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Dynamic Article LinksC<Journal ofMaterials Chemistry
Cite this: J. Mater. Chem., 2012, 22, 714
www.rsc.org/materials PAPER
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View Article Online / Journal Homepage / Table of Contents for this issue
Soft-lithographic processed soluble micropatterns of reduced graphene oxidefor wafer-scale thin film transistors and gas sensors†
Jia Zhang,a PingAn Hu,*a Rongfu Zhang,a Xiaona Wang,a Bin Yang,b Wenwu Cao,b Yibin Li,c Xiaodong He,c
Zhenlong Wanga and William O’Neilld
Received 20th August 2011, Accepted 6th October 2011
DOI: 10.1039/c1jm14071j
PDMS based imprinting is firstly developed for patterning of rGO on a large area. High quality stripe
and square shaped rGO patterns are obtained and the electrical properties of the rGO film can be
adjusted by the concentration of GO suspension. The arrays of rGO electronics are fabricated from the
patterned film by a simple shadow mask method. Gas sensors, which are based on these rGO
electronics, show high sensitivity and recyclable usage in sensing NH3.
Introduction
Patterning of nanostructure materials to generate a functional
microstructure on a large area is promising for mass production
of micro/nanoscale devices. Graphene discovered in 2004 is a two
dimensional material of sp2 bonded carbon atoms and has
aroused huge research interest in a wide field of physics, material
science, biology and electronics.1–3 Graphene exhibits excellent
electrical properties and great chemical stability, and may be
considered as the building block of future electronics and
sensors. Graphene transistors show carrier mobilities between
3000 and 27 000 cm2 V�1 s�1,4 which makes graphene a promising
material for nanoelectronics. Mechanically exfoliated graphene
has been demonstrated to have the ability to detect gases down to
a single molecular level.5 For these microelectroncis and sensor
applications, large area and selective patterning of graphene on
a substrate is urgently in need. The most popular method to
produce graphene for research purposes is through ‘‘scotch tape’’
or mechanical cleavage of graphite.1 However, this technique has
a very low yield, in which monolayer graphenes have to be dis-
cerned from a mixture of thick graphene flakes. Therefore, the
‘‘scotch tape’’ process is unsuitable for large-scale production of
devices. Patterned graphene can be produced by a chemical
vapor deposition method (CVD) on the patterned metallic film
from a hydrocarbon source.6 The device array can be made of
aKey Lab of Microsystem and Microstructure, Harbin Institute ofTechnology, Ministry of Education, No. 2 YiKuang Street, Harbin,150080, P.R. China. E-mail: [email protected] of Physics, Harbin Institute of Technology, Harbin, 150080,P.R.ChinacCenter for Composite Materials, School of Astronautics, Harbin Instituteof Technology, 150080, P.R.ChinadCentre for Industrial Photonics, Institute for Manufacturing, Departmentof Engineering, University of Cambridge, 17 Charles Babbage Road,Cambridge, CB3 0FS, UK
† Electronic supplementary information (ESI) available. See DOI:10.1039/c1jm14071j
714 | J. Mater. Chem., 2012, 22, 714–718
those grown graphene patterns. However the patterned metallic
films for graphene growth are made using a complex photolith-
ographic technique; and a complex procedure is required to
transfer patterned graphenes to the insulating substrate prior to
device fabrication6–8 since metallic substrates are unsuitable for
electrical devices application.
Reduced graphene oxide (rGO) produced from chemical or
thermal reduction of graphene oxide (GO) is competitively
alternative material for graphene. GO prepared from graphite via
a chemical exfoliation method emerges as single- or few-layered
graphene with high yield production dispersions (�4 mg ml�1).9
The solution processability of GO offers unique advantages since
it is readily amenable for spin-coating, casting, transferring,
imprinting onto substrates for large-scale production of gra-
phene electronic circuits. Especially, residual chemically active
defect sites render rGO as promising material for functional
electronic sensors.10–14 Some chemical/biological sensors made
from single-layer rGO or few-layers rGO have been demon-
strated.10–14 Up to date, most of those studies are focused on
a single electronic device or sensor. For real-life applications, it is
essential to produce highly integrated electronics and sensors, for
which research into patterning of continuous rGO films is
urgently needed.
