TYSTAR TYTAN SILICON NITRIDE LPCVD … LPCVD...tystar tytan silicon nitride lpcvd furnace operating...

DOCUMENT: TYSTAR TYTAN SILICON NITRIDE LPCVD FURNACE STANDARD OPERATING PROCEDUREVersion: 1.0

TYSTAR TYTAN SILICON NITRIDE LPCVD FURNACE

OPERATING MANUAL Version: 1.0 June, 2011

UNIVERSITY OF TEXAS AT ARLINGTON

Nanofabrication Research and Teaching

Facility


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TABLE OF CONTENTS

1. Introduction………………………………………………………..3

1.1 Scope………...………………………………………......3

1.2 Description………………………………………….……3

1.3 Safety……………………………………………....……..3

2. Hardware ..............................…………………………………....4

3. Requirements……………………………………..….….………..4

3.1 Training…………………………………….……..…..….4

3.2 Restrictions…………………………………………,…...4

3.3 System Checks…………………………….……....……5

4 Operating Procedure ………………………..…..……..…….....9

4.1 Load Recipe………….………………….…....…..….….9

4.2 Load Wafer………………….………………….…..…....11

4.3 Unload Wafer….……………………………….……..….12

5 RECIPE ……………….…….………………………..…..……….12


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1 INTRODUCTION

1.1 Scope

These procedures apply to the Tystar Tytan Silicon Nitride LPCVD

(Low Pressure Chemical Vapor Deposition) Furnace system. All maintenance should follow the

procedures set forth in the manufacturer’s maintenance and operations manuals. This document is

for reference only. Personnel should be trained by authorized staff before operating this equipment.

1.2 Description

Tystar Silicon Nitride LPCVD furnace is configured as a single tube for high temperature (700C°- 950C°) at reduced pressures (250 mtorr) to produce low deposition rate CVD processes. The Tystar Silicon Nitride processes are capable of producing highly impermeable barrier layer to H2O, O2, Na, H with excellent material properties as density, refractive index, dielectric constant and slow HF etch rates.The tool has been qualified for low stress and stoichiometric Si3N4 processes. Tystar LPCVD can process up to 25 (4” or 3” diameter) Silicon wafers during a run. The tool operates as a stand-alone unit that comprises of three modules: wafers load/unload module, furnace/process tube module, and gas control module. The system has its own computer, FCS10, whose display panel and keypad are located on the right side of the wafer load/unload module. The furnace uses highly accurate MFC’s (mass flow controllers) and uses dichlorosilane (DCS) and ammonia (NH3) as sources for the silicon and nitrogen to achieve optimum mass transport to the wafer surface to achieve optimum LPCVD conditions for improved thickness uniformity and substrate spacing sensitivity. The furnace operation is controlled by using the special function buttons and a series of menu commands.

1.3 Safety

1.3.1 This furnace uses DCS (SiH2Cl2) which is a colorless toxic gas that is extremely flammable and explosive in contact with air. This gas can form flammable mixtures in air and release of this gas which has not spontaneously ignited must be considered extremely dangerous and should not be approached. The tool also uses Anhydrous Ammonia (NH3) which is a powerful caustic irritant to the skin, eyes and mucous membranes. Lastly this tool uses Nitrogen ( N2 ) gas which in high concentrations can be asphyxiates. The process gases are normally pumped out of system; however if the process pressure is not being maintained or the furnace cannot reach base pressure notify NanoFab staff immediately.

1.3.2 Before using the tool read the DCS (SiH2Cl2) and Ammonia (NH3) material safety data sheets (MSDS) provided. http://www.consultant-on-demand.net/documents/DCSMSDS.pdf http://www.alliedaviation.com/locations/pipeline/MSDS.pdf Users are not allowed to open or adjust the any gas bottle valve or regulators for this system.

Call NanoFab staff for gas bottle or gas regulator issues.

http://www.consultant-on-demand.net/documents/DCSMSDS.pdf

http://www.alliedaviation.com/locations/pipeline/MSDS.pdf


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1.3.3 This tool continuously monitors, displays and records the toxic gas PPM(parts per million) levels

using the Drager Polytron 2 XP Transmitters and DraegerGard controller. If a PPM level exceeds an alarm set point the controller will relay an audible and visual alarm throughout the building. If the NanoFab system’s alarm light tower YELLOW light goes ON immediately leave the NanoFab building informing others to leave on your way out. If the light tower’s RED alarm light and audible alarm goes ON immediately leave the NanoFab building through the closest and safest emergency exit and wait for emergency personnel to arrive. DO NOT operate this machine if the Drager Polytron 2 XP Transmitters displays any warnings, faults or if any RED leds are ON. If any warning, alarms or RED leds are ON notify NanoFab staff immediately.

