CSP LED Lighting Modules 2017 - System Plus Consulting€¦ · FromTechnologies to Market CSP LED...

From Technologies to Market

CSP LED Lighting Modules

2017

Technology, Manufacturing and Applications Trends

Market and Technology Report

SAMPLE


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To understand how CSP LEDs modify the device and module landscape, and identify real opportunities associated to the technology.

UNDERSTAND CSP LED TECHNOLOGY:

• Difference with other packages.

• Impact on manufacturing process.

• Potential for cost reduction.

UNDERSTAND CHANGES IN SYSTEM DESIGN AND INTEGRATION RULES:

• Impact on optical design.

• Impact on thermal management.

• Impact on electrical management.

UNDERSTAND PERFORMANCES IN APPLICATIONS:

• Positioning of CSP LEDs compared to middle power, high power LED and COB LED modules.

• Opportunities for CSP LEDs in applications.

UNDERSTAND COMPETITIVE LANDSCAPE AND SUPPLY CHAIN:

• Key players.

• Impact on the LED supply chain.

REPORT OBJECTIVES

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• In this report we looked at the CSP values from the integratorperspective.

• It means we used our deep understanding of application requirementstogether with our insights in LED packages architectures and longlasting system (LED luminaires) design capabilities.

• We investigated architectures, electrical and thermal behaviors andoptical characteristics of CSP LED’s .

• We performed samples light flux and color point characterizationsunder different current and temperature settings, together withluminance measurement at PISEO's lab.

• Then we integrated all the gathered parameters in our LED basedsystem models and performed optical simulations using ZEMAX OpticStudio 16.

• By using the models and optical simulations we were able to understandhow the different CSP LED types would perform depending on theapplication.

• Based on this deep understanding we were then able to drawconclusions on the values of CSP LED depending on the applications.

How did we get to evaluate CSP LED values?

METHODOLOGY

100 200 400 600 800 1000

-40 264 536 937 1325 1588 1864

-10 254 515 902 1277 1529 1793

10 248 503 879 1244 1491 1739

30 241 489 857 1209 1438 1668

50 235 477 829 1164 1371 1579

60 231 468 813 1133 1333 1533

70 227 459 793 1102 1294 1487

80 222 448 771 1070 1255 1441

Am

bia

nt

tem

pe

ratu

re (

°C)

current (mA)System flux (lm)

100 200 400 600 800 1000

-40 -34 -28 -16 -3 9 22

-10 -4 2 14 26 39 51

10 16 22 34 46 58 71

30 36 42 53 65 78 90

50 56 61 73 85 97 109

60 66 71 83 95 107 119

70 76 81 93 105 117 129

80 86 91 103 115 126 138

Am

bia

nt

tem

pe

ratu

re (

°C)

Tjunction (°C)Driving current If (mA)

Embedded Projector lighting system - Optical design optimization and system performance calculation

Sce PISEO – Zemax Optical Studio 16 / Piseo configurator


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REPORT METHODOLOGY

Market segmentation methodology

Market forecast methodology


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REPORT METHODOLOGY

Technology analysis methodology Information collection


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o About the Authors of the Report P5

o Report Objectives P6

o Companies Cited in This Report P7

o Glossary P8

o Methodology P9

o Executive Summary P10

o Status of the LED Industry and Recent Trends P40

Status of the LED Industry

• Introduction - Segmentation of Packaged LEDs

• History of the LED Industry

• Market Landscape

• Industrial Landscape

• Key Highlights

• Packaged LED Revenue Forecast - Split by Application

• 2015 & 2016 in a Nutshell

• Future Trends

• LED Market Trends

• Displays

• General Lighting

Recent Trends in the LED Industry

• Overview

• Product Diversification (Level 1)

• LED Filaments

• COB LEDs

• Flip Chip (FC) LEDs

• Chip Scale Packaged (CSP) LEDs

• Application Diversification - Automotive Lighting

• Product Diversification (Level 2) - UV LEDs

• Vertical Integration - LED Module

• Conclusion

o CSP LED Applications Landscape P61

Overview

Flash

Backlighting

General Lighting

Automotive Lighting

o CSP LED Device P68

Introduction to CSP LED Device

• Definition

• Benefits

CSP LED Device Family Description

• Introduction

• Size Criterion

• Power Density Criterion

• CSP or Not CSP?

• Power Criterion

CSP LED Device Technology

• Difference with Other Packages

• Chip Level

• Package Level

• CSP LEDs Structure

• Overview

• Focus on Packaging

• CSP LEDs in the LED Package Proliferation

• Flip Chip CSP LEDs vs High Power Type LEDs

• Wafer Level CSP LED vs High Power Type LED

• Vertical Thin Film CSP LED vs High Power Type LED

• Flip Chip packaged CSP LED vs High Power Type LED

TABLE OF CONTENT (1/3)


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o CSP LED Device P68

CSP LED Device Manufacturing Process

• Conventional LED Manufacturing Process

• Flip Chip CSP LED Manufacturing Process

• Wafer Level CSP LED Manufacturing Process

• CSP LEDs vs Conventional LEDs

• Impact on Supply / Value Chain

• Overview

• Highlights on Phosphor Sheet / Film Suppliers

CSP LED Device Cost / Price

• Potential for Cost Reduction

• The Case of CSP Architecture for Low and Middle Power LEDs

• The Case of CSP Architecture for High Power LEDs

• Price Positioning of CSP LEDs (Vs. Traditional LEDs)

• Price Positioning of CSP LED Modules (Vs. Traditional Modules)

CSP LED Device Industry

• Key Players Identified

• Highlights on US and European Players

• Highlights on Japanese Players

• Highlights on Korean Players

• Highlights on Taiwanese and Chinese Players

• Trends - Flow Chart Comparison between Standard, CSP and COB LEDs

CSP LED Market

CSP LED Market Volume (2012 - 2021)

o CSP LED Lighting Module P112

Objectives, Methodology and Synthesis

• From Device Characteristics to Performance in Application

• System Design and Performance Assessment

• Impact of CSP LED Device on System/Module Design

• CSP LED System/Module Performance in Application

Definition and Types of LED Lighting Modules

• Definitions

• LED Module in the Global LED Value Chain

• The Different Types of LED Modules - Taxonomy

• The Different Types of LED Modules - Positioning

Main Functions in LED Lighting Modules

• System Structure

• Parameter Interdependence

Optical Design of CSP LED Lighting Modules

• Optical Management inside LED Devices

• CSP LED Optical Behavior

• Light Side Emission of a Package Free CSP LED Device

• Introduction

• Discontinuities

• Consequences

• Influence of CSP LED Package on Emission Profile

• Light Emission Profile

• CSP LED FWHM

• Observations

• Measurement on Cube and Rim CSPs

• Light Emitting Surface (LES) and Beam Angle

• Optical Management in the Application

• Luminance Control

• Optical Integration - Single LED and Arrays

• Shadowing Effect in Close Pack Arrangements

• Main Consequences and Opportunities of the Optic Properties of CSP LEDs



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o CSP LED Lighting Module P112

Thermal Management of CSP LED Lighting Modules

• Why Thermal Management is Required for LED Systems?

