Cyclone Device Handbook, Volume .Cyclone Device Handbook, Volume 2 ... High-Speed Board Design.

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Transcript of Cyclone Device Handbook, Volume .Cyclone Device Handbook, Volume 2 ... High-Speed Board Design.

  • Preliminary Information101 Innovation DriveSan Jose, CA 95134(408) 544-7000http://www.altera.com

    Cyclone Device Handbook, Volume 2

    C5V2-1.0

    http://www.altera.com

  • Copyright 2003 Altera Corporation. All rights reserved. Altera, The Programmable Solutions Company, the stylized Altera logo, specific device des-ignations, and all other words and logos that are identified as trademarks and/or service marks are, unless noted otherwise, the trademarks andservice marks of Altera Corporation in the U.S. and other countries. All other product or service names are the property of their respective holders. Al-tera products are protected under numerous U.S. and foreign patents and pending applications, maskwork rights, and copyrights. Altera warrantsperformance of its semiconductor products to current specifications in accordance with Altera's standard warranty, but reserves the right to makechanges to any products and services at any time without notice. Altera assumes no responsibility or liability arising out of the ap-plication or use of any information, product, or service described herein except as expressly agreed to in writing by AlteraCorporation. Altera customers are advised to obtain the latest version of device specifications before relying on any published in-formation and before placing orders for products or services.

    Printed on recycled paper

    ii Altera CorporationPreliminary

  • Altera Corporation

    Contents

    Chapter Revision Dates ........................................................................... v

    About this Handbook ............................................................................. xiiiHow to Find Information ..................................................................................................................... xiiiHow to Contact Altera .......................................................................................................................... xiiiTypographic Conventions .................................................................................................................... xiv

    Part I. PCB Layout GuidelinesRevision History ............................................................................................................................ Part I1

    Chapter 1. Cyclone EP1C3T100 Device Pin InformationIntroduction ............................................................................................................................................ 11Pin List ..................................................................................................................................................... 12Pin Definitions ........................................................................................................................................ 17PLL & Bank Diagram .......................................................................................................................... 110

    Chapter 2. Cyclone EP1C3T144 Device Pin InformationIntroduction ............................................................................................................................................ 21Pin List ..................................................................................................................................................... 22Pin Definitions ........................................................................................................................................ 29PLL & Bank Diagram .......................................................................................................................... 213

    Chapter 3. Cyclone EP1C6 Device Pin InformationIntroduction ............................................................................................................................................ 31Pin List ..................................................................................................................................................... 32Pin Definitions ...................................................................................................................................... 316PLL & Bank Diagram .......................................................................................................................... 320

    Chapter 4. Cyclone EP1C12 Device Pin InformationIntroduction ............................................................................................................................................ 41Pin List ..................................................................................................................................................... 42Pin Definitions ...................................................................................................................................... 420PLL & Bank Diagram .......................................................................................................................... 424

    Chapter 5. Cyclone EP1C20 Device Pin InformationIntroduction ............................................................................................................................................ 51Pin List ..................................................................................................................................................... 52

    iii

  • Cyclone Device Handbook, Volume 2

    Pin Definitions ...................................................................................................................................... 522PLL & Bank Diagram .......................................................................................................................... 526

    Chapter 6. Package Information for Cyclone DevicesIntroduction ............................................................................................................................................ 61Device & Package Cross Reference ..................................................................................................... 61Thermal Resistance ................................................................................................................................ 62Package Outlines ................................................................................................................................... 62

    100-Pin Plastic Thin Quad Flat Pack (TQFP) ................................................................................ 63144-Pin Plastic Thin Quad Flat Pack (TQFP) ................................................................................ 65240-Pin Plastic Quad Flat Pack (PQFP) ......................................................................................... 67256-Pin Non-Thermally Enhanced FineLine Ball-Grid Array ................................................... 69324-Pin Non-Thermally Enhanced FineLine Ball-Grid Array ................................................. 611400-Pin Non-Thermally Enhanced FineLine Ball-Grid Array ................................................. 613

    Chapter 7. Designing with FineLine BGA PackagesIntroduction ............................................................................................................................................ 71Overview of BGA Packages ................................................................................................................. 71PCB Layout Terminology ..................................................................................................................... 72

    Escape Routing ................................................................................................................................. 72Multi-Layer PCBs ............................................................................................................................. 72Vias ..................................................................................................................................................... 72Via Capture Pad ............................................................................................................................... 74Surface Land Pad .............................................................................................................................. 74Stringer ............................................................................................................................................... 75

    PCB Layout for FineLine BGA Packages ........................................................................................... 76Surface Land Pad Dimension ......................................................................................................... 76Via Capture Pad Layout & Dimension ......................................................................................... 77Signal Line Space & Trace Width ................................................................................................. 710Number of PCB Layers .................................................................................................................. 711

    Conclusion ............................................................................................................................................ 712

    iv Altera Corporation

  • Altera Corporation

    Chapter Revision Dates

    The chapters in this book, Cyclone Device Handbook, Volume 2, were revised on the following dates. Where chapters or groups of chapters are available separately, part numbers are listed.

    Chapter 1. Cyclone EP1C3T100 Device Pin InformationRevised: May 2003Part number: C52001-1.0

    Chapter 2. Cyclone EP1C3T144 Device Pin InformationRevised: May 2003Part number: C52002-1.0

    Chapter 3. Cyclone EP1C6 Device Pin InformationRevised: May 2003Part number: C52003-1.0

    Chapter