Contech Research - Samtec Microelectronicssuddendocs.samtec.com/testreports/ipbdqu_qua.pdf ·...

Contech Research

OCTOBER 8, 2002

TEST REPORT #202440

DURABILITY/THERMAL SHOCK/CYCLIC HUMIDITYTESTING

PART NUMBERS

IPBD-115-01-T-D-11-18IPBD-115-H1-T-D-11-18

SAMTEC, INC.

APPROVED BY: THOMAS PEELVICE PRESIDENT AND

DIRECTOR OF TEST PROGRAM DEVELOPMENTCONTECH RESEARCH, INC.

TR#202440, REV.1.0 2 of 36 Contech Research

REVISION HISTORY

DATE REV. NO. DESCRIPTION ENG.

10/8/2002 1.0 Initial Issue TP


CERTIFICATION

This is to certify that the evaluation described herein wasdesigned and executed by personnel of Contech Research, Inc.It was performed with the concurrence of Samtec, Inc., ofNew Albany, IN who was the test sponsor.

All equipment and measuring instruments used during testingwere calibrated and traceable to NIST according to ISO 10012-1and ANSI/NCSL Z540-1, as applicable.

All data, raw and summarized, analysis and conclusionspresented herein are the property of the test sponsor. No copyof this report, except in full, shall be forwarded to anyagency, customer, etc., without the written approval of thetest sponsor and Contech Research.

Thomas PeelVice President And

Director Of Test Program DevelopmentContech Research, Inc.

TP:js


SCOPE

To perform Durability/Thermal Shock/Cyclic Humidity testing onSeries IPBD Standard Contact (-SP) and Series IPBD High PowerContact(-HP) connectors as manufactured and submitted by thetest sponsor Samtec, Inc.

APPLICABLE DOCUMENTS

1. Unless otherwise specified, the following documents ofissue in effect at the time of testing performed form apart of this report to the extent as specified herein. Therequirements of sub-tier specifications and/or standardsapply only when specifically referenced in this report.

2. Samtec Test Plan : TC0228-0714 Flowchart

3. Standards: EIA Publication 364

TEST SAMPLES AND PREPARATION

1. The following test samples were submitted by the testsponsor, Samtec, Inc., for the evaluation to be performedby Contech Research, Inc.

Description Part Number

a) IPBD Standard Contact Conn.(-SP) IPBD-115-01-T-D-11-18b) IPBD High Power Contact Conn.(-HP) IPBD-115-H1-T-D-11-18

2. The following additional materials were submitted by thetest sponsor to assist and perform the testing of itemslisted in #1 above.

Description Part Number

a) Terminal Conn. IPBT-115-H1-T-D

3. Test samples were supplied assembled and terminated totest boards by the test sponsor.

4. The positions monitored for resistance were distributed asequal as possible throughout each connector row. End andmiddle positions in each pattern were monitored.

5. Unless otherwise specified in the test procedures used, nofurther preparation was used.


TEST SELECTION

1. See Test Plan Flow Diagram, Figure #1, for test sequencesused.

2. Test set ups and/or procedures which are standard or commonare not detailed or documented herein provided they arecertified as being performed in accordance with theapplicable (industry or military) test methods, standardsand/or drawings as specified in the detail specification.

SAMPLE CODING

1. All samples were coded. Mated test samples remained witheach other throughout the test group/sequences for whichthey were designated. Coding was performed in a mannerwhich remained legible for the test duration.

2. The test samples were coded in the following manner:

- SP Samples : ID# 1,2,3,4,5,6,7,8- HP Samples : ID# 9,10,11,12,13,14,15,16


FIGURE #1

TEST PLAN FLOW DIAGRAM

SAMPLE PREPARATION

LLCR

DURABILITY

LLCR

THERMALSHOCK

LLCR

CYCLICHUMIDITY

LLCR


DATA SUMMARY

TEST REQUIREMENT RESULTS

LLCR- SP SAMPLES RECORD 8.0 mΩ MAX.- HP SAMPLES RECORD 6.8 mΩ MAX.

DURABILITY- SP SAMPLES NO DAMAGE PASSED- HP SAMPLES NO DAMAGE PASSED

LLCR- SP SAMPLES +10.0 mΩ MAX.CHG. +0.6 mΩ MAX.CHG.- HP SAMPLES +10.0 mΩ MAX.CHG. +0.3 mΩ MAX.CHG.

