Water Chemistry WorkshopAKSinha
L-Cell A Novel Device for Plating Process Diagnostics L-Chem, Inc. Shaker Heights, OH 44120 .
Metallization of Submicron Features in High-End Semiconductor Devices by Copper Electroplating Uziel Landau Department of Chemical Engineering Case Western.
Inspecting Industrial/Commercial Facilities For Pollutants Of Concern Insert pictures representing Hg, Cu and PCB.
Movement Disorders
FINAL REPORT
Thermodynamics and Kinetics study of growth behavior of sono-electrodeposited Cu thin films Sabita Rout, A. Mallik, B. C. Ray [email protected] [email protected].
Nickel-aluminium bronze pitting corrosion in seawater R.C. Barik 1,3, J.A. Wharton 1, R.J.K. Wood 1, K.R. Stokes 1,2 1 national Centre for Advanced Tribology.
Electrochemical Aspects of Copper Chemical Mechanical Planarization (CMP )
