In cooperation with

WORKSHOP OVERVIEWPhotonic integration in data communication is driven

today both by the increasing demand for bandwidth and

higher channel density within the systems. Furthermore

miniaturization in lightening and projection techniques,

and a wide variety of optical sensors require new photonic

assembly concepts to reduce costs and guarantee reliability.

Photonic integrated circuits (PIC) and MOEMS based devices

need 3D-integration, and challenges in terms of optical fibre

attachment have to be solved. Photonic packaging is crucial

and includes single packages, modules or subsystems com-

prising at least one optoelectronic device or micro-optical

element and optical interconnects.

High precision alignment is a key, yet the lack of standards

for photonic interconnects hinders low cost generic solu-

tions. We see that there are many challenges to be taken

by OEM manufacturers, suppliers and service assemblers to

face the specific challenges regarding very tight tolerances.

Sub-micron accuracy has to be achieved and maintained

during operation for many photonic applications.

Thus the Photonics Packaging workshop 2018 at Fraunhofer

IZM focuses on sub-micron assembly technologies for

optoelectronic and photonic integration on board, package

and device level.

PHOTONIC PACKAGING SUB-MICRON ASSEMBLY

F R A U N H O F E R I N S T I T U T E F O R

R E L I A B I L I T Y A N D M I C R O I N T E G R AT I O N I Z M

W O R K S H O P | J U N E 1 2 - 1 3 , 2 0 1 8

REGISTRATION www.izm.fraunhofer.de/en/news_events/events/ws_8

You will find hotels near the venue on the registration

website.

PARTICIPATION FEE780 € per person

The fees are VAT exempt according to § 4 No. 22 UStG.

10% discount for members of one of the Innovation

Networks for Optical Technologies (Innovationsnetze

Optische Technologien), OptecNet Deutschland

VENUEFraunhofer Institute for Reliability and Microintegration IZM

Gustav-Meyer-Allee 25 | Bld. 17.3, Raum 60a+b

13355 Berlin

CONTACTHenning Schröder

Phone: +49 30 46403-277

henning.schroeder@izm.fraunhofer.de Cover Photo: © Fraunhofer IZM

One-lense laser-module, in cooperation with eagleyard photonics GmbH

WHO SHOULD ATTENDThe workshop addresses scientists and engineers involved

in photonic packaging: Process technology, materials and

equipment, as well as decision makers.

PROGRAM JUNE 12TH PROGRAM JUNE 13TH

Optical spot size conversion in photonic BiCMOS:

Fabrication and characterization

Lars Zimmermann, IHP – Leibniz-Institut für innovative

Mikroelektronik, Frankfurt/Oder, GER

Coffee Break

SESSION 3: MODULE INTEGRATION AND

PACKAGING

Photonic wirebonding and 3D nano-printing in

optical packaging - From research to manufacturing

Christian Koos, Vanguard Photonics GmbH and

Karlsruher Institut für Technologie, Karlsruhe, GER

Assembly of silicon photonics transceiver

modules for optical data center interconnects

Christoph Theiss, Sicoya GmbH, Berlin, GER

Chip I/O disaggregation. Co-package of a 2D

optical interconnect with a switch ASIC

Kobi Hasharoni, Dust Photonics LTD, Modiin, ISR

Advanced photonics packaging and integration

of silicon photonic devices at CNIT/InPhoTec

Giovan Battista Preve/Davide Rotta, CNIT/InPhoTec

Foundation, Pisa, ITA

Get-together with special lab-tour:

Start-a-Factory @ Fraunhofer IZM

Welcome

SESSION 1: ADVANCED PHOTONIC NEEDS FOR

HIGH PRECISION

Photonic integrated soliton frequency combs

Tobias J. Kippenberg, EPFL, Lausanne, CH

Miniaturized optical quantum technologies on

ground and in space

Markus Krutzik, Institut für Physik, HU Berlin, GER

High precision mounting - Enabling new micro

laser sources for biophotonics

Kathrin Paschke, Ferdinand Braun Institut für Höchst-

frequenztechnik, Berlin, GER

Coffee Break

SESSION 2: PIC ASSEMBLING AND PACKAGING ON

WAFER LEVEL

Industrial requirements for high precision opto-

electronic assemblies

Gunter Vollrath, Aifotec AG, Meiningen, GER

Wafer level processing and packaging of optical

modules utilizing nanoimprint lithography and

wafer bonding

Martin Eibelhuber, EV Group, St. Florian am Inn, AT

Precision flip chip bonding optoelectronic compo-

nents

Hermann Oppermann, Fraunhofer IZM, Berlin GER

Martin Rogge, Finetech GmbH&Co KG, Berlin, GER

Interferometric feedback for the SmarPod 6D-

Parallel kinematics: Tackling mechanical tolerances

with the PicoScale

Kolja Kolata, SmarAct GmbH, Oldenburg, GER

Recent advances in high-throughput, ultra-

precision photonic alignment for industrial test

and packaging

Scott Jordan, Physik Instrumente, Sausolito, USA

Lunch Break

SESSION 6: OPTICAL INTERCONNECTS AND

HYBRID COMPONENT INTEGRATION

Additive and subtractive 3D printing of transpa-

rent materials with sub-micron precision

Martin Hermans, LightFab GmbH, Aachen, GER

Integration of technologies for the development

of photonic-based lab-on-a-chip devices

Jaime Garcia-Ruperez, Polytechnic University of

Valencia, Valencia, ES

Addressing cost and reliability targets for applica-

tion specific packages

Jörg Muchametow, eagleyard photonics GmbH, Berlin,

GER

Thin glass based optical sub-assemblies of electro-

optical components

Gunnar Böttger, Fraunhofer IZM, Berlin, GER

11.50

12.10

12.30

13.30

13.50

14.10

14.30

Welcome

SESSION 4: PRECISION STRUCTURING AND

PASSIVE ALIGNMENT

Optical fiber assemblies for high-precision fiber to

chip coupling

Andreas Matiss, Corning Optical Communications

GmbH&Co. KG, Berlin, GER

Sub-micron passive alignment of photonics for pro-

duction: What about process and machine capability?

Rudolf Kaiser, Amicra Microtechnologies GmbH, Regens-

burg, GER

High precision optical 3D-microassembly for volume

production based on Si-micromechanics

Jörg-R. Kropp, InBeCon GmbH, Berlin, GER

Hybrid InP-TriPleX packaging in multi project wafer

access

Arnde Leinse, LioniX International BV, Enschede, NL

Coffee Break

SESSION 5: AUTOMATION AND PRECISE ACTIVE

ALIGNMENT

High-volume submicron attachment using active

alignment

Torsten Vahrenkamp, ficonTEC Service GmbH, Achim, GER

Sub-micron passive alignment and bonding with

automatic offset correction based on indirect visual

feedback or external measurements

9.00

9.20

9.40

10.00

10.20

10.40

11.10

11.30

Automated active alignment of an out-of-plane coupling element in an EOCB (electrical-optical cicuit board)Evaluation board with electrical and optical coupling to a Si-Chip

15.50

16.10

16.40

17.00

17.20

17.50

18.00

13.00

13.20

13.40

14.00

14.20

14.50

15.10

15.30

Automated active lens alignment for laser modules Precise micro optical bench assembly and fiber coupling