Xtw01t4v011311 i dataplex

© 2006 IBM Corporation

This presentation is intended for the education of IBM and Business Partner sales personnel. It should not be distributed to customers.IBM Systems & Technology Group Education & Sales Enablement © 2011 IBM

Corporation

IBM System x iDataPlex™:Internet Scale Computing

XTW01Topic 4

IBM Systems & Technology Group Education & Sales Enablement © 2011 IBM Corporation

Topic 4 - Course Overview

The objectives of this course of study are:

> List three emerging technologies for an iDataPlex solution

> List three business goals that iDataPlex addressed

> Identify elements of the iDataPlex rack design

> Match the server offering to its characteristics

2


Topic 4 - Course Agenda

> *Introducing IBM iDataPlex*

> Rack Unit

> iDataPlex Nodes Overview

> iDataPlex Management

3


An IBM Portfolio that Covers the Spectrum of Business Needs

BladeCenter

Enterprise eX5

iDataPlex

Enterprise Racks & Towers

Scale, Power, Density,

Optimization

Consolidation, Virtualization

Infrastructure Simplification,

Application Serving

Scale Out

Sca

le U

p

*This slide contains animations that will launch with slide.4


Introducing IBM System x iDataPlex

> High volume, low cost computing for HPC and Cloud

> Innovative, flexible design for Internet-scale computing

> Up to 5X compute density for efficient space utilization

> Front-accessible and intelligent components simplify deployment, serviceability and manageability for Internet-scale computing

> Reduce cooling costs dramatically; minimize or even eliminate data center air conditioning expense

5


Tough Challenges Require Real Innovation

Decrease Server Power Consumptionby 50%

EliminateData Center Air Conditioning

Increase Compute Density by 10x

“More than 70% of the world’s global 1000 organizations will have to modify their data center facilities significantly during the next five years.”

-- Gartner, September 2007

Appropriate density for a given power envelopeScale data center computing with no new

construction

Attack largest operational expense itemsCap carbon footprint for data centers

Rising energy costs & rising energy demandPower & thermal issues inhibit operations

6


Fast, Cool, Dense, Flexible. TCO without compromise!

Why iDataPlex?

iDataPlex is:> Optimized both mechanically as a half-depth server

solution and component-wise for maximum power and cooling efficiency

> Designed to maximize utilization of Data Center floor space, power and cooling infrastructure with Industry-standards based server platform.

> Easy-to-maintain solution with individually serviceable servers, front access hard drives/cabling,

> Configurable for customer-specific compute, storage, or I/O needs and delivered pre-configured for rapid deployment

> Common tools across the System x portfolio for management at the node, rack or Data Center level

7



> Introducing IBM iDataPlex

> *The Rack Unit*



8


Increases Density for Space Savings

Optional Rear Door Heat eXchanger

iDataPlexTypical Enterprise RackFull-fan air depth

Half-fan air depth

42U Enterprise Rack1

42U Enterprise Rack2

> Optimized rack design more than doubles server density per rack> Air flow efficiency equals power savings of up to 20% and 30-40% lower airflow impedance > IBM Rear Door Heat eXchanger provides the ultimate in cooling savings

Top-down view

9


iDataPlex Rack -vs.- Standard 19” Rack

Top View Top View

Standard 19” Rack iDataPlex Rack

600

mm

(8

40

mm

w/R

DH

x)

1200mm

446

x 40

0mm

446

x 40

0mm

RDHX

iDataPlex Rack design: Rack is rotated 90

– Half-depth, front-access servers. Low airflow impedance. Servers located side-by-side. Doubles server density in similar

footprint.– Greater cross-section for RDHX.

102U Rack– 84U for Nodes, etc.– 16U for switches, etc.(vertical) – 2U Rack Management Appliance

(horizontal) slots

Space-saving footprint– 1200mm wide x 600mm deep.

444

x 75

0mm

640mm

105

0mm

10


iDataPlex – Designed for Data Center Flexibility

PDUs

(rear)

3U Chassis

2U Chassis

iDataPlex Rear Door Heat ExchangerServer Tray

Storage Drives & Network Options

Dual IOTray

Storage Tray

Broad portfolio of customizable components that adjust to your computing needs

Switches

(front)



Rear Door Heat eXchanger

Swings to provide access to rear PDUs Lock handle to

close/ open door

Industry Standard hose fittings

No Leaks Sealed Internal coils

Perforated Door for clear airflow

IBM patent pending hex airflow design

Liquid cooling at the rack is 75%-95% more efficient than air cooling by a CRAC

Can eliminate rack heat exhaust

No electrical or moving parts

No condensation

Chilled water or evaporative liquid

12


A New Way to Cool the Data Center

Provides Up to 100% Heat Extraction, and can even cool the room!