1.3.4 USERS cannot run the tool if EITHER facility ACID or SOLVENT exhaust are OFF. If you suspect an exhaust problem notify staff.

Acid exhaust OFF = 0 Solvent exhaust OFF = RED

1.3.5 The furnace is connected to high voltage. Be very careful and aware of electrical hazards when

operating this tool. If you encounter any electrical malfunctions contact NanoFab staff immediately.

1.3.6 The furnace will heat to high temperatures (9500 C). Make sure all high temperature heat shields are installed above the furnace to minimize Drager sensors temperature sensitivity. Make sure quarts boat tongs/forks are in place. Do not touch the quartz boat during wafer unload, the quartz is 550C° and will burn your fingers.


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1.3.7 This machine has an EMO (Emergency Off) switch/button mounted on the front panel inside the clean room and another in the chase. The EMO switch should be pressed only in an emergency. An emergency would be fire, smoke, toxic gas release, electrocution hazards, and an injury to anyone using this particular piece of equipment. If the EMO is pressed notify NanoFAB staff immediately.

1.3.8 Read any posted NanoFAB Engineering Change Notices (ECN) for any hardware, process or safety changes before running the tool.

2 HARDWARE

2.1. Process Gases: DCS and NH3 source gases.

2.2. Wafers Load/Unload Module : Load station equipped with vertical HEPA filters with laminar flow. Cantilever non contact wafer loader for 3” to 6” diameter wafers. Automatic wafer loading and unloading at 5” per minute @ 550C°.

2.3. Furnace Temperature /Process Tube Module : Three zone heaters for optimum temperature control and stability.

2.4. Gas Control Module : The souce gas cabinets contain all gas controls and distribution manifold. Heated DCS gas line. All gas line are orbitally welded and are made of polished stainless steel. Mass flow controllers are used for the control of all process gases.

2.5. Vacuum Pumps /Process Exhaust : Edwards M280 mechanical pump and roots blower on remote stands for low pressure CVD processes. The system is equipped with particle traps, vacuum soft start and oil filtration system . Process exhaust is heated and filtered in Edwards M150 gas reactor column (GRC) that destroys hazardous gas to below TLV ( Threshold Limit Values) levels.


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3 REQUIREMENTS

3.1 Training

You must be a qualified user on Tystar Tytan LPCVD Furnace System. The furnace system can be used to deposit LPCVD Si3N4 on 3” to 4” diameter wafers.

3.2 Restrictions

3.2.1 The furnace is for 3” or 4” diameter clean Silicon wafers ONLY.

3.2.2 No wafers are to be processed that EVER had METAL on them or had been previously processed in RTA, PECVD, Sputtering and e-beam systems.

3.2.3 All wafers must not have any edge chips, nicks, or cracks. The wafer front and backside must be

clean and free of resist or any residues from photolithography, wet or dry etching processes. 3.2.4 All wafers must have pre-nitridation cleaning process done before nitride deposition such as RCA1,

RCA2, 2-3 min in HF dip 1:10 remove any organic contamination and other residues.

3.2.5 Use dedicated quartz boat for the furnace as shown.

3.2.6 Any deposition more than 4000Å require NanoFab approval.

3.2.7 Tystar LPCVD can ONLY be used Monday-Friday from 8am to 6pm (excluding Holidays and UTA snow days )

3.2.8 Read any posted NanoFab Engineering Change Notices (ECN) for any hardware, process or safety

changes before running the tool.

3.2.9 Users are allowed to start the process in the AM and let the recipe sequence hold at the HLD1 step

overnight and unload the wafers the next morning (typical process times are 10 hours). Users must check the status every 3-4 hours (except during the overnight HLD1 step).


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3.2.10 Only staff are allowed the Change, Copy or Download process recipes.

3.2.11 Users can only run Tystar recipes named :

LSNITR.002 STNITRSW.002 STNITR.002

3.2.12 After the wafers have completed the process and the quartz boat has moved out to the unload position you have 30 minutes to remove the boat from the quarts cantilever . The quartz boat is very hot (500C°- 550C°). Let the wafers cool in the boat 30 minutes before placing them into a cassette/box.

3.2.13 When using the FCS-10 touch screen always use the light pen for entering system commands.

3.2.14 USER’s are not allowed to open DCS or NH3 gas bottle valves or adjust the bottle regulators.

After USER’s are finished only staff are allowed to evacuate the line and close the process gas bottles.

3.2.15 For any Machine Malfunctions, Computer Lock UP’s, any type of Alarms notify staff immediately.

3.3 System checks

3.3.1 Touch the screen with the light pen at the bottom right side exit the screen saver mode The Main Menu screen will should be displayed. If the Main Menu is not displayed call staff to check the FSC-10 computer.

