iNEMI Environmental Projectsthor.inemi.org/webdownload/Pres/EGG2012/Env.pdf · 2006 2007 2008...
Transcript of iNEMI Environmental Projectsthor.inemi.org/webdownload/Pres/EGG2012/Env.pdf · 2006 2007 2008...
iNEMI Environmental
Projects
Stephen Tisdale, Intel Electronics Goes Green
September 9, 2012
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AGENDA
• Current Situation Analysis
• Environmental Project Portfolio
• iNEMI Low-Halogen Position Statement
• Industry Standards
• iNEMI Projects Status
Mercury Ban
Batteries
WEEE
RoHS
Batteries
Battery law
2000
Today
CA Green
Chemistry,
RoHS
State
mercury,
PBB/PBDE,
e-waste laws
E-waste &
packaging
laws
E-waste
Battery law
E-waste , Dfe product &
Packaging
E-waste
ErP
REACH
E-waste &
Energy
E-waste
China RoHS
Energy law
Energy
E-waste,
RoHS
Packaging
Federal
CPSIA
IPP 25 EU States –
WEEE & RoHS
RoHS study
E-waste,
RoHS
E-waste,
RoHS Draft Dfe,
Take-back,
Packaging Draft RoHS, Battery
GLOBAL REGULATORY TRENDS:
The pace of change quickens
2006 2007 2008 2009 2010 2011 2012 2013+
Product Design Requirements are Increasing
Industry Must Stay Ahead of the Curve…
Eco-Design
Std 62430
Material Declaration Std
62474*
JIG 101 Material Declaration
Std - Products
Material
Declaration
Std1752
JIG 201 Material Declaration
Std – Shipping
Media
Material
Declaration
Std1752 v. 2
Internationally recognized industry standards can facilitate cost effective IT data exchange solutions
Recast
RoHS
Conflict Minerals
India RoHS
Servers
TSCA
Laptop/PC
These initiatives involve data/information
exchange throughout industry supply chain
Low
Halogen
0
2,000
4,000
6,000
8,000
10,000
12,000
2000 2001 2002 2003 2004 2005 2006 2007 2008 2009
Hits on external facing product ecology website
144K 255K
Customer Demands are Increasing
Custo
mer
requests
fo
r pro
duct
eco
logy d
ata
0.1
10
1,000
10,0000
1970 1980 1990 2000 2010
Mips/Watt
Gas Mileage
100,000 mpg
10 mpg
The IT industry is uniquely positioned to
respond:
Moore’s Law and Sustainability
If automobiles followed Moore’s law
they would achieve 100,000 mpg!
Environmentally Sustainable Electronics
(ESE)
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iNEMI Environmental Project Portfolio
• HFR-Free PCB Material Evaluation (competed in 2008)
• HFR-Free Leadership Program
– HFR-Free PCB Materials (completed in Q1 2012)
– HFR-Free Signal Integrity (completed in Q4 2011)
• PVC Alternative Initiative (completed in 2011)
• HFR-Free High Reliability PCB (completion Q4 2012)
• Eco-Impact Evaluator for ICT Equipment – LCA (completion Q4 2012)
• White Paper of Harmonization Of Environmental Data Management
(completion Q4 2012)
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iNEMI supports removal of:
Halogenated Flame Retardants (HFRs)
and Polyvinyl Chloride (PVC)
iNEMI Position Statement Can Be Found Here :
http://thor.inemi.org/webdownload/projects/ese/HFR-Free/Low-Halogen_Def.pdf Supported by iNEMI and its member companies (Dell, HP, Intel, Lenovo, Cisco, Sun, Tyco Electronics etc.)