THERMAL SHOCK- SP SAMPLES NO DAMAGE PASSED- HP SAMPLES NO DAMAGE PASSED


CYCLIC HUMIDITY- SP SAMPLES NO DAMAGE PASSED- HP SAMPLES NO DAMAGE PASSED


TR#202440, REV.1.0 8 of 36Contech Research

EQUIPMENT LIST

ID# Next Cal Last Cal Equipment Name Manufacturer Model # Serial # Accuracy Freq.Cal

27 Temp. Humid. Chamber Blue M Co. FR-256PC-1 F2-249 See Cal Cert Each Test192 Vertical Thermal Shock Cincinnati Sub-Zero VTS-1-5-3 88-11094 See Cal Cert Each Test594 Computer Sensible P/C 586-133 DX-133 N/A N/A691 10/2/02 10/2/01 Microohm Meter Keithley Co. 580 0686748 See Cal Cert 12mon697 Temp.Humid.Chamber Cincinnati Sub Zero ZH-8-1-H/AC Z9822875 See Cal.Cert. Each Test

1176 6/26/03 6/26/02 Digital Thermometer Omega DP119 020829 See Cal Cert 12mon1314 9/23/02 2/25/02 Multiplexer card Keithley Co. 7708 0862544 N/A 6 mon.1315 9/23/02 2/25/02 Data Aquisition Multimeter Keithley Co. 2700 0862680 See Manual 6 mon.


TEST RESULTS


PROJECT NO.: 202440 SPECIFICATION: TC0228-0714------------------------------------------------------------PART NO.: IPBD-115-01-T-D-11-18 PART DESCRIPTION: IPBD-115-H1-T-D-11-18 Standard Contact (-SP)

High Power Contact (-HP)------------------------------------------------------------SAMPLE SIZE: -SP: 8 Samples TECHNICIAN: SR -HP: 8 Samples------------------------------------------------------------START DATE: 9/11/02 COMPLETE DATE: 9/12/02------------------------------------------------------------ROOM AMBIENT: 20°C RELATIVE HUMIDITY: 50%------------------------------------------------------------EQUIPMENT ID#: 594, 691------------------------------------------------------------LOW LEVEL CIRCUIT RESISTANCE (LLCR)

PURPOSE:

1. To evaluate contact resistance characteristics of thecontact systems under conditions where applied voltages andcurrents do not alter the physical contact interface andwill detect oxides and films which degrade electricalstability. It is also sensitive to and may detect thepresence of fretting corrosion induced by mechanical orthermal environments as well as any significant loss ofcontact pressure.

2. This attribute was monitored after each preconditioningand/or test exposure in order to determine said stabilityof the contact systems as they progress through theapplicable test sequences.

3. The electrical stability of the system is determined bycomparing the initial resistance value to that observedafter a given test exposure. The difference is the changein resistance occurring whose magnitude establishes thestability of the interface being evaluated.

------------------------------------------------------------PROCEDURE:

1. The test was performed in accordance with EIA 364, TestProcedure 23 with the following conditions:

2. Test Conditions:

a) Test Current : 10 milliampsb) Open Circuit Voltage : 20 millivoltsc) No. of Positions Tested : 30 per test sample


PROCEDURE: Continued

3. The points of application are shown in Figure #2.

------------------------------------------------------------REQUIREMENTS:

Low level circuit resistance shall be measured and recorded.

------------------------------------------------------------RESULTS:

1. The following is a summary of the data observed:

LOW LEVEL CIRCUIT RESISTANCE (Milliohms)

Sample ID# Avg. Max. Min.

-SP Samples

1 7.4 7.6 7.32 7.5 7.7 7.23 7.4 7.8 7.24 7.5 7.8 7.35 7.3 7.7 7.16 7.4 7.8 7.37 7.5 7.8 7.48 7.4 8.0 7.1

-HP Samples

9 6.1 6.2 6.010 6.2 6.4 6.011 6.1 6.3 6.012 6.1 6.3 6.013 6.1 6.4 6.014 6.2 6.3 6.015 6.1 6.4 6.016 6.2 6.8 6.0

2. See data files 20244001 through 20244016 for individualdata points.


FIGURE #2

Mated connectorunder test

-V, -I

+V

+I

30 AWG buss wireterminated to theribbon cable



High Power Contact (-HP)------------------------------------------------------------SAMPLE SIZE: -SP: 8 Samples TECHNICIAN: SR -HP: 8 Samples------------------------------------------------------------START DATE: 9/12/02 COMPLETE DATE: 9/12/02------------------------------------------------------------ROOM AMBIENT: 20°C RELATIVE HUMIDITY: 50%------------------------------------------------------------EQUIPMENT ID#: 594, 691------------------------------------------------------------DURABILITY

PURPOSE:

1. This is a preconditioning sequence which is used to inducethe type of wear on the contacting surfaces which may occurunder normal service conditions. The connectors are matedand unmated a predetermined number of cycles. Uponcompletion, the units being evaluated are exposed to theenvironments as specified to assess any impact onelectrical stability resulting from wear or other weardependent phenomenon.

2. This type or preconditioning sequence is also used tomechanically stress the connector system as would normallyoccur in actual service. This sequence in conjunction withother tests is used to determine if a significant loss ofcontact pressure occurs from said stresses which in turn,may result in an unstable electrical condition to exist.