Main Menu


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3.3.2 Press DISPLAY STATUS and verify that the FCS-10 (Furnace Control System-10) is in IDLE condition with about 550 ºC actual temperature.

3.3.3 Go to the chase. Check to ensure the Edwards M280 mechanical pump, Edwards booster pump and oil recirculator is ON. The pumps will be making a loud noise, the mechanical pump rotor fan blades will be spinning, the booster pump oil will be circulating and the oil recirculator pressure will be 40 and 15 psi. Check to ensure are pump oil levels are ½ up the site glass.

3.3.4 Check to ensure the pump pack N2 ballast flows are ON and in specification:

N2 ballast 1cc/min

Low N2 pump purge is maximum flow

High N2 pump purge is 15 l/min

3.3.5 Check to ensure the DCS gas supply line heater is ON and is 50C°± 3 C° Check to ensure to the DCS exhaust line heater is ON and is 45C°± 3 C°


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3.3.4 Check to ensure the FCS-460 MFC flow controller is in AUTO mode ( MANUAL led will be OFF) and there are no alarms (ALARM ACK led will be OFF).

3.3.4 Check to ensure the heat exchanger water flow meter is 2 gallons/ minute.

The cooling ring and cold trap water flow will turn ON automatically during the process.

3.3.4 Check to ensure the Edwards M150 Gas Reactor Column abatement system has no beacon alarms. The N2 purge should be 1 l/min, cartridge upper temperature at 575C°, cartridge LOWER temperature at 500C° and the inlet pressure < 1 mbarr (should be negative mbarr).

3.3.4 Check to ensure the Applied Energy System HPMII gas manifold controller for DCS and NH3 have no CURRENT or LATCHED sensor fault leds ON. Check to ensure DCS and NH3 Honeywell Sensors have no alarms leds ON


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4 OPERATING PROCEDURE

4.1. Load Recipe ( When using the FCS-10 touch screen always use the light pen for entering system commands)

4.1.1. Press MAIN MENU. This key takes you to the main menu screen.

4.1.2 Press RECIPE LOAD. Use arrow keys to select your recipe file .Press ENTER twice (double click )to load it. There is a limited disk space in the DCS-10 computer and not all the recipes can be stored at the same time. If your recipe is not listed, contact Nanofab staff to down load it from the host computer.

4.1.3 Wait for the computer to upload and check for recipe errors. This may take 10 seconds.

4.1.4 Press MAIN MENU and the press RUN. After the recipe sequence begins press DISPLAY STATUS to monitor the recipe steps and see the process sequence

count down timer.


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4.1.5 Once the recipe sequence has started the only active button is the ABORT button.

If the ABORT button is pressed the software will prompt you for a reply.

If you press on Yes the system will run an abort recipe and go to IDLE step. If you press Yes call NanoFab staff to remove your wafers. If you press No the process will continue.

4.2 Load Wafer

4.2.3 The 1st step in all sequences is STRT step .When the step is at BOUT the boat holder will come out automatically; it will take 5 minutes. After the BOUT step is finished the audible alarm will go on. Press ALARM ACK to silence the alarm. This step will be LDWF (load wafers). You have 20 minutes to load your wafers.

ALARM ACK If the quartz boat is already in the furnace remove the wafer boat with the quartz forks/tongs and load you wafers using the correct size quarts boat ( 3” or 4” boat) and place the wafers with the shinny side facing the clean room (you) and the wafer’s major flat in the “up” direction as shown. If you’re processing 3 -12 wafers separate them equally between slots. Align the boat on the loader cantilever in such a way that you can see the arrow through the right hole of the boat.


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4.2.4 When you are finished loading the wafers the on the loader press EVENT to resume the recipe sequence , otherwise you have up to 20 minutes to load you samples and then the tube will close automatically. 4.2.5 You can ABORT the process at any step see section 4.1.4 . 4.2.6 The computer will run the program automatically (35 steps over 10 hours). After the nitride deposition and a subsequent 8 cycle pump purge is finished the sequence will automatically stop/hold at HLD1 step. At the HLD1 step the audio alarm will sound again.

Press ALARM ACK to silence the alarm. At this step USER’s are allowed leave the fab and let the recipe hold at this step overnight and return the next morning to continue the process.

(Don’t press EVENT unless you can return within 2 hours to remove your wafers) When you are ready to continue the process press EVENT. The process now continues and the boat/wafers will automatically come after several steps.