• Importance of Thermal Management for LED Reliability

• Thermal Path inside the CSP LEDs

• CSP Thermal Architecture Compared to Standard LEDs

• Thermal Resistance of CSP LEDs

• Maximal Junction Temperature of CSP LEDs

• Influence Parameters on Thermal Resistance

• Size and Power

• Package Type

• Substrate/PCB

• Contact Pads

• Thermal Resistance in the Application

• Reliability of CSP LEDs Compare to Traditional LED Components

• Major Trends in Thermal Management

• Main Consequences and Opportunities of the Thermal Properties of CSP LEDs

Electrical Management of CSP LED Lighting Modules

• Electrical Behavior

• Resistive Behavior

• Binning Repartition

• Multiple LEDs Arrangements

• Introduction

• Middle and High Power LED Modules

• CSP LED Modules

• LED Modules Operating Window

• LED Balancing Circuit (Electrical Behavior)

• Electrical Static Discharge (ESD) and Electrical Over Stress (EOS)

• Electrical Static Discharge (ESD) Protection in LED Package

• Electrical Static Discharge (ESD) Protection in LED Global System

• Electrical Management - Minimal Spacing

• Main Consequences and Opportunities of the Electrical Properties of CSP LEDs

Precautions for CSP LED Integration into Modules

• Handling Precautions

• PCB Design for Optimal Performance

• Solder Recommendations

• Reflow Process for CSP LEDs

CSP LED Lighting Module Performance in Applications

• Is a CSP a Cost Effective High Power LED or a Super Mid Power LED?

• CSP LEDs in Lighting Products - Positioning

• CSP LED vs COB LED

• CSP LEDs in Lighting Products - Opportunities

• Opportunities for Accent Lighting

• Cost Value for Accent Lighting

• Opportunities for Spot Light Integration

• Opportunities for Global Indoor Application (i.e.: General Lighting)

• Integration in General Lighting Applications - Pros & Cons

• Integration in General Lighting Applications - Case Study

• Spotlighting

• Downlight

• Outdoor Lighting

• Linear Tube

• High Bay

• Lamp

• Spectrum Control with CSP LEDs

• CSP LEDs Diversity

• The Different Types of LED Modules - Positioning

• CSP LED Module Positioning vs Other Technologies

• Market Trends - Share of CSP LED Module Revenue (2016 vs. 2021)

o Conclusion P208

o Appendix - About Yole Développement P211

o Appendix - About PISEO P230



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Pars MUKISH (Business Unit Manager - LED/OLED, Sapphire and Lighting Systems - Yole Développement)

• Pars MUKISH holds a master’s degree in Materials Science & Polymers from ITECH in France and a master’s degree in Innovation & Technology Management from EM Lyon, alsoin France. He works at Yole Développement, the "More than Moore" market research and strategy consulting company, as Senior Market and Technology Analyst in the fields ofLED, OLED, Lighting Technologies and Compound Semiconductors, carrying out technical, economic and marketing analyses. In 2015, Pars has also taken on responsibility fordeveloping LED/OLED and sapphire activities as Business Unit Manager at Yole Développement. Previously, he worked as Marketing Analyst and Techno-Economic Analyst forseveral years at the French Research Center CEA.

Pierrick BOULAY (Market & Technology Analyst - LED/OLED and Lighting Systems - Yole Développement)

• Pierrick BOULAY works as a Market and Technology Analyst in the fields of LED, OLED and Lighting Systems, carrying out technical, economic and marketing analysis at YoleDéveloppement, the "More than Moore" market research and strategy consulting company. He has experience in both LED lighting, including general and automotive lighting,and OLED lighting. In the past, he mostly worked in R&D departments for LED lighting applications. Pierrick holds a master’s degree in Electronics from ESEO in France.

Dr. Olivier ANDRIEU (System Architect & Senior Research and Innovation Consultant - PISEO)

• Dr Olivier Andrieu is an R&D Project Director and Mechatronic and LED System Architect at PISEO. He is working in collaboration with Yole Développement’s team toperform comprehensive technical analyses of innovative LED-based optical systems and markets. His expertise is based on the development of disruptive solutions taking intoaccount mechanical, electronic, optic and thermal issues to achieve application requirements. Previously, Dr Andrieu worked for EFI Automotive as head of innovation and morerecently for Philips Lighting where he developed and implemented numerous LED lighting solutions on a global level.

Joël THOME (General Manager & Senior Research and Innovation Consultant - PISEO)

• Joel Thome is the General Manager & Senior Research & Innovation Consultant at PISEO. In collaboration with Yole Développement’s team, Joel Thome performs numeroustechnical and market analyses focusing on LED solutions, in addition to developing innovative optical solutions with PISEO’s R&D team. With a Master’s Degree in mechanicalengineering, Joel has been working in the lighting industry for more than 25 years. After beginning his career at Philips Lighting, he has recently held various global business,marketing and R&D senior management positions. During this period he developed strong expertise in lighting controls, LED technology and innovation processes includingstrategic roadmaps and project portfolio management. Today, Joel Thome is also the administrator of the GIL-Syndicat du Luminaire trade union organisation and the ClusterLumière association.

Grégory DUCHENE (Senior Optical Systems Engineer - PISEO)

• As a Senior Optical Systems Engineer, Grégory Duchêne is in charge of optics related projects at PISEO. He has created numerous innovative designs for optical systems, basedon spectral optimization and light conversion approaches. These disruptive solutions, developed in collaboration with other PISEO experts, are dedicated to general lighting,automotive and imaging applications. Gregory also collaborates with Yole Développement analysts to perform comprehensive technical and marketing analyses focusing on LEDlighting modules. Before PISEO, he worked for over ten years on the development of optical designs, including control benches, LED-based lighting systems, CMOS and CCDsensors, signal processing solutions and more. Gregory Duchene has a Master’s Degree in optics from the Institut d’Optique Graduate School (IOGS - France).

ABOUT THE AUTHORS OF THE REPORT


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Report sample

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• Flashlight is the main applications for CSP LEDs. Due to their small form factor and ability to deliver high lumen output, CSP LEDs have a fastgrowth in this market. Moreover, a trend in flashlight application is to use multiple LEDs to implement a dual color flash.

• TV manufacturers are using CSP LED because of their small for factor and their large beam angle. It allow to reduce the thickness of the panel andreduce the number of LEDs used in.

• General lighting is the latest industry using CSP LEDs in luminaire. It will be used for large area lighting, spot lighting applications or to bring newfunctionalities like tunable white applications.

• CSP LED are being developed to be used in headlamp application for automotive lighting with higher reliability compared to traditional LEDs.

Overview

CSP LED APPLICATIONS LANDSCAPE

2016 2017

Back Light

Unit for TV

General

Lighting

Flash for

Smartphone

2014

Applications:

Some

Integrators:

2015

Time

Automotive

Lighting

Probably :


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What is Chip Scale Package (CSP)?

