What's New in AWRDE 13

v13.03

What's Newin AWRDE 13

ni.com/awr

What's New in AWRDE 13NI AWR Design Environment v13.03 Edition

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Trademarks

• Analog Office, APLAC, AWR, AWR Design Environment, AXIEM, Microwave Office, National Instruments, NI, ni.com and TX-Lineare registered trademarks of National Instruments. Refer to the Trademarks section at ni.com/trademarks for other National Instrumentstrademarks.

• Other product and company names mentioned herein are trademarks or trade names of their respective companies.

Patents

For patents covering NI AWR software products/technology, refer to ni.com/patents.

The information in this guide is believed to be accurate. However, no responsibility or liability is assumed by National Instruments for itsuse.

Table of ContentsNI AWR Design Environment (NI AWRDE) 13 What's New ...................................................................... 1–1

What's New Organization ............................................................................................................. 1–1Major Feature Overview .............................................................................................................. 1–1

NI AWR Design Environment (NI AWRDE) ............................................................................ 1–1Microwave Office and Analog Office ..................................................................................... 1–1Visual System Simulator (VSS) ............................................................................................. 1–2Analyst 3D Editor ............................................................................................................... 1–3

NI AWR Design Environment (NI AWRDE) Features ................................................................................ 2–1Knowledge Base ......................................................................................................................... 2–1Enhanced Graph Markers ............................................................................................................. 2–1Minor Improvements ................................................................................................................... 2–1

API .................................................................................................................................. 2–1Data Files .......................................................................................................................... 2–1Data Sets ........................................................................................................................... 2–1Graphs .............................................................................................................................. 2–1Libraries ........................................................................................................................... 2–2Licensing .......................................................................................................................... 2–2Output Equations ................................................................................................................ 2–2Project Archive .................................................................................................................. 2–2User Interface .................................................................................................................... 2–2

Microwave Office (MWO) and Analog Office (AO) Features ...................................................................... 3–1APLAC Time Domain Modeling ................................................................................................... 3–1APLAC Transient Analysis ........................................................................................................... 3–1APLAC Transient Assisted Harmonic Balance ................................................................................. 3–1APLAC Marching Waveforms ....................................................................................................... 3–1Load Pull .................................................................................................................................. 3–2APLAC Circuit Envelope Simulation .............................................................................................. 3–2HSPICE Upgrade ........................................................................................................................ 3–4New Optimization Methods .......................................................................................................... 3–4Updated Yield Optimization Dialog Box ......................................................................................... 3–4New Layout Editor Commands ...................................................................................................... 3–4Shape Preprocessor Modifier ......................................................................................................... 3–5Line Types Window Pane ............................................................................................................. 3–6Multi-Technology Projects ............................................................................................................ 3–7Simulation Window ..................................................................................................................... 3–8EM Ports on Subcircuits ............................................................................................................... 3–9EM Clip Region ........................................................................................................................ 3–11AXIEM Advanced Frequency Sweep (AFS) ................................................................................... 3–12AXIEM Iterative Solver ............................................................................................................. 3–12Analyst Solver .......................................................................................................................... 3–12Analyst Frequency Sweep Type ................................................................................................... 3–12Analyst Port ............................................................................................................................. 3–12Analyst Antenna Analysis ........................................................................................................... 3–14

Analyst Options ................................................................................................................ 3–14Approx Open Boundary Condition ....................................................................................... 3–14Spherical PML Boundary Condition ..................................................................................... 3–14

Analyst Surface Roughness Model ............................................................................................... 3–15Analyst AMR Convergence Plot .................................................................................................. 3–15Analyst 3D Editor ..................................................................................................................... 3–16

What's New in NI AWR Design Environment iii

AWR Connected Partners ........................................................................................................... 3–16PCB Import Wizard ................................................................................................................... 3–16OpenAccess Import/Export Wizard ............................................................................................... 3–17Synthesis Wizards ..................................................................................................................... 3–18iFilter Wizard ........................................................................................................................... 3–20AWR RF Board Libraries Updates ................................................................................................ 3–21Minor Improvements ................................................................................................................. 3–22

New/Updated Examples ..................................................................................................... 3–22New Circuit Models ........................................................................................................... 3–22New 3D EM Parts ............................................................................................................. 3–22New Circuit Measurements ................................................................................................. 3–23

Nonlinear Power Measurements ................................................................................... 3–23Nonlinear Envelope Measurements ............................................................................... 3–23Linear Measurements ................................................................................................. 3–23Output File Measurements .......................................................................................... 3–23Load Pull Measurements ............................................................................................ 3–23

Analyst ........................................................................................................................... 3–23Geometry Simplification Rules ............................................................................................ 3–23HSPICE .......................................................................................................................... 3–24Layout ............................................................................................................................ 3–24Layout - EM ..................................................................................................................... 3–24Load Pull ......................................................................................................................... 3–24Measurements .................................................................................................................. 3–25Models ............................................................................................................................ 3–25Output Files ..................................................................................................................... 3–25Remote Computing ............................................................................................................ 3–25Schematic Editor ............................................................................................................... 3–25Scripts ............................................................................................................................ 3–25Shape Modifiers ................................................................................................................ 3–26Simulation - Nonlinear ....................................................................................................... 3–26Simulation - APLAC ......................................................................................................... 3–26Simulation - Analyst .......................................................................................................... 3–26Simulation - AXIEM ......................................................................................................... 3–26Symbols .......................................................................................................................... 3–26Tuning, Yield Analysis and Optimization ............................................................................... 3–26User Interface ................................................................................................................... 3–26Wizard - IFF .................................................................................................................... 3–27Wizard - Stability Analysis using STAN ................................................................................ 3–27

Visual System Simulator (VSS) Features ................................................................................................. 4–1VSS Output File ......................................................................................................................... 4–1RFI Spurs Output File .................................................................................................................. 4–1TDMS File Support ..................................................................................................................... 4–3System Load Pull ........................................................................................................................ 4–3LTE-A Library Improvements ....................................................................................................... 4–4Expanded Radar Library .............................................................................................................. 4–4Improved Phased Array Models ..................................................................................................... 4–45G Library ................................................................................................................................ 4–6Minor Improvements ................................................................................................................... 4–7

New/Updated Examples ....................................................................................................... 4–7New System Blocks ............................................................................................................ 4–7

Coding-Mapping Blocks .............................................................................................. 4–7

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5G Modulation Blocks ................................................................................................. 4–7TDMS File Blocks ...................................................................................................... 4–8RF Blocks ................................................................................................................. 4–8

New System Output File Measurements .................................................................................. 4–8Data Sets ........................................................................................................................... 4–8Measurements .................................................................................................................... 4–8Simulation ......................................................................................................................... 4–8System Block Updates ......................................................................................................... 4–8User Interface .................................................................................................................... 4–9

Analyst 3D Editor Features .................................................................................................................. 5–1Environment .............................................................................................................................. 5–1

Units ................................................................................................................................ 5–1Foreign Characters in Projects ............................................................................................... 5–1Structure and Annotation View Keyboard Camera Interaction ..................................................... 5–1Variables ........................................................................................................................... 5–1

Auto-Complete ........................................................................................................... 5–1Grouping ................................................................................................................... 5–1Sorting ...................................................................................................................... 5–2Value Set Management Dialog Box ................................................................................ 5–2New Functions ........................................................................................................... 5–2

Geometry .................................................................................................................................. 5–3Solid/Element Browser Organization ...................................................................................... 5–3Shaded Without Edges View Style ......................................................................................... 5–3Swept Solid Type Conversion ................................................................................................ 5–4Box Type .......................................................................................................................... 5–4Excluding Operations .......................................................................................................... 5–4STL Export ........................................................................................................................ 5–4Face/Edge Extrusions .......................................................................................................... 5–4Importing Multiple Files ...................................................................................................... 5–4New Import File Formats ..................................................................................................... 5–4Simplify Parameter for Extrusions and Revolutions ................................................................... 5–5Sketched-Based Solid Type Conversion .................................................................................. 5–5Solid, Element and Operation Order ....................................................................................... 5–5Sketcher Improvements ........................................................................................................ 5–5

Polyline Blends .......................................................................................................... 5–5Construction Elements ................................................................................................. 5–5Joining of Lines and Polylines ....................................................................................... 5–5Elliptical Tangent Arc Element ...................................................................................... 5–6Point Element ............................................................................................................ 5–6Center-based Circle Element ......................................................................................... 5–6

Calculations and Query Dialog Box Improvements .................................................................... 5–6Length Unit ............................................................................................................... 5–6Vector Component Clipboard Copy ................................................................................ 5–7

Attributes .................................................................................................................................. 5–7Application Count Indicator .................................................................................................. 5–7Folder Visibility ................................................................................................................. 5–8Attribute Propagation Through Booleans, Lofts, or Other ........................................................... 5–8Attribute and Material Order ................................................................................................. 5–8

Version 13.03 Updates ......................................................................................................................... 6–1New 3D EM Elements ................................................................................................................. 6–1Updated Example Libraries ........................................................................................................... 6–1

What's New in NI AWR Design Environment v

Contents

API .......................................................................................................................................... 6–1Data Sets ................................................................................................................................... 6–1Graphs ...................................................................................................................................... 6–1Job Scheduler ............................................................................................................................. 6–2Layout ...................................................................................................................................... 6–2Layout - EM .............................................................................................................................. 6–2Load Pull .................................................................................................................................. 6–3Measurements - Circuit ................................................................................................................ 6–3Measurements - Systems .............................................................................................................. 6–3Models - Circuit ......................................................................................................................... 6–3Models - System ......................................................................................................................... 6–3Scripts ...................................................................................................................................... 6–3Shape Modifiers and Geometry Simplification (SPP) Rules ................................................................. 6–3Simulation - Analyst .................................................................................................................... 6–3Simulation - APLAC ................................................................................................................... 6–3Simulation - AXIEM ................................................................................................................... 6–4Simulation - Extraction ................................................................................................................ 6–4Simulation - Systems ................................................................................................................... 6–4User Interface ............................................................................................................................ 6–4Tuning, Yield Analysis and Optimization ........................................................................................ 6–4Wizards - IFF Import/Export ......................................................................................................... 6–5Wizards - PCB Import ................................................................................................................. 6–5Wizards - RF Budget ................................................................................................................... 6–5Wizards - Symbol Generator ......................................................................................................... 6–5

Version 13.02 Updates ......................................................................................................................... 7–1New 3D EM Elements ................................................................................................................. 7–1New Knowledgebase Examples and Guides ..................................................................................... 7–1API .......................................................................................................................................... 7–1Geometry Simplification (SPP) Rules ............................................................................................. 7–1Graphs ...................................................................................................................................... 7–1Import/Export ............................................................................................................................ 7–1Job Scheduler ............................................................................................................................. 7–1Layout ...................................................................................................................................... 7–2Layout - EM .............................................................................................................................. 7–2Layout - Shape Modifiers ............................................................................................................. 7–2Libraries ................................................................................................................................... 7–3Load Pull .................................................................................................................................. 7–3Measurements - Circuit ................................................................................................................ 7–3Measurements - Electromagnetic ................................................................................................... 7–3Models - Circuit ......................................................................................................................... 7–3Models - System ......................................................................................................................... 7–3Schematic Editor ........................................................................................................................ 7–3Scripts ...................................................................................................................................... 7–3Simulation - APLAC ................................................................................................................... 7–4Simulation - AXIEM ................................................................................................................... 7–4Simulation - System .................................................................................................................... 7–4Tuning, Yield Analysis and Optimization ........................................................................................ 7–5User Interface ............................................................................................................................ 7–5Wizards - Component Synthesis ..................................................................................................... 7–5Wizards - IFF Import and Export ................................................................................................... 7–5Wizards - PCB Import ................................................................................................................. 7–5

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Version 13.01 Updates ......................................................................................................................... 8–1Security Risk in V13 Addressed .................................................................................................... 8–1New Examples ........................................................................................................................... 8–1API .......................................................................................................................................... 8–1Connectivity Checker .................................................................................................................. 8–1Geometry Simplification (SPP) Rules ............................................................................................. 8–1Import/Export ............................................................................................................................ 8–1Layout ...................................................................................................................................... 8–1Layout - EM .............................................................................................................................. 8–2Load Pull .................................................................................................................................. 8–2Measurements - Circuit ................................................................................................................ 8–2Measurements - Electromagnetic ................................................................................................... 8–3Models - System ......................................................................................................................... 8–3Scripts ...................................................................................................................................... 8–3Shape Modifiers ......................................................................................................................... 8–3Simulation - Analyst .................................................................................................................... 8–3Simulation - APLAC ................................................................................................................... 8–3Simulation - AXIEM ................................................................................................................... 8–4Simulation - Systems ................................................................................................................... 8–4Tuning, Yield Analysis and Optimization ........................................................................................ 8–4User Interface ............................................................................................................................ 8–4Wizards - PCB Import ................................................................................................................. 8–4