EVENT ALARM ACK

4.3 Unload Wafer

4.3.1. The computer will run the program automatically and once the HLD1 step is acknowledged by pressing EVENT the boat will subsequently come out of the furnace. When the boat is fully out the audible alarm will sound indicating that the boat/wafers are ready to unload from the cantilever loader. Press ALARM ACK to stop the alarm sound . You have 30 minutes to retrieve you wafers or the timer will expire and the loader will move back into the furnace automatically. Carefully remove your wafers/boat by using the quartz fork/tongs as shown. Place the hot wafers/boat on the quartz plate and let cool for 30 minutes before putting the wafers into a cassette/box.

EVENT Press EVENT the loader will move back into the furnace and the recipe will go to IDLE mode.

4.3.2. Before you leave, verify that the FCS-10 (Furnace Control System-10) is in IDLE condition. Leave

the furnace as clean as you found it. Press MAIN MENU to get to the starting screen.

4.3.3. Enter the required information in the logbook.


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5 RECIPES

5.1.1. Only NanoFab staff are allowed the Change, Copy or Download process recipes. 5.1.2 To change recipe parameter go to chase and use Host Computer FCS-30 and FCS-20 software programs.

5.1.3 Click on T2 bubble to open Tube 2 LPCVD recipe menu.

5.3.4 Click on refresh button to update screen recipes.

5.3.5 Click on Recipe Manager Icon to open FCS-20 software .

FCS-20 home page


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5.3.6 At the Function ? prompt enter on the keyboard DD to list all recipes or RE to Edit Recipe then press Enter .

5.3.7 Enter User name ( TYLAN ) and password (Pulsar). Enter Configuration file name ( UTACNF.002)

User name ( TYLAN ) and password (Pulsar) Configuration filename ( UTACNF.002)

5.3.8 Enter recipe file name: filename.002 The recipe edit menu will display.

Recipe filename LSNITR.002 recipe edit menu

5.3.9 At the header cmd : widow enter the process step you want to check or change ( DEPO, etc..)

5.3.10 At the a recipe step page ( DEPO ) press SP to display parameter set points.


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5.3.11 Use arrow keys to scroll to parameter window and enter new value ( i.e time = hh.mm.ss ) Then press Enter. 5.3.12 To save changes press Home on the keyboard. The software will to a recipe error check and return to the home page. Enter Home on the keyboard again and you will exit the FCS-20 software.

Recipe verification FCS-20 home page

5.13.13 To upload the modified recipe from the FCS-20 to the FCS-30. Click on the modified recipe and the click on the arrow down function. You should see DSC-30 transporting blocks displayed.

5.13.14 To upload the modified recipe from the FCS-30 to the FCS-10 simply click on Remote Command:

You should see communication with tube message displayed:


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5.3.15 If either of the uploads to not complete there may be too many files on the DCS-10 computer or problem with DCS-20. 5.15.16 To load the modified recipe to FCS-10 go to Load Recipe sections 4.1.1 to 4.1.2 and perform those tasks 5.15.17 For details of the standard recipes available, contact Nanofab Engineering staff.

TYSTAR LPCVD NITRIDE RECIPE : LSNITR.002

Value Unit Instructions

IDLE CONDITION

STEP : IDLE

IDLE STATE

N2BKFL 500.0 SCCM

TEMPL 550.0 DEGC

TEMPC 550.0 DEGC

TEMPS 550.0 DEGC

BOATSPD 5.0 IPM

COOLRNG ON

PREN2 ON

PROCESS RUN SEQUENCE

STEP : STRT

LOAD BACK

FILL

TIME: 00.20.00

N2BKFL 5000.0 SCCM

If EVENT = ON then

goto BTIN

If TEMPL or TEMPC or

TEMPS out-of-tolerance

Then goto CONT (NO

TOLERANCE ALARM)

TEMPL 550.0 DEGC

TEMPC 550.0 DEGC

TEMPS 550.0 DEGC

BOATSPD 5.0 IPM

PREN2 ON

STEP : BOUT

BOAT OUT

TIME: 00.15.00

N2BKFL 5000.0 SCCM If OUTLMT = ON then

goto LDWF

TEMPL 450.0 DEGC

TEMPC 500.0 DEGC

TEMPS 500.0 DEGC

BOATSPD 5.0 IPM

BOATOUT ON


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COOLRNG ON

PREN2 ON

STEP : LDWF

LOAD WAFERS

TIME: 00.30.00

N2BKFL 5000.0 SCCM

If EVENT = ON then

goto BTIN


TEMPS or PRCPR out-of-

tolerance

Then goto CONT (NO

TOLERANCE ALARM)

