shaping global nanofuture

XTPL S.A. – INVESTORS’ PRESENTATION 2017

Dr. Filip Granek, CEO

Maciej Adamczyk, COO

Date: 31 – 03 -2018

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OVERVIEW

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WHO ARE WE?

XTPL S.A. is a company operating in the nanotechnology segment.

The interdisciplinary team of XTPL develops on a global scale an innovative

technology, protected by international patent application, enabling ultra-

precise printing of nanomaterials. XTPL’s solution has all the features

of so-called disruptive technology and will be consistently developed

as part of advanced research & development works aimed at defining

further innovative application fields. The company is focusing now on the

fast paced commercialisation of its unique solution.

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WHAT IS OUR GOAL?

Mission:

XTPL is the leader in providing nanoprinting capabilities. We are shaping global nanofuture.

Vision:

We will support companies to outperform on their markets by using XTPL’s unique expertise & solutions in nanoprinting.

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WHAT IS OUR STRENGTH?

TECHNOLOGY

interdisciplinary, well-balanced team, with vast knowledge & experience in:

• chemistry• physics• electronics• mechanics• material science• numerical simulations

10 PhDs in the team

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business leaders & highly skilled professionals who possess know-how & experience in:

• product development• marketing & communication• implementing innovation• finance• B2B sales• capital market

... with proven successes, acquired on international markets

BUSINESS

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WHAT IS OUR SOLUTION?

Nanoprinting system designed by XTPL makes it possible to precisely apply

to the printing surface a special ink specifically formulated for this purpose

in the company’s laboratories. Under the influence of an external electric

field, the nanoparticles in the ink create conductive lines according to the

specified parameters. As such, the thickness of the individual lines, their

length and the distance between them all vary depending on a specific

application. XTPL creates complex numerical models and uses advanced

characteristics of nanoink and printed lines. This allows the company to

constantly optimize its innovative technology and adapt the process to

different implementation requirements.

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TECHNOLOGY OVERVIEW

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NANOPRINTING

XTPL Ag Line

human hair

ultra-precise printing enables achieving conductive lines up to several hundred times thinner than a human hair, invisible even for the light

nanoprinting may soon revolutionise sectors such as: printed electronics, solar cells, touch screens, wearable electronics, smart packaging, automotive, biosensors, medical devices, anti-counterfeiting & open defect repair

nanometric conductive line

XTPL’s PRINTING PROCESS

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During the process of line formation, the printing head deposits a properly formulated ink - nanoparticles in a mixture of solvents - on a non-conductive substrate, in example such as glass or flexible foil.

An external alternating electric field causes nanoparticles to assemble in a clearly defined and controlled way to form a line. The process takes place between a stationary and movable electrode.

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XTPL’s PRINTING PROCESS

Functionality of the lines: electrically conductive, optically, biologically

and chemically active

Nanomaterials: metallic & semiconductor

Line width: from 100 nm to 3 μm

Line length: up to cm range

Aspect ratio: 1, in the single run of the printing head

Very low voltage applied: 5-30 V

Substrates: i.e. glass, foil, PCB

Resistivity: 2 Ω /μm (for the line with the thickness of 1 μm),

proof of concept manufactured featuring 20-40% bulk Ag

(thickness 100-400 nm)

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Movable electrode: guides the formation of the line, which becomes an extension of the stationary electrode. Finally, the printing head short-circuits with a metallic pad, and the line connects to the pad while the printing head takes in an excess ink.

XTPL’s PRINTING PROCESS COMPARED TO OTHER METHODS

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XTPL METHOD

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PROTECTED INTELLECTUAL PROPERTY

XTPL's printing method and the ink

formula are covered by the patent

application submitted in collaboration with

the British law firm, Gill Jennings & Every

LLP. The patent protection will be

extended to around 30 countries.

