Basics of Mosfet

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    MOS Transistor (MOSFET)

    n+ n+

    p-

    SOURCE DRAIN

    GATE

    SUBSTRATE

    GATE OXIDE

    CHANNEL

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    MOS Transistor Operation

    Channel is normally non-conducting (open-circuit):No bias voltage (or small voltage) applied to Gate

    Source and Drain junctions are reverse-biasedrelative to the substrate

    Depletion regions surround the Source and Drain

    Channel is depletedof mobile charge carriers

    Channel starts to conduct when:Gate voltage VGS exceeds the Threshold VoltageVTMobile charge is present in the channel

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    p Substrate

    S DG

    VDS +

    _

    Source Depletion

    Region

    Drain Depletion

    Region

    mA

    IDS = 0

    n+ n+

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    p Substrate

    S DG

    VDS +

    _

    mA

    VGS < VT

    +_

    Channel

    in Depletion

    IDS = 0

    n+ n+

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    MOSFET Operation 0 < VGS < VT

    Channel in DepletionMajority carriers in p-type substrate (holes) are

    repelled by positive charge on the Gate

    No current flows in the channel VGS VT

    Channel in Inversion

    Electrons (minority carriers in substrate) are drawninto channel by positive charge on the Gate

    Current flows in the channel

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    p Substrate

    S DG

    VDS +

    _

    mA

    VGS < VT

    +_

    Channel

    in Depletion

    IDS = 0

    n+ n+

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    p Substrate

    S DG

    VDS +

    _

    mA

    VGS VT

    +_

    Channel

    in Inversion

    IDS 0

    n+ n+

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    Mobile charge concentration in the channel isproportional to that part of the gate-source voltagewhich exceeds the threshold voltage VT, that is by

    (VGS - VT). In this way the gate-source voltagecontrols the drain-source current.

    MOS TRANSISTOR MODEL

    Capacitance of gate-oxide-substrate capacitor is CG

    Mobile charge (electrons) in the channel is given by:

    ( )TGSG VVCQ =

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    Formation of the Inversion Layer

    GATE OXIDE SILICON

    +ve

    Charge

    -ve

    Charge

    NA

    z

    Charge Density

    GATE OXIDE SILICON

    +veCharge

    -ve

    Charge

    NA

    z

    Charge Density

    Inversion

    Layer

    (Electrons)

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    is mean transit timefor electrons to cross the channel

    All mobile charge in the channel is swept through the

    drain once per transit time; hence drain current is:

    ( )

    =

    = TGSGDSVVCQ

    I

    average drift velocity of the electrons in the channelunder the influence of an electric field E is:

    Ev =

    is the mobilityor velocity per unit field strength

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    Let the length of the channel (distance from source todrain) be L; then if the velocity v is constantthroughout the channel we can write:

    =Lv

    Assume E is uniform along the entire length of the

    channel, and that it is created by a voltage VDSbetween drain and source, then:

    L

    V

    EDS

    =

    [Note: It will be explained later that this condition is only

    fulfilled if VDS

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    The transit time is

    DS

    2

    V

    L

    =

    Substitute into previous equation for IDS:

    ( ) DSTGS2G

    DS VVV

    L

    CI

    =

    Gate capacitance CG = Cox.WL, where Cox is the gateoxide capacitance per unit area and WL is the area of

    the channel. Therefore:

    ( ) DSTGSoxDS VVVL

    WCI =

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    MOS Transistor

    n+ n+

    L

    W

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    For VDS

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    Triode Region 0 < VDS < (VGS - VT)

    ( )

    = 2

    VVVVL

    WCI

    2

    DSDSTGSoxDS

    The voltage in the channel varies between Source andDrain now that VDS is getting bigger; as a result the

    charge concentration in the channel also varies withdistance from the Source

    This equation reduces to the earlier one if VDS is small.

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    Saturation Region VDS (VGS - VT)

    ( )2

    TGSoxDS VVL

    WC2

    1I =

    When VDS reaches (VGS - VT) the end of the channelclosest to the drain pinches off and the drain currentsaturates.

    The amount of charge induced in the channel cannotbe increased beyond this level.

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    MOS Channel Pinch-Off

    n+ n+

    Electron

    Density

    Depletion

    Region

    Inversion

    Layer

    S

    G

    D

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    MOSFET Transfer Characteristic

    0

    20

    40

    60

    80

    100

    0 1 2 3 4 5

    VGS (V)

    IDS

    (A)

    VT

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    MOSFET Drain Characteristics

    VDS (V)

    0

    ID

    S

    (A)

    2 4 6 8 10 12

    200

    400

    600

    (VGS VT) = 4V

    3V

    2V

    1V

    Triode

    RegionSaturation

    Region

    800

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    MOSFET Transfer Characteristic

    VDS = 10V

    T

    Gate-Source Voltage (V)

    0.00 2.50 5.00 7.50 10.00

    DrainCurre

    nt(A)

    0.00

    5.43

    10.86

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    MOSFET Drain CharacteristicsT

    Input voltage (V)

    0.00 2.50 5.00 7.50 10.00

    Current

    (A)

    0.00

    6.00

    12.00VGS = 10V

    VGS = 8V

    VGS = 6V

    VGS = 4V

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    MOSFET Circuit SymbolsD

    G

    S

    Substrate

    n-channel

    Enhancement Mode

    MOSFET

    D

    G

    S

    Substrate

    p-channel

    Enhancement Mode

    MOSFET

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    MOSFET TransconductanceThe transconductance parameter gm is defined

    as:

    GS

    DSm

    V

    Ig

    =

    Enhancement MOSFET in saturation:

    ( ) ( )2TGS2TGSoxDS VV2VVLWC21I ==

    L

    W

    Cox=Where

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    MOSFET Transconductance

    ( )TGSGSDS

    m VVV

    I

    g =

    =

    ( ) =DS

    TGS I2VV

    DSm I2g =

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