IR Thermal Camera View of RDHx with: top photo: water flow off

bottom photo: water flow on

iDataPlex rack can run at room

temperature (no air conditioning

required) when used with the

optional Rear Door Heat

eXchanger.

These photos were taken in the

Thermal Lab at IBM, showing the

iDataPlex rack without (top

image) and with (bottom image)

the Rear Door Heat eXchanger

closed and operational.

13


Easily Serviceable Integrated x86 Packaged Design

> All-front access eliminates accessing rear of rack

> Swappable server trays in chassis

> Chassis docks directly into power

> Chassis guides keep upper servers in place

> Rack-side pockets for cables provide highly efficient cable routing

Shared dual domain power supply with hot dock ports so planars dock into power connector

Tool-less server and chassis

changes done easily with

innovative server latch locks

High Efficiency shared 80mm fans provide superior cooling at a low wattage draw and low noise levels

Flex Node Technology

Innovative design so planar trays are independent & swappable for multiple configurations

Asset Tags - Confirm Asset I/Ds

Chassis Guides & Rail kits - Individual

Chassis Rails for reliable fit & safe

servicing2U Flex Chassis

Designed for Data Center Serviceability

14


iDataPlex Rack Design

23.6”

47.2””

AIR FLOW

AIR FLOW

19” 19”

Top View

Energy efficiency> Optimizes airflow for cooling efficiency with half-depth rack > Reduces pressure drop to improve chilled air efficiency

Leadership density> Dual column / Half-depth rack > Standard two-floor tile rack footprint> Up to 168 physical nodes in 8 square feet

Flexibility> Matches US & European data center floor tile standards> Compatible with standard forced air environments

Ease of use> All service and cabling from the front

15




> Rack Unit

> *iDataPlex Nodes Overview*


16


Current iDataPlex Server Offerings

Processor: Quad Core Intel Xeon 5500Quick Path Interconnect up to 6.4 GT/sMemory:16 DIMM DDR3 - 128 GB maxMemory Speed: up to 1333 MHzPCIe: x16 electrical/ x16 mechanicalChipset: Tylersburg-36D

iDataPlex dx360 M2High-performance Dual-Socket

Storage: 12 3.5” HDD up to 24 TB per node / 672TB per rackProc: 6 or 4 Core Intel Xeon 5600Memory: 16 DIMM / 128 GB maxChipset: Westmere

iDataPlex 3U Storage RichFile Intense Dual-Socket

Processor: 6 & 4 Core Intel Xeon 5600Quick Path Interconnect up to 6.4 GT/sMemory:16 DIMM DDR3 - 128 GB maxMemory Speed: up to 1333 MHzPCIe: x16 electrical/ x16 mechanicalChipset: Westmere 12 MB cache

iDataPlex dx360 M3High-performance Dual-Socket

Processor: 6 & 4 Core Intel Xeon 56002 NVIDIA M1060, M2050,

M2070, M2070QQuick Path Interconnect up to 6.4 GT/sMemory:16 DIMM DDR3 - 192 GB maxMemory Speed: up to 1333 MHzPCIe: x16 electrical/ x16 mechanicalChipset: Westmere 12 MB cache

iDataPlex dx360 M3 RefreshExa-scale Hybrid CPU + GPU

17


Key Features Benefits

42 GPU servers in a standard rack footprint

• 10X Increased compute performance saving 65% less acquisition costs for 4X the density

• 3.7X increase in Flops/Watt offers an power and cooling efficiency of 72% lower power consumption

Support for up to two NVIDIA GPUs

• Expanded I/O capabilities fits 49 Teraflops of performance in a rack with 61% more density than outboard solutions

• Flexibility to configure I/O intense configurations with networking and storage along with compute CPU intense service without compromising density

Storage Performance Options

• Higher capacity/higher performance SAS controller

Memory capacity up to 192 GB per server

• Expanded memory options with 16GB DDR-3 1333MHz memory

Fast, Cool, Dense, Flexible. TCO without compromise!Accelerate performance without compromising density through maximum flexibility.