• CSP are novel to the LED industry but they are the mainstay of the semiconductor industry. Development of CSP in the Silicon ICs was driven byminiaturization, improved thermal management, higher reliability, and simply the need to connect to an ever increasing pin-count on an evershrinking die. Chip Scale Packages also enabled a reduction in device parasitic and allowed for ease of integration into Level 2 packaging (e.g.:module packaging for LED). It is therefore a natural evolution for such packaging innovation to proliferate into other industries (such as the LEDindustry).

• Basically, a CSP represents a single chip direct mountable package that have the same size as the chip.

• In reality, the package must have an area no larger than 1.2 times that of the die.

• Regarding LED device, CSPs are made of blue Flip Chip LED die on which a phosphor layer is coated (as main application of such package isGeneral Lighting).

• Flip Chip technology is an enabling technology to develop CSP as such package require no wire bonding (to have package size at the chip scale level).

• As getting rid of several process steps of traditional LED packaging, CSPs are also impacting the industry structure with some LED chipmanufacturers directly supplying their products to LED module manufacturers.

Definition

CSP LED DEVICE - INTRODUCTION

TSMC Chip Scale Package

Source: TSMC

Samsung Chip Scale Package

Source: Samsung


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While traditional LEDs are split in different categories, CSP LEDs are part of both high or mid-power LEDs.

CSP LEDs Definition - Power Density Criterion

CSP LED DEVICE - FAMILY DESCRIPTION

LEDs technologies have their own power range :

• Middle Power LED : 0 < MP < 1 W

• CSP LED : 1 < CSP < 7 W

• High Power LED : 3 < HP < 8,5 W

CSP LEDs can be separated into 2 groups

according to their power range :

• Middle Power CSP: from 1 W to 3 W

• High Power CSP: from 3 to 7 W

Middle Power LEDHigh Power LEDCSP LED

High Power LED

Middle Power LED

CSP LED

High Power

Middle Power


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CSP LEDs Structure - Focus on Packaging

CSP LED DEVICE - TECHNOLOGY

User perspective is focused on external packaging properties, more than internal structure.

• Two types of packaging canbe observed, according tothe presence or not of wallsaround the LED.

• Cube design

• Rim design

• The “cube design” appearsnew on the market andoffer singular opticalproperties.

• The “rim design” has aconventional behaviorcompared to the cubedesign

"Cube Design"

CSP Packaging without walls

"Rim Design"

CSP Packaging with walls

Silicone

EncapsulatedPackage Free Ceramic Substrate Entirely Package

Vertical thin

filmX

Wafer Level

Chip

Flip Chip X


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LED chipPhosphor

SMD pads – cathode/anode

Underfill

• The last known CSP structure is a packaged Flip Chip LED

• Like the Vertical Thin Film CSP, this packaged FC structure enables to introduce an ESD protection diode inside the LEDpackage

Flip Chip packaged CSP LED vs High Power Type LED

CSP LED DEVICE - TECHNOLOGY

Get the power in / out

Power to light conversion

Spectral converter (White LED)

Optical extraction functions : light

extraction, internal reflection

Thermal extraction

Lens

LED chip

Encapsulate

Reflector

Substrate

Bond wire Die attach substrate

SMD pads – cathode/anode

Lead frame

Thermal pad

Flip Chip packaged CSP LEDHigh Power type LED

Silicone Over mold

Substrate

White Silicone


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Flip Chip CSP LED Manufacturing Process

CSP LED DEVICE - MANUFACTURING PROCESS

Die formation by

epitaxy

SingulationEpi Wafer LED Chips on Epi Wafer

Chip transfer & binningPhosphor dispensing

Chip formation

Attach on substrate

Thermal pad Thermal pad

Die

Substrate

Transfer & Singulation

Cutting tape

Flip Chip CSP LED

In the Flip Chip CSP LED manufacturing process, interconnection, encapsulation and lens attach steps have been removed comparedto conventional LED process

LED Packaging


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• LED CSP ASP is clearly at an intermediate level between Mid Power and High Power LED.

• The price level reflects the success of the cost breakdown made by suppressing a large part of the packaging.

• However, the ratio Power to Cost is similar to the other packages and not technology dependent. The price is also market oriented, witha clear trend of lm/$ control.

Price Positioning of CSP LEDs (Vs. Traditional LEDs)

CSP LED - COST / PRICE

Type of LED ASP

Traditional middle power LEDs $0,01 to $0,10

CSP middle power LEDs $XX

CSP high power LEDs $XX

Traditional high power LEDs $XX

4

3

2

1

Power

Range

(W)

0,500 0,25

CSP LEDs

Middle Power - High

Power

Traditional

Middle

Power LEDs

Traditional High Power

LEDs

Single

LED ASP1

($)

0,75 ©2017 | www.yole.fr | CSP LED Lighting Modules 2017 | Sample

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In 2013, Lumileds was the first to commercialize LEDs in CSP format. But several other manufacturers (mostly Taiwanese) and material suppliers were also following the same development trends.

Key Players Identified

CSP LED - INDUSTRY

US:

Xxx, Lumileds,

Xxx

South Korea:

Seoul, Xxx (…)

Taiwan:

Edison Opto,

Xxx(…)

China:

Xxx (…)

Germany:

Osram1

Japan:

Xxx, Xxx, Nichia,

(…)

UK:

Xxx

1Manufacturer of CSP-like LEDs©2017 | www.yole.fr | CSP LED Lighting Modules 2017 | Sample

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CSP LEDs represented a market volume of 2.3B units in 2016 and should grow to a size of Xx B units in 2021.

As a reference, in 2016, HP LEDs represented a volume of 25.4B units , and MP LED a volume of 76.7 Bunits.

CSP LED Volume Forecast (2012 - 2021)

CSP LED - MARKET

Note: CSP LEDs “are / will be” used both in middle power and high power LEDs.


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CSP LED Devices have specific characteristics which offer certain advantages but also require particular attention for integration.

Impact of CSP LED Device on System/Module Design

CSP LED LIGHTING MODULE - OBJECTIVES, METHODOLOGY AND SYNTHESIS

Electrical

Management

To ensure optimal

performances

Optical Design

To shape the light beam

Thermal

Management

To ensure life time and

luminous efficacy

• Less thermal interfaces

• Xxx

• Xxx

• Small soldering surface

• Small size permitting close pack

• Xxx

• Xxx

• Small dimensions

• Xxx

• Xxx

Key System/Module

ParametersKey characteristics of CSP LED Devices Impact on System/Module

• Xxx• Heat sink to keep a low Tj

• Xxx

• Xxx

• Xxx

• Take special precautions (design,

manufacturing, logistics)

• Need for a perfect optical alignment • Xxx• Xxx

Beneficial property Critical property that may impact module integration©2017 | www.yole.fr | CSP LED Lighting Modules 2017 | Sample

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CSP LED shows a direct thermal path from active layer to solder pads

Thermal Path inside the CSP LEDs

CSP LED LIGHTING MODULES - THERMAL MANAGEMENT

• Direct connection to metal parts (solderbump, lead frame) allows good thermalconduction between materials.