------------------------------------------------------------PROCEDURE:

1. The test was performed in accordance with SpecificationEIA 364, Test Procedure 9.

2. The durability cycles were performed manually.

3. Care was taken to prevent the mating faces of the testsamples from contacting each other.

4. All subsequent variable testing was performed in accordancewith the procedures previously indicated.


REQUIREMENTS:

1. There shall be no evidence of physical damage to the testsamples so tested.

2. The change in low level circuit resistance shall not exceed+10.0 milliohms.

------------------------------------------------------------RESULTS:

1. There was no evidence of physical damage to the testsamples as tested.


CHANGE IN LOW LEVEL CIRCUIT RESISTANCE

(Milliohms)

Avg. Max. Sample ID# Change Change

- SP Samples

1 +0.0 +0.22 +0.0 +0.23 +0.0 +0.54 -0.1 +0.25 +0.2 +0.66 +0.0 +0.57 -0.1 +0.18 +0.0 +0.3

- HP Samples

9 +0.0 +0.210 +0.0 +0.311 +0.0 +0.312 +0.0 +0.213 +0.0 +0.314 +0.0 +0.315 +0.0 +0.116 -0.1 +0.2




High Power Contact (-HP)------------------------------------------------------------SAMPLE SIZE: -SP: 8 Samples TECHNICIAN: SR -HP: 8 Samples------------------------------------------------------------START DATE: 9/13/02 COMPLETE DATE: 9/18/02------------------------------------------------------------ROOM AMBIENT: 20°C RELATIVE HUMIDITY: 57%------------------------------------------------------------EQUIPMENT ID#: 192, 594, 691, 1176------------------------------------------------------------THERMAL SHOCK

PURPOSE:

To determine the resistance of a given electrical connector toexposure at extremes of high and low temperatures and the shockof alternate exposures to these extremes, simulating the worstprobable conditions of storage, transportation and application.

------------------------------------------------------------PROCEDURE:

1. The test environment was performed in accordance withEIA 364, Test Procedure 32 with the following conditions:

2. Test Conditions:

a) Number of Cycles : 100 Cyclesb) Hot Extreme : +85 +3°C/-0°Cc) Cold Extreme : -55 +0°C/-3°Cd) Time at Temperature : 30 Minutese) Mating Conditions : Matedf) Mounting Conditions : Mountedg) Transfer Time : Instantaneous

3. The total number of cycles were performed continuously.

4. All subsequent variable testing was performed in accordancewith the procedures as previously indicated.

5. Prior to performing variable measurements, the test sampleswere allowed to recover to room ambient conditions.


REQUIREMENTS:

1. There shall be no evidence of physical damage to the testsamples as tested.


------------------------------------------------------------RESULTS:

1. There was no evidence of physical damage to the testsamples as tested.

2. The following is a summary of the observed data:


(Milliohms)


- SP Samples

1 +0.1 +0.42 +0.4 +0.93 +0.2 +0.84 +0.2 +0.85 +0.2 +0.66 +0.2 +0.97 +0.3 +0.68 +0.0 +0.3

- HP Samples

9 +0.2 +0.710 +0.2 +0.911 +0.2 +0.712 +0.6 +0.913 +0.2 +0.514 +0.1 +0.315 +0.2 +0.616 +0.2 +0.7




High Power Contact (-HP)------------------------------------------------------------SAMPLE SIZE: -SP: 8 Samples TECHNICIAN: SR -HP: 8 Samples------------------------------------------------------------START DATE: 9/20/02 COMPLETE DATE: 9/30/02------------------------------------------------------------ROOM AMBIENT: 20°C RELATIVE HUMIDITY: 54%------------------------------------------------------------EQUIPMENT ID#: 27, 594, 691, 697, 1314, 1315------------------------------------------------------------HUMIDITY (THERMAL CYCLING)

PURPOSE:

To evaluate the impact on electrical stability of the contactsystem when exposed to any environment which may generatethermal/moisture type failure mechanisms such as:

a) Fretting corrosion due to wear resulting frommicromotion, induced by thermal cycling. Humidityaccelerates the oxidation process.

b) Oxidation of wear debris or from particulates from thesurrounding atmosphere which may have become entrappedbetween the contacting surfaces.

c) Failure mechanisms resulting from a wet oxidationprocess.

