Judah Wolf ATC Ceramics • Keith Eastler Kyocera America Inc.• Kevin Ewsuk Sandia National Laboratories• Martin Oppermann EADS • Mike Ehlert Barry Industries• Neal Mellen TDK• Paul Collander Poltronic• Paul Vianco Sandia National Laboratories• Peter Uhlig IMST• Reinhard Kulke IMST• Sam Horowitz DuPont• Steve Annas NATEL Engineering• Terho Kutilainen Asperation Oy

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Ceramic Interconnect TechnologyCeramic Interconnect Technology

LTCCLow Temperature Cofired Ceramic

Aluminum Nitride

Plated Cu on Ceramic

Thick Film / Photopatterned

ThinFilm

DirectBond Cu

HTCCHigh Temperature Cofired Ceramic

Courtesy of DuPont

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Business Trends & DriversBusiness Trends & Drivers

• Neal Mellen/TDK inputs• Evolution of cell phone to handset• Reduce Eng. $, Assembly $, & size>certification• Cost, performance, size trade offs comparing MCM-L, MCM-C,

and MCM-D• Digital Data & RF power driven• Device-Person-Office; Device-Device; Person-Person• 750 mil Cell phones, 282 mil BT, 142 mil WLAN +UWB+WiMAX• 2007 WLAN MIMO (Lap tops) 2.5-3X market growth• 2009-2010 lose market share to MCM-D• Tomita san/Kyocera input-Digital TV Tuner/Cell PhoneAsia• Bio-Medical & Military applications (to be defined)• Hi-Temp aps (Sante Fe HiTEC 2006)?

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PRODUCT TRENDSPRODUCT TRENDS

Integration

Integration

niaturization

iniaturization

++

Infrastructure

MiM

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MODULE TRENDMODULE TREND

TFPDISCRETE LTCC IC

New 3rd Gen 5th Gen Mature

Discretes

CustomLTCC

LTCCModules

CustomTFP

TFPModules Discretes

Application and IC performance (maturity & power level) drives technology selection !

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SUBSTRATESSUBSTRATES

315 / 398 / 247428 / 398398Thermal ρ (W / m-K)

.005/ .003 / .0001.0003 - .003.015 /.009/.010Loss Tangent (1 GHz)

12 / 5 / 107 - 124.9 / 3.9 / 4.7Dielectric Constant (εr)

6308# of Layers

100 / 1.7 / 422.5.2 - .4Thermal σ (W / m-K)

2.6 / 1 / 8615 / 15 / 13CTE (ppm)

2.6 / 1.7 / 2.11.7 / 1.71.7Electrical ρ (10-8 Ω-m)

$.5 K

1 week

5

< 10 GHz

10 - 15 %

100

Cu

FR-4, BT, FR-5

MCM-L

2 – 4 %2 – 4 %Process Variation

< 50 GHz<25 GHzRF Frequency

55# Iterations to Spec

Si, Glass, SapphireCeramicSubstrates

$10 K$2 KIteration Cost1

2-4 weeks2 weeksIteration Time

575Line Width (µm)

Al, Cu, AuAg, CuConductors

MCM-DMCM-CCHARACTERISTIC

1 – Screen, mask, PCB cost

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SUBSTRATE COSTSUBSTRATE COST

SiP

SoC

PhotoImageable

Screen PrintEtchE-Beam

.1 1 10 100 1000

$1

$.1

$.01

$.001

$.0001

$.00001

Nor

mal

ized

Cos

t ($

/mm

2 )

Laminate

LTCCThin Film

Si

GaAs

CD

Stepper Projection

Process Feature Size (µm)

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SUBSTRATE COSTSUBSTRATE COST

SoC

Stepper Projection PhotoImageable

Screen PrintEtchE-Beam

.1 1 10 100 1000Process Feature Size (µm)

$1

$.1

$.01

$.001

$.0001

$.00001

Nor

mal

ized

Cos

t ($

/mm

2 )

Laminate

LTCCThin Film

Si

GaAs

CD

SoC

Stepper Projection PhotoImageable

Screen PrintEtchE-Beam

.1.1 11 10 100 1000Process Feature Size (µm)

$1

$.1

$.01

$.001

$.0001

$.00001

$1

$.1

$.01

$.001

$.0001

$.00001

Nor

mal

ized

Cos

t ($

/mm

2 )

Laminate

LTCCThin Film

Si

GaAs

CD

There has been significant debate about “which technology is better”?Clearly all technologies have strengths and weaknesses relative to each other.The debate is reallyonly relevant at thepoints at whichperformance, sizeand cost overlap.