TEMPL 350.0 DEGC

TEMPC 400.0 DEGC

TEMPS 400.0 DEGC

BOATSPD 5.0 IPM

COOLRNG ON

SONIC ON

PREN2 ON

BOATOUT ON

STEP : BTIN

BOAT IN

TIME: 00.15.00

N2BKFL 5000.0 SCCM

If DNTLK = OFF then

goto STB1


TEMPS or PRCPR out-of-

tolerance

Then goto CONT (NO

TOLERANCE ALARM)

TEMPL 550.0 DEGC

TEMPC 550.0 DEGC

TEMPS 550.0 DEGC

BOATSPD 5.0 IPM

PREN2 ON

BOATIN ON

COOLRNG ON

STEP : STB1

STABILIZE 550

TIME: 00.10.00

BOATIN ON

If TEMPL or TEMPC or TEMPS or

PRCPR is out-of-tolerance

Then goto CONT (NO TOLERANCE

ALARM)

IF DNTLK = ON goto SHLD

IF ANTLK = ON goto SHLD

IF VNTLK = ON goto SHLD

IF GASNTLK = ON goto SHLD

IF EXHNTLK = ON goto SHLD

IF N2PRSAL = ON goto SHLD

TEMPL 550.0 DEGC

TEMPC 550.0 DEGC

TEMPS 550.0 DEGC

BOATSPD 5.0 IPM

COOLRNG ON

GATEVLV ON

STEP : VACC

VACUUM

TEMPL 550.0 DEGC




TEMPC 550.0 DEGC


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CHECK

TIME: 00.01.00

TEMPS 550.0 DEGC ALARM)

IF PRCPR > 500 MTOR goto SHLD

IF DNTLK = ON goto SHLD


IF BNTLK = ON goto SHLD


IF GNTLK = ON goto SHLD

IF TUBEOT = ON goto SHLD

IF CABOT = ON goto SHLD

IF SCROT = ON goto SHLD

COOLRNG ON

GATEVLV ON

STEP : TEMP

TEMP 835

TIME: 01.30.00

N2BKFL 200.0 SCCM




ALARM)


TEMPL 835.0 DEGC

TEMPC 835.0 DEGC

TEMPS 835.0 DEGC

COOLRNG ON

PREN2 ON

GATEVLV ON

STEP : PMP2

VAC PUMP 2

TIME: 00.05.00




ALARM)


TEMPL N/C DEGC

TEMPC N/C DEGC

TEMPS N/C DEGC

COOLRNG ON

GATEVLV ON

STEP : PUR2

PUMP/PURGE

2

TIME: 00.05.00

N2BKFL 200.0 SCCM



Then goto cont (NO TOLERANCE

ALARM)


TEMPL N/C DEGC

TEMPC N/C DEGC

TEMPS N/C DEGC

COOLRNG ON

PREN2 ON

GATEVLV ON

STEP : PMP3

If TEMPL or TEMPC or TEMPS or TEMPL 835.0 DEGC


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VAC PUMP 3

TIME: 00.05.00

TEMPC 835.0 DEGC PRCPR is out-of-tolerance


ALARM)


TEMPS 835.0 DEGC

COOLRNG ON

GATEVLV ON

STEP : PUR3

PUMP/PURGE

3

TIME: 00.05.00

N2BKFL 200.0 SCCM




ALARM)


TEMPL N/C DEGC

TEMPC N/C DEGC

TEMPS N/C DEGC

COOLRNG ON

PREN2 ON

GATEVLV ON

STEP : PMP4

HARD PUMP 4

TIME: 00.10.00




ALARM)


TEMPL 835.0 DEGC

TEMPC 835.0 DEGC

TEMPS 835.0 DEGC

COOLRNG ON

GATEVLV ON

STEP : LKCH

LEAK CHECK

TIME: 00.02.00

TEMPL N/C DEGC If TEMPL or TEMPC or

TEMPS or PRCPR is out-of-

tolerance

Then goto CONT (NO

TOLERANCE ALARM)

IF PRCPR > 1000 MTOR

goto SHLD

TEMPC N/C DEGC

TEMPS N/C DEGC

COOLRNG ON

STEP : VACP

TEMPL 835.0 DEGC




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VACUUM

PUMP

TIME: 00.02.00

TEMPC 835.0 DEGC Then goto CONT (NO TOLERANCE

ALARM)



IF BNTLK = ON goto SHLD


IF GNTLK = ON goto SHLD

IF CABOT = ON goto SHLD

IF SCROT = ON goto SHLD

IF GASNTLK = ON goto SHLD

IF EXHNTLK = ON goto SHLD

IF N2PRSAL = ON goto SHLD

TEMPS 835.0 DEGC

COLDTRP ON

COOLRNG ON

GATEVLV ON

STEP : STBP

STABLE

PRESSURE

TIME: 00.02.00

N2BKFL 150.0 SCCM If TEMPL or TEMPC or

TEMPS or PRCPR is out-

of-tolerance

Then goto CONT (NO

TOLERANCE ALARM)