------------------------------------------------------------PROCEDURE:

1. The test environment was performed in accordance withEIA 364, Test Procedure 31, Method III with the followingconditions:

2. Test Conditions:

a) Preconditioning (24 hours) : 50°C ± 5°Cb) Relative Humidity : 90% to 95%c) Temperature Conditions : 25°C to 65°Cd) Cold Cycle : Noe) Polarizing Voltage : Nof) Mating Conditions : Matedg) Mounting Conditions : Mountedh) Duration : 240 hours


PROCEDURE: Continued

3. Prior to performing variable measurements, the test sampleswere allowed to recover to room ambient conditions.

4. All subsequent variable testing was performed in accordancewith the procedures previously indicated.

------------------------------------------------------------REQUIREMENTS:

1. There shall be no evidence of physical deterioration of thetest samples as tested.


------------------------------------------------------------RESULTS:

1. The test samples as tested showed no evidence of physicaldeterioration.



(Milliohms)


- SP Samples

1 +0.5 +1.32 +0.6 +1.43 +0.4 +1.34 +0.4 +1.45 +0.5 +1.06 +0.4 +1.37 +0.6 +2.28 +0.4 +1.3


RESULTS: Continued


(Milliohms)


- HP Samples

9 +0.4 +0.810 +0.5 +1.811 +0.7 +1.412 +0.5 +2.013 +0.7 +2.014 +0.2 +0.715 +0.6 +1.516 +0.5 +1.9



LLCR DATA FILES

FILE NUMBERS

-SP SAMPLES -HP SAMPLES

20244001 2024400920244002 2024401020244003 2024401120244004 2024401220244005 2024401320244006 2024401420244007 2024401520244008 20244016


Low Level Contact Resistance

Project: 202440 Spec: EIA 364, TP 23Customer: Samtec Subgroup: ID# 1Product: SP Connector File #: 20244001Description: PN:IPBD-115-01-T-D-11-18Open circuit voltage: 20mv Current: 10ma

Delta valuesunits: milliohms

Temp ºC 20 20 20 20R.H. % 60 50 57 54Date: 11Sep02 12Sep02 18Sep02 30Sep02Pos. ID INITIAL Dur.30x T-Shock Humidity

1 7.3 -0.1 0.3 0.22 7.4 -0.1 0.0 0.23 7.3 0.0 0.0 0.44 7.3 -0.1 0.1 0.15 7.4 0.0 0.0 0.56 7.4 0.0 0.0 0.67 7.3 0.1 0.1 0.78 7.3 0.0 0.1 0.49 7.4 0.0 0.4 1.3

10 7.6 -0.1 0.0 0.311 7.3 0.0 0.2 0.912 7.4 0.0 -0.2 0.713 7.4 0.0 0.0 0.614 7.4 0.1 0.3 0.915 7.5 -0.2 0.0 0.216 7.5 -0.1 0.3 1.017 7.5 -0.2 -0.1 0.118 7.4 -0.1 -0.3 0.319 7.3 0.0 0.2 0.020 7.4 0.0 0.1 0.121 7.3 0.0 0.1 0.322 7.3 -0.1 0.2 0.323 7.3 -0.1 0.4 0.724 7.4 0.0 0.0 0.125 7.4 -0.2 0.0 0.826 7.4 0.0 0.0 0.227 7.4 -0.2 -0.1 0.128 7.5 0.2 0.3 0.629 7.4 -0.1 0.4 1.030 7.4 0.1 0.2 0.6

MAX 7.6 0.2 0.4 1.3 MIN 7.3 -0.2 -0.3 0.0 AVG 7.4 0.0 0.1 0.5 STD 0.1 0.1 0.2 0.3 Open 0 0 0 0 Tech S-R S-R S-R S-R

Equip ID 594 594 594 594691 691 691 691






1 7.4 0.1 0.6 1.22 7.5 0.0 0.7 0.83 7.5 0.0 0.6 1.14 7.7 0.1 0.9 0.85 7.4 0.0 0.4 0.06 7.5 -0.1 0.1 0.47 7.4 0.0 0.1 0.28 7.4 -0.1 0.0 0.39 7.4 0.0 0.4 0.7

10 7.6 -0.1 0.1 1.311 7.5 -0.1 0.1 1.212 7.7 -0.2 0.2 0.713 7.3 0.1 0.2 0.814 7.6 -0.1 0.1 0.315 7.6 0.0 0.5 0.516 7.4 0.0 0.6 0.317 7.6 -0.1 0.6 0.518 7.3 0.0 0.1 0.419 7.2 0.2 0.3 0.620 7.4 0.0 0.4 1.021 7.5 0.0 0.2 0.422 7.4 0.0 0.4 1.423 7.5 0.0 0.1 0.224 7.5 0.2 0.8 0.525 7.3 0.0 0.1 0.126 7.3 0.1 0.4 0.427 7.5 0.1 0.3 0.228 7.5 0.0 0.4 0.029 7.4 0.1 0.3 0.330 7.5 0.1 0.9 0.9

MAX 7.7 0.2 0.9 1.4 MIN 7.2 -0.2 0.0 0.0 AVG 7.5 0.0 0.4 0.6 STD 0.1 0.1 0.3 0.4 Open 0 0 0 0 Tech S-R S-R S-R S-R

Equip ID 594 594 594 594691 691 691 691






1 7.4 0.1 0.3 0.42 7.7 -0.2 -0.3 0.43 7.4 0.3 0.4 0.74 7.6 -0.7 -0.1 -0.55 7.8 -0.5 -0.4 -0.26 7.4 0.0 0.0 0.37 7.2 0.1 0.1 0.28 7.2 0.2 0.4 0.49 7.3 0.0 0.2 0.0