Migration Issues ................................................................................................................................. 9–1NI AWRDE V13 Specific Migration Issues ...................................................................................... 9–1

Licensing .......................................................................................................................... 9–1Remote Computing ............................................................................................................. 9–1AXIEM Multiple RHS Solver Option ..................................................................................... 9–1AXIEM Advanced Frequency Sweep (AFS) ............................................................................ 9–1Analyst Antenna Measurements ............................................................................................. 9–1Negation Elements .............................................................................................................. 9–1HSPICE Upgrade ................................................................................................................ 9–2Unit Type on Subcircuit Passed Parameters .............................................................................. 9–2AWR RF Board Libraries ..................................................................................................... 9–2

Version Independent Migration Issues ............................................................................................. 9–3Files Automatically Migrated ............................................................................................... 9–3

Files in Appdatacommon .............................................................................................. 9–3Files in Appdatauser .................................................................................................... 9–3

Files NOT Automatically Migrated ........................................................................................ 9–4License File ............................................................................................................... 9–4User-Defined XML Libraries ........................................................................................ 9–4

Other Concerns .................................................................................................................. 9–4Model Compatibility ................................................................................................... 9–4Multiple NI AWRDE Versions ...................................................................................... 9–5Redirection ............................................................................................................... 9–5

What's New in NI AWR Design Environment vii

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viii NI AWR Design Environment

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NI AWR Design Environment (NI AWRDE) 13 What's NewWhat's New Organization

The NI AWRDesign EnvironmentTM (NI AWRDE) 13What's New document is organized into several sections including:

• “NI AWR Design Environment (NI AWRDE) Features” - Common improvements to all products.

• “Microwave Office (MWO) and Analog Office (AO) Features” - Microwave Office (MWO) and Analog Office(AO)-specific improvements.

• “Visual System Simulator (VSS) Features” - Visual System SimulatorTM (VSS)-specific improvements.

• “Analyst 3D Editor Features ” - Analyst 3D Editor-specific improvements.

• “Migration Issues” - Migration issues from previous versions to the current version.

Features listed in this document may also include links to videos or reference examples included in the NI AWRDEinstallation. Examples are listed by file name, for example: filename.emp. To find an example in the NI AWRDE, chooseFile > Open Example and type the example name.

The following are updates for minor versions:

• “Version 13.01 Updates” - Updates for the 13.01 minor version.



Major Feature OverviewA video or new example is available for many major new features in this release. A list of these features follows. Featuredetails are presented in the corresponding section of this document.

Notes:

• New FLEX tools and vendor daemon are required for Floating licensing. See “Licensing” for details.

• NI AWRDE V13 is the last version that will support HASP4 hardware dongles. See the HASP4 No Longer SupportedAfter V13 KB article for more details.

NI AWR Design Environment (NI AWRDE)

• “Knowledge Base”: New interactive Knowledge Base.

• “Enhanced Graph Markers”: New auto-search markers, offset markers, and rich-text marker notes.

Microwave Office and Analog Office

• “APLAC Time Domain Modeling”: Improved time domain extraction of S-parameters and models.

• “APLAC Transient Analysis”: Improved transient analysis.

• “APLAC Transient Assisted Harmonic Balance”: Improved TAHB analysis.

• “APLAC Marching Waveforms”: Real-time plotting of APLAC simulation results.

• “Load Pull”: Harmonic Load and Source Pull improvements.

What's New in NI AWR Design Environment 1–1

https://awrcorp.com/support/help.aspx?id=79


• “APLAC Circuit Envelope Simulation”: New APLAC Circuit Envelope simulator.

• “HSPICE Upgrade”: Upgrade to 64-bit HSPICE.

• “New Optimization Methods”: Advanced Genetic Algorithm and Particle Swarm.

• “Updated Yield Optimization Dialog Box”: New Yield dialog box.

• “New Layout Editor Commands”: Commands to edit layout more efficiently.

• “Shape Preprocessor Modifier”: Layer modifier that allows geometry simplification rules to be applied to schematiclayouts.

• “Line Types Window Pane”: New Line Types pane in the Layout Manager that allows selection of a line type fordrawing line type shapes.

• “Multi-Technology Projects”: Ease-of-use improvements that facilitate working with multiple PDKs in the sameproject.

• “Simulation Window”: New job Pause button and additional remote computing job states.

• “EM Ports on Subcircuits”: Faster method to add ports in hierarchical EM structures.

• “EM Clip Region”: Trim layout to create EM structures.

• “AXIEM Advanced Frequency Sweep (AFS)”: Faster and more accurate simulations.

• “AXIEM Iterative Solver”: Simultaneous port solves.

• “Analyst Solver”: Faster simulations.

• “Analyst Frequency Sweep Type”: Improved "Automatic" sweep type.

• “Analyst Port”: Additional Analyst port definitions including custom sized wave ports.

• “Analyst Antenna Analysis”: Improved options and boundary conditions for antenna analysis.

• “Analyst Surface Roughness Model”: Modeling loss effects of surface roughness.

• “Analyst AMR Convergence Plot”: Real-time convergence plot.

• “AWR Connected Partners”: Ability to simulate EM structures with AWR Connected partner simulators.

• “PCB Import Wizard”: Expanded wizard for importing 3Di, IPC-2581, and ODB++ board files.

• “OpenAccess Import/Export Wizard”: Import and export individual schematics and project symbols from/to ADS andVirtuoso OpenAccess databases.

• “Synthesis Wizards”: Wizards that aid in designing passive components such as power dividers, and mixers anddoublers.

• “iFilter Wizard”: Enhanced version of iFilter that allows manual placement, and distribution, of transmission zeros.

• “AWR RF Board Libraries Updates”: Improvements to the example AWR RF Board Library.

Visual System Simulator (VSS)

• “VSS Output File”: Export VSS RF Link characteristics to text data file.

• “RFI Spurs Output File”: Export VSS RFI signal heritage information to an .xml file.

• “TDMS File Support”: Support for TDMS files.

• “System Load Pull”: Load Pull VSS measurements.

• “LTE-A Library Improvements”: Support for carrier aggregation, with intraband and interband component carriers.

• “Expanded Radar Library”: Support for multiple and variable PRF radar sources.

1–2 NI AWR Design Environment

Major Feature Overview

• “Improved Phased Array Models”: Modeling of RF link for each array element.

• “5G Library”: Implemented a number of 5G candidate modulation waveforms.

Analyst 3D Editor

• “Variables”: Enhanced Variable Control editing, grouping, sorting, and comparison operations.

• “Geometry”: Geometry improvements in Browser operations, with new options, views, conversions, parameters, fileformats and more.

• “Attributes”: Improved attribute organization and views in the Browser.



NI AWR Design Environment (NI AWRDE) FeaturesTheNIAWRDesign EnvironmentTM (NI AWRDE) version 13 software includes the following new features, enhancements,and user interface changes. These changes are common to the Microwave Office (MWO), Visual System SimulatorTM(VSS), and Analog Office (AO) products.

Knowledge BaseThe new NI AWR Knowledge Base is easier to navigate and contains interactive content. With the NI AWRDE open,you can directly open examples from the KB by clicking the Open Example button. You can also import test bencheswith a click and view a Tip of the Day on the KB.

Enhanced Graph MarkersTwo new marker types, auto-search markers and offset markers, are now available. Auto-search markers automaticallysearch for a user-specified feature such as trace maximum, and shift along the x-axis to stay aligned with the feature asthe trace is updated due to tuning or optimization, or other. Offset markers maintain a specified x or y offset from anothermarker on the trace. In addition, rich-text notes can now be attached to markers.

Additional Information:

• Documentation: “Auto-search Markers”.

• Example: Autosearch_Marker_Example.emp

• Watch Video

Minor ImprovementsNI AWRDE V13 includes the following minor new features, enhancements, and user interface changes:

API

• New Project.Import method which imports the contents of a specified project into the current project.

• Added an API Update() method to the Equations collection. Also fixed API commandInvokeCommand("SimulateUpdateEquations"), which performs the same action.

Data Files

• Touchstone version 2.0 file format is now supported.

• Added support for port names in Touchstone data files.

• File format options for Raw Data files can now be specified at the document level.

Data Sets

• Data sets greater than 2 GB are now supported.

Graphs

• Histogram graphs now support general markers and horizontal line markers.

• Auto-Search markers with "X Index" search type now functions for time domain graphs.




Libraries

• PDKs can now specify a set of toolbars that are loaded and unloaded along with the PDK itself.

• Partial device extraction is supported for libraries with compatible models.

• When available, PDK-specific wizards are loaded with the PDK and unloaded when the project is closed.

• Elements defined in XML can be aliased into the regular part of the Element Browser (not under "Libraries") usingthe new XML "<ALIAS>".

• When browsing for elements defined as "Libraries", you can now right-click on the "Models" or "Description" columnsto access the Help for those parts.

Licensing

• NI AWRDE license features are now served on a "first-come, first-served" basis.

Output Equations

• When adding an output equation measurement, you can now search the available measurements.

Project Archive

• Archived project (.emz) files can be renamed outside of, and re-opened directly in the NI AWRDE without manualnavigation to the unzipped folder.

User Interface

• Filtering on the Statistics columns in the Variable Browser now supports the common set of Boolean filter keys: youcan now use "1" or "0", "c" or "u", or "t" or "f" to filter true/false.


Minor Improvements

Microwave Office (MWO) and Analog Office (AO) FeaturesMicrowave Office and Analog Office version 13 includes the following new features, enhancements, and user interfacechanges. The NI AWR Design EnvironmentTM (NI AWRDE) changes also apply to these specific products.

APLAC Time Domain ModelingWith time domain simulations such as transient and envelope simulations, it is necessary to extract a time domain model.Time domain extraction improvements include:

• Better speed-to-accuracy ratio in the extraction of S-parameter data, more robust handling of poor quality data, andmore robust passivity enforcement.

• New method of handling aggregate models such that extraction is done on the lowest level possible instead of toplevel.

• Bug fixes on extraction of various models.

APLAC Transient AnalysisThe new transient analysis algorithm includes:

• Improved time step algorithm and error control.

• Transient Preset option that can be set to Accurate, Moderate, or Fast.

APLAC Transient Assisted Harmonic BalanceThe new TAHB algorithm includes:

• Transient Assisted HB option that can be set to Disabled, Convergence aid, or Initial guess.

• Separated time-domain and frequency domain netlists for the transient and harmonic balance simulations so that theharmonic balance analysis is not affected by netlist modifications required by the transient analysis.

• TAHB can now be used for oscillator analysis.

APLAC Marching WaveformsFor supported measurements, APLAC simulation results on graphs update in real-time as the simulation progresses. Youno longer need to wait until the simulation is complete for results to display.



• Example: QPSK_receiver.emp

Load PullLoad Pull improvements include:

• Support for source pull.

• Improved align measurement accuracy.

• Significant speed improvement of Load_Pull script.

• Significant increase in the number of simulated load pull points that can be supported.

• Simulated load pull support for controlling impedances other than fundamental (for example, low frequency two-toneoffset impedance).

• Ability to define simulated load pull points around impedances other than 50 ohms.

• Limited (expert mode) 4th and 5th harmonic load/source pull support.

• Support for SPL file load harmonic gamma sweeps.

• Support for CST power sweep only (no gamma sweep) files.

APLAC Circuit Envelope SimulationAPLAC now includes a Circuit Envelope simulator capable of simulating non-periodic signal sources, or modulated RFsignals. The associated measurements allow measurement of the time-varying voltage or current of a particular carrieror viewing of the spectrum around a carrier. With the added capability of Circuit Envelope to simulate modulatedwaveforms, new sources are added for describing modulated waveforms, such as specifying the IQ data of a modulatedsignal.