Patterning GO have been performed using micromolding in
capillaries (MIMIC).15 This method mainly exploits a weak
capillary force which produces the limit area of micropatterns
(<20 cm � 20 cm). In addition, a limit geometric structure of
stripe type can be made by the MIMIC method. Nano-
imprinting, which is a most widely used soft-lithography tech-
nique, allows fabrication of two- or three-dimensional structures
with micro/nanoscale resolution.16–20 Polydimethylsiloxane
(PDMS) is the most popular soft elastomeric and conformable
stamp for nanoimprinting. In the imprinting procedure, pressure
is applied to make the PDMS stamp contact with the solution (or
soft solid materials) coated substrate and various geometric
patterns can be replicated to the substrate from the PDMS stamp
This journal is ª The Royal Society of Chemistry 2012
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(shown in Fig.1a). Compared to MIMIC, the advantages of this
technique include simplicity, large area (depending on the size of
stamp) and possible production of various geometric micro-
patterns. To our best knowledge, up to date, there is no report
about exploitation of this imprinting technique for GO
patterning. In this paper, we present PDMS based imprinting to
fabricate wafer-scale continuously conductive rGO micro-
patterns. Highly integrated thin film transistors (TFTs) are made
based on these rGO micropatterns. And the applications of our
rGO TFT for gas sensors are also demonstrated.
Experimental details
Graphite oxide was synthesized from natural graphite flakes
using a modified Hummer’s method. Graphite oxide was then
fully exfoliated in water to produce suspension of graphene oxide
(GO) sheet for imprinting. The glassy carbon toolsets were
prepared via a previously reported laser machining.15 A 10 : 1
(PDMS : curing agent) mixture of the PDMS and silicon elas-
tomer kit (Dow Corning) was poured onto the glassy carbon
mold. Then, the PDMS was cured at 80 �C for 2 h. After curing,
the PDMS stamp was carefully lifted off the glassy carbon
master. To fabricate the rGO pattern (shown in the schematic
drawing of Fig. 1): a GO suspension was dispersed onto the
substrate, then the PDMS stamp (length � width � thichness:
10 � 10 � 3 mm; depth of pattern structure: 1 mm) was pressed
onto the GO suspension and pressure of 0.2 N was used to ensure
close contact between the PDMS and the substrate. After water
was evaporated by heating at 80 �C for 1 h, the PDMS stamp was
carefully lifted off the substrate, leaving the GO patterns on the
substrate intact. Patterned GO films were annealed in H2/Ar (10/
40 sccm) under ambient pressure at 800 �C for 30 min. The
patterned GO and rGO films were characterized by optical
microscopy (Leica DM4500P), scanning electron microscopy
(SEM, Hitachi S-4200), atomic force microscopy (Nanoscope
IIIa Vecco) and Raman spectroscopy (LabRAM XploRA,
power 0.15 mW, excitement wavelength 532 nm). The element
components and structure analysis was performed using X-ray
photoelectron spectroscopy (XPS, Thermo Sentific K-Alpha
XPS, using Al (Ka) radiation as a probe). Cr/Au electrodes on
Fig. 1 Schematic illustration of (a) a soft-lithographic procedure for
patterned rGO film, (b) an rGO electronics array fabricated using
a shadow mask.
This journal is ª The Royal Society of Chemistry 2012
the patterned film were fabricated using film-plating machines
(ZHD-300) by a shadow mask. Electrical measurements of these
devices were performed using a semiconductor analyzer (Keith-
ley 4200 SCS) combined with a Lakeshore probe station.