• Low number of interfaces participates tothe improvement of the thermalconduction.

• Difference between the LED chiptemperature and the solder padtemperature is reduced compared tostandard LED chip

Wafer Level CSPFlip Chip CSPHeat

production

areas

Heat

transfer

Active layer

Xxx

Xxx

Solder pads

Xxx

Active layer

Solder pads


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• High Power LED & CoB modules:

• High luminous efficacy with moderateluminous density.

• Cree XQ-E module:

• Cree XQ-E has the same internal structure asHP and MP LED (chip connected with wirebonds), but its size is closer to CSP LED.

• XQ-E follows High Power LED tendency.

• CSP LED module:

High luminous density but moderately effective.

• Mid Power LED module:

High efficacy but very poor luminous density.

Luminous performances of CSP LED modules arecloser to CoB and High Power LED modulesthan Mid Power LED modules.

Those performances can be correlated to theinternal structure as shown by Cree XQ-E LEDwhich has a chip scaled size but wire bonded.

Is a CSP a Cost Effective High Power LED or a Super Mid Power LED?

CSP LED LIGHTING MODULE - PERFORMANCES IN APPLICATIONS

Luminous performances of different LED technology modules


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CSP LED allows more flux than a Mid Power LED, with a better cost than High Power LED

CSP LEDs in Lighting Products - Positioning


• CSP LED have clearly been created by the majorLED manufacturer to fill the gap between MidPower LED and High Power LED.

• This technology doesn’t have the requiredqualities to directly compete Mid Power LEDneither High Power LED.

• lm/$ is too low compared to the achievablelm/$ based on Mid Power LED.

• Lower performances than High Power LED:lm/W, optical properties, thermal properties.

• However, properties like embedded power, lightflux performance, diversity of color, CCT, CRIallow much more possibilities than those achievedwith mainstream Mid Power LED.

• This open the way for intermediate products,between core market and high level positioning,which suffer today from low competitivity or badperceived performance.

Mid Power

LED

CSP

LED

High

Power

LED

Product

performances

More flux

Less cost

Office

Retail

Hospitality

Lamps…

Highbay Outdoor

Accent Lamps …

System cost


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CSP LED Module Positioning vs Other Technologies


High Bay / Low Bay

Spot Lighting

Troffer

Downlight

Linear Lighting

Street Lighting

Wall Washer

Middle Power LED

Module

High Power LED

ModuleCOB LED Module

MAIN

LUMINAIRE

TYPE

LAMP

Can be used but not mainstream Custom solution mostly

Mainstream technology

CSP LED ModuleOpportunities to be evaluated

Automotive Headlamp


Complete analysis in the report!

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CSP LEDs represented less than 1% of LED module business in 2016.

It should represent more nearly 6% by 2021.

Market Trends



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Chip-scale packages (CSPs) are new to the LED industry, but are the mainstay of the traditional semiconductor industry, where they improve reliability, thermal management and enable smaller packages.

CSP LEDs can be less than a tenth of the size of high and middle power LEDs, increasing power density and simplifying integration into final products. This new architecture can also lower thermal resistance, improve reliability and widen viewing angles compared to other traditional packages.

However, there are also several challenges to overcome at the device manufacturing and module integration levels. These include color uniformity, chemical stability, given there is little to no sealing off from the external environment, and control of optical properties like the radiation pattern.

In this context, Yole Développement estimates that CSP LED modules represented less than 1% of the LED module business in 2016. However, with strong potential in multiple applications and the lighting industry getting experience with integrating such technology, we forecast a market share of nearly 6% by 2021.

This report provides a comprehensive analysis of CSP LED devices, with analyses including: chip and package technology, manufacturing processes, related costs/prices, industry and market trends. The report details deeply analyses CSP LED lighting module design, with focuses including: optical design, thermal and electrical management and precautions for CSP LED integration.

CSP LED LIGHTING MODULESMarket & Technology report - February 2017

CSP LEDS: A PROMISING SOLUTION WITH CHALLENGES TO OVERCOME

CSP LED lighting modules: a potential revolution for the LED industry?

KEY FEATURES OF THE REPORT Get the sample of the report on www.i-Micronews.com• CSP LED device technology,

manufacturing and industry• CSP LED application landscape • CSP LED module pros and cons,

and impact on supply/value chain• CSP LED module design: thermal

management, optical design, power supply and driver

OBJECTIVES OF THE REPORTObjectives are to understand:CSP LED technology:• Differences from other packages• Impact on manufacturing processes• Potential for cost reductionChanges in system design and integration rules:• Impact on optical design• Impact on thermal management• Impact on electrical managementPerformances in applications:• Positioning of CSP LEDs compared

to mid-power, high-power LEDs and COB LED modules

• Opportunities for CSP LEDs in applications

Competitive landscape and supply chain:• Identify key players• Impact on the LED supply chain

(Yole Développement, February 2017)

LED lighting module market revenue in 2021Breakdown by module technology in US$

Others(Middle power LED module,

high power LED module,COB LED module)

94.4%

CSP LEDmodule

5.6%

A CSP LED market size multiplied by more than 3 since 2016

AFTER SMARTPHONES AND TVS, A POTENTIAL REVOLUTION IN GENERAL AND AUTOMOTIVE LIGHTING APPLICATIONS?

CSP LEDs add value through power density offered from a small surface. The first targeted application was smartphone flashes. As smartphones get thinner and add functions, so too must integrated components/modules.

The small form factor and wide beam angle of CSP LEDs have also driven their use in TV backlighting units. Wide beam angles mean the pitch between LEDs can be larger, reducing the number of devices needed and in turn lowering backlight cost.

But CSP LEDs are also a means to develop new functions in lighting products. Some general lighting

applications are likely to adopt these light sources to reduce the cost of the lamp/luminaire. Their small size enables LED clusters, similar to chip-on-board (COB) LED modules but with more functionality. CSP LED clusters promise tunable white, human centric light (HCL), intended to promote a person’s well-being, mood and health, and others smart lighting functions.

Last but not least, high luminance and uniformity will mean CSP LEDs enter automotive headlamp applications, which requires high intensity and beam shape control. New developments in

• Thermal Management Technology and Market Perspectives in Power Electronics and LEDs 2017

• LED Packaging 2017: Market, Technology and Industry Landscape

• Automotive Lighting: Technology, Industry, and Market Trends

• UV LEDs - Technology, Manufacturing and Application Trends

Find all our reports on www.i-micronews.com

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ABOUT PISEO






CSP LED LIGHTING MODULES

COMPANIES CITED IN THE REPORT (non exhaustive list)Apple, AT&S, Audi, BMW, BREE Optronics, Bright LED, Carclo, Cree, Dow Corning, Edison Opto, Epistar, ETI, Everlight, Fraen, Genesis Photonic Inc., Haeusermann, Hakko, Harvatek, Honglitronics, Huawei, ITRI, Jufei, Kathod, Kingbright, Ledil, Lextar, LG, Lite On, Luminus Devices, Mason, Maven Optronics, Mercedes-Benz, MLS, Nationstar, Nichia, Oasis, Opel, Optotech, Osram, Philips Lumileds, Plessey Semiconductors, Refond, Samsung, Sanan, Seoul Semiconductors, Toshiba, Toyoda Gosei, Tridonic, Trilux, TSMC, Unistars Mercury, Unity Opto, Wellypower...

matrix headlamps will include CSP LEDs to increase matrix resolution, enhance driver vision and improve Advanced Front Light Systems (AFLS) in combination with cameras.