Load Pull

9 9.5 10 10.5 10.999Frequency (GHz)

2 GHzBWAround10 GHzCarrier

-80

-70

-60

-50

-40

-30

-20

Power

(dBm

)

PowerSpectrum(dBm)

New Circuit Envelope sources:

• PORTMOD_ENV

• PORTIQ_ENV

New Spectrum measurements:

• Ispectrum_ENV

• Pspectrum_ENV

• Vspectrum_ENV

New Total Time Waveform measurements:

• Itime_ENV

• Ptime_ENV

• Vtime_ENV

New Time Varying Complex Envelope around a Specific Carrier measurements:

• Itime_f_ENV

• Ptime_f_ENV

• Vtime_f_ENV

New Output File measurement:


APLAC Circuit Envelope Simulation

• ENVELOPEF


• Documentation: “Circuit Envelope Simulation ”

• Example: Circuit_Envelope_APLAC.emp

HSPICE UpgradeThe HSPICE simulator is upgraded to 64-bit HSPICE 2016.06.

New Optimization MethodsTwo new optimizationmethods, AdvancedGenetic Algorithm and Particle Swarm, are introduced. Both of these optimizersare suitable for optimization problems with a large number of variables and for problems in which the initial guess isunknown. They can also be combined with a local optimizer such as Simplex to efficiently solve large optimizationproblems.


• Documentation: “Advanced Genetic Algorithm”, “Particle Swarm”

Updated Yield Optimization Dialog BoxThe Yield Analysis dialog box is updated in a similar manner to the Optimizer dialog box, including a Goals tab for quickediting of yield optimization goals.

New Layout Editor CommandsThe following are new Edit menu commands:


HSPICE Upgrade

• Move: A two-point move command where the first mouse click establishes a reference point for the move, and thesecond mouse clicks determines distance of the move (dx and dy) relative to the first point.

• Copy with Reference: Two-point copy command similar to the Move command.

• Expanded the Rotate submenu to include: Rotate, Rotate Right, and Rotate Left.

• Auto Repeat: Automatically repeat a layout command. Press Esc to end the repeat mode. This command is also mappedto a toolbar button next to the Redo button:


• Documentation: “Layout Shapes Editing”

Shape Preprocessor ModifierThe Shape Preprocessor modifier uses a set of rules to specify the types of editing operations to perform on the shapesof each layer and on shapes between layers. The modifier extends the advantages of EM geometry simplification rulesto schematic layout and provides a clean and flexible method to apply layer-based shape editing operations in layout.To use the modifier, choose Draw > Parameterized Modifiers > Shape Preprocessor to add the modifier to a schematiclayout. To add or edit rules, select the modifier, right-click and choose Shape Properties, then click the Rules tab. Likeall layer modifiers, the Shape Preprocessor modifier does not modify the schematic in which it is placed. Instead, theschematic must be placed as a subcircuit in a parent schematic, and the effects of the modifier are seen in the parentlayout.

For example, the corners on this rectangular inductor can be rounded using the Shape Preprocessor modifier.

By applying the following rule:


Shape Preprocessor Modifier

the corners are now rounded.


• Documentation: “Properties Dialog Box: Shape Preprocessor (SPP) Modifier ”

• Example: SPP_Modifier_Manufacturing_View.emp

Line Types Window PaneThe Line Types pane is added to the Layout Manager. This pane offers a fast method to draw line type shapes, whichdraw with all the layers and layer offsets set in the Line Type definition in the LPF. To draw using a line type, simplyselect a line type in the pane and begin drawing.


Line Types Window Pane


• Watch Video

Multi-Technology ProjectsSeveral improvements facilitate working in a multi-technology project:

• The Select Process Library dialog box now shows a list of installed PDKs for easier PDK addition.

• LPFs, Global Definitions documents, and Artwork Cell Libraries from newly added PDKs are now imported into theproject.

• When creating a new schematic in a project with multiple LPFs, you are prompted to choose an LPF to associate withthe schematic. If there is a Global Definitions document with the same name as the selected LPF, the Global Definitionsdocument is now automatically set for the Equations option of the new schematic.


Multi-Technology Projects


• When adding a new STACKUP in a schematic, the STACKUP now automatically uses the schematic's LPF.

Simulation WindowSimulation Window improvements include the addition of a Pause button and the addition of remote computing Sendingand Receiving job states.


Simulation Window


• Documentation: “EM: Job Scheduler”

EM Ports on SubcircuitsPorts can now be automatically added to EM subcircuits to greatly simplify creating EM layout with documents thathave high port counts. Select the EM subcircuits,


EM Ports on Subcircuits

then choose Draw > Create Ports from Subckt

and ports are automatically added at all possible locations.


EM Ports on Subcircuits


• Watch Video

EM Clip RegionThe EM Clip Region can be used to create an EM structure from a schematic layout. It can also be used to trim downcomplex EM layout, and reduce the simulation problem size.

To access this feature, select layout shapes then choose Draw > Create EM Clip Region.

In the Create EM Clip Region dialog box, select the Clip Region Style.


EM Clip Region


To create an EM structure, select the EM clip region and choose Layout > Copy to EM Structure.

For more information, see “Trimming with EM Clip Region ”.

AXIEM Advanced Frequency Sweep (AFS)The AXIEM AFS algorithm automatically selects a set of frequency points to simulate, then uses these simulated pointsto interpolate the S-parameter response for the whole band. AFS is now faster and more accurate, and generally convergeson a solution with fewer frequency points.

AXIEM Iterative SolverAXIEM simulations using the iterative matrix solver are faster due to simultaneous solution of multiple ports (right-handsides), assuming there is enough memory for the parallel solves. Structures with large port counts benefit the most fromthis improvement.

Analyst SolverImprovements to the Analyst solver result in up to a 50% reduction in simulation time compared with the V12 solver.

Analyst Frequency Sweep TypeWhen the Automatic sweep type is selected, the solver now uses either a Discrete sweep or a GAWE sweep dependingon which is likely to be faster for the given frequency count, port count, and parallel configuration.

Analyst PortAnalyst port definitions are expanded to provide greater control over port specifications.


AXIEM Advanced Frequency Sweep (AFS)

The new Lumped As In Child port type is used when the lumped port strap is already defined in the child arbitrary 3D EMsubcircuit (in the 3D editor). The newWave Custom Size port type allows specification of the wave port extent. This porttype may improve mode extraction when there are multiple conductors touching the enclosure side.

What's New in NI AWRDesign Environment 3–13

Analyst Port


• Documentation: “Adding Ports”

Analyst Antenna Analysis

Analyst Options

The solver option Field Output Frequency can now be set to "None" for antenna far field measurements. Setting "None"may decrease simulation time, and will decrease data set size.

The only option required for antenna analysis is the Antenna Far Fields option Output Frequency.

Approx Open Boundary Condition

Approx Open can now be used as a radiating boundary condition for antenna far field calculations. Using Approx Openinstead of a Perfectly Matched Layer (PML) boundary results in a faster simulation.

Spherical PML Boundary Condition

Specifying a spherical Perfectly Matched Layer (PML) boundary condition may result in a faster simulation than usingPML on a rectangular boundary, because the extrusion usually adds fewer elements to the mesh than it would in therectangular case.


Analyst Antenna Analysis

Analyst Surface Roughness ModelAnalyst now models the effects of surface roughness if a roughness parameter is specified.


• Documentation: “Loss Model for Conductor Surface Roughness”

Analyst AMR Convergence PlotReal-time AMR convergence is now plotted in the Simulation window.


Analyst Surface Roughness Model

Analyst 3D EditorSee Analyst 3D Editor Features for details on new features specific to the 3D Editor.

AWR Connected PartnersThe AWR Connected program enables the automated flow of layout data from NI AWR Design Environment (NIAWRDE)/MicrowaveOffice (MWO) software into partner simulators. Supported partners include ANSYSHFSS, Sonnet,and CST.


• Documentation: “EM: AWR Connected Partners”

PCB Import WizardThe 3Di Import Wizard is renamed to the PCB Import Wizard and now additionally supports importing IPC-2581 andODB++ files without any reliance on third-party tools. This wizard allows you to import IPC-2581 (A and B) and ODB++(V7 and V8) files that are produced by most enterprise board tools. Importing these files produces a schematic layoutrepresenting the board geometry along with a STACKUP element representing the board cross-section. This tool isintended for importing PCB designs and preparing them for EM simulation. In addition to the Import wizard, several


Analyst 3D Editor

features are added to the MWO Layout Editor to ease the selection of pieces of the board to create an EM structure andset up EM ports.


• Documentation: “PCB Import Wizard”

OpenAccess Import/Export WizardThis wizard allows importing and exporting individual schematics and project symbols from/to ADS and VirtuosoOpenAccess databases.


OpenAccess Import/Export Wizard


• Documentation: “OpenAccess Import/Export Wizard”

Synthesis WizardsThe Component SynthesisWizard andMixer andMultiplier SynthesisWizard are new in V13. The Component Synthesiswizard designs transformers, power dividers, and hybrids given a set of input specifications. Likewise, the Mixer andMultiplier Synthesis Wizard designs various mixers and doubles given a set of input specifications.


Synthesis Wizards


Synthesis Wizards

iFilter WizardiFilter now allowsmanual placement and distribution of transmission zeros. For a standard bandpass filter implementation,zeros can be weighted on the low side or the high side of the passband, allowing for extra emphasis on filter rejectionfor the selected side. In addition, transmission zeros can be added manually at any desired frequency. iFilter allows forautomated extraction of zeros and automated implementation of producibility transforms, or these functions can beperformed in full manual mode. As always, the completed filter may be implemented in Microwave Office with a singleclick for further refinement and optimization.


iFilter Wizard


• Watch Video

AWR RF Board Libraries UpdatesThe AWR RF Board libraries AWR_RFBoard_2layer_FR4, AWR_RFBoard_2layer_RO4003, andAWR_RFBoard_2layer_RO4350 are replaced with the AWR_RFBoard_2layer library. See “AWR RF Board Libraries”for migration issues.

This new library includes:

• Additional global variables for all substrate and solder mask parameters except for substrate conductivity. STACKUPs,VIAs, and MSUBs to point to these variables where applicable.

• Renamed MSUBs for Line Type for synchronization.

• Negative thickness definitions in STACKUPs.


AWR RF Board Libraries Updates


• Additional user attributes for resistors, inductors, and capacitors to indicate mounting layer and case size as well aslayer attributes for vias and DC headers.

• Additional static EM cells for QFN and MMIC structures for use with Analyst simulations.

• An additional 3D EM Elements library, with end launch connectors for use with Analyst simulations.

Minor ImprovementsMWO V13 includes the following minor new features, enhancements, and user interface changes.

New/Updated Examples

The following are new or updated NI AWRDE examples for V13. To find an example, choose File > Open Example andtype the example name.

• Amplifier_Phase_Noise.emp

• Coax_Fed_Patch_Antenna.emp

• CoffeeCanRadar_SMT_Redesign.emp

• Inverted_F_Antenna.emp

• TESTBENCH_PA_Two_Tone_Sweep_Freq_and_Spacing.emp

New Circuit Models

The following new circuit models are included in MWO V13.

• “N Port Negation Element (Closed Form): NEG”

• “Port with Modulated Signal (Data File-based): PORTIQ_ENV”

• “Port with Modulated Signal (Data File-based): PORTMOD_ENV”

New 3D EM Parts

The following new 3D EM parts are included in MWO V13 for use with the Analyst 3D simulator.

• “Copper Pillar Bump with Tin Cap: CU_PILLAR”

• “MMIC Substrate with Bond Pads: MMIC_3D”

• “Solder Trace: SOLDER_BLOB ”

• “Solder Joint Fillet: SOLDER_FILLET ”


Minor Improvements

New Circuit Measurements

The following new circuit measurements/annotations are included in MWO V13.

Nonlinear Power Measurements

• “Available Power: PAvail ”

Nonlinear Envelope Measurements

• “Envelope Current Spectrum at Specified Carrier: Ispectrum_ENV”

• “Time Domain Current: Itime_ENV”

• “Time Domain Current Envelope at Specified Carrier: Itime_f_ENV”

• “Envelope Voltage Spectrum at Specified Carrier: Vspectrum_ENV”

• “Time Domain Voltage: Vtime_ENV”

• “Time Domain Voltage Envelope at Specified Carrier: Vtime_f_ENV”

• “Envelope Power Spectrum at Specified Carrier: Pspectrum_ENV”

• “Time Domain Power: Ptime_ENV”

• “Time Domain Power Envelope at Specified Carrier: Ptime_f_ENV”

Linear Measurements

• “Compute Network Terminated S-parameters: S_TERM”

Output File Measurements

• “Write Envelope Data to File: ENVELOPEF”

Load Pull Measurements

• “Minimum Value for Generalized Load Pull Data: G_LPCMMIN_EX”

• “Generalized Load Pull Contours Aligned to a Value Over Any Sweep: G_LPCM_EX_A”

• “Plot Load Pull Gamma Points from Aligned Measured Load Pull File: G_LPGPM_A”

• “Generalized Interpolated Load Pull Data Points (Reversed Data File Definition): G_LPINT2”

• “Plot Dynamic Load Line for Load Pull Data: G_LP_IVDLL ”

Analyst

• For ports-only simulation, set the new Solve Type option to Ports Only.