Target Workloads:Workloads: Risk Analytics, Seismic/Petro Exploration, Medical Imaging, Digital Content Creation, Online GamingIndustries: FSS (Financial, Insurance), Public (Life Science, Education, Government) Industrial (Petro, Auto, Comm (M&E, DCC)Customers: looking for value hardware to perform massive parallel computing in data center with space, power & cooling constraints

How to Beat HP/Dell:

1. Better flexibility and density in power and cooling constrained data centers

2. Energy Efficiency – maximizes power & cooling efficiency for GPU servers

3. Ultimate space and OPEX savings with the Rear Door Heat Exchanger

How to Beat HP/Dell:

1. Better flexibility and density in power and cooling constrained data centers

2. Energy Efficiency – maximizes power & cooling efficiency for GPU servers

3. Ultimate space and OPEX savings with the Rear Door Heat Exchanger

iDataPlex dx360 M3

18


4- 2.5” SS SAS 6Gbps(or SATA, or 3.5”, or SSD…)

InfiniBand DDR(or QDR, or 10GbE…)

NVIDIA Tesla M2050 #1(or NVIDIA Tesla M1060,or FX3800, or Fusion IO, or)

NVIDIA Tesla M2050 #2(or NVIDIA Quadro FX3800, or Fusion IO, or…)

Server level value

>Each server is individually serviceable

>Each GPU is individually replaceable

>6Gbps SAS drives and controller for maximum performance

>Service and support for server and GPU from IBM

dx360 M3 Server GPU I/O Tray - Front View

19


Why GPU’s

> Applications run faster because it is using the high-performance of parallel cores on the GPU

> Many codes and algorithms in HPC and other applications are parallel floating point math problems

> GPU’s do general purpose scientific and engineering computing

> GPGPU = General Purpose Graphics Processing Unit

Visualization – Method of representing large amounts of complex

data in ways that are easier to understand, analyze and support decision making.

Acceleration– Augment or supplement the server CPU’s to

achieve greater overall performance and/or efficiency by leveraging massive parallelism and the superior floating point capability and on card memory

x86 Intel CPU + GPU work together in heterogeneous computing model

–The sequential part of the application runs on the CPU

–The computationally-intensive part runs on the GPU

20


Do More with Maximum Performance Density

49 Teraflops of Sustained performance

4X increased performance per rack

10X increased performance per node

65% Less acquisition costs

3.7X increase in Flops/Watt

dx360 M3

Xeon X56702.93GHz / 6C / 95W

1008Cores

672Cores

Xeon X5570

2.93GHz / 4C / 95W

dx360 M238,136

Cores

Xeon X56702.93GHz / 6C / 95W

Fermi M2050448C / 225W

dx360 M3 Refresh

21


16x PCI-E Riser card slot

Virtual Media Key

Mini PCI-E SAS Card Slot

JP1Clear CMOS

Hard drive carrier

16 max.(8x per) DDR3 DIMMs(2GB, 4GB, & 8GB) 1.5V and 1.35V

DIMM Bank 1

DIMM Bank 2

CPU 1-Supports DIMM Bank 0(Intel Westmere EP / Nehalem EP)

CPU 0-Supports DIMM Bank 1(Intel Westmere EP)

SATA ports 6x

JP2 Boot Block Enable

Battery

8X RAID Rise Card slot

Ethernet Ports & Management

dx360 M3 1U Flex Node (MT 6391) Interior View

22


System x iDataPlex dx360 M3Tailored for Your Business Needs

iDataPlex flexibility with better performance, efficiency and more options!