In this report, Yole Développement maps the CSP LED application landscape. It analyses CSP LED lighting module performance in general lighting applications, identifying opportunities, describing case studies, and comparing positioning against other module technologies.

(Yole Développement, February 2017)

CSP LED application landscape

2016 2017

Backlighting unit for TV

General lighting

Flash smartphone

2014

APPLICATIONS:

EXAMPLE OF INTEGRATORS:

2015

Time

Automotive lighting

Probably:

SIMPLIFIED MANUFACTURING PROCESS IMPACTS THE SUPPLY/VALUE CHAIN

Comparison between standard, COB and CSP LED module manufacturing chain

COB is considered as a module itself. Therefore, there is no need for a module manufacturer in the manufacturing chain.

CSP LEDs can be made by chip manufacturers because most of the package steps are removed.However,additional expertise is required, for example in applying phosphores

LED Chip manufacturing

Standard LED package manufacturing

Standard LED module manufacturing

LED Chip manufacturing

LED Chip + CSP LED manufacturing

COB LED manufacturing

Standard low / middle / high power LED

module

COB LED module

CSP LED module

CSP LED module manufacturing

LED die / Chip Packaged LED Light / LED module

CSP LED technology eliminates some package assembly and die attach stages. This is likely to benefit to LED chip manufacturers, who can develop packages and supply them directly to LED module manufacturers more easily, bypassing their traditional customers, and so increasing their profits. Vertically integrated LED manufacturers can also decrease their packaging costs. However, adopting the

technology requires development of new expertise, modifying the traditional packaging landscape. For example, phosphor and encapsulant deposition processes will move from dispensing to phosphor sheet/film deposition or molding. This evolution affects equipment and material suppliers, who have to develop new solutions.

Operationally, Lumileds was the first company to commercialize LEDs in CSP format in 2013. The company was rapidly followed by several other players, mostly Taiwanese. But some others, like Osram, still have doubts about the necessity of such technology, and instead are positioned toward traditional middle and high power LEDs, including COBs.

This debate is also relevant at the LED module level, where CSPs cause some difficulties. For example, during PCB design, special care should be given to copper traces and solder masks for optimum performance. Some critical properties, like their small soldering surfaces and sideways light emission, may impact module integration. And while the benefits of CSP LEDs are not yet clear for them, they question the real opportunity of this solution.

This report provides insights into the changes in manufacturing and integration processes CSP LEDs bring, and potential consequences on the supply/value chain. Additionally, it analyses real opportunities for such technologies based on simulations and case studies.(Yole Développement, February 2017)

Find more details about

this report here:

MARKET & TECHNOLOGY REPORT

About the authors of the report 5

Report objectives 6

Companies cited in this report 7

Glossary 8

Methodology 9

Executive summary 10

Status of the LED industry and recent trends 40

> Status of the LED industry including - Introduction - Segmentation of packaged LEDs- History of the LED industry- Packaged LED revenue forecast - Split by application- 2015 and 2016 in a nutshell- Future trends- LED market trends

> Recent trends in the LED industry - Overview- Product diversification (Level 1)- Application diversification - Automotive lighting- Product diversification (Level 2) - UV LEDs- Vertical integration - LED module - Conclusion

CSP LED application landscape 61> Overview> Flash> Backlighting> General lighting> Automotive lighting

CSP LED devices 68

> Introduction to CSP LED devices- Definition- Benefits

> CSP LED device family description- Introduction- Size criterion- Power density criterion- CSP or not CSP?- Power criterion

> CSP LED device technology- Differences from other packages- CSP LED structures- CSP LEDs in LED package proliferation- Flip Chip CSP LEDs vs high power-type LEDs- Wafer Level CSP LEDs vs high power-type LEDs- Vertical thin film CSP LEDs vs high power-type LEDs- Flip Chip packaged CSP LEDs vs high power-type LEDs

> CSP LED device manufacturing process- Conventional LED manufacturing process- Flip Chip CSP LED manufacturing process- Wafer Level CSP LED manufacturing process- CSP LEDs vs conventional LEDs- Impact on supply/value chain

> CSP LED device cost/price- Potential for cost reduction- The case of CSP architecture for low and middle

power LEDs- The case of CSP architecture for high power LEDs- Price positioning of CSP LEDs vs. traditional LEDs- Price positioning of CSP LED modules vs. traditional

modules> CSP LED device industry

- Key players identified- Highlights of US and European Players- Highlights of Japanese Players- Highlights of Korean Players- Highlights of Taiwanese and Chinese Players- Trends - Flow chart comparison between standard,

CSP and COB LEDs> CSP LED market

- CSP LED market volume (2012 - 2021)

CSP LED lighting module 112

> Chip singulation- Objectives, methodology and synthesis- From device characteristics to performance in applications- System design and performance assessment- Impact of CSP LED device on system/module design- CSP LED system/module performance in application

> Definition and types of LED lighting modules- Definitions- LED module in the overall LED value chain- The different types of LED modules – Taxonomy - The different types of LED modules – Positioning

> Main functions in LED lighting modules- System structure- Parameter interdependence

> Optical design of CSP LED lighting modules- Optical management inside LED devices- CSP LED optical behavior- Sideways light emission of a package-free CSP LED device- Influence of CSP LED package on emission profile- Light emission profile- Light Emitting Surface (LES) and beam angle- Optical management in the application- Luminance control- Optical integration - Single LED and arrays- Shadowing effect in close pack arrangements- Main consequences and opportunities of the optical

properties of CSP LEDs> Thermal management of CSP LED lighting modules

- Why is thermal management required for LED systems?