Results and discussion
The significance of our work is in demonstrating the fabrication
of continuous patterned thin film consisting of single or few
layered rGO by an imprinting procedure of soft-lithography and
the simplicity to make the array of graphene electronics from
these patterns. The imprinting procedure is schematically shown
in Fig.1. Graphene oxide for imprinting is synthesized from
natural graphite flakes using modified Hummer’s method.21 We
can prepare single-layer GO with different concentrations
(Fig. S1).† A high quality and large area rGO pattern (depending
on the size of PDMS mold) can be made on solid or flexible
substrates by this PDMS imprinting procedure. Stripe and
square shaped micropatterns of GO film are generated from
PDMS replication. The morphologies of patterned films are
characterized using optical microscopy, SEM, AFM. A series of
typical images of the rGO pattern that were made using 0.3 mg
ml�1 GO suspension are shown in Fig. 2. Fig. 2a gives a low
magnification view of stripe shaped rGO patterns. The stripe
structure has a width of�15 mm and length up to 5 cm. The array
of the square shaped rGO pattern is shown in Fig. 2b. Each
microscale square has a size 30 � 30 mm. A magnified image
(Fig. 2c) shows that the patterned film is continuous and
composed of stacked individual rGO flakes with a size range of
Fig. 2 Optical image of patterned rGO films: (a) striped shape, (b)
square shape. (c) A magnified SEM image indicates that rGO films are
composed of one- to a few-layer randomly stacked rGO sheets. (d) AFM
image of the film edges. (e) Section analysis indicates that the thickness of
rGO sheets is �3 nm. (f) Raman spectra of GO and rGO film.
J. Mater. Chem., 2012, 22, 714–718 | 715
Fig. 3 (a) Thickness of patterned rGO film as a function of GO
suspension concentration. (b) Conductance of patterned rGO film as
a function of GO suspension concentration. SEM images of the patterned
rGO film made from GO suspension of (c) 0.1 mg ml�1, (d) 0.5 mg ml�1,
(e) 1 mg ml�1.
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1�15 mm. The AFM images of the film edge (Fig. 2d, Fig. 2e)
indicate that the film thickness is �3 nm, which corresponds to
2�3 layers of rGO. These patterned films exhibit nonuniformity
in colours under optical microscopy, which indicates nonuni-
formity in the film thickness (shown in Fig. 2a and Fig. 2b).
Deeper colours mostly observed at the film edges reflect a little
bigger thickness at the rim. GO pattern are formed in the
patterned PDMS stamp, in which GO suspension is evaporated.
The generation of nonuniformity in GO film thickness may be
accounted for by the coffee ring effect that occurred in the
microscale chamber which formed by compact contact of PDMS
stamp with substrate. GO suspension evaporates on a solid
surface. As the three-phase contact line (CL) of the GO
suspension droplet is pinned on the surface in the microscale
chamber due to physical roughness or surface heterogeneities,
the evaporation induces a capillary flow within the droplet which
drives the suspended GO flakes toward the CL and leaves a little
thicker structure at the rim (shown in Fig. 2a, b.).22,23 In addition,
there are no GO residues left on the surface of PDMS stamp after
imprinting (shown in Fig. S2).† This is attributed to the low
surface energy of the PDMS interface (19.8 mJ m�2). Therefore,
the low surface energy of the PDMS interface enhances the
formation of a high quality GO pattern.
The structure of GO and rGO is characterized using Raman
spectroscopy. Raman spectra taken from a GO film and the
corresponding chemically reduced GO film are shown in Fig. 2f.
Compared to GO, the G band (�1600 cm�1) of rGO is sharper
and more symmetrical and has an up-shift of �2 cm�1. The
intensity ratio of D (�1350 cm�1) and G band (ID/IG), which is
utilized to determine the extent of defects in graphene, decreases
from 1.2 to 0.92. This implies an increase in the size of sp2
domains in rGO.24,25 This can be explained by the removal of
epoxide and hydroxyl groups on the basal plane and carbonyl
and carboxyl groups on edges of GO via chemical reduction,
leading to the restoration of sp2-hybridized carbons. The struc-
ture and components of GO and rGO are further analyzed by
XPS. The analytic results are shown in Fig. S2:† the oxygen
content in GO is more than 24.9% as compared with 17.11% in
rGO (calculated from Fig. S3a). The high-resolution XPS spectra
of C1s of as-prepared GO sheets (Fig. S3b) shows that oxidized
carbon atoms exist in form of different functional groups:
aromatic or conjugated C (284.5 eV), the C in C–O bonds (286.8
eV), the carbonyl C (C]O, 288.3 eV), and the carboxylate
carbon (O–C]O, 289.0 eV).24,26 These oxygen containing groups
are produced from harsh oxidation, which destroyed the sp2
atomic structure of graphene. Those oxygen containing groups
are also observed from rGO (Fig. S3c), but the intensities of
those oxidized carbon groups are much weaker than that in the
GO, proving considerable de-oxygenation and restoration of the
sp2 carbon sites by the reduction treatment.