1U Drive Tray

1U Compute Node

3U Storage ChassisMaximize Storage Density

3U, 1 Node Slot & Triple Drive TrayHDD: 12 (3.5” Drives) up to 24TB

I/O: PCIe for networking + PCIe for RAID

Compute + StorageBalanced Storage and Processing

2U, 1 Node Slot & Drive TrayHDD: up to 5 (3.5”)

Compute IntensiveMaximum Processing2U, 2 Compute Nodes

750W N+N Redundant

Power Supply

900W Power Supply

1U GPU I/O Tray

550W Power Supply

Acceleration Compute + I/OMaximum Component Flexibility

2U, 1 Node SlotI/O: up to 2 PCIe, HDD up to 8 (2.5”)

23


dx360 M3 Front View

Two Ethernet ports

Power-connector button

Power-on LED

Hard disk drive activity LED

Locator LED

System-error LED

Serial Video USB ports

System-management Ethernet

24


Intel® 5520 Chipset

PCI Express* 2.0

ICH 9/10 Intel® 82599 10GbE Controller

Intel® Data Center Manager

Intel® Node Manager Technology

New Processor,Proven Platform

Intel® Xeon® 5600Intel® Xeon® 5600

Intel® Xeon® 5600Intel® Xeon® 5600

> Intel® Xeon® 5600 Processor Series

32nm Technology with 2nd Generation High-k Process

> Intel 5520 (Tylersburg) Chipset

IOH (Northbridge) + ICH10 (Southbridge)

Up to 6.4 GT/sec speeds

Dual x16 Gen2 or Quad x8 PCI Express 2.0graphics card support

> Integrated DDR3 three-channel memory controller

2nd CPU required to use all 16 DIMMs

> Two Intel QuickPath interconnect (Intel QPI) links per components

High Speed Serial link between CPUs/chipset

Up to 25.6 GB/sec bandwidth per link

> Single die four or six core

> Three cache levels:

32 KB data / 32 KB instruction L1 cache per core

256 KB L2 memory cache per core

Shared 8MB L3 cache (12MB max.)

dx360 M3 Processor Subsystem

QPI

Up to 25.6 GB/secbandwidth per link

Up to 16 slotsDDR3 Memory

25


dx360 M3 Refresh - Westmere-EP SKU

Server / Workstation2S

X56702.93 GHz 6C

X56602.80 GHz 6C

X56502.66 GHz 6C

E56402.66 GHz 4C

E56302.53 GHz 4C

E56202.40 GHz 4C

L56402.26 GHz 6C

L5630 2.13 GHz 4C

95W95W

95W95W

95W95W

80W80W

80W80W

80W80W

60W60W

40W40W

Sta

nd

ard

Ad

van

ced

Bas

ic

E5507

2.26 GHz 4C

E55062.13 GHz 4C

E55032.00 GHz 2C

80W80W

80W80W

80W80W

•5.86 GT/s QPI

•12MB L3 Cache

•Turbo/HT enabled

•DDR3-1066

•Turbo 4C: NA/NA/1/1/2/2

•Nehalem-EP remains for Value SKUs.

• 4.8 GT/s QPI

•4MB L3 Cache on 4C

•DDR3-800

Freq Optimized

X56673.06 GHz 4C 95W95W

X56773.46 GHz 4C

X56803.33 GHz 6C

130W130W 130W130W

LV• up to 5.86 GT/s QPI and 12MB cache

•60W Turbo 2/2/3/3/4/4

•40W Turbo NA/NA/1/1/2/2

•Turbo/HT disabled on 1.6 GHz

•6.4 GT/s QPI

•12MB L3 Cache

•Turbo/HT enabled

•DDR3 -1333

•130W Turbo

6C: 1/1/2/2/3/3 4C: NA/NA/1/1/2/2

•95W Turbo

6C: 2/2/3/3/4/4

4C: NA/NA/2/2/3/3

L5609 1.86 GHz 4C <=40W<=40W

Support for 130 W not cost efficient for iDataPlex dx360 M3

26


Intel®

Xeon® 5600Intel®

Xeon® 5600Intel®

Xeon® 5600Intel®

Xeon® 5600

95W

80W

60W

40W

Better performance/WattLower power consumption

Lower Power CPUs

Up to 10% reduction in memory power†

Intelligent PowerTechnology

Integrated Power Gates and Automated Low Power States with Six Cores

Lower PowerDDR3 Memory

Nehalem Micro-architecture + 32nm CPU + Enhanced Power Mgt= Greater Energy EfficiencyNehalem Micro-architecture + 32nm CPU + Enhanced Power Mgt= Greater Energy Efficiency

CPU Power Management

Optimized power consumption through more efficient Turbo Boost and memory power management

Building on Xeon® 5500 Leadership Capabilities

CTO

Westmere-EP Energy Efficiency

27


dx360 M3 Planar Building Block Diagram

Tylersburg36D

SAS LSI 1064 Opt.