- Importance of thermal management for LED reliability- Thermal path inside the CSP LEDs- CSP thermal architecture compared to standard LEDs- Thermal resistance of CSP LEDs- Maximal junction temperature of CSP LEDs- Influence parameters on thermal resistance- Thermal resistance in the application- Reliability of CSP LEDs compare to traditional LED

components- Major trends in thermal management- Main consequences and opportunities arising from the

thermal properties of CSP LEDs> Electrical management of CSP LED lighting modules

- Electrical behavior- Resistive behavior- Binning distribution- Multiple LED arrangements- LED module operating window- LED balancing circuit (electrical behavior)- Electrical Static Discharge (ESD) and Electrical Over

Stress (EOS)- Electrical Static Discharge (ESD) protection in LED

package - Electrical Static Discharge (ESD) protection in LED

global system- Electrical management - Minimal spacing- Main consequences and opportunities of the electrical

properties of CSP LEDs> Precautions for CSP LED integration into modules

- Handling precautions- PCB design for optimal performance- Solder recommendations- Reflow process for CSP LEDs

> CSP LED lighting module performance in applications- Is a CSP a cost effective high power LED or a super

mid power LED?- CSP LEDs in lighting products - Positioning- CSP LED vs COB LED- CSP LEDs in lighting products - Opportunities- Opportunities for accent lighting- Cost value for accent lighting- Opportunities for spot light integration- Opportunities for global indoor application (i.e.:

general lighting)- Integration in general lighting applications - Pros and cons - Integration in general lighting applications - Case studies- Spectrum control with CSP LEDs- CSP LED diversity- The different types of LED modules - Positioning- CSP LED module positioning vs other technologies- Market trends - Share of CSP LED module revenue

(2016 vs. 2021)

Conclusion 208

Appendix - About Yole Développement 211

Appendix - About PISEO 230

TABLE OF CONTENTS (complete content on i-Micronews.com)Pars MUKISH holds a master’s degree in materials science and polymers from ITECH in France and a master’s degree in innovation and technology management from EM Lyon in France. Since 2015, Mukish has taken on responsibility for developing LED, OLED and sapphire activities as Business Unit Manager at Yole Développement. Previously, he worked as Marketing Analyst and Techno-Economic Analyst for several years at the French Research Center, CEA.

Pierrick BOULAY works as Market and Technology Analyst in the fields of LED, OLED and lighting systems, doing technical, economic and marketing analysis at Yole Développement, the “More than Moore” market research and strategy consulting company. He has experience in both LED lighting, including general lighting and automotive lighting, and OLED lighting. In the past, he mostly worked in R&D departments for LED lighting applications. Pierrick holds a master degree in Electronics from ESEO in France.

YOLE DÉVELOPPEMENT

Dr Olivier ANDRIEU is R&D Project Director and Mechatronic and LED System Architect at PISEO. He is working in collaboration with Yole Développement’s team to perform comprehensive technical analyses of innovative LED-based optical systems and markets. His expertise is based on the development of disruptive solutions taking into account mechanical, electronic, optic and thermal issues to achieve application requirements. Previously, Dr Andrieu worked for EFI Automotive as head of innovation and more recently for Philips Lighting where he developed and implemented numerous LED lighting solutions on a global level.

Joel THOME is the General Manager and Senior Research and Innovation Consultant at PISEO. In collaboration with Yole Développement’s team, Thome performs numerous technical and market analyses focusing on LED solutions, in addition to developing innovative optical solutions with PISEO’s R&D team. With a master’s degree in mechanical engineering, Thome has worked in the lighting industry for more than 25 years. After beginning his career at Philips Lighting, he has recently held various global business, marketing and R&D senior management positions. During this period he developed strong expertise in lighting controls, LED technology and innovation processes including strategic roadmaps and project portfolio management. Today, Thome is also the administrator of the GIL-Syndicat du Luminaire trade union organisation and the Cluster Lumière association.

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Founded in 1998, Yole Développement has grown to become a group of companies providing marketing, technology and strategy consulting, media and corporate finance services. With a strong focus on emerging applications using silicon and/or micro manufacturing, the Yole Développement group has expanded to include more than 50 collaborators worldwide covering MEMS, Compound Semiconductors, LED, Displays, Image Sensors, Optoelectronics, Microfluidics & Medical, Advanced Packaging, Manufacturing, Nanomaterials, Power Electronics and Batteries & Energy Management.The “More than Moore” company Yole and its partners System Plus Consulting, Blumorpho, KnowMade and PISEO support industrial companies, investors and R&D organizations worldwide to help them understand markets and follow technology trends to develop their business.

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ABOUT PISEOA unique innovation platform dedicated to smart LED based optical systems. PISEO owns high skilled engineers and cutting edge characterization equipment, all situated in a single location. The team, mainly issued from an industrial global leader, delivers a whole set of services to the industry throughout the entire product life cycle. Therefore, PISEO runs projects from applied research up to product recycling, including market analysis, technology scouting, strategic planning and industrial design.

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Presentation of Yole Développement

With Focus on Solid State Lighting (LED,

OLED…) and Display Activities

Corporate Presentation


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Our 30 analysts operate in the following areas.

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R&D centers

Our analysts provide market analysis, technology evaluation, and business plan along the entire supply chain.

SERVING THE ENTIRE SUPPLY CHAIN


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We are workingaccrossmultiplesindustries tounderstand theimpact of More-than-Mooretechnologiesfrom device tosystem.

SERVING MULTIPLE INDUSTRIAL FIELDS

From A to Z…

Transportation

makers

Mobile phone

and consumer

electronics

Automotive

Medical

systemsIndustrial and

defense

Energy


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36

o Yole Développement publishes a comprehensive collection of market & technology reports and patent analysis in:

• MEMS & Sensors.

• RF devices and technologies.

• Imaging.

• Medical Technologies (MedTech).

• Photonics.

• Advanced packaging.

• Manufacturing.

• Power electronics.

• Batteries & Energy management.

• Compound semiconductors.

• LED.

• Displays.

o You are looking for:

• An analysis of your product market.

• A review of your competitors evolution.

• An understanding of your manufacturing and production costs.

• An understanding of your industry technology roadmap and related Ips.

• A clear view on the evolution of the supply chain.

Our team of 50+ experts (PhDs, MBAs, industry veterans…) from Yole Développement, System Plus Consulting and KnowMade, collect information, identify the trends, thechallenges, the emerging markets, the competitive environments and turn it into results to give you a complete picture of your industry landscape.

In the past 18 years, we worked on more than 1?500 projects, interacting with technology professional and high level opinion makers from the main players of the industry.

o Every year, Yole Développement, System Plus Consulting and Knowmade publish +120 reports.

o Take the full benefit from our Bundle and Annual Subscription offers.

REPORTS COLLECTION

www.i-Micronews.com


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MARKET AND TECHNOLOGY REPORTS byYole Développement

o MEMS & SENSORS

− Fingerprint Sensor Applications and Technologies - Consumer Market Focus

2017

− MEMS Microphones, Speakers and Audio Solutions 2017

− Status of the MEMS Industry 2017

− MEMS & Sensors for Automotive 2017

− High End Inertial Sensors for Defense and Industrial Applications 2017

− Sensor Modules for Smart Building 2017

− Sensing and Display for AR/VR/MR 2017 (Vol 1)