10 7.5 0.0 0.1 0.711 7.4 0.2 0.2 1.012 7.4 0.0 0.3 0.013 7.5 0.1 0.2 0.814 7.4 0.3 0.8 0.915 7.6 0.0 0.4 0.916 7.5 -0.1 0.2 0.517 7.4 -0.1 0.3 0.318 7.4 -0.1 0.3 0.519 7.2 0.0 0.4 0.720 7.3 0.1 0.1 0.121 7.5 0.1 0.5 0.422 7.4 -0.1 0.1 0.223 7.5 -0.1 0.0 0.124 7.3 0.0 0.1 0.225 7.4 0.0 0.2 0.426 7.4 -0.3 0.3 0.727 7.5 0.0 0.4 0.928 7.4 0.5 0.2 0.829 7.5 -0.3 0.1 0.230 7.6 0.2 0.4 1.3

MAX 7.8 0.5 0.8 1.3 MIN 7.2 -0.7 -0.4 -0.5 AVG 7.4 0.0 0.2 0.4 STD 0.1 0.2 0.2 0.4 Open 0 0 0 0 Tech S-R S-R S-R S-R

Equip ID 594 594 594 594691 691 691 691






1 7.8 -0.3 0.7 0.62 7.8 -0.2 0.3 1.23 7.6 -0.4 0.3 0.74 7.6 -0.3 0.3 0.45 7.5 -0.6 0.1 0.06 7.4 -0.1 0.3 0.67 7.5 -0.2 0.2 0.58 7.5 -0.3 0.2 0.49 7.4 0.1 0.3 0.5

10 7.7 0.0 0.8 0.411 7.6 -0.2 0.1 0.912 7.5 0.0 0.5 0.413 7.3 0.1 0.2 1.214 7.5 -0.3 0.1 0.015 7.5 -0.1 0.2 0.216 7.4 0.2 0.3 0.317 7.4 -0.1 0.2 1.418 7.6 -0.4 0.2 -0.119 7.5 0.0 0.1 0.320 7.3 0.0 0.3 0.321 7.5 -0.1 0.1 -0.122 7.7 -0.3 0.2 0.023 7.6 -0.2 -0.2 0.424 7.4 -0.1 0.1 0.025 7.6 -0.1 0.5 0.026 7.4 -0.1 0.1 0.027 7.4 -0.1 0.0 0.428 7.5 -0.1 0.0 0.129 7.8 -0.2 0.2 -0.230 7.3 -0.1 0.2 0.5

MAX 7.8 0.2 0.8 1.4 MIN 7.3 -0.6 -0.2 -0.2 AVG 7.5 -0.1 0.2 0.4 STD 0.1 0.2 0.2 0.4 Open 0 0 0 0 Tech S-R S-R S-R S-R

Equip ID 594 594 594 594691 691 691 691





Temp ºC 20 20 20 20R.H. % 60 50 57 54Date: 11Sep02 12Sep02 18Sep02 30Sep02Pos. ID INITIAL Dur.30x T-Shock Humidty

1 7.7 -0.1 0.6 0.72 7.3 0.0 0.1 0.53 7.3 0.0 0.0 0.24 7.3 0.0 0.0 0.25 7.3 -0.1 -0.1 0.46 7.4 -0.1 0.0 0.37 7.3 -0.5 0.2 0.38 7.3 0.3 0.1 0.39 7.2 0.5 0.3 0.7

10 7.3 0.0 0.1 0.411 7.1 0.1 0.3 0.512 7.2 0.3 0.0 -0.113 7.3 0.3 0.0 0.614 7.3 0.0 0.0 0.315 7.3 0.2 0.1 0.716 7.4 0.1 0.3 0.417 7.3 0.2 0.2 0.318 7.4 0.1 0.1 0.219 7.4 0.1 0.2 0.820 7.3 -0.4 -0.1 0.421 7.3 0.5 0.4 1.022 7.3 0.5 0.2 0.923 7.2 0.3 0.2 0.524 7.4 0.3 0.3 0.925 7.3 0.4 0.0 0.526 7.3 0.5 0.2 0.527 7.4 0.5 0.3 0.728 7.3 0.6 0.1 0.229 7.3 0.5 0.2 0.330 7.2 0.6 0.2 0.5


Equip ID 594 594 594 594691 691 691 691






1 7.4 0.1 0.6 0.92 7.5 0.0 0.4 0.43 7.8 -0.2 -0.2 -0.14 7.3 -0.2 0.1 0.25 7.3 0.0 0.2 1.16 7.3 0.4 0.2 0.47 7.3 0.1 0.4 0.38 7.3 0.0 0.1 0.09 7.4 0.0 0.1 0.2