RAID Mini-SlotPCI-E x4 Gen1

CSI

16 x DDR3 800/1066/1333MHz

VRD11.1VRD11.1

CSI

LGA 1366

6.4 GT/sCSI

VRD11.1VRD11.1

Intel Xeon5600

LGA 1366

6.4 GT/s

6.4 GT/sDDR3

DDR3

DDR3

8 DIMMs

DDR3

DDR3

DDR3

8 DIMMs

LPC

PCI-E x16 slotPCI-E x16 Gen2

PCI-E x1

ICH10

6 SATA 3 USB

CL

INK

ES

I

Video

Maxim

VSC452

COM

RJ45RJ45

10/1003000MB/s 480Mb/s

2GB/s

8GB/s

IMM

PCI-E x8 Gen2

RAID PCI-E x8 slot

4GB/s

PCI-E x4IntelZoar

IntelZoarRJ45RJ45

GbERJ45RJ45 GbE

Intel NIC

Intel Xeon5600

28


dx360 M3 Processor Installation

Intel Xeon Processor

Align Tabs/notches

> Intel Xeon Processors

Same clock rate, cache size/type, and identical in the core frequencies

> LGA 1366 socket (Socket B)

Pads of bare gold-plated copper

− (No pins on CPU)

Load plate with locking lever

Align notches to ensure proper installation

Attention: Follow the instructions carefully to install the CPU. Do not use any tools or sharp objects to lift the locking lever on the CPU socket. Do not press CPU into the socket. Make sure that the CPU is oriented and aligned correctly in the socket before closing the CPU retainer.

Attention: Follow the instructions carefully to install the CPU. Do not use any tools or sharp objects to lift the locking lever on the CPU socket. Do not press CPU into the socket. Make sure that the CPU is oriented and aligned correctly in the socket before closing the CPU retainer.

29


dx360 M3 Heatsink Requirements

Dust Cover Heat Sink Filler

Heat Sink

P/N # Heatsink ASM for CPU #1 and #2

46M5518 dx360 M3 Processor Heat sink

Plus

Attention: Do not set the heat sink once removed from the plastic cover. Do not touch thermal material on the bottom of the heat or CPU. Touching thermal material will contaminate it.

Attention: Do not set the heat sink once removed from the plastic cover. Do not touch thermal material on the bottom of the heat or CPU. Touching thermal material will contaminate it.

30


dx360 M3 Memory Subsystem

> Supports registered DDR3 LP ECC memory

Active Memory features, including advanced Chipkill memory protection

– 16x better error correction thank standard ECC memory

Choice of standard 1.5v or 1.35v consumes 10% less energy

Sixteen DIMM slots

DIMM sizes:

– 2 GB, 4 GB, 8 GB or 16 GBRDIMM sizes:

Maximum capacity

– 256 GB (max. x16GB DIMMs)

31


DIMM 1

DIMM 2

DIMM 4

DIMM 5

DIMM 7

DIMM 8

Example of Memory Bank 1 and CPU 1

Ch 2DIMMs

Ch 1DIMMs

Ch 0DIMMs

DIMM 9

DIMM 6

DIMM 3

dx360 M3 Memory Installation

CPU must be populated for access

to it’s DIMMS

Intel® Xeon® processor

32


> Standard with onboard ICH10 SATA II controller

Support 5 drives (depending on the configuration) internal simple-swap (SS) SATA II drives, or 4 SS SSDs. Hot-swap SAS or SATA HDDs, or simple-swap SAS HDDs, require an optional adapter

> ServeRAID-BR10il v2 controller

Support (no cache) for up 3Gbps7 (x4 PCIe)

> RAID-0/1/1E to 4 HDDs or SSDs.

> ServeRAID-M1015 SAS/SATA controller

6Gbps (x8 PCIe) RAID-0/1/10 (no cache) for up to 16 drives (limited by available bays)

> ServeRAID M1000 Series Advance Feature Key adds RAID-5 with SED support

> ServeRAID-M5014 SAS/SATA controller offers

6Gbps (x8 PCIe)

> Enhanced performance with 256MB of cache memory RAID-0/1/10/5/50 for up to 16 drives (limited by available bays).