Overlap leads to debate

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TECHNOLOGY DRIVERSTECHNOLOGY DRIVERSD

ata

Rat

e (M

b/se

c)

Desk

.1 1 10 100 1,000Distance (m)

10,000

100

10

.1

1

Room Building Block City

10,000

1000

RF POWER DRIVEN

DIG

ITA

L IC

DR

IVE

N

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New New Technology DriversTechnology Drivers

• Able to trim resistors and capacitors to <1% 25 microns below surface. Jun Harada/Murata

• Tomita san/Kyocera inputs• Miniaturize & low profile realized with LTCC• Blind via mature • Cavity forming mature• Flexible layout with built in passive components• Hi-level electrical performance with stable dielectric• > Mechanical strength for drop test• Matched TCE for 2nd level reliability• Modulization

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MARKET DRIVERSMARKET DRIVERS

Desk

.1 1 10 100 1,000Distance (m)

10,000

100

10

.1

1

Room Building Block City

10,000

1000

Person to Person - PhoneDevic

e to Perso

n - Portable Offic

e

Dev

ice

to D

evic

e -U

SB

Dat

a Rat

e (M

b/se

c)

12

Desk

.1 1 10 100 1,000

10,000

100

10

.1

1Dat

a Rat

e (M

b/se

c)

Room Building Block City

10,000

1000

BT Class II BT Class I

802.11b

802.11a/g

802.11nUWB

UWB BT

1G (Analog)

3G

2 / 2.5G

4G

WiMAX802.16

BT EDR

WIRELESS POTPOURRIWIRELESS POTPOURRI

Distance (m)

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WIRELESS MARKETWIRELESS MARKET

2005 Wireless Opportunities: 1

750 M Cell Phones – 21 % growth282 M Bluetooth Devices – 94 % growth142 M Wireless LAN products – 65 % growth

< 1 M UWB Devices< 1 M WiMAX Devices

WLAN MIMO• 802.11 a/b/g were single input (Rx) / single output (Tx)

systems – 1 x 1• 802.11 n is a multiple input / multiple output (MIMO)

system. Initial implementation is 3 x 2 moving up to 3 x 3, etc..

• In terms of RF content this represents an 2.5X market growth for these systems.

1- Prismark “Wireless Technology Report”, Jan. 2006.

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WLAN EVOLUTIONWLAN EVOLUTION

0%

20%

40%

60%

80%

100%

Per

cen

tag

e (%

)

2006 2007 2008 2009Year

802.11 g 802.11 a/g 802.11 n

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RF IMPACTRF IMPACT

-

200

400

600

800

1,000

1,200

1,400

2004 2005 2006 2007 2008 2009YEAR

UN

ITS

(M)

WLAN Units

WLANRx + Tx

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Business IssuesBusiness IssuesSummary Table: • LTCC Component and Modules: Global Growth

Forecasts By End-Segment: 2001 - 2007(Forecast Made December 2002)In Millions of USD

Courtesy of Paumanok Publications

ZVEI 2006: Technologieroadmap: Elektronische Komponenten und Systeme (www.zvei.de/index.php?id=342):

Film circuits growth% 2006 , % 2007, use 2006 (M$): America 0.9%, 5.3%, 1170M, Europe 0.5, 3.1, 1210M, ROW 6.0%, 7.4%, 2280M

LTCC winning over Thickfilm, thinfilm stable (Paul Collander presented Munich iNEMI Workshop April 5, 2006)

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Applications/Technology convergenceApplications/Technology convergence

Courtesy of Paumanok Publications