• Analyst arbitrary 3D parts now remain the same size when project units are changed. This change only applies tonewly instantiated 3D parts.

• Various issues with foreign characters in project names and paths are resolved.

Geometry Simplification Rules

• A new rule, SET_RESIZE_CORNER_STYLE <round|sharp>, specifies how the RESIZE operation rounds acutecorners.


Minor Improvements

HSPICE

• Corrected the terminal current direction for IVCURVEI netlisted to HSPICE or Spectre.

• Corrected the current direction when using current annotations for some components netlisted to HSPICE or Spectre.

• The RLGC_TX model now works with the HSPICE transient simulator.

Layout

• You can now use Edit in Place with subcircuits containing parameterized layout.

• A new Draw > Modify Shapes > Modify Corners command performs the same operations as the Corner Modifier but onselected shapes.

• The Drawing Layer Options dialog box now supports multi-selection.

• The Layout Options dialog box has a new Boolean tab. New options include Cutout processing and Resize acute corners.

• 2D layout now supports translucency like the 3D layout view.

• Parameterized subcircuits used in multi-technology hierarchy now display on their own drawing layers.

• The GDS Compare command allows you to choose the export mapping to use when multiple mappings exist, andfunctions better under those conditions.

• Bondwires and other EM 3D pCells used in an Analyst EM structure that is placed as a subcircuit in a schematic nowdisplay in the schematic layout 3D view.

• Parameterized subcircuits where the parameter is passed up through hierarchy now display properly in the 3D view.Previously the subcircuit did not display.

• The Connectivity Highlighter now displays properly in a 3D view with multiple technologies.

• Updated the Slice command to function better when holding down the Ctrl key to access gravity snap points.

• Non-orthogonal iNet routes now support rounded and chamfered end styles.

• Fixed schematic 3D layout so that EM subcircuits with parameterized STACKUP parameters now display with correctparameter values in the schematic 3D layout view.

Layout - EM

• When you change a "Material" name in an EMSTACKUP, the name change now synchronizes with any "EMMapping"entries that used that original name.

• Parameterized length variables for newly created arbitrary 3D EM subcircuits and 3D EM elements are now assignedlength units, so that length values scale appropriately with project unit changes.

• Updated the Draw menu for EM layout to add the Add Shapes command for via fills and via fences.

• Improved the processing time of geometry simplification rules.

Load Pull

• Fixed bugs with Import_Loadpull_Files script.

• Fixed "No contours were found" Load Pull measurement error.

• PLoad_Total is now included as a calculated value for Load Pull measurements.

• The Load Pull Import script now supports source pull format for LPC and CST file types.


Minor Improvements

Measurements

• Two-port measurements NF, NFMin, GMN, YMN, ZMN, RN, TE, NMEAS, TN, GMax, GU, K, B1, MU1, MU2,MSG, GA, GP, GT, GM1, GM2, YM1, YM2, ZM1, ZM2,SCIR1, SCIR2, GACIR, GAC_MAX, GPCIR, GPC_MAX,NFCIR now function with n-port documents.

• Modified the Q_IN and Q_IN2 measurements to provide positive values for both inductive and capacitive networks.

Models

• A new IsSubInf secondary parameter for CPWTAPER controls whether it is modeled with a closed form or quasi-staticEM model.

• Improved accuracy for physical transmission line models TLINP, TLOCP, TLOCP2, TLSCP, TLSCP2, TLINP4,TLINP4T, TLINP4NL, and CLINP. A new LossModel secondary parameter can be set to "Full" to model multiplesources of loss including frequency-dependent dielectric parameters, which can improve time domain causality.

• VIAM Top_Cap and Bot_Cap parameters have additional options "Inside Antipad with Pad" and "Inside Board &Antipad with Pad".

• The PORTSIG_F, PORTSIGF_F, and PORTMOD_F models now support drop-down options to change the "Net"parameter for any text files loaded into the project.

• Improved the UCSD HBT model with ADS compatibility set.

• A secondary parameter, GAIN_BACKOFF, is added to the XDB block to control linear gain input power backofffrom nominal input power.

Output Files

• The AntPat_TPwrF and AntPat_EF output file measurements can now write to MATLAB files.

• The NPORTF Output File measurement has a newWrite Noise for Active 2-Port Source option which allows you to omitnoise data from the file. Also, the reference impedance setting can be made zero to have the normalizing impedanceautomatically set from the port 1 termination impedance.

• The NPORTF Output File measurement now generates a valid default file name extension based on the number ofports (for example, *.s4p) when clicking the browse button (...).

Remote Computing

• Analyst and AXIEM documents that are set to simulate remotely now mesh locally.

• Remote simulation Status updates are now available over VPN.

Schematic Editor

• The schematic symbols for elements with vector instance specifications are now drawn in bold, with the line weightmatching that used for buses and bundles.

Scripts

• The Generate_MDIF_Files script is updated to better handle files with > 10 ports. Efficiency improvements result inapproximately 10x speed improvement (mostly evident on large port count files).


Minor Improvements

Shape Modifiers

• Interactive shape modifier debugger: (“Debug Cell Instance Dialog Box”)

Simulation - Nonlinear

• The simulation Status Window now displays Time Domain simulation updates.

Simulation - APLAC

• Added support for nested frequency sweeps for tones 2 and higher. See example:TESTBENCH_PA_Two_Tone_Sweep_Freq_and_Spacing.emp.

• A new option permits storage of simulation results only for active measurements.

• APLAC linear simulation when optimizing is now significantly faster.

• APLAC simulators can now handle MDIF files with blocks that have different frequency ranges.

• APLAC simulation of MDIF files is now significantly faster.

Simulation - Analyst

• Analyst can now simulate with wide characters in the project path.Wide characters are typical of non-English languagesettings on the operating system.

• The "Sphere X" and "Sphere Z" options for Antenna Far Fields are removed. You can make the Analyst structure asa subcircuit and rotate it to obtain the pattern at an appropriate coordinate system.

• Mesh connectivity annotation in Analyst now properly displays the mesh and connectivity of a swept geometry EMstructure.

Simulation - AXIEM

• The AFS convergencemeasure in the Simulation log now reports themaximum convergence error of the AFS sub-bandsrather than the convergence measure of the entire band. This is a better measure since the simulation can completewhen all of the sub-bands converge.

• The AXIEM direct solver now predicts memory requirements and stops with an informative error message if there isnot enough available RAM, rather than crash or use the impractically slow virtual memory.

Symbols

• The Symbol Editor now supports a smaller minimum text size and the ability to rotate text.

Tuning, Yield Analysis and Optimization

• The Cost column on the Goals tab of the Optimizer window now updates in real-time during optimization.

• Fixed several issues with in-situ annotations EM_CKT_CURR and ANTENNA_CKT_3D. Annotations now updatecorrectly in the 3D view when tuning.

User Interface

• EM structures now support use of the Shift + F2 keys for editing the document name in the Project Browser.


Minor Improvements

• Added support for the CTRL+A Select All shortcut to the Rules tab editor for the STACKUP and the Shape Preprocessormodifier.

Wizard - IFF

• Added support for importing ADS XFERTAP, STATZ, and TERMG components.

• Equations are now automatically rearranged on the schematic, so that variables are defined before use.

• Added support in the IFF Import Wizard for the TanD, Mur, TanM, and Sigma parameters in ADS TLINP/TLINP4components.

Wizard - Stability Analysis using STAN

• STAN now supports power sweep.

• STAN now functions correctly with schematics that have Touchstone data file subcircuits.


Minor Improvements


Minor Improvements

Visual System Simulator (VSS) FeaturesThe NI AWRVisual System SimulatorTM (VSS) version 13 software includes the following new features, enhancements,and user interface changes. The NI AWR Design EnvironmentTM (NI AWRDE) changes also apply to these specificproducts.

VSS Output FileA newOutput File measurement is added to export VSS RF link characteristics. The “Write VSS RF Link Characteristicsto Text Data File: RFA_TDF ” output file measurement writes a “Nonlinear Behavioral Model (File-Based): NL_F”compatible text file that included information on fundamental input, fundamental output, IM products (for 2-tonesimulations), harmonics (for 1-tone simulations), S11, S22, characteristic input and output impedances, and noise figure.

RFI Spurs Output FileRFI signal heritage information can be exported to an .xml file. From the Signal Heritage dialog box, click on the Exportbutton:


to open the Export Options dialog box.


RFI Spurs Output File

TDMS File SupportThese new block are used to support TDMS files in VSS Time Domain simulations:

• “TDMS File Source: TDMS_SRC ”provides direct access to channels for analog data and to channel groups for digitaldata. TDMS_SRC blocks may be configured with multiple output ports, with each port representing a different channelor channel group.

• “TDMS File Independent Variable Source: TDMS_IVARSRC ”, which only works with analog waveforms, supportsindependent variables. Common properties of channels within a channel group are identified as independent variables.These variables then appear as parameters of the block and are used to select a channel at simulation time. Anexample-independent variable is the signal power level.

• “TDMS File Sink: TDMS_SNK ” is used to create a TDMS file containing the samples from one or more input ports.Samples from real or complex input ports are written to channels, while samples from digital input ports are writtenas a group of channels within a channel group.

System Load PullSystem Load Pull for VSS measurements such as ACPR and EVM is now supported.


TDMS File Support


• Example: System_Load_Pull.emp

LTE-A Library ImprovementsCarrier aggregation, with intraband and interband component carriers are now supported. Throughput measurement ofcombined component carriers is now supported.

Expanded Radar LibraryMultiple and variable RF radar sources are now supported.

Improved Phased Array ModelsThe new VSS “Phased Array Assembly, Data-file based: PHARRAY_F ” block allows you to simulate phased arraysand model specific RF links and antenna patterns for individual elements in the array. In addition, the model can accountfor mutual coupling between elements, allowing further insight into the array performance. PHARRAY_F makes it easyto configure very large phased arrays, with standard or user-defined geometries or gain tapers, for example. The uniqueNI AWRDE capabilities allow you to measure the phased array response and investigate effects of RF link nonlinearities,gain and phase errors, element failure, and also perform yield analysis based on the tolerances of individual elementparameters.


LTE-A Library Improvements


Improved Phased Array Models

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• Example: Phased_Array_PHARRAY_F.emp

5G LibraryImplemented a number of 5G candidate modulation waveforms, such as FBMC, GFDM, and filtered-OFDM. Addedfunctionality includes signal generation and demodulation to allow for full system simulation and BER measurements.


• Examples: 5G_BER_Analysis_FBMC.emp, 5G_EVM_ACPR_Analysis_FBMC.emp,5G_PA_Analysis_FBMC_GFDM_OFDM.emp


5G Library

Minor ImprovementsAWRVisual System Simulator (VSS) V13 includes the following minor new features, enhancements, and user interfacechanges:

New/Updated Examples

The following are new or updated NI AWRDE examples for V13. To find an example, choose File > Open Example andtype the example name.

• 16APSK_Modulation.emp demonstrates how to simulate 16APSK modulation.

• Circuit_Envelope_Cosimulation_with_VSS.emp demonstrates circuit envelope co-simulation with VSS.

• CoffeeCanRadar_SMT_Redesign.emp shows the design and simulation of a FMCW radar.

• LMS_Multipath.emp performs better in most configurations and is easier to integrate into other systems.

• LTE_NBIoT_UL_Coexistence_TestBench.emp demonstrates operation of NB-IoT in the guardband of an LTE signal.

• NBIoT_Guardband_UL_RX_TestBench.emp demonstrates performance of LTE UL coexisting with NB-IoT uplinksignal.

• NBIoT_Inband_UL_RX_TestBench.emp demonstrates operation of NB-IoT inside an LTE signal band.

• NBIoT_UL_RX_TestBench.emp demonstrates NB-IoT uplink signal.

• NL_F_Freq_Dependent.emp shows how NL_F can be used to accommodate frequency-dependent AM/AM andAM/PM characteristics.

• Phased_Array_PHARRAY_F.emp shows how to use PHARRAY_F to simulate phased arrays and model specific RFlinks and antenna patterns for individual elements in the array.

