Ref: BARC/CnID/AMIS/SKB/2020/ 61826 Sub: Minor fabrication - invitation to quote Date: June 19 , 2020

Last date for receiving quotations: /06/2020

Dear Sir/Madam,

1. Quotations are invited by Head, Control Instrumentation Division, on behalf of President of

India for minor fabrication job givenbelow:

SI No. Description Quantity

1 PCBLayout design, Fabrication, Procurement of components, Assembling and

Testing of HMI module, Main Power Supply Module, Power Supply Module

& Front Panel PCB with piggybackKeypad as per specifications given in

Annexure-I, II,III.

16 (4 Sets)

2. Quotations are invited on the letter head with official seal(rubber stamp) for the above mentioned

job.The quotation should contain the following details:(i) Validity of offer (ii) Terms and

conditions of offer (iii) PAN, GST, registration no.(iv)Delivery time schedule(v)Price breakup.

The quotation has to be signed by authorized person with company seal.

3. Item intended to be fabricated/procured in this workis required for R&D purposehence GST

@5% will be applicable and GST certificate will be provided by BARC for the same.

4. The quotation must reach, Head, Control Instrumentation Division by 13/07/2020 (12:00 Noon)

and must be sent in a sealed envelope super scribed with the above Ref. No., and due date given

above.The quotation must be sent by speed post/ordinary post only.

5. Address for sending quotation is as following:

Head,

Control Instrumentation Division,

BARC, Trombay, Mumbai - 400 085.

(Kind attention: S. K. Bahuguna, SO/G, CnID)

6. Requirements of supplier qualification:

i. Certification: The bidder must have ISO 9001:2008 certification and must attach

documentary evidence with the bid.

ii. Human resources: The supplier must give the details of human resources including

Engineers, Draftsman, assembly mechanic, quality control inspector, etc.

iii. Infrastructure: The supplier must give the details of infrastructure suitable for this job

such as Orcad design entry tool, cadence allegro layout tool, solidworks/similar

mechanical design tool, fabrication facility, assembly equipments,electronic testing

equipments.

Government of India

Bhabha Atomic Research Centre

CnID,

TROMBAY,

MUMBAI - 400 085

iv. Past experience: Bidder must provide documentary evidence of prior experience of

working with similar high density, high speed electronic designs with capabilities to do

multilayer PCB design with client’s name.

v. Bidder should have necessary electronic hardware test set up at their facility to carry out

the above fabrication and testing. The list of facilities must be submitted along with the

bid.

vi. If required, vendor must allow BARC officials factory visit for evaluation.

7. The bidder should quote for fabrication of the items, including the cost of the materials.

No free issue of materials will be provided by BARC.

8. Delivery schedule :

1 First two set of boards (total 8 nos)within 22 weeks from the date of schematics cleared

for layout from the user. Important milestones are as follows:

i. Final gerber generation -14 weeks (This includes two week for netlist verification

and layout approval at BARC)

ii. Fabrication & assembly - 6 weeks

iii. Testing - 2 weeks ( First at vendor’s site and then at BARC)

2 Remainingtwo set of boards (total 8 nos) within 10 weeks from the date of acceptance of

first 8 boards by I/O.

3 The vendor shall deliver all the boards within 36 weeks from the date of purchase order

issued to the vendor.

9. The vendor should give atleast 15 working days advance intimation to the Indenting Officer to

arrange for visiting vendors’s premises for inspection & functional testing.

10. Boards shall be delivered by the bidder at CnID Stores, Bhabha Atomic ResearchCentre,

Trombay, Mumbai-400085.

11. All materials required for the above said job shall be supplied by the bidder.

12. All work covered by the specification shall be subject to quality surveillance by our engineer.

The finished board shall not be dispatched prior to approval by our engineer, at bidder’s

premises. Necessary inspection facilities shall be provided to our engineers during

fabrication/repairs at bidder’s premises

13. The finished PCBs shall be guaranteed for 1 year against defects and poor workmanship. The

guarantee shall include onsite replacement of defective boards at no extra cost.

14. Payment will be made by electonic transfer after satisfactory completion of the work as per

government rules.

15. Delivery charges if any must be clearly mentioned in the offer. Quotation must indicate the

validity of offer.

16. Head, Control Instrumentation Division reserves the right to accept / reject any or all the

quotations received withoutassigning any reasons.