− MEMS Packaging 2017

− Magnetic Sensors Market and Technologies 2017**

− Microspectrometers Markets and Applications 2017**

o RF DEVICES AND TECHNOLOGIES

− RF Components and Modules for Cellphones 2017

− Advanced RF SiP for Cellphones 2017

− 5G and Beyond (Vol 1): Impact on RF Industry, from Infrastructure to Terminals

2017

− 5G and Beyond (Vol 2): RF Materials Platform, from Infrastructure to Terminals

2017

− RF Technologies for Automotive Applications 2017

− GaN and Si LDMOS Market and Technology Trends for RF Power 2017

o IMAGING & OPTOELECTRONICS

− 3D Imaging & Sensing 2017

− Status of the CMOS Image Sensor Industry 2017

− Camera Module for Consumer and Automotive Applications 2017

− Uncooled Infrared Imaging Technology & Market Trends 2017

− Active Imaging and Lidars 2017 (vol 1)

o MEDTECH

− Status of the Microfluidics Industry 2017

− Solid State Medical Imaging 2017

− Sensors for HomeCare 2017

− Sensors for Medical Robotics 2017

− Organs-on-a Chip 2017

o ADVANCED PACKAGING

− Advanced Substrates Overview 2017

− Status of the Advanced Packaging Industry 2017

− Fan Out Packaging: Market & Technology Trends 2017

− 3D Business Update: Market & Technology Trends 2017

− Advanced QFN: Market & Technology Trends 2017**

− Inspection and Metrology for Advanced Packaging Platform 2017**

− Advanced Packaging for Memories 2017

− Embedded Die Packaging: Technologies and Markets Trends 2017

o MANUFACTURING

− Glass Substrate Manufacturing 2017

− Equipment & Materials for Fan Out Technology 2017

− Equipment & Materials for 3D T(X)V Technology 2017

− Emerging Non Volatile Memories 2017

** To be confirmed

OUR 2017 REPORTS PLANNING (1/2)


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o POWER ELECTRONICS

− Status of Power Electronics Industry 2017

− Power Mosfets Market and Technology Trends 2017

− IGBT Market and Technology Trends 2017

− Power Packaging Market and Technology Trends 2017

− Power SiC 2017: Materials, Devices, and Applications

− Power GaN 2017: Materials, Devices, and Applications

− Materials Market Opportunities for Cellphone Thermal Management (Battery

Cooling, Fast Charging, Data Processing, Battery Cooling, etc.) 2017

− Gate Driver Market and Technology Trends in Power Electronics 2017

− Power Management ICs Market Quarterly Update 2017

− Power Electronics for Electrical Aircraft, Rail and Buses 2017

− Thermal Management for LED and Power 2017

o BATTERY AND ENERGY MANAGEMENT

− Status of Battery Industry for Stationary, Automotive and Consumer Applications

2017

o COMPOUND SEMICONDUCTORS

− Power SiC 2017: Materials, Devices, and Applications

− Power GaN 2017: Materials, Devices, and Applications

− GaN and Si LDMOS Market and Technology Trends for RF Power 2017

− Bulk GaN Technology Status and Market Expectations (Power, LED, Lasers) 2017

o DISPLAYS

− Microdisplays and MicroLEDs 2017

− Display for Augmented Reality, Virtual Reality and Mixed Reality 2017

− QD for Display Applications 2017

− Phosphors & Quantum Dots 2017 - LED Downconverters for Lighting & Displays

− Emerging Display Technologies 2017**

o SOLID STATE LIGHTING (LED, OLED…)

− UV LEDs 2017 - Technology, Manufacturing and Application Trends

− Agricultural Lighting 2017 - Technology, Industry and Market Trends

− Automotive Lighting 2017 - Technology, Industry and Market Trends

− Active Imaging and Lidar 2017 (Vol 2) - IR Lighting**

− LED Lighting Module 2017 - Technology, Industry and Market Trends

− IR LEDs 2017 - Technology, Manufacturing and Application Trends

− Phosphors & Quantum Dots 2017 - LED Downconverters for Lighting & Displays

− CSP LED Lighting Modules 2017

− LED Packaging 2017 - Market, Technology and Industry Landscape

PATENT ANALYSIS by Knowmade

− 3D Monolithic Memory: Patent Landscape Analysis

− Microfluidic Diagnostic: Patent Landscape Analysis

− GaN Technology: Top-100 IP profiles**

− Uncooled Infrared Imaging: Patent Landscape Analysis**

− MEMS Microphone: Patent Landscape Analysis**

− MEMS Microphone: Knowles' Patent Portfolio Analysis**

− MicroLEDs: Patent Landscape Analysis**

− Microbolometer: Patents used in products**

− Micropumps: Patent Landscape Analysis**

− Flexible batteries: Patent Landscape Analysis**

TEARDOWN & REVERSE COSTING by System Plus Consulting

More than 60 teardowns and reverse costing analysis and cost simulation tools to be

published in 2017.

** To be confirmed

OUR 2017 REPORTS PLANNING (2/2)


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o MEMS & SENSORS

− Gas Sensors Technology and Market 2016

− Status of the MEMs Industry 2016

− Sensors for Cellphones and Tablets 2016

− Market and Technology Trends of Inkjet Printheads 2016

− Sensors for Biometry and Recognition 2016

− Silicon Photonics 2016

o IMAGING & OPTOELECTRONICS

− Status of the CMOS Image Sensor Industry 2016

− Uncooled Infrared Imaging Technology & Market Trends 2016

− Imaging Technologies for Automotive 2016

− Sensors for Drones & Robots: Market Opportunities and Technology Evolution 2016

o MEDTECH

− BioMEMS 2016

− Point of Care Testing 2016: Application of Microfluidic Technologies

o ADVANCED PACKAGING

− Embedded Die Packaging: Technology and Market Trends 2017

− 2.5D & 3D IC TSV Interconnect for Advanced Packaging: Business Update 2016

− Fan-Out: Technologies and Market Trends 2016

− Fan-In Packaging: Business update 2016

− Status and Prospects for the Advanced Packaging Industry in China 2016

o MANUFACTURING

− Thin Wafer Processing and Dicing Equipment Market 2016

− Emerging Non Volatile Memories 2016

o COMPOUND SEMICONDUCTORS

− Power GaN 2016: Epitaxy and Devices, Applications and Technology Trends

− GaN RF Devices Market: Applications, Players, Technology and substrates 2016

− Sapphire Applications & Market 2016: from LED to Consumer Electronics

− Power SiC 2016: Materials, Devices, Modules, and Applications

o LED

− UV LED Technology, Manufacturing and Applications Trends 2016

− OLED for Lighting 2016 – Technology, Industry and Market Trends

− Automotive Lighting: Technology, Industry and Market Trends 2016

− Thermal Management Technology and Market Perspectives in Power Electronics and

LEDs 2017

− Organic Thin Film Transistor 2016: Flexible Displays and Other Applications

− Sapphire Applications & Market 2016: from LED to Consumer Electronics

o POWER ELECTRONICS

− Power Electronics for EV/HEV 2016: Market, Innovations and Trends

− Status of Power Electronics Industry 2016

− Passive Components Technologies and Market Trends for Power Electronics 2016

− Power SiC 2016: Materials, Devices, Modules, and Applications

− Power GaN 2016: Epitaxy and Devices, Applications, and Technology Trends

− Inverter Technologies Trends & Market Expectations 2016

− Opportunities for Power Electronics in Renewable Electricity Generation 2016

− Thermal Management Technology and Market Perspectives in Power Electronics and

LEDs 2017

− GaN RF Devices Market: Applications, Players, Technology and substrates 2016

o BATTERY AND ENERGY MANAGEMENT

− Beyond Li-ion Batteries: Present and Future Li-ion Technology Challengers 2016

− Stationary Storage and Automotive Li-ion Battery Packs 2016

− Opportunities for Power Electronics in Renewable Electricity Generation 2016

OUR 2016 PUBLISHED REPORTS LIST


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• Consulting and Specific Analysis

• North America: Steve LAFERRIERE, Director of Northern America Business Development,Yole Inc.