• RFI_Spur_Identification_Script.emp contains a “spur finder” script that identifies all the spurs above a pre-definedlevel for specified ranges of RF and multiple LO frequencies.

• VSS_TI_TRF370417_Quadrature_Modulator.emp models TI's TRF370417 Quadrature Modulator.

New System Blocks

The following new system blocks are included in VSS V13.

Coding-Mapping Blocks

• “Barker Code Generator: BARKER”

• “Zadoff-Chu Sequence Generator: ZADOFF_CHU”

5G Modulation Blocks

• “FBMC Modulation Block: FBMC_MOD”

• “FBMC Demodulation Block: FBMC_DMOD”

• “GFDMModulation Block: GFDM_MOD”

• “GFDM Demodulation Block: GFDM_DMOD”

• “Subcarrier Mapper: SC_MAP”

• “Subcarrier Demapper: SC_DMAP”


Minor Improvements

TDMS File Blocks

• “TDMS File Independent Variable Source: TDMS_IVARSRC ”

• “TDMS File Sink: TDMS_SNK ”

• “TDMS File Source: TDMS_SRC ”

RF Blocks

• “IQ Imbalance: IMBAL_IQ”

• “Lossless Tuner: LTUNER”

• “n Port S Parameter Block: SnP_BLK”

• “n Port Y Parameter Block: YnP_BLK”

• “n Port Z Parameter Block: ZnP_BLK”

• “Phased Array Assembly, Data-file based: PHARRAY_F ”

New System Output File Measurements

The following new system Output File measurements are included in VSS V13.

• “Write VSS RF Link Characteristics to Text Data File: RFA_TDF ”

Data Sets

• VSS data sets may now be pinned to the document.

Measurements

• Added LTE RFmx measurements as a result of integration with NI RFmx/Toolkits.

• The RF Budget Analysis measurements C_SNR and SPWR_node now account for correlated signals at combiners,similar to P_node.

Simulation

• VSS Time Domain simulations now support simulation filters.

• Eliminated NL_S redundant co-simulations when there are SWPVAR blocks in MWO schematics.

• Improved VSS memory performance with large sweeps.

System Block Updates

• VSS ANTENNA and PHARRAY_ANT blocks now support specifying the signal direction using U/V coordinates aswell as THETA/PHI angles.

• VSS blocks that support multiple data groups, such as NL_F with independent variable support, now support anINCLUDE property for including other text data files.

• FREQS_OUT and FREQS_LO parameters are added to the mixer blocks to simplify the specification offrequency-dependent output and LO related parameters. These parameters allow frequencies for those settings to bespecified separately from the frequencies for the input settings.


Minor Improvements

• The 2nd order and 4th order products generated by nonlinear amplifiers are adjusted to properly account for phaseshifts due to impedance mismatch effects. Previously the phase shifts were ignored.

• TheMixer blocks now properly account for the signal delay introduced by internal filters when frequency-dependencyis specified.

• MIXER_B and MIXER_B2 are updated so that when LOMULT is specified as something other than 1, the P1dB andIP3 settings apply to the final IF signal for RFB/RFI simulations (the settings were already applied to the final IFsignal for TD simulations). You can still select the previous behavior (to apply the P1dB and IP3 settings to the 1,1or 1,-1 output) via the new LOMULTMODE secondary parameter.

• When using NL_F with behavioral parameters such as P1dB or IP3, NL_F would use a measurement reference level(MEASREF) of the operating point if input levels were not specified. This did not match the behavior ofAMP_B/AMP_B2. NL_F now does not set a measurement reference level in this case to more closely match thebehavior of AMP_B/AMP_B2.

• NL_F now chooses "Data set closest to simulation frequency" for FRQDEP if FRQDEP is set to "Auto" and the datafile contains two tone data. This allows modeling of differing lower and upper IM products. Previously "Frequencyindependent" was selected if there was only one set of two tone data.

• Added pre- and post-filters for AM/AM-AM/PMmodel to NL_F andNL_MDIFwhich include a newAMPMFRQDEPparameter for controlling how filtering is to be applied.

• Support for passing parameter values to the schematic via parameterized equations is added to NL_S_ENV.

• The RF dynamic switches RFSW_1nDYN and RFSW_n1DYN support for primitive blocks on their control signalinputs in RF Budget Analysis and RF Inspector simulations is improved.

• Improved frequency-dependent parameter calculations for AMP_B2 model.

• In the VSS behavioral amplifiers AMP_B, AMP_B2, etc., when the amp was configured with frequency-dependentsettings and the center frequency to sampling frequency ratio was high (the amp decided it was narrowband), theresults would be poor when ALIAS = "Auto" because the AM/AM-AM/PM implementation was chosen. This ischanged so when AALIAS = "Auto" and the signal is narrowband, it is still treated as if it were broadband. The typicalnet result is that a polynomial implementation is chosen, which models frequency-dependencies better than theAM/AM-AM/PM implementation.

• NL_S now allows you to control whether RFB, RFI and TD simulations utilize the S11 from the co-simulation. Thisis done via the new S11USERFB, S11USERFI, and S11USETD parameters. Previously, the S11 from the co-simulationwas used by RF Inspector simulations, but not RF Budget Analysis nor Time Domain simulations. Now by defaultRFI and RFB simulations use the S11, while TD simulations ignore the S11.

User Interface

• The VSS Simulation Status dialog box now displays total sweep progress.


Minor Improvements


Minor Improvements

Analyst 3D Editor FeaturesThe AnalystTM 3D Editor version 13 software includes the following new features, enhancements, and user interfacechanges. Open Help from within the 3D Editor for more documentation specific to the 3D Editor.

Environment

Units

Both "microns" and "micron" can be used as an alternative to "um" in expressions.

Foreign Characters in Projects

Analyst now supports the use of foreign characters in project file names and paths.

Structure and Annotation View Keyboard Camera Interaction

These views now support using the keyboard for camera rotation, panning, and so on. See the Analyst User Guide fordetails.

Variables

Auto-Complete

When editing an expression in a property grid, or in the Variable Control or Value Set Management dialog box, a list ofavailable variables, built-in constants, and functions is presented in a list box. This list is dynamically filtered as youtype to show items that match the content being typed. Items from the list can be selected with the up/down arrow keysor by clicking on them. The selected item can be used to replace the word under the cursor by pressing the Tab or Enterkeys or by double-clicking. As functions are selected in the list, a tooltip displays to the right of the item to provide anitem description. For variables, the expression is shown, and for constants, the numeric value is shown.

Grouping

The Variable Control now includes a "Group" column that can be used to specify which group a variable belongs to.


You can type a new group name directly into the drop-down box and click the Edit Groups button to control groupvisibility and rename and delete groups. See the Analyst User Guide for details.

Sorting

The contents of the Variable Control can be sorted by variable name or group by clicking the table column header.

Value Set Management Dialog Box

The Value Set Management dialog box is redesigned to make it easier to observe differences between value sets. It alsosupports editing, duplication, and renaming of value sets.

New Functions

• An overload of the cellvalue function is added in which the row and column are specified by header name instead ofindex.

• A round function is added to support rounding a number to the specified number of significant figures.


Environment

Geometry

Solid/Element Browser Organization

Solids and elements can now be organized in several ways in the Browser, including in User folders. This functionalityis accessed by right-clicking theGeometry node in the Browser and choosing Solid/ElementOrganization and an organizationoption. that allows you to perform various actions on all solids included in the folder. See the Analyst User Guide fordetails.

• Creation Order - Solids and elements are displayed in the order in which the solids or elements were created. Userfolders are visible. This is the default ordering.

• Alphabetical - Solids and elements are displayed in alphabetical order. User folders are visible.

• By Material - Solids are displayed within folders that represent used Materials. This has no impact on sketch elements.

Shaded Without Edges View Style

In addition to Shaded andWireframe styles, you can now display faces without edges to help in face picking in geometrieswith large edge counts.


Geometry

Swept Solid Type Conversion

Transitioning from 2D to 3D is now easier by switching between a sketched Sheet (2D), extrusion, and revolution bychoosing Convert To XXX from the solid's Browser context menu.

Box Type

The box solid now includes a Type parameter that allows for a Start and End Corner definition as an alternative to thedefault Corner and Extent definition. This addition can make certain parameterizations easier.

Excluding Operations

All non-creation solid and element operations now expose an Include parameter that allows for the operation to beexcluded from the regeneration process. This can be used to parametrically exclude an operation such as a rotation froma solid or element.

STL Export

Geometry can now be exported in STL format for use in 3D printing.

Face/Edge Extrusions

This command now supports extrusion of an edge into a face. The default direction of an edge extrusion is normally tothe largest face that contains the edge. This has a variety of uses, but a primary use is to create patches for lumped portsas shown in the following figure.

Importing Multiple Files

The dialog box used to import SAT, IGES, STEP and other file types now supports multiple file selection so that severalfiles can be imported in a single operation.

New Import File Formats

Import of binary ACIS (.SAB) files is now supported.


Geometry

Simplify Parameter for Extrusions and Revolutions

Sketch-based and face/edge-based extrusions and revolutions now provide a Simplify parameter. If "True", adjacentcolinear element/edges produce a single face; otherwise they produce adjacent coplanar faces. This is useful if you needto apply separate attributes to such adjacent faces.

Sketched-Based Solid Type Conversion

Sketch-based solids can now be converted from one type to another using Browser context menu options. For example,you can convert a Sketched Sheet (2D) to a Sketched Revolution. This conversion maintains the contents of the sketch,however, you must revisit attributes.

Solid, Element and Operation Order

Solids, elements, solid operations and element operations can be reordered in the Browser by dragging the nodeabove/below another node. The order can also be changed by right-clicking a node and choosing Move Up or Move Down.

Sketcher Improvements

Polyline Blends

Interior points of polylines can now be blended (fillet/chamfer). This feature is accessed on the Sketch ribbon in theElement Modification group by clicking Blend. See the Analyst User Guide for details.

Construction Elements

All sketch elements now include a Construction Only parameter. If this value is "True", the element is ignored duringcovering although it can be used for snapping, and related operations. Such element lines are rendered using a dashedline.

Joining of Lines and Polylines

Adjoining lines and polylines can be combined into a single polyline. This is particularly useful if you then need to applyblends to the resulting polyline. This feature is accessed on the Sketch ribbon in the Element Modification group by clickingJoin.


Geometry

Elliptical Tangent Arc Element

You can now draw an elliptical arc specified by 2 tangent lines and a start and end point. The axes orientation canadditionally be chosen from a list of options.

Point Element

You can now draw a point element. By definition, this is a construction-only element and exists strictly for snapping,and other related operations.

Center-based Circle Element

You can now draw a circle defined by a center and radius.

Calculations and Query Dialog Box Improvements

Length Unit

You can now override the working length unit in this dialog box.


Geometry

Vector Component Clipboard Copy

You can now copy a specific component of a vector cell to the Clipboard.

Attributes

Application Count Indicator

Browser nodes for attributes include a suffix that indicates how many bodies, faces, and edges the attribute is appliedto, as shown in the following figure. To turn off this feature, on the Home tab in the Settings group, click Environmentand choose Properties from the drop-down menu to display the Environment Properties dialog box. Under Browser setthe Show Attribute Application Information (Structure Browser) property to "False".


Attributes

Folder Visibility

Like the Geometry folder in the Browser, the Materials and attribute folders now display a light bulb icon that can betoggled on/off to show or hide the contained items. This option is useful if, for example, you want to hide all faces withmesh constraints.

Attribute Propagation Through Booleans, Lofts, or Other

When creating a Boolean, loft, or other, attributes on the stocks and tools are now automatically propagated to the resultingsolid whenever possible. In earlier versions, these attributes were removed automatically.

Attribute and Material Order

Attributes and materials can be reordered in the Browser by dragging the attribute/material node above/below anothernode. The order can also be changed by right-clicking a node and choosing Move Up or Move Down.


Attributes

Version 13.03 UpdatesThe NI AWR Design EnvironmentTM (NI AWRDE) version 13.03 includes the following new features, enhancements,and user interface changes.

New 3D EM Elements• “PCB Edge Wrap: EDGE_WRAP_3D”

• “Dielectric Cover/Air Pocket: GLOBTOP ”

Updated Example Libraries• AWR_Module PDK scripts that hide/show flood and keepout regions are now functional.