If PRCPR > 1000 MTOR

goto SHLD

TEMPL N/C DEGC

TEMPC N/C DEGC

TEMPS N/C DEGC

COOLRNG ON

PRCPR 250.0 MTOR

GATEVLV ON

STEP : TMPC

TEMP CHECK

TIME: 00.01.00

N2BKFL 150.0 SCCM If TEMPL or TEMPC or


of-tolerance

Then goto CONT (NO

TOLERANCE ALARM)

TEMPL 835.0 DEGC

TEMPC 835.0 DEGC

TEMPS 835.0 DEGC

COOLRNG ON

PRCPR N/C MTOR

COLDTRP ON

PREN2 ON

GATEVLV ON

STEP : PNH3

PRE NH3

TIME: 00.03.00

If PRCPR is out-of-tolerance


ALARM)

IF PRCPR > 1000 MTOR goto ABRT

IF ANTLK = ON goto ABRT

IF BNTLK = ON goto ABRT

TEMPL 835.0 DEGC

TEMPC 835.0 DEGC

TEMPS 835.0 DEGC


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COOLRNG ON IF VNTLK = ON goto ABRT

IF GNTLK = ON goto ABRT

IF CABOT = ON goto ABRT

IF SCROT = ON goto ABRT

IF GASNTLK = ON goto ABRT

IF EXHNTLK = ON goto ABRT

IF N2PRSAL = ON goto ABRT

PRCPR N/C MTOR

COLDTRP ON

PREN2 ON

PRENH3 ON

GATEVLV ON

STEP : PDCS

PRE DCS

TIME: 00.02.00

NH3 50.0 SCCM If PRCPR is out-of-tolerance

Then goto cont (NO TOLERANCE

ALARM)




IF VNTLK = ON goto ABRT







DCS 12.0 SCCM

TEMPL 835.0 DEGC

TEMPC 835.0 DEGC

TEMPS 835.0 DEGC

COOLRNG ON

PRCPR N/C MTOR

COLDTRP ON

PREN2 ON

PREDCS ON

PRENH3 ON

GATEVLV ON

STEP : DEPO

DEPOSITION

TIME: 01.00.00

NH3 N/C SCCM If NH3 or DCS out-of-tolerance

Then goto ABRT (NO TOLERANCE

ALARM)








DCS N/C SCCM

TEMPL 835.0 DEGC

TEMPC 835.0 DEGC

TEMPS 835.0 DEGC

COOLRNG ON

PRCPR N/C MTOR


22

COLDTRP ON IF GASNTLK = ON goto ABRT



PREN2 ON

PREDCS ON

PRENH3 ON

GATEVLV ON

STEP : DCSO

DCS OFF

TIME: 00.05.00

NH3 100.0 SCCM If TEMPL or TEMPC or TEMPS or

PRCPR out-of-tolerance


ALARM)











TEMPL N/C DEGC

TEMPC N/C DEGC

TEMPS N/C DEGC

COOLRNG ON

PRCPR N/C MTOR

COLDTRP ON

PREN2 ON

PREDCS ON

PRENH3 ON

GATEVLV ON

STEP : PMPP

PUMP GASES

TIME: 00.03.00

N2BKFL 150.0 SCCM If TEMPL or TEMPC or TEMPS or

PRCPR out-of-tolerance


ALARM)


TEMPL N/C DEGC

TEMPC N/C DEGC

TEMPS N/C DEGC

COOLRNG ON

PRCPR N/C MTOR

COLDTRP ON

PREN2 ON

GATEVLV ON

STEP : PMP5

VAC PUMP 5


PRCPR is out-of-tolerance TEMPL 550.0 DEGC

TEMPC 550.0 DEGC


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TIME: 00.05.00

TEMPS 550.0 DEGC Then goto CONT (NO TOLERANCE

ALARM)


COOLRNG ON

GATEVLV ON

STEP : PUR5

PUMP/PURGE 5

TIME: 00.02.00

N2BKFL 200.0 SCCM




ALARM)


TEMPL 550.0 DEGC

TEMPC 550.0 DEGC

TEMPS 550.0 DEGC

COOLRNG ON

PREN2 ON

GATEVLV ON

STEP : PMP6

VAC PUMP 6

TIME: 00.05.00




ALARM)


TEMPL 550.0 DEGC

TEMPC 550.0 DEGC

TEMPS 550.0 DEGC

COOLRNG ON

GATEVLV ON

STEP : PUR6

PUMP/PURGE 6

TIME: 00.02.00

N2BKFL 200.0 SCCM




ALARM)