10 7.4 0.0 0.0 0.311 7.3 0.0 0.0 0.212 7.4 0.1 0.2 0.313 7.3 0.0 0.0 0.114 7.4 0.0 0.4 0.715 7.4 0.2 0.3 0.716 7.3 -0.1 0.1 0.617 7.3 0.1 0.0 0.218 7.3 0.1 0.1 0.619 7.4 0.1 0.4 0.820 7.3 0.1 0.1 0.521 7.4 0.1 0.1 0.222 7.4 0.0 0.0 0.323 7.4 0.0 0.1 1.024 7.4 -0.1 0.1 0.425 7.4 0.0 0.0 0.226 7.4 0.0 0.0 0.127 7.3 0.0 0.0 0.328 7.4 0.3 0.3 0.029 7.3 -0.3 0.5 1.230 7.3 0.5 0.9 1.3


Equip ID 594 594 594 594691 691 691 691





Temp ºC 20 20 20 20R.H. % 50 50 57 54Date: 12Sep02 12Sep02 18Sep02 30Sep02Pos. ID INITIAL Dur.30X T-Shock Humidity

1 7.5 -0.3 0.4 0.62 7.6 -0.1 0.3 0.53 7.5 -0.1 0.2 0.04 7.8 -0.2 0.0 1.05 7.6 0.0 0.5 2.26 7.4 0.1 0.3 0.17 7.5 0.0 0.4 0.98 7.6 0.0 0.3 0.79 7.5 0.0 0.0 0.1

10 7.5 0.0 0.3 1.111 7.7 -0.1 0.0 0.412 7.6 -0.3 0.2 1.013 7.6 -0.1 0.1 1.214 7.8 -0.3 0.6 1.415 7.6 0.0 0.5 0.216 7.4 -0.2 0.1 0.817 7.5 -0.1 0.1 0.618 7.5 0.1 0.1 0.119 7.4 0.1 -0.1 0.120 7.6 -0.1 0.1 0.621 7.5 0.0 0.3 1.122 7.5 -0.1 0.2 0.223 7.4 -0.1 0.5 0.524 7.5 -0.1 0.1 0.725 7.5 0.0 0.2 0.626 7.5 -0.1 0.3 0.727 7.5 -0.2 0.3 0.228 7.6 0.0 0.6 -0.129 7.7 -0.2 0.5 0.230 7.5 0.0 0.5 0.1


Equip ID 594 594 594 594691 691 691 691






1 7.5 0.0 0.0 1.02 7.1 0.1 0.2 0.53 7.3 -0.1 0.3 0.54 7.3 0.0 0.2 0.15 7.4 -0.1 0.0 0.26 7.4 0.1 0.2 0.57 7.6 -0.2 -0.1 0.28 7.7 -0.1 -0.1 0.19 7.4 -0.1 -0.1 -0.1

10 7.7 -0.5 -0.2 -0.311 7.5 -0.1 -0.1 0.012 7.5 -0.2 -0.1 1.313 7.4 -0.2 0.0 0.314 7.3 -0.1 0.0 1.215 7.8 0.0 -0.1 0.616 7.3 0.1 0.2 0.717 7.3 0.3 0.2 0.618 7.3 0.0 0.2 0.719 7.5 0.0 0.0 0.220 7.4 0.0 0.1 -0.221 7.2 0.0 0.1 0.322 7.5 0.1 0.3 0.523 7.2 0.1 0.1 0.224 7.4 0.0 -0.1 0.225 7.4 0.0 0.0 0.326 8.0 0.0 -0.4 1.027 7.4 -0.1 0.1 0.628 7.4 0.0 0.0 0.629 7.3 -0.1 0.0 0.330 7.4 0.0 0.0 0.8


Equip ID 594 594 594 594691 691 691 691



Project: 202440 Spec: EIA 364, TP 23Customer: Samtec Subgroup: ID# 9Product: HP Connector File #: 20244009Description: PN:IPBD-115-01-T-D-11-18Open circuit voltage: 20mv Current: 10ma



1 6.1 0.0 0.7 0.62 6.1 0.1 0.4 0.43 6.1 0.0 0.2 0.14 6.2 0.0 0.1 0.45 6.1 0.0 0.1 0.46 6.2 -0.2 0.1 0.37 6.1 0.0 0.1 0.48 6.1 0.0 0.1 0.49 6.2 0.0 0.0 0.5

10 6.2 -0.1 0.1 0.311 6.1 -0.1 -0.1 0.512 6.1 -0.1 0.5 0.613 6.1 -0.1 0.1 0.114 6.2 -0.2 0.2 0.315 6.1 0.2 0.3 0.316 6.2 0.0 0.4 0.217 6.2 0.1 0.1 0.018 6.2 -0.1 0.1 0.119 6.0 0.0 0.3 0.420 6.1 -0.1 0.3 0.221 6.1 -0.1 0.2 0.322 6.1 0.0 0.3 0.223 6.1 -0.1 0.1 0.324 6.1 0.0 0.3 0.525 6.1 0.0 0.2 0.526 6.1 -0.1 0.4 0.727 6.1 0.2 0.5 0.628 6.1 0.0 0.6 0.529 6.2 0.0 0.2 0.230 6.1 0.0 0.3 0.8