• AWR_RFBoard_2layer PDK updates:

• Updated both flat and PCELL QFNs to better conform to RF industry standards

• Fixed library 1, 2, & 3 bondwires H2 and Beta to connect properly with default parameter

• Corrected DXF export mapping for +/- layers export

• Updated IC_GaAs library element HiK dielectric value to have more reasonable tand

• Configured global page so project units are more easily changed and relations are unaffected

• Added Air_h parameter to Stackups for easier scaling

• Added substrate Monte Carlo analysis tolerances to Globals which affect MSUBs and STACKUPs

• Added handy PDK toolbar with SimulateOpenGraphs, GerberFileExport, and ToggleBackground Color buttons

API• The Tuner object has a new Visibility property that both checks and sets whether the Tuner window is visible orhidden.

• Fixed an issue with setting values for enumerated API options which do not take sequential values.

• Added API access to the Options collection for EM3DStructure objects.

• Schematics window-in-window embedded graphs now print the graphs with the same resolution whether the printoperation is initiated by API methods or from the NI AWRDE.

• Added support for enabling and disabling state job queues in the Job Scheduler configuration via the API.

Data Sets• Fixed a data set lock issue that caused unnecessary EM resimulations.

Graphs• Yield Analysis results now display Antenna Plot graphs correctly.

• Graphs with RF Budget measurements from different system diagrams now have a correct x-axis while the VSS TimeDomain simulator is running.


Job Scheduler• From the Scheduler node, you can now remotely install/uninstall the NI AWRDE on remote compute node serversrunning AWR_JobScheduler service version 13.02+. See Compute Node Remote Update for details.

• Several Job Scheduler crashes are now fixed.

• An intermittent deadlock no longer occurs during job cancellation.

• Jobs with Min Processors per Job set to "0" now run on machines with more than 8 logical processors.

• A new ReservedSystemMemory option in the jobschedulersettings.xml file limits how much memory a job can utilizeby reserving an amount of memory from being allocated to a job. The default reserved value is the smaller of 20% ofthe system memory or 2 GB. An error is issued for the job if it reaches this limit.

• The Job Scheduler shut-down sequence is now faster.

• Remote connections between computers are now faster, and recover better from network drops.

• Increased connection wait timeout, which should help remote computing connection issues on degraded networks.

• Remote status is now returned to user computers for scheduled jobs that start up while the user computer is disconnectedfrom the Scheduler node. Remote status resumes when the user reconnects to the Scheduler.

• The Simulation dialog box now displays the status of remote jobs on the remote machine, and matches the informationon the Job Monitor that is pointing to the remote machine.

Layout• MTRACE and MCTRACE layouts are now consistently correct after being stretched.

• Shapes drawn on multiple layers now consistently display when zoomed in on a small edge.

• Polygons drawn on a multi-layer line type with coincident points are now correctly drawn.

• Subtraction operations between shapes drawn on multi-layer line types now consistently produce correct results.

• Fixed a routing issue where using coordinate entry to just change layers would sometimes also add an additionalsegment.

• A warning message now displays in the Status Window when Lock Hierarchical Updates is enabled (choose Layout> Lock Hierarchical Updates). A Warning dialog box also displays when exporting a layout (choose Layout > ExportLayout).

Layout - EM• Mirroring a bond-wire cell in EM layout no longer sometimes results in the cell being placed at a large offset insteadof the correctly mirrored position.

• Zero-thickness impedance materials are now transferred correctly as thin metals in the Preview Geometry structure.

• EM ports no longer move to another shape when viewed in the Preview Geometry window.

• The outline of a copied pCell with dynamic parameters now consistently displays correctly while it is being draggedbefore placement.

• Fixed a regression in which the EM Layers pane became unresponsive if the Drawing Layer pane was not open.

• EM 3D Layout shapes no longer lose their fill and display in wireframe in certain situations.


Job Scheduler


Load Pull• Added input return loss (IRL) contours/values for various Load Pull measurements.

Measurements - Circuit• Markers now remain associated with a measurement when the measurement changes.

Measurements - Systems• Using a PWR_SPEC measurement in an output equation no longer causes a crash.

Models - Circuit• The EEHEMT model and large signal APLAC simulations now support PDK models that do not use the LShuntparameter.

• The PORT_PS2 model Fdelt parameter is now tunable.

• The PORTIQ_ENV model PWR parameter can now be swept.

• Fixed Singular Y Matrix simulation errors with compiled models.

Models - System• The PHARRAY_RXSIG block has a new MEASBHV parameter which controls whether or not measurements thatsupport PHARRAY_RXSIG adjust results for the number of channels.

• The AMP_B model with its FRQINTRP (frequency interpolation for frequency dependency) parameter set to "CubicSpline" no longer causes floating point overflow errors.

• A warning is now issued if the NL_F block DFTYP parameter is not set to "Auto".

• The LTE library is updated to reflect the latest improvements in VSS modulation/demodulation capabilities.

Scripts• The VSS XML Generation script now allows you to add custom descriptions to parts in the library.

Shape Modifiers and Geometry Simplification (SPP) Rules• Shapes can no longer be lost when using the Boolean engine in SPP rules.

• Fixed a small cutline gap created by LAYSPPMOD using the Clipper Boolean engine.

Simulation - Analyst• Analyst Boundary Condition annotation now immediately updates when layout is edited.

Simulation - APLAC• Fixed XPARAM simulations with data files that are tabulated as a function of GP_2_1 and 2-tone data files that aretabulated as a function of AM, and both AP and AN are defined outside the block.


Load Pull

• N-tone frequency or power sweep simulation now works with XPARAM files that contain only one gamma value foreach frequency or power-level data block.

• APLAC simulation results are no longer missing when pass-down variables are swept.

• SDiode tunneling current is no longer set to zero if the sidewall tunneling current is zero.

• Improved PINDRC model ADS compatibility.

• Improved UCSD_HBT model ADS compatibility.

Simulation - AXIEM• Improved AXIEM modeling of floating ports, which fixes the issue of significant voltage or current on open nodes inDC analysis of AXIEM subcircuits.

Simulation - Extraction• HFSS no longer resimulates Extracted EM structures which have current data sets.

Simulation - Systems• When an RF Budget Analysis measurement is connected to an M_PROBE, and the M_PROBE is connected to a portof a subcircuit, the port of the subcircuit is now used as the display point in the graph. Previously, the port of the blockinside the subcircuit that was connected to the subcircuit port was used as the display point in the graph.

• In RF Inspector simulations if the LO of a mixer is generated from a pair of image reject mixers, the output of themain mixer is no longer too high.

• An RFI simulation crash no longer occurs when impedance mismatch is enabled.

• Fixed a VSS floating point error.

• Using a CHANGE_FS block with its FSOUT parameter left empty with either certain blocks downstream (for example,FIR_IMP) or no blocks downstream that specified a sampling frequency, no longer results in a "Node properties notpropagated" error reported for the downstream block.

• NL_S_ENV no longer generates an error if there are more ports in the circuit than defined in the NL_S_ENV block,and the maximum port number in the NL_S_ENV block is less than the maximum port number in the circuit.

User Interface• Window-in-Window now works with 3D layout of arbitrary 3D EM structures.

• The Tools > Create New Process command now finishes without extraneous "Missing LPF" messages to dismiss, andnow creates a simpler sample design.

Tuning, Yield Analysis and Optimization• Circuit envelope simulations no longer generate errors when tuning, optimizing, or running yield analysis.

• Optimizing goals that include nonlinear stability analysis results from the STAN wizard no longer causes a crash.

• Tuning an NPORT_F parameter no longer causes an error with APLAC simulators.


Simulation - AXIEM

Wizards - IFF Import/Export• Enhanced the component parameter mapping in the IFF Import Wizard to allow mapping of enumerated parametervalues using strings for the MWO values.

• The IFF Import Wizard now inserts a '0' at the beginning of NCONN names that start with an underscore character inorder to make the name compatible with NI AWRDE name restrictions.

Wizards - PCB Import• Importing a 3DI file when there are no global definition documents named "Global Definitions" now works.

• Implemented the possible per file units overrides per the ODB++ standard.

Wizards - RF Budget• Cascaded headroom (C_HDRM) measurements now properly display in the RF Budget Wizard.

Wizards - Symbol Generator• The Symbol Generator Preview function now works with system diagrams.


Wizards - IFF Import/Export


Wizards - Symbol Generator


New 3D EM Elements• “IC Conductive Pedestal: PEDESTAL”

New Knowledgebase Examples and Guides• Time_Freq_Compare.emp

• Temperature_with_the_AWRDE.emp: The Use of Temperature in Simulations

API• Querying an API measurement object for a trace with an out-of-range index no longer causes a crash.

• Attempting to add a marker via the API to a measurement that is in error no longer causes a crash.

• Using the API to get the count of the number of items in an empty TreeNodes collection now functions correctly.

• Using the API to import a process library with a reference to an LPF file with the same name as the default LPF nowreplaces the default LPF, and no longer results in merged values when the project is later saved and reopened.

• Adding an EM port through the API no longer ignores the specified port number and uses the next available.

• Using the API to add an EM port to an Analyst structure no longer places an invalid port type.

Geometry Simplification (SPP) Rules• In SPP rules, operations which accept layer lists now process correctly if the specified list has no shapes. Previously,the operation would be run on all shapes in the layout rather than no shapes.

Graphs• Using an auto-search marker to find peaks/valleys on a graph of data from VSS no longer causes a crash.

Import/Export• Import Project now correctly imports EM structures containing parameterized arbitrary 3D EM subcircuits. Previously,parameters on the arbitrary 3D EM subcircuit were reset to default values upon import.

Job Scheduler• Remote computing file transfer protocol is switched from using pipe IPC to OS command file copy. The result issignificant speed improvements in transferring simulation files from the user computer to the scheduler node, and intransferring data sets from the remote computers back to the user.

• Analyst mesh jobs now run in parallel with local and remote simulation jobs.

• Improved the detection of circular remote host connections, in which a remote computer lists itself as remote host.Previously this resulted in the remote computer crashing.


• Improved the reliability of remote simulation Status returning to the user computer in cases of network drop or serverrestart.

Layout• Subcircuits implemented as artwork cells are now consistently selectable in layout.

• Modified drag handle selectability to be consistent with layer visibility. This allows easier editing of multi-levelstructures by turning off upper layers to access edit handles of the deeper layers.

• The layout dimension line and layout ruler objects are no longer erroneously selected by Select Allwhen the dimensionline layer is not visible.

• Copying to the Clipboard a design that uses multiple process technologies no longer results in layers mapped to thetop-level technology when the design is pasted into other applications or printed.

• Layout display is corrected and no longer appears slightly shifted from the origin markers instead of lining up.

• Parameterized subcircuit instances which contains a complex polygon with overlapping cutouts no longer draw theoverlapped cutout incorrectly in the instance placement.

• The cursor now snaps to gravity points along the closing edge of generalized polygons with cutouts.

• Generalized polygons with cutouts no longer sometimes show line artifacts in polygon fill.

• When an instance is flipped, text no longer sometimes rotates when descending into a subcircuit layout or cell instanceusing "Edit in Place".

• Cells besides the edit-in-place cell are no longer sometimes drawn with full intensity instead of dimmed.

• Non-orthogonal route segments are no longer sometimes pulled to a different angle by gravity when aligning with apin.

• Multi-layer routes with overlapping matching segments and vias no longer lose curve bend style when Minimal Vias2 mode or Manual Via mode is used.

• Highlights on a sub-object (such as a route via) of a standalone route now consistently display when selected withoutrequiring a window refresh.

• The 3D layout view rendering of positive and negative layers in different levels of hierarchy now functions correctly.

• Drawing layers display in the schematic 3D Layout View now match V12 behavior. Layer thickness and position inthe 3D view is now dependent only on LPF settings.

• GMCLIN now draws with correct width when N=1.

Layout - EM• Fixed regression with displaying polygons in the 3D EM Layout View when cut planes are in use.

• Editing multiple points of a path simultaneously in EM layout no longer causes the EM port to sometimes move to anincorrect location.

• The Copy To Arbitrary 3D EM Structure command no longer issues an error when the original EM structure contains noports.

Layout - Shape Modifiers• Eliminated a false warning issued for possible point stretch modifier conflict when modifiers were stretching inorthogonal directions and were not in conflict.


Layout

• LAYSPPMOD can now perform Boolean operations on complex polygons.

Libraries• Added a Replace default LPF check box to the Select Process Library dialog box which displays when clicking the Addbutton in the Add/Remove Process Library dialog box.

Load Pull• A new Edit Load Pull Measurements script improves the handling of projects with large numbers of load pullmeasurements.