Gill Jennings & Every LLP, London UK

Printing headUnique nano-ink

Patent cloud

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APPLICATION SEGMENTS

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APPLICATION SEGMENTS

OPEN DEFECT REPAIR - removing broken metallic links for:

TRANSPARENT CONDUCTIVE FILMS (TCF) for:

• displays• thin film photovoltaic cells• touchscreens or smartphones

BIOSENSORS

LAB-ON-A-CHIP SOLUTIONS

SMART PACKAGING SOLUTIONS

WEARABLES

ANTI-COUNTERFEITING SOLUTIONS

PRINTED ELECTRONICS

• solar cells• displays TFT/LCD/OLED• integrated circuits (IC)• printed circuit boards (PCB)• multichip modules (MCM)• photolithographic masks

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APPLICATION SEGMENTS

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OPEN DEFECT REPAIR

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Micro- and nano-conductive structures are indispensable in the broadly understood electronics

(i.e. integrated circuits, LCD/ OLED displays, PCBs, solar cells and many others) The conducting

structures depending on the application are manufactured with the following technologies:

a) thin film (paths width 7nm-50 μm, photolithography, vapor deposition, sputtering, etching)

b) thick film (paths width 50-100 μm, screen printing, inkjet printing, stencil printing , etching)

The most common production defects in producing such micro- and nano-structures are:

• breaking of conductive paths due to local lack of conductive material (opens 'defects)

• narrowing of conductive paths (near opens' defects) occurring when the width or height of the

conductive path is less than required. Narrowing of conductive paths can degrade to complete

breaking of paths due to further production processes or stress related to exploitation.

The problem is significant because previously mentioned conductive lines are applied to semi-

finished products whose production price is a significant part of the cost of the final product.

The continuous trend towards miniaturization of electronic devices is exceeding the problem.

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OPEN DEFECT REPAIR – POTENTIAL SECTORS

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SOLAR CELLS

defects of the conductive lines are the most common production error leading to the rejection of the finished solar cell (58% of

rejected solar cells)

TFT / LCD DISPLAYS

sector characterized by a very large number of defects; the share of rejects in production can

reach up to 50%; the increase in resolution with simultaneous enlargement of the display

dimensions increases the number of conductive lines and the risk of defects

high material costs in production ranging from 50% to 70% of total manufacturing costs =

pressure to obtain high yields and an effective method of repair

PCBs

current trend in the development of PCBs results in the need for the paths to be more narrow d <20 μm & insulation panels from

materials with a low melting point like polytetrafluoroethylene (PTFE), polyamide,

benzocyclobutane (BCB) and glass-epoxy (i.e.FR-4), which presents new challenges before

defects repair methods

MCM MULTICHIP MODULES

a typical package for multichip modules has over 1000 input/output signals. Unfortunately, the thin-

film technology of MCM modules is prone paths being broken.

INTEGRATED CIRCUIT

Along with the miniaturization of integrated circuit structures, the editing and repair of metal

paths has become more and more complex. Currently, the only developed method of editing

contacts with a width of less than 1 μm is focused ion beam (FIB) - not suitable for editing

metal paths above 100 μm, characterized by high electrical resistance of the tracks & causes the destruction of active electronic systems in integrated systems (ESD-electrostaic discharge defects) and other adverse effects hindering or

preventing correct repair and analysis of the integrated system

PHOTOLITHOGRAPHIC MASKS

they are a key element in the production of microelectronics, with progressing miniaturization and increase in the complexity of structures, the price of

a set of photolithographic masks increases;the cost of repairing defects, analysis & ensuring the quality of the mask represents 40% of the total cost

of the mask, exceeding the cost of manufacturingDefects of the local lack of the metallic layer

(transparent defects) are frequent and difficult to repair production errors.

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OPEN DEFECT REPAIR - CURRENT STANDARD

Current technology

extremely complex (LCVD, FIB)

uses toxic and hazardous gases (LCVD)

long processing time (LCVD, FIB, DLD)

No alternative…?

yes !there is

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LCVD (Laser Chemical Vapour Deposition), DLD (Direct Laser Deposition), FIB (Focused Ion Beam)

limited possibility to obtain 10 µm and less (LCVD, DLD);

destruction of the active systems in integrated circuits (FIB)

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OPEN DEFECT REPAIR – XTPL SOLUTION

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XTPL developed innovative printing-head and dedicated nanoinks

for repairing defects in electrical connections in micrometric & nanometric

scale (<1 μm), which together with the optical detection systems already

used on the market will provide a comprehensive technological solution

to be implemented on production lines, among others, for the production

of solar cells, LCD/OLED displays, PCBs, MCM multichip modules &

integrated circuits. XTPL’s solution allows to repair the interrupted thin

conductive lines already in production stage, without complicated, slow

and expensive vacuum processes.

