WIRE BOND PROCESS INTRODUCTION

CONTENTSCONTENTS ASSEMBLY FLOW OF PLASTIC IC

Wire Bond 原理 M/C Introduction

Wire Bond Process

Material

SPEC

Calculator

DEFECT

封裝簡介封裝簡介

晶片 Die 金線 Gold Wire

導線架

Lead fram

Wafer Grinding Die BondingWafer Saw toaster

Wire Bonding Die Surface Coating

Molding Laser Mark

Solder Ball

Placement Singulation

Packing

封裝流程

Dejunk

TRIM

Solder

Plating

Solder

Plating

Dejunk

TRIM

TRIM/

FORMING

BGA

SURFACE

MOUNTPKG

THROUGH

HOLE PKG

Wire Bond 原理Wire Bond 原理

padpadleadlead

Gold wireGold wire

Ball BondBall Bond

( 1st Bond )( 1st Bond )

Wedge BondWedge Bond

( 2nd Bond )( 2nd Bond )

GLASS

CONTAMINATIONCONTAMINATION

VIBRATIONVIBRATION

SiO2

Si

GOLD BALL

PRESSUREPRESSURE

MOISTURE MOISTURE

AL2O3AL2O3

AlAl

B.PRINCIPLE

銲接條件銲接條件 HARD WELDING

Pressure (Force)

Amplify & Frequecy

Welding Time (Bond Time)

Welding Tempature (Heater)

THERMAL BONING

Thermal Compressure

Ultrasonic Energy (Power)

Bond Head ASSYBond Head ASSY• Low impact force

•Real time Bonding Force monitoring

• High resolution z-axis position with 2.5 micron per step resolution

• Fast contact detection

• Suppressed Force vibration

• Fast Force response

• Fast response voice coil wire clamp

X Y TableX Y Table•Linear 3 phase AC Servo motor

•High power AC Current Amplifier

•DSP based control platform

•High X-Y positioning accuracy of +/- 1 mm

•Resolution of 0.2 mm

W/H ASSYW/H ASSY• changeover

•· Fully programmable indexer & tracks

•· Motorized window clamp with soft close feature

•· Output indexer with leadframe jam protection feature

• Tool less conversion window clamps and top plate enables fast device

EagleEagle•Bonding System•Bonding Method Thermosonic (TS)•BQM Mode Constant Current, Voltage, Power and Normal (Programmable)•Loop Type Normal, Low, Square & J•XY Resolution 0.2 um•Z Resolution (capillary travelling motion)2.5 um•Fine Pitch Capability 35 mm pitch @ 0.6 mil wire•No. of Bonding Wires up to 1000•Program Storage 1000 programs on Hard Disk•Multimode Transducer System Programmable profile, control and vibration modes

MACHINE SPECIFICATIONS (I)MACHINE SPECIFICATIONS (I)

Eagle Eagle

•Vision System•Pattern Recognition Time 70 ms / point•Pattern Recognition Accuracy + 0.37 um•Lead Locator Detection 12 ms / lead (3 leads/frame)•Lead Locator Accuracy + 2.4 um•Post Bond Inspection First Bond, Second Bond Wire Tracing•Max. Die Level Different 400 – 500 um

•Facilities•Voltage 110 VAC (optional 100/120/200/210/•220/230/240 VAC

MACHINE SPECIFICATIONS (II)MACHINE SPECIFICATIONS (II)

Eagle Eagle

•Material Handling System•Indexing Speed 200 – 250 ms @ 0.5 “ pitch•Indexer Resolution 1um•Leadframe Position Accuracy + 2 mil•Applicable Leadframe W = 17 – 75 mm @ bonding area in Y = 65mm = 17 – 90 mm @ bonding area in Y = 54mm L = 280 mm [Maximum] T = 0.075 – 0.8 mm

•Applicable Magazine W = 100 mm (Maximum) L = 140 – 300 mm H = 180 mm (Maximum)•Magazine Pitch 2.4 – 10 mm (0.09” – 0.39 “)•Device Changeover < 4 minutes•Package Changeover < 5 minutes•Number of Buffer Magazine 3 (max. 435 mm)

MACHINE SPECIFICATIONS (III)MACHINE SPECIFICATIONS (III)