In previous reports on the rGO film prepared by filtration or
transfer printing,18,26 the thickness of the as-made rGO film,
which can be controlled and adjusted by the concentration of GO
suspension, is the key for the field effect properties. We perform
the experiments in the thickness and conductance of the rGO film
as a function of the concentration of GO suspension (shown in
Fig. 3). The thickness shows a linear increase with concentration
of the GO suspension (Fig. 3a). The rGO films fabricated from
GO suspension with concentrations 0.5 mg ml�1 and 1 mg ml�1
716 | J. Mater. Chem., 2012, 22, 714–718
are continuous and exhibits respective average thicknesses of 6
nm and 10 nm (shown in Fig. 3a, Fig. 3d, Fig. 3e), while
a discontinuous film with an average thickness of 2 nm is
obtained when the concentration of GO suspension is below 0.1
mg ml�1 (shown in Fig. 3a, Fig. 3c). From Fig. 3b, the conduc-
tivity of rGO increases from 1.2 � 10�11 to 1 � 104 S m�1 in the
GO concentration range of 0.05�0.5 mg ml�1, and higher
concentrations (>0.5 mg ml�1) lead to a nearly constant
conductivity of �7 � 3 � 104 S m�1.
Multilayered graphene reaches the 3D limit of graphite in
terms of its electronic and dielectric properties at about 10
layers,27,28 which theoretically corresponds to a thickness below
3.4 nm for the pristine graphene since a single graphene has
a thickness of 0.34 nm, while owing to the oxygen functional
groups in both sides, single layer GO and rGO show a much
larger thickness of �1 nm, which is reported in the previous
theoretical and experimental research.29–31 Our experimental
results (Fig. 3a) show that a dense rGO flake film with a stacked
layer number above 10 can be fabricated using a high concen-
tration (1 or 2 mg ml�1) solution, which has the characteristics of
a good conductor. And a rGO film made using GO solution with
concentration of below 0.5 mg ml�1 can be used for transistor
application since its average stacked layer number is estimated to
be below 5.
The parallel array of graphene electronics for the gas sensor is
made from patterned film using a shielding mask (shown in
Fig.1b and Fig. 4a). This provides a simple and efficient
approach for scalable production of rGO electronics and sensors.
The devices with a channel length (L) of 60 mm and a width (W)
This journal is ª The Royal Society of Chemistry 2012
Fig. 4 (a) SEM images of the array of rGO TFT, the insert SEM image
in (a) is a magnified TFT device, bar¼ 15 mm. (b) Transfer curves of rGO
TFT measured in air and in vacuum. (c) Output curve of rGO TFT in
vacuum. (d) Current variance of rGO TFT versus exposal to 1000 ppm
NH3. (e) Resistance variance of rGO TFT as a function of NH3
concentration. (f) Adsorption and desorption of NH3 on the rGO sensor.