1 - Applies only to halogenated flame retardants and PVC. Halogens are below 1000 PPM bromine and 1000 PPM chlorine when used in Flame Retardants or PVC
iNEMI’s Low-Halogen1 Position
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Low-Halogen Electronics Standards
Industry
Standards
(PCB Material Only)
IEC 61249-2-21
JPCA-ES-01-1999
IPC - 4101B
Industry Standard (Defining “Low-Halogen”
Electronic Products)
(Removal of BFR/CFR/PVC)
JS-709A (Joint JEDEC / ECA Standard)
Supply Chain Alignment / Definition Critical
NOTE: The JEDEC/ECA Joint Industry Standard “JS-709A” Defining “Low-
Halogen” Electronic Products (Removal of BFR/CFR/PVC), is aligned to the
iNEMI Position Statement and is available through the JEDEC Website at
http://www.jedec.org
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HFR-free Technology Leadership Program
Stephen Tisdale, Intel – Chair HFR-Free Leadership Program
HFR-Free PCB Materials Chair: John Davignon – Intel
HFR-Free Signal Integrity Chair: Stephen Hall - Intel
Co-Chair: David Senk - Cisco
Identify key thermo-mechanical performance characteristics and determine if they are in the
critical path for the HFR-free PCB material transition.
Ensure there is no degradation of electrical signals in HFR-free PCB materials, base on investigation of
permittivity and loss as well as how they are impacted by moisture absorption in new HFR-free materials.
HFR-Free Technology
Leadership Program
HFR-Free PCB
Materials
Chair:
John Davignon, Intel
Project Chair: Project Co-Chair:
Strategy Tactics Start: End:
Issues Graphics
Focus Area:
Sep-12 TIG:
Goal: Define the material set parameters and test conditions for all relevant market segments
Environment
ECE
HFR-Free PCB Materials – Phase 2
-- John Davignon, Intel
• Identify key performance characteristics and test criteria - Make recommendations for performance tests
– Electrical
– Output broadband frequency dependent dielectric constant (Dk) and loss tangent (Df) of candidate halogen-free laminate materials (10KHz - 20GHz)
– Moisture absorption impact on Dk, Df
– Breakdown Voltage Analysis
– Simulate results of high speed buses …. DDR3, PCI2,3
– Thermo-Mechanical - Critical Margin Degradation Review
• Define and correlate test metrology to critical defects
• Define the PCB material property requirements
• Define the material set parameters and test conditions for all relevant market segments
• Carry out the necessary testing of available materials from participating companies
• Publish a set of material guidelines
• Drive test conditions and material properties into supplier data sheets
• Large number of tests proposed may impact schedule for Phase 2 testing schedule
12-10 9-11
Focus Area:
Sep-12 TIG:
Project Members
Environment
ECE
HFR-Free PCB Materials
HFR-Free Technology
Leadership Program
HFR-Free Signal
Integrity
Chair: Stephen Hall, Intel;
Co-Chair: David Senk, Cisco
Project Chair: Project Co-Chair:
Strategy Tactics Start: End:
Issues Graphics
Focus Area:
Sep-12 TIG:
Goal: Define the electrical signaling and PCB material property requirements as well as the associated test conditions
Environment
ECE
HFR-Free Signal Integrity – Phase 2
David Senk, Cisco Stephen Hall, Intel
• Identify candidate materials for evaluation
• Poll the supplier base, keying in on candidate materials for market segment applications.
