3.155J/6.152J Lecture 1: Introduction
Prof. Martin A. SchmidtMassachusetts Institute of Technology
9/3/2003
1
Outline
� Introductions � Staff � You
� Motivation � Course Organization
� Handout
� Lab Assignments � Safety
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Tiny Technologies
� A definition which captures two extremes: � Miniaturization
� Making things smaller, often using Integrated Circuit process technologies
� Atom-level Manipulation/Assembly/Growth � Often to achieve a unique material property
� e.g. Carbon Nanotubes
� We will focus on the former
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The Driver: Microelectronics
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Engineering Challenges of the 20th Century:INCREASING SCALE
Brooklyn Bridge Space V rocket
Hoover Dam Boeing 747-400
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Engineering Challenges of the 21st Century: DECREASING SCALE
� Portable, Distributed Systems � Manipulation of Small Things
� Drugs � Biological Cells � Biological Matter
� DNA � Proteins
� Atoms
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MIT Tiny Technologies
mmmm PPmm nmnm
Microengines
MicrochemicalPlants(Jensen)
Low Power DSP(Chandrakasan)
Transistors(delAlamo)
Connectors(Slocum)
Biosensors(Manalis)
Organization
� Pre-Req � Total overhaul since last year
� Spring ’03 was trial run
� Three lab modules � IC � MEMS � Microfluidics
� Lecture alignment with labs
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Laboratory
� Each session is 4 hours (9-1 or 1-5) � Tuesday, Thursday, Friday � Groups A,B,C,D,E,F
� Each lab is 3 sessions � 2 for processing, 1 for testing
� Three labs � IC : MOS Capacitor � MEMS : Silicon Nitride Microcantilever � Fluids : Micromixer
� Lab report for each lab
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Lectures
� 12 Topical Lectures � Vacuum, CVD, Oxidation, Diffusion/Implantation,
Lithography, Etching, Sputtering, Evaporation, Interconnect
� 3 Lab Overview Lectures � Given in first week of lab
� 3 Lab Report Lectures � Given in last week of lab
� 5 Advanced Topic Lectures � Advanced Si Devices, Crystal Growth, Reliability,
Nanobio, Nanolithography
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Grading
� Quiz #1 and #2 (15% each) � Each Covers 6 Topical Lectures � Quiz #2 includes 3 advanced topic lectures
� Take Home (15%) � Design Problem � Integrates Lectures
� Lab Reports (10% each + 5% writing) � IC Lab – Satisfies CIM Requirements
� Homework (10%) � Lab Participation (10%)
� Lab instructor evaluations
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Policy for Academic Conduct
� Homework� Collaboration OK, everyone must contribute � Contributors must be identified
� Take-Home and Quizzes � No collaboration
� Lab Reports � Each group shares the same data, but… � Data reduction, analysis, discussion MUST be
done individually
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Books, References
� Lecturer will handout notes � Copies of chapters when appropriate � Recommended book:
� Plummer
� Other references
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st Half Lecturer
W /
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Schedule – 1
9/3
9/8
9/9/
22 9/
9/10/1
(
10/20
Day Date Topic Lab Assignments Due
MAS Overview Safety/Lab assignment
MAS IC Lab - Overview IC-1: Gate oxide/poly 9/10 Vacuum System No Assignment
15 CVD IC-2: Photolith/Etch 17 Oxidation HW1 (Vac/CVD
Student Holiday IC-3: Test 24 MAS IC Lab: Testing HW2 (CVD/Oxidation
29 Diffusion No Lab RCOH Diffusion/Implantation IC Lab Report
10 MAS MEMS Lab: Overview MEMS-1: Backside 10/8 MAS Lithography HW3 Diffusion/Implant
10 13 Columbus Day-Holiday MEMS-2: KOH etch 10/15 MAS Lithography, Soft Lithography HW4 (Litho)
MAS MEMS Lab: Testing MEMS-3: Test 10/22 Staff Quiz#1 (up to Lithography Quiz#1
10/27 MAS Etching wet No Lab 10/29 MAS Etching dry MEMS Lab Report
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nd Half M / W
M W )
M ( ) W ( )
M W )
M W
M W ( e
M W RCOH
M W
M W
Schedule – 2
10/20
(
11/10
11/19
/
12/3
12/8 12/10
10 13 Columbus Day-Holiday MEMS-2: KOH etch 10/15 MAS Lithography, Soft Lithography HW4 (Litho)
MAS MEMS Lab: Testing MEMS-3: Test 10/22 Staff Quiz#1 (up to Lithography Quiz#1
10/27 MAS Etching wet No Lab 10/29 MAS Etching dry MEMS Lab Report
11/3 MAS Fluids Lab: Overview Fluids-1: Photolith 11/5 RCOH Sputtering HW5 etching
Veterans Day-Holiday No Lab 11/12 RCOH Evaporation Take Home
11/17 RCOH Interconnect Fluids-2: Molding MAS Advanced Si Devices HW6 Sputtering,Evap,Int
11/24 RCOH Crystal Growth No Lab 11 26 Reliability IC Lab Resubmit
12/1 MAS Fluids Lab: Testing Fluids-3: Test Staff Quiz#2: Soft Lith-Interconnect + 11/19,24,26 Lectures Quiz#2
Guest Special topic: Nanobio No Lab RCOH Special topic: Nanolithography Fluids Lab Report
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Safety
� Sleep� Better safe than sorry
� Be responsible � Ask questions � Respect but don’t fear
� No injuries in the history of the class
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