> ServeRAID-M5015 SAS/SATA controller

6Gbps (x8 PCIe)

> enhanced performance with 512MB of cache memory and battery backup, and supports RAID-0/1/10/5/50 for up to 16 drives (limited by available bays).

> ServeRAID M5000 Series Advance Feature Key adds RAID-6/60 with SED support to the M5014 and M5015

> ServeRAID M5000 Series Battery Key adds battery backup support to the M5014.

Support either SAS or SATA, hot-swap or simple-swap, 3.5-inch or 2.5-inch drives. Drives cannot be intermixed.

dx360 M3 Disk Controller

Simple-swap drive

Hot-swap drive

33


dx360 M3 Hard Drive Flexible Configurations2U Chassis with 2 1U Server trays

2 3.5-inch SS SATA HDDs (1 per server)—using the onboard controller

2 3.5-inch SS SAS HDDs (1 per server)—requires ServeRAID-BR10il v2

4 2.5-inch SS SAS HDDs (2 per server)—requires ServeRAID-BR10il v2 or M1015

4 2.5-inch SS SATA HDDs (2 per server)—using the onboard controller, ServeRAID-BR10il v2

4 2.5-inch SS SATA SSDs (2 per server)—using the onboard controller, ServeRAID-BR10il v2, or IBM 6GB SSD HBA Card

2U Chassis with 1 Server and one 1U Storage tray

5 3.5-inch SS SATA HDDs (1 per server, 4 per tray)—5 using the onboard controller

4 3.5-inch SS SAS HDDs (0 per server, 4 per tray)—requires ServeRAID-BR10il v2, M1015 or M5015

4 3.5-inch SS SATA HDDs (4 per tray)—requires ServeRAID-BR10il v2, M1015 or M5015

8 2.5-inch SS SAS HDDs (0 per server, 8 per tray)—requires ServeRAID-M1015 or M5015

8 2.5-inch SS SATA HDDs (0 per server, 8 per tray)—requires ServeRAID-M1015 or M5015

8 2.5-inch SS SATA SSDs (0 per server, 8 per tray)—requires ServeRAID-M1015, M5015, or IBM 6GB SSD HBA Card

2U Chassis with 1 Server and one 1U I/O tray

2 3.5-inch SS SATA HDDs (1 per server, 1 per tray)—using the onboard controller or ServeRAID-BR10il v2

2 3.5-inch SS SAS HDDs (1 per server, 1 per tray)—requires ServeRAID-BR10il v2, or M1015

4 2.5-inch SS SAS/SATA HDDs (2 per server, 2 per tray)—requires ServeRAID-M1015

4 2.5-inch SS SSDs (2 per server, 2 per tray)—requires ServeRAID-M1015 or IBM 6GB SSD HBA Card

3U Chassis with 1 Server and one 2U Storage tray

12 3.5-inch HS SATA HDDs (0 per server, 12 per tray)—requires ServeRAID-M1015, or M5015

12 3.5-inch HS SAS HDDs (0 per server, 12 per tray)—requires ServeRAID-M1015, or M501534


NVIDIA Graphic Adapters Options

iDataPlex Server Platform

NVIDIA Tesla M1060 1 GT200 GPU4 GB Memory190 Watt Double Wide / Dual SlotPassive CoolingFRU PN 43V5909

NVIDIA Quadro FX3800 1 GB Memory107 WattSingle Wide / Single Slot FRU PN 43V5925

NVIDIA Tesla M20501 Fermi GPU3 GB Memory225 Watt Double Wide / Dual SlotPassive CoolingFRU PN 43V5894

NVIDIA Tesla M2070/M2070Q1 Fermi GPU6 GB Memory225 Watt Double Wide / Dual SlotPassive CoolingCuda, OpenCL, OpenGLFRU PN 43V5935 M2070 43V5943 M2070Q

35


Tesla T10: The Processor Inside

Double Precision

Special Function Unit (SFU)

TP Array Shared Memory

> 8 TP per TPA (240 Total)

> Full scalar processor with integer and floating point units

> 16K of RAM for Shared Memory

Thread Processor (TP)

FP Integer

Multi-banked Register File

SpcOpsALUs

Thread Processor Array (TPA)