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of 15 mm are made on a doped silicon substrate with a 300 nm
thermally grown SiO2 layer. The silicon wafer layer is used as the
back gate. The conductivity of the patterned rGO film is in the
range of 100 � 1000 S m�1. The electrical transport properties of
rGO film TFT in air and in vacuum are measured. The transfer
characteristics (Ids�Vgs) of a typical rGO device are shown in
Fig. 4b. It has high conductance under a negative gate bias and
almost no conduction under a positive gate bias when the device
is measured in air, indicating that the carriers in this condition
are holes and the device behaves as p-type semiconductor.32–35
This strong p-type behaviour is resulted from the adsorption of
oxygen or water from the ambient or hydroxyl group of the
substrate. In order to exclude such ambient impact, the device is
placed inside a high vacuum chamber (<5 � 10�5 Torr) for 24 h
before electrical measurement. Ambipolar behavior, which has
been reported in single-layer reduced GO transistor,34,35 is then
observed from the rGO film transistor (shown in Fig. 4b). The
output characteristics (Ids�Vds) exhibits a large linear region in
Fig. 4c, implying a good ohmic contact between the Cr/Au
electrodes and the rGO. The mobility (m) of hole or electron can
be extracted from the two branches of the transfer characteristics
using the following equation:36
m ¼�DIdsDVgs
L
W
��ðVds CoxÞ (1)
where Cox is the silicon oxide gate capacitance (which is 1.15 �10�8 F cm�2 for a gate oxide thickness of 300 nm). The room
temperature-field effect mobilities of as-made rGO TFTs are
This journal is ª The Royal Society of Chemistry 2012
�2.3 cm2 V�1 s�1 for holes and �0.84 cm2 V�1 s�1 for electrons.
Compared to the pristine graphene, rGO exhibits very low
mobilities, which may result not only from the scattering by
doping defects, growth defects, and other imperfections or
adsorbates,35,37 but also from the scattering at junctions of two or
more rGO sheets overlapped.
Current interest in rGO sensors can be attributed to two main
reasons. First, its every constituted atom is at surface which
makes its electrical transport properties sensitive to the envi-
ronment, which is similar to pristine graphene. Second, the
existence of chemically active defects such as vacancies or small
holes may render more adsorption sites for gaseous molecules,
which enhances the sensing capability.10 To test the sensing
performance of as-fabricated rGO TFTs, we use NH3 gas as the
sensing target in this study. Sensing performance of the devices is
characterized against the low concentration of NH3 diluted in N2
gas. The rGO sensor shows a strong response to NH3 and
exhibits a decrease of about 10% in conductance with the expo-
sure to 1000 ppm NH3. This is verified by the measurement of
Ids�Vds curve of the devices at the gate voltage of 0.1 V as shown
in Fig. 4d. This conductance variance is due to the depletion of
holes in rGO by the NH3 adsorption.37 Resistance variance of
rGO film as a function of NH3 concentration is given in Fig. 4e,
the resistance of rGO film increases linearly with the NH3
concentration. The lowest detection concentration of 400 ppm
has been achieved in our experiments, which is not even opti-
mized. Compared to other NH3 sensors such as oxide sensor
which are operated at high temperature of 100�300 �C,38 the
rGO film sensors work at room temperature, which greatly
facilitates the operation.
To test the stability, the adsorption and desorption of NH3 on
rGO film device are performed several times (shown in Fig. 4f). A
flow of pure N2 is applied to clean the device after each run. The
sensor demonstrates stable sensing capability after several circles
of adsorption and desorption of NH3. The adsorption behavior
of the molecules on graphene is proposed to be closely related to
the structure.39 Adsorption on sp2-bonded carbon (the low-
energy binding sites) occurs through weak dispersive forces,
which is a recoverable process; while adsorption onto higher
energy binding sites (e.g. vacancies, structural defects, and
oxygen functional groups) is usually nonrecoverable without
moderate thermal treatment.39 For example, a carboxylic acid
group with single- and double-hydrogen bonding allows binding
energies of at least several hundred meV molecule�1 for adsorp-
tion of a molecule.40 Our recoverable sensor is here attributed to
the fully reduced treatment, which increases the number of sp2-
bonded carbons.13 This fully reduced treatment can be evidenced
by the analysis of Raman spectra and XPS (shown in Fig. 2f and
Fig. S3†). As for the sensing mechanism, the sensing behavior
can be attributed to the effective adsorption of NH3 on the
surface of p-type rGO. NH3 is an electron donator because of
the existence of the lone pair of electrons. Electron transfer from
the adsorbed NH3 to the rGO leads to depleted hole concen-
tration and decreased electrical conduction in rGO film.37
Conclusions
In summary, we demonstrate that the PDMS based imprinting
enables large area patterning of rGO film, which makes scalable
J. Mater. Chem., 2012, 22, 714–718 | 717
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fabrication of rGO electronics a reality. Microscale features with
stripe and square geometries are successfully fabricated by the
PDMS based imprinting. An array of rGO TFTs are made using
the patterned film following a simple mask shielding process and
a gas sensor is then fabricated. The sensor is quite sensitive even
at the non-optimized stage, and the sensing capability is very
stable. Our results are significant because this PDMS based
imprinting method make scalable fabrication of electronics and
sensors of rGO an easy task.