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OPEN DEFECT REPAIR – REMOVING LOCAL DEFECTS IN METALIC LINKS

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There is a demand for a new technology for repairing damaged conductive structures

XTPL’s technology will address those requirements byeliminating all the disadvantages of current methods

OPEN DEFECT REPAIR - COMPARISON OF METHODS

ParameterFIB LCVD XTPL*

(initial lab results)

Impact on

Minimal feature size [um] < 0.05 > 5 0.2 – 1 flexibility of process

Deposition rate [um3/s] 0.05 10 50 throughput

Maximal line length <100 um mm range cm range flexibility of process

Vacuum chamber required yes yes no process cost and throughput

Toxic/ dangerous gases/media required no yes no process cost and throughput

Surface damage yes yes no flexibility of process

Price$$$

high

$$

medium

$

lowprocess cost

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OPEN DEFECT REPAIR - XTPL’S VALUE PROPOSITION

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XTPL’S TECHNOLOGY

will address those

requirements

by eliminating all the

disadvantages of current

methods

There is a demand for

a new technology

for repairing damaged

conductive structures

cost-effective repair of the severed

lines

reduced width of the printed conductive lines with concurrent reduction of the distances between them

increased total length of the conductive lines

reduction of mechanical, thermal & electromagnetic stress during production & repair process

allows for low cost repair

does not require any toxic substances

is aimed to ensure high efficiency for industrial use

REQUIREMENTS

ADVANTAGES

TRANSPARENT CONDUCTIVE FILMS (TCF)

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Transparent Conductive Films - the value of this market was estimated at approx. USD 5

billion in 2016. (based on IDTechEx report from 2016 and data from www.statista.com). The

operation of displays, solar cells, touch screens and smartphones requires application of

conductive layers (TCF) with the greatest possible neutrality to light (absorbed or emitted by

the device) and at the same time with the highest possible conduction parameters. Currently,

the most commonly used TCF layers are based on indium-tin oxide (ITO). Indium is a rare

element whose supply on a global scale is mostly controlled by China (about 50% -60% of

global production) and Korea (15% market share). Layers based on ITO are not flexible (a

significant limitation for electronics manufacturers), they do not conduct enough electricity

and have limited optical transparency. Due to the limitations of ITO, technology companies

around the world are looking for new generation TCF layers technology as an alternative to

ITO. Such technology has been developed and implemented by XTPL.

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TRANSPARENT CONDUCTIVE FILMS – CURENT STANDARD

Current technology

multistep, complicated process

low optical transparency & low conductance

expensive – based on rare element - idium

No alternative…?

yes !there is

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lack of flexibility

TRANSPARENT CONDUCTIVE FILMS - XTPL’S VALUE PROPOSITION

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XTPL has developed

such technology and is

currently implementing

it – the solution

ensures:

Operation of displays,

solar cells, touchscreens

or smartphones include

among others

application of

transparent conductive

films (TCFs)

highest possible

neutrality to light

(absorbed or emitted

by the device)

highest conductance

parameters

full transparency

excellent conductance parameters

low production costs due to the use of commonly available materials i.e. silver) that can provide the sought-after technological independence from indium

REQUIREMENTS

ADVANTAGES

flexibility of the conductive films, which will enable electronics manufacturers to develop and provide new generation of revolutionary solutions to customers

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PRINTED ELECTRONICS

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It is expected that printed electronics will favor the spread of cheaper, energy-efficient electronics for

applications such as flexible displays, monitors, touch screens, smart labels, decorative signs and

animated posters or active clothing. The field of applications is extremely wide.

According to available studies, the value of this market in 2017 is estimated at approx. USD 9.3 billion,

while in 2027, the forecasted value of this sector is USD 73.4 billion, which gives CAGR in 2017-2027

at 10 %. The XTPL solution, due to its platform character, is to be offered to the entire printed

electronics industry.