TEMPL 550.0 DEGC

TEMPC 550.0 DEGC

TEMPS 550.0 DEGC

COOLRNG ON

PREN2 ON

GATEVLV ON

STEP : PMP7

VAC PUMP 7

TIME: 00.05.00




ALARM)


TEMPL 550.0 DEGC

TEMPC 550.0 DEGC

TEMPS 550.0 DEGC

COOLRNG ON

GATEVLV ON

STEP : PUR7

PUMP/PURGE 7

N2BKFL 200.0 SCCM




TEMPL 550.0 DEGC

TEMPC 550.0 DEGC

TEMPS 550.0 DEGC


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TIME: 00.02.00 COOLRNG ON ALARM)


PREN2 ON

GATEVLV ON

STEP : PMP8

VAC PUMP 8

TIME: 00.05.00




ALARM)


TEMPL 550.0 DEGC

TEMPC 550.0 DEGC

TEMPS 550.0 DEGC

COOLRNG ON

GATEVLV ON

STEP : STB2

STABILIZE PRESS

TIME: 01.30.00

N2BKFL 200.0 SCCM

If TEMPC = 550 DEGC

Then goto HLD1

TEMPL 550.0 DEGC

TEMPC 550.0 DEGC

TEMPS 550.0 DEGC

PREN2 ON

COOLRNG ON

GATEVLV ON

STEP : HLD1

PURGE / HOLD

TIME: 00.00.00

N2BKFL 200.0 SCCM




ALARM)


IF PRCPR < 10 MTOR goto SHLD

IF N2BKFL < 100 SCCM goto SHLD

IF EVENT = ON Then goto BKF1

TEMPL 550.0 DEGC

TEMPC 550.0 DEGC

TEMPS 550.0 DEGC

PREN2 ON

COOLRNG ON

GATEVLV ON

SONIC ON

STEP : BKF1

SLOW BACKFILL1

TIME: 00.02.00

N2BKFL 500.0 SCCM




ALARM)

TEMPL 550.0 DEGC

TEMPC 550.0 DEGC

TEMPS 550.0 DEGC

PREN2 ON

COOLRNG ON


25

STEP : BKFL

SLOW BACKFILL2

TIME: 00.02.00

N2BKFL 1000.0 SCCM




ALARM)

TEMPL 550.0 DEGC

TEMPC 550.0 DEGC

TEMPS 550.0 DEGC

PREN2 ON

COOLRNG ON

STEP : BKF3

SLOW BACKFILL3

TIME: 00.02.00

N2BKFL 3000.0 SCCM




ALARM)

TEMPL 550.0 DEGC

TEMPC 550.0 DEGC

TEMPS 550.0 DEGC

PREN2 ON

COOLRNG ON

STEP : BKF4

SLOW BACKFILL4

TIME: 00.02.00

N2BKFL 4000.0 SCCM




ALARM)

TEMPL 550.0 DEGC

TEMPC 550.0 DEGC

TEMPS 550.0 DEGC

PREN2 ON

COOLRNG ON

STEP : BKF5

SLOW BACKFILL5

TIME: 00.15.00

N2BKFL 5000.0 SCCM




ALARM)

TEMPL 550.0 DEGC

TEMPC 550.0 DEGC

TEMPS 550.0 DEGC

PREN2 ON

COOLRNG ON

BOATSPD 5.0 IPM

STEP : BTOT

BOAT OUT

TIME: 00.10.00

N2BKFL 5000.0 SCCM



of-tolerance

Then goto CONT (NO

TEMPL 450.0 DEGC

TEMPC 500.0 DEGC

TEMPS 500.0 DEGC

BOATSPD 5.0 IPM

BOATOUT ON


26

COOLRNG ON TOLERANCE ALARM)

IF OUTLMT = ON then

goto ULWF

PREN2

ON

STEP : ULWF

UNLOAD WAFERS

TIME: 00.30.00

N2BKFL 5000.0 SCCM



of-tolerance

Then goto CONT (NO

TOLERANCE ALARM)

+F388

TEMPL 350.0 DEGC

TEMPC 400.0 DEGC

TEMPS 400.0 DEGC

BOATSPD 5.0 IPM

BOATOUT ON

COOLRNG ON

SONIC ON

PREN2

ON

STEP : CLOS

CLOSE DOOR

TIME: 00.10.00

N2BKFL 5000.0 SCCM



of-tolerance

Then goto CONT (NO

TOLERANCE ALARM)

IF DNTLK = OFF then

goto ENDP

TEMPL 550.0 DEGC

TEMPC 550.0 DEGC

TEMPS 550.0 DEGC

BOATSPD 5.0 IPM

COOLRNG ON

BOATIN ON

PREN2

ON

STEP : ENDP

END PROCESS

TIME: 00.00.30

N2BKFL 5000.0 SCCM



of-tolerance

Then goto CONT (NO

TOLERANCE ALARM)