• The Generate Gamma Points File script now exports a file in a format supported by the LPGPT measurement.

• The Create Load Pull Template and Create System Load Pull Template scripts now work correctly when projectoptions are set to use Schematic dependent parameters use base units.

• Improved the import of *.cst swept load pull files.

Measurements - Circuit• Linear Gain and Noise measurements are now correct when Port 2 is the "from" port, and Port 1 is the "to" port (ex:GP(1,2)).

• The PlotVs measurement no longer crashes when plotting Output Equations on VSS measurements.

Measurements - Electromagnetic• Antenna and In-situ antenna radiation pattern measurements now function correctly when swept variables (SWPVAR)are used.

Models - Circuit• Added IBVL and NBVL parameters to support modeling of reverse leakage current. IFF import of SDIODE modelnow maps IBVL, NBVL, NR, and ISR parameters properly.

Models - System• The RFATTEN block now includes a secondary parameter for specifying phase shift.

• The default value for the T_ANT parameter of the ANTENNA, PHARRAY_ANT, PHARRAY_F, and RX_ANTENNAblocks is now 290 K, previously it was empty.

Schematic Editor• Schematic wire editing that overlapsmultiple segments no longer sometimes leaves disconnected segments on undo/redo

Scripts• The Export_PCB_Drill_Gerber script no longer causes a blank project pane after canceling the script.


Libraries

Simulation - APLAC• Creating an APLAC operating-point measurement with switch lists is no longer a problem.

• APLAC no longer issues an error with simulation sweeps of elements using multiplicity, where "M" is defined as anexpression, such as "2*5".

• An "Unknown object or incorrect object type (powDB)" simulation error with the CONSTPOUT block is no longergenerated.

• Corrected APLAC multiplicity (MULT) scaling for the collector, base and emitter inductors (LPC, LPB, LPE) of theUCSD_HBT model.

• Fixed APLAC simulation of NPORT_F when the file is located on a network drive. The network path is now resolvedcorrectly.

• APLAC now accounts for the FORCEPASSIVE parameter on the NPORT_F element. Previously that parameter wasignored.

• APLAC simulations no longer sometimes fail if an element has long vector parameters which exceed the netlist linelength.

• XDB - Gain compression from the linear gain point works more reliably when the device has a lot of gain expansion.

• XDB and CONSTPOUT no longer report answers if the simulation fails to find the specified solution.

• BSIM3 no longer has compatibility issues.

• MTL is now more accurate in envelope analysis.

• FDD element evaluation during multi-threaded simulation now functions correctly.

• Swept variables with Pass Down Mode set to Strong now simulate correctly with Switch Views.

Simulation - AXIEM• Corrected a v13 regression in AXIEM which improved accuracy, but significantly reduced speed and memory. Theimprovement in accuracy is retained while recovering v12 speed and memory.

• Significantly improved the speed when using the Multiple RHS solver when the number of iterations required toconverge is significantly different between ports.

• Improved AXIEM DC convergence of the Multiple RHS solver.

• An error message is now issued instead of crashing when overlapping ports sharing the same ground are detected.

Simulation - System• VSS transient co-simulation with the terminals of a voltage or current source shorted together no longer causes a crash.

• Fixed an issue with IMBAL_IQ that would cause a spectral flip, which was visible when partial-band signals are used.

• When operating at DC for ZIF configurations, the operating point used to compute the noise gain in nonlinear ampsin RF Budget Analysis simulations now treats the noise level as rms. Prior to this treatment, there was a somewhatlower than expected noise when operating near the compression level.

• The VSS mixers now properly compute RF Budget Analysis noise when there is a phase shift on the LO. Prior to thefix the LSB gain computed for the noise calculations was not conjugated correctly.

• In RF Budget Analysis simulations, when a VSS nonlinear amp is connected upstream of a mixer, the mixer's MODEis set to 'DIFF', and the signal frequency at the amp is less than the frequency of the LO. The noise generated by thisamp is now correctly output-referred noise rather than the previous input-referred noise.


Simulation - APLAC

• The algorithm used to identify the LO signal for RF Inspector simulations when there are multiple tones on the LOinput is adjusted. It now looks for the frequency components whose heritage contains the most levels of being markedas a signal, and if there is more than one, the strongest one is chosen. Previously it only looked at the categorizationof the frequency component at the LO input, not at the heritage of the components.

Tuning, Yield Analysis and Optimization• Optimization is corrected where the goals are APLAC-based simulations that also use EM extraction which dependson an optimization variable. Correct costs are now reported during optimization, and the final cost is now correct anddoes not change with subsequent simulations.

User Interface• In the Project Browser you can now right-click the Optimizer Goals node and choose Edit All Goals to open the Optimizerwindow Goals tab. You can also right-click the Yield Goals node and choose Edit All Goals to open the Yield Analysiswindow Goals tab.

• Enabled multi-row editing in the Optimizer window Goals tab.

• Fixed a regression when directly editing cell values of a table in a dialog box. The next cell is correctly selected forediting when the cursor focus is moved using arrow keys.

• Different multi-selected cells are no longer erroneously selected after sorting a table by clicking on a column name ina dialog box.

• Table redraws are corrected when scrolling a dialog box while editing a cell.

Wizards - Component Synthesis• In the Component Synthesis Wizard, rat lines now correctly display in the layout of the synthesized circuit.

Wizards - IFF Import and Export• The IFF Export Wizard no longer omits the last character in symbol names when exporting to Mentor.

• When the IFF Export Wizard is used to export to Mentor, it now takes advantage of relevant User Attributes on theelements.

• Added support to the IFF ImportWizard for using the element map file to convert the values of enumerated parameters.

• Updated the IFF Import Wizard to take advantage of new parameters in the SDIODE model.

• Importing ADS INDQ components from IFF files now functions correctly.

• The IFF Import Wizard is updated to map the Rg, Rd, and Rs parameters of the ADS Statz model to the correspondingparameters of the AWRDE Statz model. Previously the RG, RD, and RS parameters were always set to 0.

• The map file for the IFF Import Wizard can now indicate that the component identifier from the IFF file should beignored for specific component types.

Wizards - PCB Import• Importing IPC-2581 files which use CONTOURs as a standard dictionary shape for pads now honors any transformation(for example, rotation) that is present.

• Fixed rendering of overlapping path outlines that can occur in imported PCB files that have paths defined with segmentsthat track back upon itself.


Tuning, Yield Analysis and Optimization

• Fixed PCB import of overlapping holes with offset centers that are defined as arcs with different centers and segmentsthat track back upon itself.

• Fixed ODB++ import when dielectric layers are defined with multiple materials. Each layer is now assigned the correctmaterial.


Wizards - PCB Import


Security Risk in V13 AddressedThe Guided Help feature added in V13 runs automatically in the background. Guided Help assists users of the NI AWRKnowledge Base to seamlessly download projects and run AWRDE scripts. It’s conceivable that a user could be givena URL to visit that contains malicious script code that would be executed by the AWRDE. To mitigate this possibility,Guided Help no longer runs by default. Instead, you must now enable it by choosing Help > Enable Guided Help.

New Examples• Analyst_Custom_Port_Size.emp

API• Added API support for issuing an object properties command for objects selected in the project view tree.

• Added API support for passing arguments to aWizard when starting it programmatically from the AWRDevelopmentEnvironment.

• Added Close() method to the API Windows collection to close all the top level windows.

• Added check for missing file extension when importing LPF files through the API, and added code to try importingwith the extension added.

Connectivity Checker• Highlight Connectivity Probe now works with multi-technology projects that contain multiple LPFs.

• Connectivity Checker now supports polygons with holes.

• Highlight Connectivity now renders polygons with holes correctly.

Geometry Simplification (SPP) Rules• The Shape Pre-Processor no longer generates an error when working with shapes a large distance (for instance, halfa meter or more) from the origin.

• The SPP engine no longer occasionally crashes when running the PRE_MERGE_VIA_ARRAYS rule.

• Results of the RESIZE rule are now identical to the BOOLEAN_OPS RESIZE rule.

• The SPP Region Statement now works correctly with layers that have a space in the name (for example, "Metal 1").

Import/Export• Fixed DXF import of arc segments defined by LWPOLYLINE.

Layout• Copying shapes from one instance of NI AWRDE to another instance no longer loses net names associated with pastedshapes.


• Improved net name handling when reading older projects that do not have net names registered in the project.

• iNet associated shapes now export correctly when a design does not use the default LPF file.

• TheMerge Shapes command no longer loses cutout shapes in complex polygons when merging shapes with +/- layers.

• Added alignment guides between cutout center points when dragging holes on a complex polygon.

• Improved Via Fence functionality with negative offset.

• The program no longer hangs when saving projects that contain layout polygons with overlapping holes as V12.

• Improved 2D Layout View of translucent shapes with holes.

• Changing the database units on a design which contains generalized polygons with many arc segments no longerresults in rendering problems for some of the arc segments.

• Selecting and deleting a cutout in a network associated polygon now deletes the cutout rather than the polygon.

• Modified the Edit Arc Segments command to ensure that an edited object is taken out of standard segment edit modebefore entering arc segment edit mode.

• Editing the arc segments of a generalized polygon and then undoing the edits now correctly restores the shape to itspre-edited shape and bounding box size.

• Drawing generalized polygons with cutouts on a linetype with multiple translucent layers no longer results in a crash.

• Fixed some rendering issues for paths with rounded bends and rounded ends with very short segments.

• Very short orthogonal path segments with curved ends can no longer cause malformed path shapes to be drawn inlayout.

• Descending into Edit in Place from a document on one LPF to a subcircuit with a master document on a different LPFno longer displays the incorrect layers for the top-level context document.

• Deleting the primary port element on a subcircuit master no longer causes movement in the subcircuit placements.

• Create EM Clip Region now works with a zero resize offset.

Layout - EM• A default Global STACKUP can now be designated by adding a user attribute named "Default" to the STACKUP.The default STACKUP is selected by default when creating a new EM document.

• New EM structures created with Initialization Options set as Default are now correctly created with the Enclosure optionsdefined in the "Default" LPF.

Load Pull• Load pull contour markers now display parameter values in the case when there is only a single contour.

• Load pull contours are now more robust for cases where the sampled data is concentrated in a very small area.

Measurements - Circuit• Fixed incorrect Harmonic Index frequency in the Add/Modify Measurement dialog box when using _FREQH1 fortone spacing.


Layout - EM

Measurements - Electromagnetic• The in-situ antenna measurement, SF_TPwr_CKT, is improved for cases including resistive or reflection/couplinglosses, and the driving circuit has multiple termination ports (for example, for power sampling).

Models - System• The ZRAD statement in PHARRAY_F data files is now properly implemented.

• Added support for MIMO operation to PHARRAY_ANT.

Scripts• Fixed STACKUP element file parse errors with the Archive Project and Clean Project scripts.

• Fixed Load Pull scripts to work with non-English Windows regional settings.

• In order to prevent memory issues, the Generate_MDIF_Files script now only supports files with a maximum of 20ports.

Shape Modifiers• Fixed issue where modifiers with Boolean operations that resulted in blank subcircuit instance would remain blankwhen edited until the project was reopened.

• Boolean modifiers now update to reflect new settings when the project layout Boolean options for handling polygonholes are changed.

• Creating a parameterized instance of a design with a Boolean layer modifier no longer causes a snap-together to occurin the parent design.

• Temporary layers created by the Shape Preprocessor (SPP) Modifier are now automatically deleted.

• A spacing modifier associated with the cutouts of a complex polygon now tracks with the polygon when the polygonis rotated or flipped.

• There is no longer a selection issue for subcircuits that contain both a complex polygon and a Boolean layer modifier.

• The A-Touches-B Layer Boolean modifier now correctly retains holes in complex polygons.

• Fixed inconsistent results when using the SMALL_CORRECTIONS_SNAP rule with the Shape Preprocessor (SPP)modifier.

Simulation - Analyst• Analyst mesher no longer crashes, and the EM3D_SURF_CONCERNS annotation can be used to visually locate theproblem geometry.

Simulation - APLAC• APLAC simulator options now display with a linear license.

• APLAC simulation results now update correctly when editing a subcircuit.

• Using a function of _FREQ as the value of the "Freq" parameter of a tone source like PORTF, which is invalid, nowprompts an error message rather than a crash.

• Improved model compatibility for BSIM3, Hicum and Sdiode models.


Measurements - Electromagnetic

Simulation - AXIEM• Meshing is now faster for AXIEM structures with a large number of bad facets.