Encl:

1. Annexure-I: General specification (1 sheet)

2. Annexure-II: Technical specifications (4 sheets)

3. Annexure-III: Block Diagrams & BOM (11 sheets)

(Anuradha Mayya)

Head, Control Instrumentation Division

[For & on behalf of the President of india(the purchaser)]

ANNEXURE-I (1 sheet)

(Ref:BARC/CnID/AMIS/SKB/2020/ 61826 )

General Specifications

1.0 Quality surveillance, inspection and inspection report:

1.1 All work covered by the specifications shall be subject to quality surveillance by the purchaser or

his authorised representatives for which purpose the fabricator shall allow access at all reasonable times

during components assembly to:

1.1.1 The premises in which work is being carried out.

1.1.2 The drawings and / or tooling involved.

1.1.3 Gauges, instruments etc. required for inspecting the work.

1.2 Inspection and tests shall be carried out by the fabricator as per the requirements detailed in the

drawings and these specifications.

1.3 The finished components shall not be despatched prior to approval by our engineer.

2.0 Delivery: 3.1 The bidder shall deliver first two set of boards within 22 weeks from the date of schematics cleared

for layout from the user.

3.2 The bidder shall deliver remaining two set of boards within 10 weeks from the date of acceptance of

first 8 boards by I/O.

3.3 The bidder shall deliver all the boards within 36 weeks from the date of purchase order issued to bidder fromCnID, BARC, Mumbai-85.

3.4In case any extension in the delivery period is required, the fabricator should submit a written request

for the same before the expiry of work order. Any delay in delivery which is attributable to the fabricator

is liable for LD to be imposed on the fabricator

3.0 Sub Contract: 4.1The fabricator shall not sub-contract any or all the work without written consent from the purchaser.

The fabricator shall be responsible for all work of the sub-contractor of the fabricator, if at all allowed by

the purchaser.

5.0 Taxes:

5.1 GST @ 5%will be applicable and GST certificate will be provided by BARC for the same.

5.2An undertaking should be provided regarding promptly deposition of GST to authorities.

6.0 Excise duty:NA

7.0 Payment:

7.1 Payment will be made only after satisfactory completion of work and on production of bill,

advance stamped receipt& Guarantee/Warrantee Certificate. Advance / Part payment against

delivery cannot be made.

7.2 It may be noted that Income tax at 2% and GST TDS at 2% will be deducted from your bill.

8.0 Confidentiality:

8.1 No party shall disclose any information to third party concerning the matters under this

contract generally. In particular, any information identified as “PROPRIETARY” in nature by the

disclosing party shall be kept strictly confidential by the receiving party and shall not be disclosed

to any third party without the prior written consent of the original disclosing party. 8.2 “RESTRICTED INFORMATION” categories under section 18 of the Atomic Energy Act, 1962 and

“OFFICIAL SECRETS” under section 5 of the official Secrets Act,1923: -

Any contravention of the above mentioned provisions by any contractor, sub-contractor, consultant,

advisor or the employees of a contractor will invite penal consequences under the aforesaid legislation.

8.3 Prohibition against the use of BARC’s name without permission for publicity purposes: - The contractor or sub-contractor, consultant, advisor or the employees engaged by the contractor shall not

use BARC’s name for Publicity purpose through any public media like press, radio, T.V. or internet

without the prior written approval of BARC (vide circular ref: 2/Misc-9/Lgl/2001/92 dated April 30,

2001).

(S. K. Bahuguna)

Indentor

Annexure-II(4 Sheets)

(Ref:BARC/CnID/AMIS/SKB/2020/ 61826 )

Technical specification for Layout, Fabrication of PCB Design, Procurement of components,

Assembling and Testing of HMI module, Main Power Supply Module, Power Supply

Module & Front Panel PCB with piggyback Keypad

Job Description:

• Layout, fabrication, procurement of components, assembly, testing of HMI Module, Main

Power Supply Module, Power Supply Module, and Front Panel PCB with piggyback

Keypadas per the technical specifications including scope of work, material, standards and

qualification.

• Circuit schematics will be provided by user (purchaser) for layout and fabrication.