Bonding ProcessBonding Process

The Wire Bond Temp

The Wire Bond Temp

PREHEAT BONDSITEPREHEAT BONDSITE

CU L/F200+/-10 200+/-10CU L/F200+/-10 200+/-10

AL L/F210+/-10 230+/-10AL L/F210+/-10 230+/-10

BGA 150+/-10 160+/-10BGA 150+/-10 160+/-10

TFBGA150+/-10 160+/-10TFBGA150+/-10 160+/-10

LBGA 150+/-10 160+/-10LBGA 150+/-10 160+/-10

NOT INCLUDE DEDICATE LINENOT INCLUDE DEDICATE LINE

padpadleadlead

Free air ball is captured in the chamfer

padpad

leadlead

Free air ball is captured in the chamfer

SEARCH HEIGHT

padpadleadlead

Free air ball is captured in the chamfer

SEARCH SPEED1

SEARCH TOL 1

Free air ball is captured in the chamfer

padpadleadlead

SEARCH SPEED1

SEARCH TOL 1

Free air ball is captured in the chamfer

padpad leadlead

SEARCH TOL 1

SEARCH SPEED1

Free air ball is captured in the chamfer

padpad leadlead

SEARCH TOL 1

SEARCH SPEED1

Free air ball is captured in the chamfer

padpad leadlead

SEARCH TOL 1

SEARCH SPEED1

Formation of a first bond

padpad leadlead

SEARCH SPEED1

SEARCH TOL 1

Formation of a first bond

padpad leadlead

SEARCH SPEED1

SEARCH TOL 1

IMPACT FORCE

Formation of a first bondContact

padpad leadleadheatheat

PRESSUREPRESSURE

Ultra Ultra

Sonic Sonic

VibrationVibration

Formation of a first bondBase

padpad leadlead

Ultra Ultra

Sonic Sonic

VibrationVibration

heatheat

PRESSUREPRESSURE

Capillary rises to loop height position

padpad leadlead

Capillary rises to loop height position

padpad leadlead

Capillary rises to loop height position

padpad leadlead

Capillary rises to loop height position

padpad leadlead

Capillary rises to loop height position

padpad leadlead

Capillary rises to loop height position

padpad leadlead

RHRH

Formation of a loop

padpad leadlead

RD (Reverse Distance)

Formation of a loop

padpad leadlead

padpad leadlead

padpad leadlead

Calculated

Wire Length

WIRE CLAMP ‘CLOSE’

padpad leadlead

Calculated

Wire Length

padpad leadlead

SEARCH DELAY

padpad leadlead

TRAJECTORY

padpad leadlead

TRAJECTORY

padpad leadlead

TRAJECTORY

padpad leadlead

TRAJECTORY

padpad leadlead

TRAJECTORY

padpad leadlead

TRAJECTORY

padpad leadlead

TRAJECTORY

padpad leadlead

TRAJECTORY

padpad leadlead

TRAJECTORY

padpad leadlead

TRAJECTORY

padpad leadlead

2nd Search Height

Search Speed 2Search Tol 2

padpad leadlead

Search Speed 2Search Tol 2

padpad leadlead

Search Speed 2Search Tol 2

Formation of a second bond

padpad leadleadheatheat

Formation of a second bondContact

padpad leadleadheatheatheatheat

padpad leadleadheatheatheatheat

Formation of a second bondFormation of a second bondBaseBase

padpad leadlead

padpad leadlead

padpad leadlead

padpad leadlead

Tail length

padpad leadlead

padpad leadlead

padpad leadlead

Disconnection of the tail

padpad leadlead

Disconnection of the tail

padpad leadlead

Formation of a new free air ball

MaterialMaterial

Leadfram

Capillary

Gold Wire

Leadfram (I)Leadfram (I)

Leadfram ( II )Leadfram ( II )

CAPILLARY (I)CAPILLARY (I)

Capillary Manufacturer

(SPT, GAISER, PECO, TOTO…)

Capillary Data

( Tip , Hole , CD , FA&OR , IC )

CAPILLARY (II)CAPILLARY (II)

CAPILLARY (III)

TIP ..…… Pad Pitch Pad pitch x 1.3 ~ TIPHole ..…. .Wire Diameter Wire diameter + 0.3~0.5 = HCD………Pad size/open/1st Ball CD + 0.4 ~ 0.6 = 1st Bond Ball sizeFA & OR….Pad pitch(um) FA >100 0,4 ~90/100 4,8,11 <90 11,15IC type …… loop type

Gold WireGold Wire

Gold Wire Manufacturer

(Nippon , SUMTOMO , TANAKA…. )

Gold Wire Data

( Wire Diameter , Type , )

SPECSPEC

Pad Open & Bond Pad Pitch

Ball Size

Ball Thickness

Loop height

Wire Pull

Ball short

Crater Test

BPO&BPPBPO&BPP 單位 : um or Mil

BPO : 是指 Pad 內層 X 方向及 Y 方向的 size, 一般是取最小值為 我們的 data

BPO : 是指 Pad 如左邊內層至右邊 Pad 左邊外層邊緣其它依此類推 ; 或著一個 Die 上出現不同 Pad 大小那就是以兩個Pad 中心距離為 BPP, 但是一般我們要取一個 Die 上最小的BPP

Bond Pad Pitch

Bond Pad Open

Bond Pad Open

Ball SizeBall Thickness

Ball Size & Ball Thickness 單位 : um ， Mil

量測倍率 : 50X

Ball Thickness 計算公式 60 um BPP ≧ 1/2 WD=50%

60 um BPP ≦ 1/2 WD=40%~50%

Ball Size

Loop HeighLoop Heigh 單位 : um ， Mil

量測倍率 : 20X

Loop Height

線長

Wire PullWire Pull 1 Lifted Bond (Rejected)