30 TPAs = 240 Processors

Double Precision



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36


NVIDIA Tesla M2050 and M2070/M2070Q

Tesla M2050 and Tesla M2070/M2070Q Computing Processor Module

9.75 inches

4.37 inches

vented bracket

37


2 PCIe x16(1 per side)

PCIE x8

GPU 1GPU 1GPU 2GPU 2

HBA

dx360 M3 – New 3-slot Riser and I/O Tray

38


New Innovations

> 448 CUDA Cores

> NVIDIA Parallel DataCache

> NVIDIA GigaThread

> ECC Support

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L2L2

The Soul of a Supercomputer in the body of a GPU

Tesla T20 Series Architecture Structure (1 of 5)

39


448 CUDA Cores

> Optimized performance and accuracy with up to 8X faster double precision

> Compliant with industry standards for floating point arithmetic

> Versatile accelerators for a wide variety of applications

> Valued by HPC clients running linear algebra and numerical simulation applications

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NVIDIA Parallel DataCache

> First GPU architecture to support a true cache hierarchy in combination with one-chip shared memory

> Improves bandwidth and reduces latency through L1 cache’s configurable shared memory

> Fast, coherent data sharing across the GPU through unified L2 cache

> Clients running physics solvers, raid tracing or sparse matrix multiplication algorithms benefit greatly from this cache hierarchy

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NVIDIA GigaThread

> Increased efficiency with concurrent kernel execution

> Dedicated, bi-directional data transfer engines

> Intelligently manage tens of thousands of threads

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ECC Support

> First GPU architecture to support ECC (error checking and correction)

> Detects and corrects errors before system is affected

> Protects register files, shared memories, L1 and L2 cache and DRAM

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Tesla M2070 and Tesla M2070Q Board Configuration

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Emulex PCI-e HBA

Brocade PCIe HBAs

dx360 M3 I/O Support

High IOPS SS Class SSD PCIe HBA

QLogic PCIe HBA

QLogic CNA

Brocade CNA

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> High-performance PCIe Host Bus Adapter (HBAs)

10Gb Ethernet, Fibre Channel, InfiniBand and GPU cards

> Up to 3 PCIe adapter slots per chassis

Five differ riser cards available:

– 1U single-slot (front) PCIe slot

♦ Supports all configurations

– 2U two-slot (front PCIe slot

♦ Supports any two adapters with max. one GPU/GPGPU adapter

– 2U three-slot (front PCIe slot

♦ Supports 2 GPU/GPGPU adapters and any other PCIe card

Third PCIe slot backside of riser card

♦ 2U I/O Rich configurations using PCIE tray

– 1 single-slot (rear) PCIe slot

♦ All 2U configurations

– 2U single-slot (rear) PCIe slot

♦ 3U configurations only

NVIDIA Tesla M2050/M2070/M2070Q


> Flexibility to match power supply with workload 550W High Efficiency Non-redundant Power Support

− Maximum Efficiency for lower power requirements More efficiency by running higher on the power

curve 900W High Efficiency Power Supply available for non-

redundant higher power requirements

750W N+N Redundant Power Supply

− Optional at the chassis level to tailor rack-level applications that require redundant power in some or all nodes

− Power envelope fits most applications, oversubscription / throttling for extremes

Straightforward, cost-effective solution for both node and line-feed redundancy

Meets customer requirement for rack-level line feed redundancy

Meets requirement for node-level power protection for storage-rich, VM & Enterprise environments

> Maintains maximum floor space density with the iDataPlex rack

New power supplies in same form factor as existing for 2U & 3U chassis power supply

iDataPlex 2U/3U Power Supply Option900W HE

550W HE

750W N+N

AC 1

AC 2

PS 1 750W Max

PS 2 750W Max

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200-240V onlyRedundant supply block diagram

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Fan unit comprised of four 80 mm fans (partially removed) Redundant power

supply cable

iDataPlex Efficiency in Power and Cooling

Direct Dock Power connector

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> Rack Unit


> *iDataPlex Management *

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The Total Systems Management Experience

Integrated Management Module (IMM)

• Standards-based hardware which combines diagnostic and remote control

UEFI—next generation BIOS

• Richer management experience and future-ready

Hardware and firmware advances which are standard across all new systems

ToolsCenter

• Consolidated, integrated suite of management tools

• Powerful bootable media creator

Redesigned system tool portfolio for single-system management and scripting

IBM Systems Director

• Platform management that is easy and efficient

• Management of physical and virtual resources across heterogeneous systems

IBM Systems platform solution for System x, BladeCenter, Power Systems, System z and storage