– Identify candidate HFR-free laminate materials to allow interchangeability for standard halogenated materials
• Define the electrical signaling
• Define the material set parameters and test conditions for all relevant market segments
• Carry out the necessary testing of available materials from participating companies
• Publish a set of material guidelines
• Drive test conditions and material properties into supplier data sheets
• Higher permittivity of HFR-materials leads to more crosstalk & reduced bus performance
• More crosstalk necessitates more routing area which can lead to increased cost
• Reduced Margins
08-10 09-11
3.4 3.5 3.6 3.7 3.8 3.9 4 4.1
3.4
3.6
3.8
4
4.2
4.4
4.6
4.8
5
15 17 19 21 23 25
Eye Area (ps-volts)
perm
itti
vit
y
Eye from lower limit of 1080 FR4
Eye from upper
range of HF
materials on the
market
37.5% margin degradation
voltage
Time, ps
voltage
Time, ps
Nominal 1080 FR4 permittivity
Focus Area:
Sep-12 TIG:
Project Members
Environment
ECE
HFR-Free Signal Integrity
HFR-Free High Reliability
Chair:
Steve Tisdale,
Intel
Project Chair: Project Co-Chair:
Strategy Tactics Start: Anticipated End:
Issues Graphics
Focus Area:
Sep-12 TIG:
Goal: Promote standards for bromine flame retardant (BFR) free printed wiring boards
Miniaturization
Organic PCB TIG
HFR-Free High Reliability PCB
-- Stephen Tisdale, Intel
• Phase 1.0- Initiate project
• Phase 1.1- Review prior work and identify testing method
• Phase 1.2- Develop, manage, and execute performance testing
• Phase 1.3- Compile results, evaluate and publish results
• Extend results of the Halogen Free PCB Phase I Project
• Build on industry knowledge and capability
• Create a proactive stance in the electronics industry for other non-regulated halogenated organic substances
• Stimulate supply capability
• Consider unique market segment requirements
• Identify technology readiness and gaps
• Determine HF board level reliability for various components
10-08 06-10
Focus Area:
Sep-12 TIG:
Project Members
Miniaturization
Organic PCB TIG
HFR-Free High Reliability PCB
Eco-Impact Evaluator for ICT
Equipment
Chair: Tom Okrasinski, Alcatel-
Lucent;
Co-chair: John Malian, Cisco
Project Chair: Project Co-Chair:
Strategy Tactics Start: Anticipated End:
Issues Graphics
Focus Area:
Sep-12 TIG:
Goal: Develop a tool to more easily derive key eco-environmental information for an ICT equipment / assets
Environment
ECE
Eco-Impact Evaluator for ICT Equipment – Phase 2
John Malian, Cisco Tom Okrasinski, Alcatel-Lucent
• Focused on developing an estimator / emulator tool that will provide a degree of accuracy relative to the end results intended use
• Build on the knowledge from the ICT industry, published literature and publicly available data / information
• Final development and deployment of the data collection and maintenance survey
• Focused on commonly used equipment / assets within the ICT industry
• Centered on generating prototype tool leading to an industry standard
• Intended to be periodically updated
• Building on the knowledge from the ICT industry
• Providing eco-impact for ICT products is becoming an increasing requirement for placing products on the market
• The benefits of this eco-environmental impact estimator will provide a more simplified means of evaluating such impacts
06-11 06-12
Focus Area:
Sep-12 TIG:
Project Members
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Environment
ECEt
Eco-Impact Evaluator for ICT Equipment – Phase 2
PVC Alternatives
Chair:
Scott O’Connell, Dell Inc.
Project Chair: Project Co-Chair:
Strategy Tactics Start: End:
Issues Graphics
Focus Area:
Sep-12 TIG:
Goal: Perform an Life Cycle Assessment of the electrical and mechanical properties, and safety aspects of PVC alternatives for Power Cord Sets
Environomental
ECE
PVC Alternatives
-- Scott O’Connell, Dell
• Phase I conduct a cradle-to-grave Life Cycle Assessment (LCA) on PVC and PVC-free Alternatives for detachable US desktop power cord sets
• Phase 2 Conduct performance testing of different PVC-free alternatives
• Phase 1 - Develop environmental (LCA) comparing PVC with PVC-free compounds for detachable desktop US power cord sets
• Phase 2 - Develop and conduct a test to gain a better understanding of the electrical, mechanical and safety aspects of PVC-free alternatives
• Industry migration to “PVC-free” materials
• LCA studies can be costly and it remains to be seen if there will be a critical mass of companies who want to share the cost of performing a full LCA on various materials used in US Power Cord Sets.
01-11 07-11
Focus Area:
Sep-12 TIG:
Project Members
Environment
ECE
PVC Alternatives Initiative
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iNEMI Active Environmental Projects
• All are driving scientific study of key electronics
manufacturing alternative materials, design practices,
&/or product performance metrics
• The goals are to deliver highly reliable, user friendly, and
environmentally friendly products and processes
• Many key projects are wrapping up in depth learning and
results in 2012
• To get the most learning and benefit from iNEMI projects
you need to be an iNEMI member and GET INVOLVED
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Feedback??
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Thank You