Email: [email protected] - +1 31 06 008 267

• Greater China: Mavis WANG, Director of Greater China Business Development

Email: [email protected] - +886 979 336 809

• Japan & Rest of Asia:Takashi ONOZAWA, General Manager,Asia Business Development


• RoW: Jean-Christophe ELOY, President & CEO,Yole Développement

Email [email protected] - +33 4 72 83 01 80

• Report business

• North America: Steve LAFERRIERE, Director of Northern America Business Development


• Europe: Lizzie LEVENEZ, EMEA Business Development Manager


• Rest of Asia:Takashi ONOZAWA, General Manager,Asia Business Development


• Japan & Asia: Miho OTHAKE, Account Manager


• Greater China: Mavis WANG, Director of Greater China Business Development


• Financial services

• Jean-Christophe Eloy, CEO & President

Email [email protected] - +33 4 72 83 01 80

• General

Email: [email protected] - +33 4 72 83 01 80

CONTACT INFORMATION

Follow us on


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http://www.yole.fr/

mailto:[email protected]











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https://twitter.com/Yole_Dev

https://twitter.com/Yole_Dev

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About Solid State Lighting (LED, OLED…) and Display Activities


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42

We are active throughout the value chain: from substrates to systems!

And we interact with industrial / R&D playersfrom each level!

Yole is active throughout the value chain (Example of LED and Sapphire activities)

FOCUS ON SOLID STATE LIGHTING (LED, OLED…) AND DISPLAY ACTIVITIES

Substrate

SiC / Sapphire / Silicon /

Bulk GaN / Engineered

substrates

LED epi-

wafer

Mesa LED, Flip Chip LED,

Vertical LED structures

LED dies-

on-wafer

LED dies

Front-end Level 0 - Epitaxy• Nucleation layer

• n-type layer

• Active layers (MQW)

• p-type layer

Back-End Level 0 - Packaging• Substrate separation & Bonding

• Die singulation

• Testing & Binning

LED systems and applications

Front-end Level 1 - Device Production• Inspection

• Masking / Lithography

• Etching

• Metallization / Contacts / Mirrors

Back-End level 1 - Packaging• Die Attach & Interconnections

• Phosphors

• Encapsulation & Optics


Packaged LEDs

Module Packaging• Substrates (PCB)

• Encapsulation & Optics

• Heatsink


LED modules


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“What’s Behind the Crystal Ball?”

Only analysts that follow the industry on a daily basis (trough interviews) and developed market modeling tools based on discussions with key players of the industry.

Insights on Forecast Methodology (Example of LED and Sapphire activities)



APPLICATION

Forecast of standard

product market volume

(unit)Ex.: Smartphone, TVs, lamps (…)

Definition of functions using

LEDsEx.: “Flash vs. Keypad” for

smartphone (…)

Definition of technical

requirementsEx.: Efficacy, size (…)

Definition of LED

penetration rate and

competitiveness with

alternative technologiesEx.: “OLED vs. LED” in smartphone

(…)

Forecast of LED market volume (unit)Split by application, power type (low vs. medium vs. high

power), package type (single vs. multi-die…) (… )

Definition of LED

ASPPer power type, packaged

type (…)

Forecast of LED market size ($)Split by application, power type, package type

(… )

Definition of manufacturing flows for

front-end and packaging (process,

technologies, materials, yields…)Split by application, power type, package type (…)

Forecast of LED manufacturing

equipment and material markets

(unit and $)Ex.: Phosphors, encapsulant, dicing equipment

Definition of LED die

surface (mm²)

Definition of substrate die surface (mm²)

and epiwafer volume (unit)Split by type of substrate (…)

Forecast of LED substrate

markets (unit and $)Split by type of substrate (…)

Definition of sale

levels of key

manufacturers ($)Ex: LED, packaging

materials, epitaxy

materials, manufacturing

equipment, MOCVD

reactor, substrate (…)

System Plus Consulting

expertise in reverse

costing / reverse

engineering

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A team based on persons having complementary skills and expertise.

About Yole’s Analyst Team


Pars MUKISH - Business Unit Manager - SSL & Display

Pars MUKISH holds a master degree in Materials Science & Polymers (ITECH - France) and a master degree in Innovation

& Technology Management (EM Lyon - France). Since 2015, Pars MUKISH has taken on responsibility for developing LED,

OLED and Sapphire activities as Business Unit Manager at Yole Développement. Previously, he has worked as Marketing

Analyst and Techno-Economic Analyst for several years at the CEA (French Research Center).

Dr. Eric VIREY - Senior Market & Technology Analyst - Sapphire & Display

Eric VIREY holds a Ph-D in Optoelectronics from the National Polytechnic Institute of Grenoble (INPG - France). He

works as Market and Technology Analyst in the fields of Sapphire, LED / OLED and Display. In the last 12 years, he has held

various R&D, engineering, manufacturing and marketing positions with Saint-Gobain. Most recently, he was Market Manager at

Saint-Gobain Crystals, in charge of Sapphire and Optoelectronic products.

Pierrick BOULAY - Market & Technology Analyst - SSL

Pierrick BOULAY holds a master degree in Electronics from ESEO (France). He works as Market and Technology Analyst

in the fields of LED, OLED and Lighting Systems to carry out technical, economic and marketing analysis. He has experience

in both LED lighting (general lighting, automotive lighting…) and OLED lighting. In the past, he has mostly worked in R&D

department for LED lighting applications.


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A collection of more than 15 reports on Solid State Lighting and Display.

Report collection


Previous Publications:

• Status of the LED Industry

• LED in Road and Street Lighting

• LED Front End

• GaN-on-Si Technology and Market

• Phosphors & QDs - IP Landscape

2016 Publications:

• OLED For Lighting - February 2016

• Automotive Lighting - April 2016

• UV LED - August 2016

• Sapphire - September 2016

• Organic TFT - October 2016

2017 Publications:

• Thermal Management for LED and Power Electronic - New

• MicroLEDs and MicroDisplays - New

• CSP LED Lighting Module - New

• Agricultural Lighting - New

• IR LED - New

• Display for Augmented Reality - New

• QD for Display Applications - New

• LED Packaging - Update

• Phosphors & QDs - Update

• UV LED - Update

• LED Lighting Module - Update

• Automotive Lighting - Update

Our reports are unmatched in quality and technology depth and typically include:

• Technology trends and evolution: costs, barriers, roadmaps (…).

• Supply & value chain analysis: business models, relationships (…).

• In-depth analysis of applications and market drivers: challenges, inflection points (…).

• Market data ($, units, wafer starts…).©2017 | www.yole.fr | CSP LED Lighting Modules 2017 | Sample

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