IBM TivoliUpward integration into Tivoli Service Management

End-to-end stack to deliver future-proof systems management today

*This slide contains animations that will launch with slide. 49


50

iDataPlex/Intelligent Cluster Partner Ecosystem

Technology Collaboration PartnersSolution Collaboration Partners


An Affordable Fabric - Reliable Switches

Trusted Industry Switch Suppliers>1GbE, 10GbE and InfiniBand>Up to 384 Ethernet connections

Affordable Price-Performance >Highest throughput with lowest latency>Easy provisioning >Repurpose connections

Scalable & Interoperable>Interconnect with existing network>Manage server changes automatically>Interoperable with CISCO Management



"Despicable Me represents a breakthrough in the emerging model of collaborative, geographically distributed digital movie making. Thanks to the capacity of IBM's rendering technology and the skills of our artists, we were able to bring our creative vision to life through the completion of a wonderfully entertaining film.” Chris Meledandri, founder of Illumination Entertainment

IBM System x iDataPlexIBM System x iDataPlex

Supported a 330 person global team

Created 142 terabytes of data

6500 processor cores

Cut data center floor space in half

Reduced energy consumption by 40%

The Real Star of ‘Despicable Me’ – System x iDataPlex

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43 iDataPlex Systems43 iDataPlex Systems listed with Supercomputing Leadership in TOP 500TOP 500

November 2010Semiannual independent ranking of the top 500 supercomputers in the world. www.top500.org

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2009 - 2010 iDataPlex Awards

IBM’s Largest IBM’s Largest Green Data CenterGreen Data Center

“Top Server Product of 2009”

SearchDataCenter.com"IBM is building what the customers are telling them to build."

IBM TOP 5 Technologies for Corporate Environmental Innovation Program

16 of top 50 in Green 500

43 Places on TOP500 list

iDataPlex dx360 M3

2010 Readers' Choice:

“Best HPC Server Product or Technology”

Awarded at Super

Computing

2010

2010 Silicon Valley Leadership Group (SVLG) Chill Off 2 Competition

Results proved the IBM Rear Door Heat Exchanger had the “best energy efficiency.” Solution also considered “Lowest Facilities Energy Consumption” and “Most Economical.”

SVLG Chill Off competitors included: APC, LCP+, Knurr, Liebert, Sun and DirectTouch

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Topic 4 - Course Summary

Having completed this topic you should be able to:

> List three emerging technologies for an iDataPlex solution

> List three goals that iDataPlex addressed

> Identify elements of the iDataPlex rack design

> Match the server offering to its characteristics

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Glossary of Acronyms

Active Energy Manager

BIOS (Basic Input/Output System)

Compute

Compute Unified Device Architecture (CUDA)

Dynamic System Analysis (DSA)

Extreme Cluster Administration Toolkit (xCAT)

Flex Node Technology

Graphical Processing Unit (GPU)

InfiniBand

Integrated Management Module (IMM)

Nehalem EP (Efficient Performance)

Predictive Failure Analysis (PFA)

QPI (Quick Path Interconnect)

Reliability, Availability, and Serviceability (RAS)

Teraflops

Tesla M1060 and M2050

Thread Processing Array (TPA)

Thread Processing Cluster (TPC)

Thread Processing (TP)

UEFI (Unified Extensible Firmware Interface)

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Additional ResourcesIBM STG SMART Zone for more education:

> Internal: http://lt.be.ibm.com/smartzone/modulartechnical

> BP: http://www.ibm.com/services/weblectures/dlv/partnerworld

IBM System x iDataPlex home page

> http://www-03.ibm.com/systems/x/hardware/idataplex/

Rear Door Heat eXchanger Installation and Maintenance Guide

> http://www.ibm.com/support/docview.wss?uid=psg1MIGR-5075220

IBM System x iDataPlex dx360 User's Guide


IBM System x iDataPlex dx360 Problem Determination and Service Guide


IBM PDU+ Installation and Maintenance Guide


IBM ServerProven

> http://www.ibm.com/servers/eserver/serverproven/compat/us/nos/ematrix.shtml57


End of Presentation

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Xtw01t4v011311 i dataplex

Technology

Transcript of Xtw01t4v011311 i dataplex