• Fixed a potential math error in the AXIEM Low Frequency Iterative solver.

• Fixed a mesh error where the top mesh is missing.

• Switching from EM document frequency to "Use project defaults" no longer results in a bad mesh.

• The mesher no longer wrongly assigns a small edge from a nearby shape as part of a port on a different shape.

• Improved AXIEM iterative solver passivity.

Simulation - Systems• In RF Inspector simulations with mixers or frequency multipliers, feedthrough terms that are near DC are nowconsistently passed through when the RF frequency is less than 2 LO.

• RF Inspector simulations now always limit generated spectral components to the minimum floor levels specified onthe System Simulator Options dialog box RFI/RFB Settings tab, especially when the signal is a modulated signal.

• Fixed RFI Spur File Export crash.

• When runningmultiple VSS TimeDomain simulations, if one simulation finishes, and you pause the system simulators,continuing the simulations no longer restarts the finished simulation.

• When RF_CNTRLR or RF_PID blocks have impedance mismatches at their input port and impedance mismatchmodeling is enabled, the Time Domain simulation output now properly accounts for the impedance mismatch, as RFInspector and RF Budget Analysis simulations do.

• The PWR_MTRblock can now be used in AGC style control loops in RFBudget Analysis and RF Inspector simulations,similar to RF_CNTRLR and RF_PID.

• Multiple FMULT_B2 elements on separate LOs no longer share the same frequency vectors, resulting in erroneousnoise results.

Tuning, Yield Analysis and Optimization• Fixed tuning with APLAC simulations when the schematic contains a PORT2 element.

User Interface• The EM Port Properties dialog box now supports multi-select editing, filtering and sorting.

Wizards - PCB Import• ODB++ import now handles surfaces with multiple islands.

• Fixed ODB++ import of user-defined shapes that do not have numeric characters in the name.

• IPC-2581 import of non-orthogonal rotated circles or ellipses now displays correctly in the resulting layout.


Simulation - AXIEM

Migration IssuesThe following are issues you need to address when migrating from an NI AWR Design EnvironmentTM (NI AWRDE)V12 release to an NI AWRDE V13 release. Not all topics apply to every user. If you are not familiar with a topic orprogram feature included here, it probably does not apply to your use of the software. You should read about all of theissues before developing your migration strategy. You can contact <[email protected]> with any questions.The path to the <Appdatauser> files referenced in this document is operating system dependent. To view the directorypath to your <Appdatauser> files, choose Help > Show Files/Directories to display the Directories dialog box, thendouble-click the Appdatauser folder.

NI AWRDE V13 Specific Migration Issues

Licensing

NI AWRDE V13 requires FLEXlm version 11.14.0 or later for floating licensing. New FLEX tools and the vendordaemon are available from the Downloads page at www.ni.com/awr.

Remote Computing

In order to submit NI AWRDEV13 remote jobs from a user computer, the scheduler and compute nodes must be upgradedto a V13 service. See “Manual Upgrade” for details.

AXIEM Multiple RHS Solver Option

A new AXIEM secondary Iterative Solver option, Multiple RHS Solver, is introduced in V13. By default, this option isenabled. Older projects will also have this option enabled when opened in V13. This option potentially speeds upsimulation time, at the expense of memory. AXIEM detects how much memory is available to prevent the simulationfrom running out of memory and resorting to disk swapping. In the unlikely case that AXIEM does run out of memoryon a very large design, clear the Multiple RHS Solver option to reduce memory requirement.

AXIEM Advanced Frequency Sweep (AFS)

Due to an improved algorithm, AXIEM simulations using AFS may converge with fewer simulated frequencies whencompared to previous versions. EM annotations in older projects may need to be deleted and re-added if the annotationdoes not display, because the number of frequency points (FSAMP) stored in the newly simulated data set is differentfrom what the old annotation was saved with.

Analyst Antenna Measurements

In NI AWRDE V13, if only antenna patterns are desired (not field patterns), in the EM Options dialog box (or Optionsdialog box for specific projects) on the Analyst tab, set the Field Output Frequency to "None" to decrease data set size andimprove simulation time.

Negation Elements

In V13, a new general N-port negation element, NEG, is added as a replacement for NEG2, NEG4, and NEG4_DEMB.NEG2 and NEG4 models are now obsolete, but may continue to be used. The NEG4_DEMB model is eliminated, andany NEG4_DEM models in projects are converted to the obsolete NEG4 model.


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HSPICE Upgrade

In V13, HSPICE simulation of the EEHEMT model is no longer supported.

Unit Type on Subcircuit Passed Parameters

Subcircuit passed parameters (i.e. equations defined with syntax "VariableName << DefaultValue") are by defaultunitless, but can be assigned units by setting the Unit Type option. Also by default, the subcircuit schematic optionDependent parameters use base units is not enabled. A double scaling issue occurs when both Unit Type is used, andDependent parameters use base units is not enabled. The work-around in previous versions of NI AWRDE was to enterparameters values on subcircuit instances that canceled double scaling. In the following example, a project is set up withlength units set to microns (um). In a subcircuit, the passed parameter L << 100 has Unit Type set to Length. In the parentdocument, in order to correctly set L = 100um on the subcircuit instance, you need to enter 100e6 (which is then scaledby 1e-6 from the um unit so that the value 100 is passed down) to work around the double scaling.

In V13, a new schematic option is introduced that eliminates the double scaling issue. For new schematics, the newschematic option Scale exported parameters with units to user unit values is selected by default. With this option enabled,you do not need to account for double scaling when entering values on subcircuit parameters that have Unit Type set. Inthe previous example, if this new option is selected, you no longer needed to multiple subcircuit parameter values by1e6. In migrating older projects to V13, if Unit Typewas previously set on a schematic, this new option will not be enabledwhen the project is opened in V13 in order to retain the double scaling behavior since parameter values were previouslyadjusted to account for double scaling.

AWR RF Board Libraries

AWR Example Libraries AWR_RFBoard_2layer_FR4, AWR_RFBoard_2layer_RO4003, andAWR_RFBoard_2layer_RO4350 are replaced with the AWR_RFBoard_2layer library. You should remove links to theold libraries by choosing File > New With Library > Purge.

Opening older projects that use the older libraries causes this message to display:

Click Yes and browse to the AWR_RFboard_2layer.ini file and clickOpen. The default location for this file isC:\ProgramFiles (x86)\AWR\AWRDE\13\Library\example_pdks\rfboard_2layer\AWR_RFboard_2layer.ini. Click Yes in the nextwindow to continue to use 'AWR_RFBoard_2layer'. Save the project to retain the new library.

Likewise, when opening projects using the newAWR_RFBoard_2_layer library, if a AWR - Library Load Error messagedisplays to indicate that Library 'AWR_RFBoard_2_layer' was not found, follow the previous steps to browse to andselect the new library.


NI AWRDE V13 Specific Migration Issues

Version Independent Migration IssuesThe items in this section address moving files and settings from one software version to another. Beginning in NI AWRDEV11, some of these files and settings are automatically migrated from a previous version of the software to the currentversion. If the previous software version is not found, up to three major versions back are searched. For example, ifmigrating to NI AWRDE V13, NI AWRDE 12, NI AWRDE V11, and NI AWRDE V10 are searched.

NOTE: Ensure that your Windows® Explorer program is set to show hidden and system files.

Files Automatically Migrated

If the Appdatauser or Appdatacommon folders are redirected to non-default locations, no files or directories areautomatically migrated. This is not common; you would have to create a redirect.ini file in the program directory toaccomplish this.

Files in Appdatacommon

The migration of Appdatacommon is triggered based on the existence of the mwoffice.ini file in the Appdatacommonfolder for the newly installed version.

• If there is an existing mwoffice.ini file, no files or folders are migrated.

• If the mwoffice.ini file does not exist, it is copied from the previous location if found.

• If the mwoffice.ini file does not exist and an older version is not found, a new file is created.

The path to each PDK is stored in the mwoffice.ini file and is available for any user of that computer. The installationlocation of foundry libraries is typically version-independent; the default installation locations are not dependent on theNI AWRDE version. These paths are used when opening a project using a PDK or by choosing File > New with Library.

All additional files and directories at this location are not copied since they should not be used with the new version ofthe software.

Files in Appdatauser

The migration of Appdatauser is triggered based on the existence of the user.ini file in the Appdatauser folder for thenewly installed version. If there is an existing user.ini file, no files/folder are migrated. No existing files or folders areoverwritten.

The following files/folders are migrated:

• All .ini files located at the top level directory of Appdatauser, including user.ini. The user.ini file contains environmentsettings, custom layout modes, and other environment defaults.

• All XML files located at the top level directory of Appdatauser. This includes:

• customizations.xml - contains your hotkey settings.

• UICustomizations.xml - contains your menu settings. You can always reset the menus to the NI AWRDE V13defaults.

• UIDockingLayout.xml - contains settings for how different windows are docked in the NI AWRDE.

• UIToolBarLayout.xml - contains your toolbar settings. You can always reset the toolbars to the NI AWRDE V13defaults.


Version Independent Migration Issues

• materialdefs.xml - There are several preset materials such as FR4, alumina, and GaAs available in the EM interface.If you modify these settings, the changes are stored in materialdefs.xml.

• These directories:

• scripts - Global (available in any project) Visual Basic scripts.

• models/model64 - Custom models used in the NI AWRDE.

• cells/cells64 - Custom cells used in the NI AWRDE.

• symbols - Custom symbol files created in the NI AWRDE.

• em_models - User-filled X-Model tables.

• XML - XML libraries installed in the default location.

All additional files and directories in this location are not copied since they should not be used with the new version ofthe software.

Files NOT Automatically Migrated

License File

TARGET: License Administrators

• NI AWRDE V13 requires a new license file. You can request an updated license file by sending an email to<[email protected]> with your company name and a copy of your current license file.

• Your NI AWRDE V13 license file is also backwards-compatible to AWR 2006. If you use a floating license server,your lmgrd.exe must be version 11.14.0 or later.

User-Defined XML Libraries

TARGET: Users who have local XML libraries (anything outside of the NI AWR web library)

• Many users either choose to install a local copy of the XML libraries or add to the default installation with othervendor-specific XML libraries. The default location is the <Appdatauser> folder. If your XML is in this location itcan be migrated automatically (see “Files Automatically Migrated ”).

• Starting in V11, the correct location for these libraries is :\Users\UserName\AppData\Local\AWR\DesignEnvironment\V11.0\XML. There are top level folders for 3D EM Elements, Circuit Elements and System Blocks. AnyXML file located in these top level directories is automatically used in the NI AWRDE WITHOUT the need to editfiles in the installation folders.

The best way to migrate these libraries is to open your current lib.xml and sys_lib.xml files in the Library folder ofyour old installation and search for any paths you added to this library (perhaps compare with v12). Find those librariesand move the top level XML file to the directory listed above to break the cycle of needing to edit these install XMLfiles.

Other Concerns

Model Compatibility

TARGET: Designers

• When model changes are identified, the project can use a model compatibility flag. When you open an old project ina newer version of the NI AWRDE, the simulation results from the previous version do not change. You can change



the model compatibility setting to see simulation results with the old and new model implementation. A dialog boxsimilar to the following displays when you open your design in a newer version if there are models with a compatibilitysetting in your design.

You can switch betweenmodel versions in the Circuit Options dialog box by choosingOptions > Default Circuit Options,then clicking the AWR Sim tab, clicking the Show Secondary button, and then selecting the desired modeling versionfrom Model compatibility version.

Multiple NI AWRDE Versions

TARGET: NI AWR software installers

• Most users keep NI AWRDE V12 installed when upgrading to NI AWRDE V13 to ensure their designs upgradeproperly before converting permanently to NI AWRDE V13.

• When you install NI AWRDE V13, both versions will run. Uninstalling any version may result in registry problems;therefore, when you uninstall, NI AWR recommends that you also repair your active installation. One way to repairyour installation is to open the Control Panel and double-click Add or Remove Programs. In the Add or Remove Programsdialog box, find your NI AWRDE installation and click on the Click here for support information link to open the SupportInfo dialog box, then click the Repair button.

Redirection

TARGET: Users of any type of file redirection (changing the default locations for any of the folders used by the NIAWRDE)

• In networked environments, some users may choose to change the default location for certain files.

• Complete information on redirection is available in the Installation Guide under "Configuring Program File Locations".If you use this capability, ensure that you make the same changes in NI AWRDE V13 that you set up for NI AWRDEV12.



What's New in AWRDE 13

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