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FINANCIAL RESULTS

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P&L

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The name of the position 2016 2017

A. Net revenues from sales and equivalent, including: 38,58 2 205,90

- from subsidiaries and affiliates 0,00 0,00

I. Net sales revenues (including subsidies) 0,00 1 774,34

II. Change in the balance of products (increase – positive value, decrease – negative value) 38,58 431,56

B. Operating expenses 2 321,73 6 044,14

I. Depreciation and amortisation 295,63 469,88

II. The consumption of materials and energy 71,14 312,18

III. Outsourcing 928,80 2 239,52

IV. Taxes and fees, including: 13,05 47,37

V. Salaries 827,32 2 291,50

VI. Social security and other benefits, including: 155,00 394,61

VII. Other expenses by type 30,79 289,08

VIII. Value of sold goods and materials 0,00 0,00

C. Profit (loss) on sales (A-B) -2 283,15 -3 838,24

D. Other operating income 1,20 0,01

E. Other operating expenses 0,13 0,94

F. Profit (loss) on operating activities (C + D-E) -2 282,08 -3 839,17

G. Financial income 0,00 35,73

H. Financial costs 6,89 47,18

I. Gross profit (loss) (F+G-H) -2 288,97 -3 850,62

J. Income tax 0,00 0,00

L. Net profit (loss) (I-J-K) -2 288,97 -3 850,62

CASH FLOW

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2016 2017

A. Cash flows from operating activities

I Net profit (loss) -2 288,97 -3 850,62

II. Total adjustments 403,22 179,62

1. Depreciation and amortisation 295,63 469,88

2. Profit (loss) due to exchange differences 0,00 0,00

3. Dividend and share in profits 0,00 36,17

4. Profit (loss) on operating activities 0,00 -35,73

5. Change in provisions 0,00 0,00

6. Change in inventory -94,93 87,98

7. Change in receivables -106,02 -143,66

8. Change in short-term liabilities excluding loans 352,61 304,41

9. Change in prepayments and accruals -5,49 -539,43

10. Other adjustments -38,58 0,00

III. Net cash flows from operating activities (I + II) -1 885,75 -3 671,00

B. Cash flows from investing activities

I Inflows 0,00 35,73

II. Outflows 231,99 617,24

1. Purchase of intangible assets and tangible fixed assets 231,99 617,24

III. Net cash flows from investing activities (I-II) -231,99 -581,51

C. Cash flows from financing activities

I Inflows 3 386,42 10 724,08

1. Net inflows from issuance of shares and other capital instruments and from capital contributions 2 894,96 9 389,33

2. Loans payable 350,22 1 265,95

4. Other inflows from financial activities 141,24 68,80

II. Outflows 0,00 1 682,26

4. Repayment of loans and advances 0,00 1 605,27

7. Payment of liabilities arising from financial leases 0,00 40,82

8. Interest 0,00 36,17

III. Net cash flows from financing activities (I-II) 3 386,42 9 041,82

D. Total net cash flows (A.III±B.III±C.III) 1 268,68 4 789,31

E. Balance sheet change in cash, including 1 268,68 4 789,31

F. Cash opening balance 152,26 1 420,94

G. Closing balance of cash (F±D), including 1 420,94 6 210,25

STOCK QUOTATIONS

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The company plans to become listed on the main market of the Warsaw Stock Exchange and to obtain the so-called ‘Single European Passport’. At the sametime, the Management Board of XTPL intends to pursue a secondary listing on the Open Market in Frankfurt (operated by Deutsche Börse). The dual listingwill bring XTPL closer to investors from Western Europe, an area that is one of the key directions for foreign expansion planned for 2018 in the process ofcommercialization of solutions offered by the company.

SHAREHOLDING STRUCTURE

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XTPL’s founders, Filip Granek and Sebastian Młodziński, as

well as the investor Konrad Pankiewicz (who finances the

company through the company Leonarto) control more

than 50% of votes at the General Meeting. The

shareholding structure also includes two German

investment funds, with over 5% of the share: Acatis

Investment GMBH and Heidelberger Beteiligungsholding

AG (a subsidiary of Deutsche Balaton AG).