• Supply of HMI Module, Main Power Supply Module, Power Supply Module, and Front

Panel PCB with piggyback Keypad: 4 No. for each type (2 No. for each type shall be

provided in first iteration and remaining 2 no. of each type after testing and correction in first

set)

Technical Specifications

1. Description, Drawings, Bill of Material

The circuit schematics and part number of components will be provided to the supplier after

placement of Purchase Order. The PCB layout shall be designed by supplier. Designer shall

interact with user’s engineer and after completion of layout, the layout file shall be submitted to

user before fabrication. Refer Figure-1,2, 3& 4 for block diagram and Table-1, 2, 3& 4 for Bill of

material.

2. PCB size specifications:

a) PCB Size: 160 mm x 100 mm (HMI Module, Main Power Supply Module and Power

SupplyModule)

: 162 mm x 205 mm (Front Panel PCB)

b) No. of layers- As applicable

3. Scope of Work

a) Hardware Schematic, Layout Design and Gerber file generation

i. Schematic design and BOM will be provided to supplier. The layout design shall be prepared

by an experienced and skilled engineer. If the layout design work is to be outsourced by the

supplier, the name of the company shall be mentioned in the quotation.

ii. Layout design shall be carried out from circuit schematics (.dsn format) as per IPC-2221

guidelines.

iii. All respective datasheets and layout guidelines shall be referred and shall be implemented in

schematic and layout design.

iv. Layout design files should be submitted to user for review and approval before proceeding to

next stage.

v. Signal Integrity (SI) and Power Integrity (PI) of the PCB should be carried out after final

layout.

vi. Gerber files in RS 274-X format should be generated.

b) PCB fabrication and component Assembly:

PCB fabrication shall be started only after the approval of schematic, Layout and Gerber file from

user. The supplier shall procure all the active and passive components and populate/assemble the

PCB. PCB fabrication, components assembly, PCB testing shall be as per the following

requirements:

1- Baking of PCB shall be done before components assembly as per the standard method.

2- The packages of critical components for assembly isBGA.

3- BOM and Package details for all the components are given in annexure-III.

4- The fabricator should buy all the items as per the BOM and of standard make.

5- Inspection of assembled PCB for any shorting.

6- X-Ray inspection for soldering of BGA components are needed to insure the proper joint of

balls on PCB.

7- Final acceptance of assembled PCBs shall be as per the quality acceptance plan given under

clause 6.0-“Quality Acceptance Plan (QAP)” of same annexure.

c) Supply of first set of Modules

After assembling, two numbers of assembled PCBof each type of module (HMI Module, Main

Power Supply Module, Power Supply Module and Front Panel PCB with piggyback Keypad)

shall be supplied for evaluation. User will evaluate the modules and give the feedback within two

weeks. Based upon the performance obtained during evaluation/testing, component changes and

PCB layout modifications if any, shall be carried out. Functional testing on modules will be

carried out as per test procedure prepared by user.

d) Fabrication of 2nd set of modules and final supply

After approval of revised layout and gerber files, new modules will be fabricated and 2numbers of

assembled modules (second set of modules) of each type shall be supplied for testing. Functional

testing of the final units will be performed by user’s engineer at supplier’s site as per mutually

agreed acceptance test procedure.

e) Documentation

The supplier must provide following documents:

i. Final Bill of material,

ii. General Arrangement and Mechanical drawings,

iii. PCB layout files and Gerber files,

iv. Bare Board Test Report, SI and PI analysis report

4. Material & Workmanship

a) Materials and standard parts shall be of good quality and in accordance with best engineering

practice in order to ensure satisfactory operation and ease of maintenance.

b) The components assembly and workmanship shall be in accordance with high grade industrial

practice and the best approved methods as per the given QAP and shall be adequate to achieve

accuracy and finish in accordance with drawings to ensure satisfactory operation and service

life of various parts.

c) A care for cleanliness is to be maintained during assembly and storage of components. A

complete record of assembly and subassembly checks is to be carried out. For this purpose a

checklist is needed to be maintained for counter verification of the finished / completed jobs,

required for assembly.

5. Standards & Engineering Practices to be Followed for PCB

a) PCB quality of FR4 grade Class-2, PCB thickness of 100 mil (or less) copper clad with glass

epoxy lamination should be used. Solder mask & legend print should be provided.