Equip ID 594 594 594 594691 691 691 691






1 6.2 0.1 0.1 0.12 6.2 0.2 0.2 0.03 6.2 0.0 0.0 0.64 6.4 -0.3 0.2 1.25 6.2 0.1 0.0 0.46 6.3 -0.1 0.1 0.47 6.1 0.3 0.1 -0.18 6.1 0.1 0.0 0.39 6.2 -0.1 -0.1 0.7

10 6.1 -0.1 0.9 0.911 6.0 0.2 0.3 0.312 6.2 -0.1 0.0 0.613 6.1 -0.1 0.0 0.314 6.1 0.0 0.2 0.415 6.2 -0.1 0.5 1.816 6.3 -0.1 0.6 0.517 6.1 0.1 0.4 0.518 6.1 -0.1 0.2 1.119 6.1 0.0 0.1 0.620 6.3 -0.2 0.3 0.421 6.2 0.0 0.0 0.522 6.3 -0.1 0.2 0.423 6.2 -0.1 0.0 0.224 6.2 0.3 0.0 0.325 6.1 0.1 0.0 0.326 6.2 -0.1 0.1 1.027 6.3 -0.3 0.1 0.128 6.1 0.1 0.1 0.229 6.3 -0.2 0.3 0.330 6.1 0.0 0.3 0.5


Equip ID 594 594 594 594691 691 691 691






1 6.2 0.0 0.5 0.42 6.0 0.1 0.7 0.83 6.1 0.1 0.1 0.24 6.2 0.2 -0.1 0.35 6.3 -0.3 0.0 0.46 6.1 0.1 0.1 0.67 6.3 -0.2 0.1 1.48 6.2 -0.2 -0.3 0.69 6.2 -0.1 0.0 0.7

10 6.1 0.0 0.0 0.611 6.2 -0.2 0.1 0.812 6.1 0.2 0.2 0.713 6.0 0.2 0.2 0.714 6.2 0.0 0.4 0.615 6.1 0.0 0.4 0.516 6.2 0.3 0.2 1.217 6.1 0.0 0.3 0.818 6.1 0.0 0.2 0.219 6.2 -0.1 0.2 1.120 6.1 0.3 0.2 0.421 6.3 -0.2 0.0 0.522 6.2 0.1 0.1 0.323 6.1 0.0 0.3 0.524 6.1 0.3 -0.1 0.925 6.2 -0.1 0.4 1.026 6.1 0.0 0.0 0.327 6.2 0.1 0.1 1.028 6.1 -0.1 0.1 0.829 6.0 0.3 0.5 0.830 6.0 0.1 0.3 0.6


Equip ID 594 594 594 594691 691 691 691






1 6.1 0.1 0.3 0.42 6.3 0.0 0.4 0.53 6.2 -0.1 0.4 0.34 6.1 0.1 0.7 0.85 6.1 0.0 0.5 0.46 6.1 0.1 0.7 1.37 6.2 -0.1 0.6 0.48 6.0 0.1 0.9 0.79 6.1 0.0 0.6 0.8

10 6.1 0.0 0.5 0.411 6.3 0.1 0.9 0.512 6.1 0.0 0.8 0.313 6.1 0.1 0.8 0.414 6.1 0.0 0.7 0.715 6.1 0.0 0.9 0.316 6.2 0.2 0.4 0.817 6.1 0.1 0.4 0.118 6.1 0.0 0.4 0.519 6.0 0.1 0.8 1.120 6.1 0.0 0.4 0.221 6.1 0.0 0.4 0.522 6.1 0.0 0.5 0.123 6.1 0.1 0.5 0.424 6.0 0.1 0.4 0.125 6.1 0.0 0.4 0.426 6.2 0.0 0.7 0.227 6.1 0.1 0.5 0.928 6.1 0.1 0.7 0.529 6.1 0.0 0.6 0.330 6.2 0.0 0.6 2.0

MAX 6.3 0.2 0.9 2.0 MIN 6.0 -0.1 0.3 0.1 AVG 6.1 0.0 0.6 0.5 STD 0.1 0.1 0.2 0.4 Open 0 0 0 0 Tech S-R S-R S-R S-R

Equip ID 594 594 594 594691 691 691 691






1 6.1 0.0 0.2 0.82 6.1 0.0 0.1 1.13 6.2 0.0 0.3 0.64 6.1 0.0 0.2 0.25 6.1 -0.1 0.2 0.46 6.1 0.0 0.2 0.37 6.1 0.0 0.2 0.38 6.1 0.0 0.2 0.69 6.0 0.0 0.1 0.5