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HIGHLIGHTS IN 2017

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Subscription of Series M Shares. Debut on NewConnect and International Investors in the Company

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In Q3 2017 the Company conducted a public offering of its series M shares,

raising 2.5 million EUR to finance the commercialisation of its newly

developed technology. On September 8, 2017, the Management Board of

the Warsaw Stock Exchange passed a resolution on the introduction of XTPL

S.A. shares to trading in the Alternative Trading System on the NewConnect

market. On September 14, 2017, the Company shares were listed for the first

time. As a result of the public offering, registration of series M shares, and

transactions on the Issuer's securities, two large international investment

funds: ACATIS Investment GmbH and Heidelberger Beteiligungsholding AG

have exceeded the threshold of 5% of votes at the General Meeting of

Shareholders.

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R&D Successes and a New Application for the XTPL Technology

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As a result of its R&D activities in 2017, the Company has managed to

overcome the technological barrier in the precise printing of conductive lines.

The current XTPL technology allows for printing lines with thickness below

100 nm (with the initial target of 400 nm). The Company's technological team

has also successfully completed the pilot stage of its works in the area of

open-defects repair, thus opening a possibility of using the Company's own

technology to repair metallic connectors in thin film electronic circuits that

have been broken at the production stage. Potentially, the solution can be

implemented by manufacturers of TFT/LCD displays, silicon solar cells,

integrated circuits and PCBs, i.e. on the market worth as much as 4.5 billion

USD.

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Grant Agreement for the Development of Laboratory Printer Demo Prototypes

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On December 13, 2017, the Company signed a grant agreement for

the development of laboratory printer demo prototypes under the

Regional Operational Programme for the Lower Silesian Voivodeship

2014-2020. The grant is to sponsor the commercialisation of laboratory

printers, including the development of laboratory printer demo

prototypes with compatible nano ink formulas. The project also

provides for internal and external printer testing. Once the Company

plans are completed, it will be another crucial step towards

commercialisation of the ground-breaking ultra-thin conductive line

printing technology for use in printed electronics. The grant amounts to

0.6 million EUR, whereas the total value of the project is 1.1 million

EUR.

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Decision to Change the Listing Market

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On December 12, 2017, the Management Board of XTPL S.A. adopted a

resolution to start work towards changing the listing market of the

Company shares from the Alternative Trading System (NewConnect

market) to the regulated market of Warsaw Stock exchange in Warsaw.

A single European passport obtained upon transition to the regulated

market will allow the Company to pursue the dual listing of its shares on

the regulated Open Market (Freiverkehr) operated by Deutsche Börse

AG, one of the largest stock exchanges in the world.

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Technical Development Manufacturing Award and the Economic Award of the President of the Republic of Poland

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The prototype of the XTPL laboratory printer, presented during the

IDTechEx Show Printed Electronics Europe in Berlin in May 2017 won

the prestigious industry award, namely the Technical Development

Manufacturing Award. The jury of the award included: Ashutosh Tomar,

Principal Engineer for Technical Strategy at Jaguar Land Rover and

Professor Ulrich Moosheimer from Munich University of Applied

Sciences.

On November 16, 2017, during Congress 590 in Rzeszów, President

Andrzej Duda honoured XTPL with the Economic Award of the

President of the Republic of Poland. The award is presented to

companies which significantly contribute to Poland’s economic

development and build a positive image of Poland worldwide. The

award was granted in a special Startup_PL category, dedicated

specifically to the enterprises with the market presence of less than 5

years, which have created an innovative product or technology.

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FUTURE GOALS

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STAGES OF COMMERCIALIZATION

• Developing a lab prototype of the printer & a printer-compatible nano ink formula

At this stage, company did not generate any operating revenue; most of its operations were financed from external sources, such as grants, subsidies and funds obtained from the issue of shares.

STAGE I (completed)

Prototype development.

• MVP on offer (minimum viable product) in the form of a lab printer

• Lab printer is designed for R&D centres of business & scientific entities.

• Validation the technology & showcasing it to the research & development departments of prospective customers,

• Building technological relationships & allowing customers to create prototypes

• Defining other potential uses for specific application areas

First revenues to be expected a) sale of lab printers & nanoinks b) concluding joint development agreements (JDAs) for technology development

• Providing full solutions for the industry • Industrial printer will differ from the lab printer

in terms of size, functionality (better performance) & technological maturity

• Direct sales of the nanoink & print heads, as well as implementation the technology at the customer's site (technological consulting).