6. Quality Acceptance Plan (QAP)

Following are quality acceptance plan for the component assembly job under this minor

fabrication job.

a) Inspection-After components assembly the boards are required to test for interconnections &

continuity using test instruments. For BGA& fine pitch assemblies high resolution cameras

&AOI machine is required to use to insure solder ability of each pin of BGA on bare PCB. For

FPGAs/BGA device X-ray inspection report is required to generate for verification of solder

ability of BGA on PCB. The test reports should cover all data measured as per instructions

given at different stages of soldering. Acceptability of Electronics assemblies will be checked

as per IPC-A-610E.

b) Powering up of boards- All boards will be powered up after partial assembly (assembly of

power sections only) and complete assembly. Output voltages of each power section will be

reported.

c) After the inspection and powering test the boards will be given to the indenter for final

testing.If any assembly (soldering) defects are noticed during testing the supplier will

correct the same free of cost. If the boards are found functional, further remaining boards are

to be assembled, tested and final delivery can be made. Final acceptance of all the boards

will be given by the indenter after complete functional testing.

7. Quality Surveillance

a) General: Quality surveillance and expediting, relating to all the aspects of the contract will be

carried out by the purchaser or his authorized representative, for which purpose the supplier

and his subcontractor shall allow access to the premises in which the work is being carried out,

during manufacture, assembly and testing.

b) Produce an inspection plan to the purchaser’s satisfaction and notify when checkpoints on the

plan are imminent so that the purchaser’s representative may be present, if it is so desired.

c) The supplier shall be responsible for the inspection of the components that is subcontracted by

him.

d) Waiving of quality surveillance by the purchaser’s acceptance of the items by the purchaser or

his authorized agent, shall not relieve the supplier from his responsibility for supplying the

items in accordance with specification requirements of this document and purchase order.

8. Subcontracting

The supplier shall not sub-contract any or all the work without the written consent from the

purchaser.

9. Packing and Shipment

a) PACKAGING: After completion of all tests and acceptance by the purchaser, the assembled

PCBs shall be thoroughly cleaned, dried, protected from dirt, and any other damage.

Afterwards these PCBs shall be crated suitably with proper protection and with antistatic cover

and shipped to Purchaser’s workplace, CnID, B.A.R.C., Trombay, Mumbai - 400 085. The

Supplier shall be fully responsible for the proper care and handling of PCBs during packing and

shipment to ensure their arrival at destination without damage to any part.

b) DELIVERY: Delivery of subassemblies shall be made only after obtaining approval in all

respect from purchaser. Completed jobs shall be delivered on or before the stipulated delivery

period mentioned in Purchase Order/Work Order.

10. Warranty

The supplier shall give a warranty for a period of 12 months from the date of acceptance of all the

modules (after supply of all items) against defects and poor workmanship. A certificate stating the

period shall be given by the supplier for the same.

11. Deliverables:

The bidder will have to supply the following:

A. Board Layout File.

B. Gerber files in RS-274X format.

C. Sixteen Numbers (4 Set)of assembled and tested Modules (to be tested in two phases as given

in 3 (c) and 3 (d))

D. Documents as given in section-3 (e)

12. Vendor Qualification

a) Supplier shall have facilities and adequate resources for carrying out work of this nature. He

should have executed PCB fabrication & assembling work of similar complexity in recent past.

Supplier shall have necessary tools and manpower for layout design, gerber generation and

component assembling. Supplier shall have applicable software tools for SI and PI analysis.

b) If the supplier wants to outsource PCB fabrication, then name of the company having

fabrication facility shall be provided alongwith the quotation.

c) Supplier should have necessary test equipment like oscilloscope, network switch, etc.

d) User shall have a right to evaluate the supplier through facility inspection by user’s engineer

before the placement of purchase order. Vendor’s found not meeting above qualification

criteria are liable to be rejected during evaluation.

13. Confidentiality

The supplier shall agree to maintain confidentiality for the hardware schematic and other design

files.

14. The quotations shall have breakup of engineering cost, component cost and module cost.

Annexure

(Ref:BARC/CnID/AMIS/SKB/

BLOCK Diagram and BOM

(Layout, Fabrication of PCB Design, Procurement of components, Assembling and Testing of HMI module,

Main Power Supply Module, Power Supply Module & Front Panel PCB with

1.1-Block Diagram (HMI Module)

Figure-1: Block diagram of

Annexure-III (11 Sheets)

BARC/CnID/AMIS/SKB/2020/ 61826)

BLOCK Diagram and BOM

brication of PCB Design, