OVERCOMING KEY CHALLENGES OF TODAY'S COMPLEX SOC: PERFORMANCE OPTIMIZATION AND VERIFICATION QUALITY
Temperature-Gradient Based Burn-In for 3D Stacked ICs Nima Aghaee, Zebo Peng, and Petru Eles Embedded Systems Laboratory (ESLAB) Linkoping University 12th.
Twenty Years of HP Videos: 1986 to 2005 Jake Schwartz.
Temperature-Gradient Based Burn-In for 3D Stacked ICs
CHIP 2012 Conference 2012 Booklet