2 Break at neck (Refer wire-pull spec)

3 Break at wire ( Refer wire-pull spec)

4 Break at stitch (Refer stitch-pull spec)

5 Lifted weld (Rejected)

Ball ShortBall Short 單位 : gram or g/mil²

Ball Shear 計算公式 Intermetallic （ IMC ）有 75% 的共晶 ,SHEAR STRENGTH 標準為＞ 6.0g/mil² 。

SHEAR STRENGTH ＝ Ball Shear/Area (g/mil²)

Ball Shear = x; Ball Size = y; Area = π(y/2) ²

x/π(y/2) ² = z g/mil²

CBall bond

Test specimen

Specimen clamp

Shearing ram

Wire

Bond shoulder

Interfacial contactball bond weld area

Bonding padh

(A) Unsheared

CL CBall bond

CL

Test specimen

Specimen clamp

Bonding pad

Full ball attached towire-except for regionsof intermetallic voiding

Ball separated at bonding pad-Ball interface-residual intermetallic(and sometimes portion of unalloyedball and metal) on pad in bondinteraction area

(D) Ball bond-bonding pad interface separation (typical Au to Al)

C

Test specimen

Specimen clamp

Shearing ram

WireMinor fragment of ballattached to wire

Bonding padCL

Ball sheared too high(off line, etc.)only aportion of shoulder andball top removed

Interfacial contactball bond weld area

(B) Wire (ball top and/or side) shear

CBall bond

CL

Test specimen

Specimen clamp

Shearing ram

Bonding pad

Major portionof ball attached to wire

Interfacial contact-ball bond weld areaintact

(C) Below center line shear, ball sheared through (typically Au to Au)

CBall bond

CL

Test specimen

Specimen clamp

Bonding pad

Pad metallizationseparates fromunderlying surface

Residual pad on ballball-pad interfaceremains intact

(E) Bond pad lifts

Test specimen

Specimen clamp

CBall bond

CL Bonding pad

Bonding pad lifts,taking portion of underlyingsubstrate material with it

(F) Cratering

Residual pad and substrate attachedto ball,ball-pad interface remainsintact

Shear Failure Modes

Crater TestCrater Test

Calculate (I)Calculate (I) UP Time =

(Total Actual Production Times – Total Repair Time )

Total Actual Production Time

DOWN TIME RATE= Total Repair Time

Total Actual Production Times

Total Operator Actual Repair TimeTotal Operator Repair Frequency Stoppages

Total Actual Production Times – Total Operator Repair Time

Total Operator Repair Frequency Stoppages

Total Technical Actual Repair Times

Total Technical Repair Frequency Stoppages

MTTS (MEAN TIME TO STOP ) =

MTBS (MEAN TIME BETWEEN STOP)=

MTTA (MEAN TIME TO ASSISTANCE ) =

Calculate (II)Calculate (II) MTBA (Mean Time Between Assistance) =

Total Actual Production Times – Total Technican Repair Times

Total Technical Repair Frequency Stoppages

MTBF(Mean Time Between Failure)= Total Actual Production Times – Total Technician Repair Time

Total Change Parts Repair Frequency Stoppage

規格寬度 製程寬度

規格上限 - 規格下限 6 σ( 公差 )

( 上限 or 下限 ) - 平均值 三個公差

CP ( 製程能力指標 ) =

CPK =

=

QualityQuality 正常品 Material Problem

1st Bond issue

(Peeling , Ball Lift , Off Center)

2nd Bond issue

( 滑針，縫點脫， short tail )

Looping Fail

(wire snake wire ， sweep wire

loop base bent )

正常品

Material Problem

With Ball Wire

Pad Size Missing Ball

Wire Broken

Bonding Ball Inspection

• Ball Detection

Ball Size

Pad Center

Ball Center

Ball Placement (X,Y)

Ball Off Pad

Bonding Ball Inspection (cont.)

• Ball Measurement

Peeling1st Bond Fail ( I )

Ball Lift

1st Bond Fail (II) Ball Lift

Neck Crack

1st Bond Fail ( III )

Off Center

1st Bond Fail (IV) Off Center Ball

1st Bond Fail (V)Smash Ball

Smash Ball

With Weld

Wire

Capillary Mark

Missing Weld Wire Broken

Lead

Bonding Weld Inspection

• Weld Detection

2nd Bond Fail ( I ) 滑針

2nd Bond Fail ( II ) 縫點脫落

縫點脫落

Looping Fail(Wire Short I)Wire Sweep

Wire Short

Looping Fail(Wire Short II)Loop Base Bend

Wire Short

Looping Fail(Wire Short III)Excessive Loop

Wire Short

THE ENDTHE END