Acknowledgements
This work is supported by the National Natural Science Foun-
dation of China (NSFC, No. 61172001), the Scientific Research
Foundation for Returned Overseas Chinese Scholars, State
Education Ministry and the Fundamental Research Funds for
Central Universities and Chinese Program for New Century
Excellent Talents in University.
References
1 K. S. Novoselov, A. K. Geim, S. V. Morozov, D. Jiang, Y. Zhang,S. V. Dubonos, I. V. Grigorieva and A. A. Firsov, Science, 2004,306, 666.
2 A. K. Geim, Science, 2009, 324, 1530.3 C. N. R. Rao, K. Biswas, K. S. Subrahmanyam and A. Govindaraj, J.Mater. Chem., 2009, 19, 2457.
4 C. Berger, Z. M. Song, X. B. Li, X. S. Wu, N. Brown, C. Naud,D. Mayou, T. B. Li, J. Hass, A. N. Marchenkov, E. H. Conrad,P. N. First and W. A. de Heer, Science, 2006, 312, 1191.
5 F. Schedin, A. K. Geim, S. V. Morozov, E. W. Hill, P. Blake,M. I. Katsnelson and K. S. Novoselov, Nat. Mater., 2007, 6, 652.
6 K. S. Kim, Y. Zhao, H. Jang, S. Y. Lee, J. M. Kim, K. S. Kim,J.-H. Ahn, P. Kim, J.-Y. Choi and B. H. Hong,Nature, 2009, 457, 706.
7 A. Reina, X. T. Jia, J. Ho, D. Nezich, H. Son, V. Bulovic,M. S. Dresselhaus and J. Kong, Nano Lett., 2009, 9, 30.
8 X. S. Li, W. W. Cai, J. An, S. Kim, J. Nah, D. X. Yang, R. Piner,A. Velamakanni, I. Jung, E. Tutuc, S. K. Banerjee, L. Colomboand R. S. Ruoff, Science, 2009, 324, 1312.
9 X. F. Zhou and Z. P. Liu, Chem. Commun., 2010, 46, 2611.10 J. T. Robinson, F. K. Perkins, E. S. Snow, Z. Q. Wei and
P. E. Sheehan, Nano Lett., 2008, 8, 3137.11 C. H. Lu, H. H. Yang, C. L. Zhu, X. Chen and G. N. Chen, Angew.
Chem., Int. Ed., 2009, 48, 4785.12 Y. Ohno, K. Maehashi and K. Matsumoto, J. Am. Chem. Soc., 2010,
132, 18012.13 V. Dua, S. P. Surwade, S. Ammu, S. R. Agnihotra, S. Jain,
K. E. Roberts, S. Park, R. S. Ruoff and S. K. Manohar, Angew.Chem., Int. Ed., 2010, 49, 2154.
14 G. H. Lu, L. E. Ocola and J. H. Chen, Appl. Phys. Lett., 2009, 94,083111.
718 | J. Mater. Chem., 2012, 22, 714–718
15 Q. Y. He, H. G. Sudibya, Z. Y. Yin, S. X. Wu, H. Li, F. Boey,W. Huang, P. Chen and H. Zhang, ACS Nano, 2010, 4,3201.
16 X. Liang, K. J. Morton, R. H. Austin and S. Y. Chou, Nano Lett.,2007, 7, 3774.
17 P. A. Hu, K. Li, W. L. Chen, L. Peng, D. P. Chu and W. O’Neill, J.Micromech. Microeng., 2010, 20, 075032.
18 J. Zaumseil, M. A. Meitl, J. W. P. Hsu, B. R. Acharya,K. W. Baldwin, Y.-H. Loo and J. A. Rogers, NanoLett., 2003, 3,1223.
