Cadence_tutorial
Lecture 01
3D IC'S
3 d(1)
3 d
Resilience at Extreme Scale
3 d ic
High k dielectric
Overview-finfet
Huichu2012DRC (1)
Methodology for Standard Cell Compliance and Detailed Placement for Triple Patterning Lithography Bei Yu, Xiaoqing Xu, JhihRong Gao, David Z. Pan.