Revenues are to be generated from the sale of print heads (one-off revenues), sales of nanoinks (recurring revenues), & from the sales of dedicated implementation services (one-off revenues).

STAGE II (underway)

Sale of equipment to R&D centers & conclusion of JDAs.

STAGE III

Sale of the industrial equipment and provision of the complexed solutions.

2017 2018-2019 Q3 2019 >

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IMPLEMENTATION STATUS OF GOALS FOR THE PUBLIC OFFER

Task Current state

Set up of Business Development

Department, Sales Department and other

marketing activities

• Two business development leaders recruited (start: October/November)

• ID TechEX market survey done, April 2017

• Participation in IDTechEX Trade Fair – Printed Electronics, May 2017, Berlin

• Participation in Techinnovation Trade Fair, September 2017, Singapore

• Participation in IDTechEx Show! – Printed Electronics, November 2017, Santa Clara (USA)

Set up of application laboratories • First laboratory is operating;

• Development in progress (additional 2 lab printers and 2 researchers)

• New application segment verified (open defects repair)

Laboratory printers production for external

customers

• Internal alpha-tests in progress (lab printer and ink)

• Concluding conceptual work regarding β-version of the printer

Industrial printhead and printer prototype

development

• 2019

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MOST IMPORTANT STRATEGIC ACTIONS PLANED

ACTION TIMING

Assembly & internal complex test of β-version printer Q1 2018

JDA with mature players in verified application segments - leading to industrial implementation in the future 2018

Initiation of Advisory Board H1 2018

Patent family development 2018

Transition to the main market of stock exchange in Poland H1 2018

Parallel quotation on other European stock exchange (e.g. Frankfurt) H2 2018

Additional grant to enforce commercialization process 2018

Implementation of the new business development strategy 2018

XTPL SUBMICRON LAB PRINTER – β-VERSION CONCEPT

Lab Printer β-version will allow for:

• validation of the technology

• showcasing it to the research & development departments of prospective customers

• building technological relationships

• customers to create prototypes

• defining other potential uses for specific application areas

Key features:

Functionality: electrically conductive, optically, biologically and chemically active

Line width: from 100 nm to 3 μm

Line length: up to cm range

Aspect ratio: 1, in the single run of the printing head

Very low voltage applied: 5-30 V.A

Resistivity: 2 Ω /μm (for the line with the thickness of 1 μm), proof of concept manufactured featuring

20-40% bulk Ag (thickness 100-400nm)

Examples of applications: printed electronics, solar cells, touch screens, wearable electronics, automotive,

smart packaging, automotive, biosensors, medical devices, anti-counterfeiting & open defect repair

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WORLDWIDE RECOGNITION

Dr. Adam WeissCEO & PresidentWDI

Dr. Pierre VerlindenVP Chief ScientistTrinaSolar

Dr. Markus GlatthaarLeader of the Department of Novel ProcessesFraunhofer ISE

Dr. Homer AntoniadisGlobal Technology DirectorDuPont

“…make a clear value proposition for this market segment.”

“…if successfully scaled, would fit very well into the

Technological Roadmap…”

“…unique and very attractive feature

for next generation silicon solar cells.”

“We would consider the implementation

of the XTPL technology…”

SELECTED AWARDS & GRANTS

GRANTFINALISTWINNER

THE ECONOMY AWARD OF THE PRESIDENT OF THE REPUBLIC OF POLAND ANDRZEJ DUDA 2017

IDTECHEX PRINTED ELECTRONICSTECHNICAL DEVELOPMENTMANUFACTURING AWARD

MIT ENTERPRISE FORUM POLAND

CLIMATE KIC ACCELERATION PROGRAMM POLAND 2016

CLIMATE VENTURE SUMMIT

INPHO VENTURE SUMMIT

WOLVES SUMMIT

ABSL START-UP CHALLENGE

SME INSTRUMENTS

RPO

NCBR FAST PATH

PARP

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SUMMARY – MOST IMPORTANT ASSETS

GreatMarket

response

Clearstrategy

Strongteam

Globaltechnology

XTPL S.A.

Stabłowicka 147

54-066 Wrocław, Poland

xt-pl.com Thank You

investors@xt-pl.com

M. +48 717 072 204