10 6.0 0.0 0.2 0.211 6.1 0.0 0.0 1.112 6.0 0.0 0.2 0.213 6.1 0.0 0.1 0.414 6.1 0.0 0.2 0.215 6.0 0.0 0.0 0.816 6.1 0.0 0.4 1.417 6.1 0.0 0.2 0.518 6.1 0.0 0.2 0.819 6.1 0.0 0.2 0.820 6.0 0.3 0.5 2.021 6.2 0.0 0.1 0.522 6.4 -0.2 0.0 0.523 6.3 -0.1 0.1 0.924 6.2 -0.1 0.2 0.725 6.2 -0.2 0.0 0.326 6.1 0.1 0.3 1.327 6.2 -0.1 -0.3 0.828 6.0 0.1 0.0 1.729 6.2 0.0 0.0 0.430 6.0 0.2 0.3 0.5


Equip ID 594 594 594 594691 691 691 691






1 6.1 0.2 0.3 0.22 6.2 0.0 0.1 0.23 6.2 0.1 0.0 0.14 6.2 0.0 0.1 0.55 6.3 0.0 0.1 0.26 6.3 0.3 0.2 0.27 6.3 0.1 0.2 0.18 6.2 0.1 0.3 0.39 6.3 0.0 0.1 0.1

10 6.2 0.1 0.1 0.111 6.2 0.1 0.2 0.312 6.1 0.1 0.1 0.413 6.1 0.0 0.0 0.714 6.3 0.0 0.2 0.215 6.1 0.0 0.2 0.216 6.0 0.0 0.3 0.317 6.2 -0.4 0.0 0.118 6.2 -0.3 0.2 0.019 6.2 -0.3 0.2 0.220 6.2 -0.1 0.0 0.021 6.2 -0.1 0.1 0.122 6.1 0.0 0.2 0.023 6.1 -0.1 0.1 0.024 6.3 -0.1 0.2 0.225 6.2 -0.1 0.1 0.026 6.2 -0.1 0.1 0.027 6.1 0.0 0.1 0.428 6.1 0.0 0.1 0.329 6.1 -0.1 0.2 0.530 6.1 0.0 -0.1 0.3


Equip ID 594 594 594 594691 691 691 691






1 6.0 0.1 0.4 0.62 6.1 0.0 0.2 0.93 6.1 -0.1 0.2 0.94 6.2 -0.1 0.3 1.15 6.1 -0.1 0.3 0.36 6.1 0.0 -0.1 0.57 6.0 0.0 0.2 0.48 6.2 0.1 0.3 0.29 6.0 0.0 0.2 0.2

10 6.1 -0.1 0.1 0.211 6.1 0.0 0.0 0.412 6.1 -0.1 0.3 0.113 6.2 -0.1 0.1 0.314 6.0 0.1 0.3 1.015 6.2 0.1 0.3 1.316 6.0 0.0 0.3 1.517 6.0 0.0 0.2 1.018 6.0 0.0 0.3 0.719 6.0 0.0 0.3 0.520 6.1 -0.1 0.1 0.221 6.0 0.0 0.3 0.522 6.1 0.0 0.6 0.423 6.1 -0.1 0.3 0.824 6.4 -0.1 0.0 0.925 6.1 0.0 0.2 0.926 6.1 -0.1 0.1 1.427 6.4 -0.2 0.0 0.428 6.0 0.0 0.3 0.629 6.0 0.0 0.2 0.730 6.2 -0.1 0.2 0.4


Equip ID 594 594 594 594691 691 691 691






1 6.3 -0.1 0.6 0.02 6.2 0.0 0.2 0.43 6.2 0.1 0.4 0.24 6.8 -0.5 0.4 -0.45 6.2 0.0 0.7 0.66 6.1 0.1 0.4 0.37 6.4 -0.3 -0.2 -0.18 6.5 -0.3 -0.1 0.09 6.4 -0.3 0.0 0.7

10 6.5 -0.3 0.2 0.211 6.4 -0.1 0.2 0.912 6.2 -0.1 0.2 0.913 6.3 -0.1 0.2 1.314 6.1 0.0 0.1 1.115 6.1 0.0 0.1 0.416 6.1 0.1 0.3 1.617 6.0 0.1 -0.1 1.218 6.3 -0.2 -0.1 0.419 6.2 -0.1 0.1 0.420 6.0 0.1 0.1 0.521 6.0 0.2 0.5 0.522 6.2 0.0 0.0 1.923 6.3 -0.2 0.1 1.024 6.1 0.0 0.1 0.625 6.2 -0.1 0.1 0.026 6.1 0.0 0.1 0.227 6.2 0.0 0.0 0.428 6.2 0.0 0.0 0.429 6.2 0.0 -0.1 0.230 6.2 0.0 0.4 0.1


Equip ID 594 594 594 594691 691 691 691

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