TEMPL 550.0 DEGC

TEMPC 550.0 DEGC

TEMPS 550.0 DEGC

BOATSPD 5.0 IPM

COOLRNG ON

BOATIN ON

PREN2

ON

SPECIAL HOLD STEP

STEP : SHLD

TEMPL N/C DEGC


27

SPECIAL HOLD

TIME: 00.05.00

TEMPC N/C DEGC

TEMPS N/C DEGC

BOATSPD 10.0 IPM

SONIC ON

COOLRNG ON

BOATIN ON

PREN2

ON

ABORT SEQUENCE

STEP : ABRT

PUMP

TIME: 00.05.00



tolerance

Then goto CONT (NO

TOLERANCE ALARM)

TEMPL 550.0 DEGC

TEMPC 550.0 DEGC

TEMPS 550.0 DEGC

BOATSPD 10.0 IPM

SONIC ON

COOLRNG ON

GATEVLV ON

BOATIN ON

PREN2

ON

STEP : ABT1

PUMP / PURGE 1

TIME: 00.02.00

N2BKFL 200.0 SCCM



tolerance

Then goto CONT (NO

TOLERANCE ALARM)

IF EVENT = ON then goto

ABT2

TEMPL 550.0 DEGC

TEMPC 550.0 DEGC

TEMPS 550.0 DEGC

BOATSPD 10.0 IPM

SONIC ON

COOLRNG ON

GATEVLV ON

BOATIN ON

PREN2

ON

STEP : ABT2

VAC PUMP 2

TIME: 00.05.00

N2BKFL 200.0 SCCM



tolerance

Then goto CONT (NO

TOLERANCE ALARM)


ABT3

TEMPL 550.0 DEGC

TEMPC 550.0 DEGC

TEMPS 550.0 DEGC

BOATSPD 10.0 IPM

GATEVLV ON

COOLRNG ON


28

STEP : ABT3

PUMP / PURGE 3

TIME: 00.05.00

N2BKFL 200.0 SCCM



tolerance

Then goto CONT (NO

TOLERANCE ALARM)


ABT4

TEMPL 550.0 DEGC

TEMPC 550.0 DEGC

TEMPS 550.0 DEGC

BOATSPD 10.0 IPM

PREN2 ON

COOLRNG ON

GATEVLV ON

STEP : ABT4

PUMP 3

TIME: 00.05.00



tolerance

Then goto CONT (NO

TOLERANCE ALARM)


ABT5

TEMPL 550.0 DEGC

TEMPC 550.0 DEGC

TEMPS 550.0 DEGC

BOATSPD 10.0 IPM

COOLRNG ON

GATEVLV ON

STEP : ABT5

SLOW BACKFILL

TIME: 00.05.00

N2BKFL 500.0 SCCM



tolerance

Then goto CONT (NO

TOLERANCE ALARM)


ABT6

TEMPL 550.0 DEGC

TEMPC 550.0 DEGC

TEMPS 550.0 DEGC

BOATSPD 10.0 IPM

PREN2

ON

COOLRNG ON

STEP : ABT6

BACKFILL

TIME: 00.05.00

N2BKFL 5000.0 SCCM



tolerance

Then goto CONT (NO

TOLERANCE ALARM)


ABT7

TEMPL 550.0 DEGC

TEMPC 550.0 DEGC

TEMPS 550.0 DEGC

BOATSPD 10.0 IPM

PREN2 ON

COOLRNG ON

STEP : ABT7

N2BKFL 5000.0 SCCM


TEMPL 550.0 DEGC


29

END ABORT

TIME: 00.00.10

TEMPC 550.0 DEGC TEMPS or PRCPR is out-of-

tolerance

Then goto CONT (NO

TOLERANCE ALARM)

TEMPS 550.0 DEGC

BOATSPD 10.0 IPM

PREN2 ON

COOLRNG ON

TEMPS : Temperature of source zone (From where the steam enters) TEMPL : Temperature of load zone (At the opposite end of source zone) TEMPC : Temperature of center zone BOATSPD : Boat speed SCROT : Silicon Controlled Rectifier Over Temperature sensor TUBEOT :Tube Over Temperature sensor CABOT : Cabinet Over Temperature sensor DNTLK : Door Interlock

TYSTAR TYTAN SILICON NITRIDE LPCVD … LPCVD...tystar tytan silicon nitride lpcvd furnace operating...

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Transcript of TYSTAR TYTAN SILICON NITRIDE LPCVD … LPCVD...tystar tytan silicon nitride lpcvd furnace operating...