Dirk Beernaert, European Commission
Brussels, 16 December 2010
IC design Challenges and opportunities Workshop
Semiconductors as key enabling industry
ElectronicsWW$1500B / Europa $315B
Automotive Industrial Defense
Medical Space
Semiconductors$256B /
Europa $41B
Service ProvidersWW$6300B / Europa $1600B
2007 World GDP=65200BUS$ (ppp based)
- Internet Services Providers- Games
- Broadcast- Telecom Operators
Semiconductors provide the knowledge & technologies that generate some 10% of global GDP.
Source: IMF, ESIA, WSTS, Decision
The Supply Chain Today
Systems2008
~1430B$2009
~1380B$
Devices2008
~275B$2009
~250B$
Equipment2008
~31B$2009
~17B$
Material
~20B$
2010~1440B$
2010~280B$
2010~26B$
Global electronic market supply chain revenue
Source: Gartner, Ic Insights (2008-2009)Automotive
Industrial and Medical
Military, Civil Aerospace, Security
Consumer
Communications
Data Processing
The evolving SC value chain / landscape
Academia,ScientificResearch
Institu-tions
Eq.& Materials
IDM
DISTI
(branded) OEM
Service providers(virtual) Network op.
(Consumer) Retail
Businesses, Consumers, Authorities
From a linear chain...
S/C MfgServices:• Foundry• SATS
Fabless
IP Providers:• IP blocks• Software
(firmware, stacks, middleware, OS)
• Design houses• EDA
DISTIODM EMS
(branded) OEM
Module makers
Service providers/(virtual) network op.
(Consumer) Retail
Distrib.
Content Industry:• Providers• Aggregators• Service prov.
Businesses, Consumers, Authorities
Academia,ScientificResearch
Institu-tions
Eq.& Materials
IDM
Logistics
service
providers
...to a networked model
Source: ESIA
Global Consolidation: Number of Logic IDMs with Fabs.European Chip makers are moving up the value chain: From the hardware supply side into the final application
IBS 2009, ST 2010
Semi equipment
Semi materials
Wafer foundry
Software
Systemmgmt
Chip maker
Application
Contentprotection
Infrastructure
System integrator
Service provider
Contentprovider
Deliverynetwork
Gatewaymgmt
Legislatorregulations
Changing business models
-
Keep research, manufacturing, integration & system competence in Europe?
IP, lead markets, user-supplier relationships, regional innovation clusters, equipment, manufacturing, SMEs
Policy & more efforts to keep Europe attractive for investments in semiconductor research & manufacturing and
for their application in key lead markets High on EU 2020 Agenda
Nanoelectronics”Small, smaller, smarter”
Nanoelectronics”Small, smaller, smarter”
- Advanced communication & computing components enabling pervasive applications -
Lower cost, higher performance and more
functionality
pe
rfo
rma
nc
e
Smart design and Smart manufacturing of Smart Components
Enabled by
•Power consumption
-
Mo
ore
’s L
aw:
Min
iatu
riza
tio
nB
asel
ine
CM
OS
: C
PU
, Mem
ory
, Lo
gic
130nm
90nm
65nm
45nm
32nm
22nm
Beyond
Moore
Analog/RF Passives HV Power SensorsActuators
Biochips
InformationProcessing
Digital content SoC
Interacting with people and environment
Non-digital SoC & SiP
Combining SoC and SiP: Higher Value Systems
More than Moore: Diversification
Digital Society
Current FP7 R&D Work Programme
• To stimulate interaction of system and technology to better explore European system competences.
• To address energy efficiency needs for mobile applications
• Nanoelectronics products as system enablers and solution providers for global challenges as aging society, global warming, growing population or sustainable manufacturing.
• To prepare for “beyond” traditional shrinking (ITRS roadmap)
-
Mo
ore
’s L
aw:
Min
iatu
riza
tio
nB
asel
ine
CM
OS
: C
PU
, Mem
ory
, Lo
gic
130nm
90nm
65nm
45nm
32nm
22nm
Beyond
Moore
Analog/RF Passives HV Power SensorsActuators
Biochips
InformationProcessing
Digital content SoC
Interacting with people and environment
Non-digital SoC & SiP
Combining SoC and SiP: Higher Value Systems
More than Moore: Diversification
Manufacturing, Equipment assessment and Access
– Access to nano-manufacturing and to advanced technologies to be assured in Europe.
– Access to world wide equipment market for European suppliers, especially SMEs, need to be stimulated.
– Access to design tools and multi-project wafers fabrication for education, PhD and SMEs.
Semiconductor Equipment for Wafer Bonding with Plasma Activation
EV Group, CEA-LETI, Soitec
3D Integration of Bulk Si WafersEV Group, CEA-LETI,
STMicroelectronics Crolles II
Low Energy and Dose Implant TestSEMILAB, Fraunhofer IISB,
ST Microelectronics Crolles II,NXP Crolles R&D
Ruthenium Atomic Vapor Deposition Competitiveness in Nanoelectronic
Device GenerationsAIXTRON, Fraunhofer IISB, Infineon
Munich
Metrology Using X-Ray TechniquesJordan Valley, CEA-LETI,
STMicroelectronics Crolles II,NXP Crolles R&D
ENIAC Joint Undertaking as Public-Private Partnership
Industry and R&D actors
Commission and Public
Authorities
Executive Dir. and secretariat
He
alth
& th
e A
gin
g S
ocie
ty
En
erg
y Efficie
ncy
Sa
fety &
Se
curity
Au
tom
otive
& T
ran
spo
rt
Co
mm
un
icatio
n &
Dig
ital L
ifestyle
s
Design Technologies
Equipment, Materials & Manufacturing
Semiconductor Process & Integration
Newemphasis
FP7-CIP/ICT/ENIAC Budget Profiles: 70% increase in period 2011-13
M€ 2007 2008 2009 2010 2011 2012 2013 TOTAL
PF7 ICT 1.189 1.217 1.227 1.241 1.382 1.582 1.760 9.597
CIP 58 52 105 113 120 135 149 732
ENIAC JU (2/3nat’l + 1/3EC)
97 106 87 125 240 620 1275
What’s next for nanoelectronics R&D in Europe?
• What are the challenges ahead in a globalized world?• What are the priorities?• How to measure impact and success?
What’s necessary to better exploit results in Europe?
What’s necessary to innovate and invest in Europe?
What’s next for nanoelectronics R&D in Europe?
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