19 E. Menard, L. Bilhaut, J. Zaumseil and J. A. Rogers, Langmuir, 2004,20, 6871.
20 J. P. Urbanski, W. Thies, C. Rhodes, S. Amarasinghe and T. Thorsen,Lab Chip, 2006, 6, 96.
21 X. L. Li, G. Y. Zhang, X. D. Bai, X. M. Sun, X. R. Wang, E. Wangand H. J. Dai, Nat. Nanotechnol., 2008, 3, 538.
22 T.-S. Wong, T.-H. Chen, X. Y. Shen and C.-M. Ho, Anal. Chem.,2011, 83, 1871.
23 S. Choi, S. Stassi, A. P. Pisano and T. I. Zohdi, Langmuir, 2010, 26,11690.
24 A. C. Ferrari, J. C. Meyer, V. Scardaci, C. Casiraghi, M. Lazzeri,F. Mauri, S. Piscanec, D. Jiang, K. S. Novoselov, S. Roth andA. K. Geim, Phys. Rev. Lett., 2006, 97, 187401.
25 L.M.Malard,M. A. Pimenta, G. Dresselhaus andM. S. Dresselhaus,Phys. Rep., 2009, 473, 51.
26 G. Eda, G. Fanchini and M. Chhowalla, Nat. Nanotechnol., 2008, 3,270.
27 B. Partoens and F. M. Peeters, Phys. Rev. B: Condens. Matter Mater.Phys., 2006, 74, 075404.
28 C. Casiraghi, A. Hartschuh, E. Lidorikis, H. Qian, H. Harutyunyan,T. Gokus, K. S. Novoselov and A. C. Ferrari, Nano Lett., 2007, 7,2711.
29 S. Stankovich, R. D. Piner, X. Q. Chen, N. Q. Wu, S. T. Nguyen andR. S. Ruoff, J. Mater. Chem., 2006, 16, 155.
30 H. C. Schniepp, J.-L. Li, M. J. McAllister, H. Sai, M. Herrera-Alonso, D. H. Adamson, R. K. Prud’homme, R. Car, D. A. Savilleand I. A. Aksay, J. Phys. Chem. B, 2006, 110, 8535.
31 C. Gomez-Navarro, R. T. Weitz, A. M. Bittner, M. Scolari, A. Mews,M. Burghard and K. Kern, Nano Lett., 2007, 7, 3499.
32 O. Leenaerts, B. Partoens and F. M. Peeters, Phys. Rev. B: Condens.Matter Mater. Phys., 2008, 77, 125416.
33 K. Kim, H. J. Park, B. C. Woo, K. J. Kim, G. T. Kim andW. S. Yun,Nano Lett., 2008, 8, 3092.
34 S. Adam, E. H. Hwang, V. M. Galitski and S. D. Sarma, Proc. Natl.Acad. Sci. U. S. A., 2007, 104, 18392.
35 S. Fratini and F. Guinea, Phys. Rev. B: Condens. Matter Mater.Phys., 2008, 77, 195415.
36 J. Fulton, W. Fragale, S. Banas and M. Imam, IEEE, 2000, 2, 14.37 T. Jeremy, F. Robinson, K. Perkins, E. S. Snow, Z. Wei and
P. E. Sheehan, NanoLett., 2008, 8, 3137.38 C. S. Rout, M. Hegde, A. Govindaraj and C. N. R. Rao,
Nanotechnology, 2007, 18, 205504.39 Y. P. Dan, Y. Lu, N. J. Kybert and A. T. Charlie Johnson,Nano Lett.,
2009, 9, 1472.40 J. A. Robinson, E. S. Snow, S. C. Badescu, T. L. Reinecke and
F. K. Perkins, Nano Lett., 2006, 6, 1747.
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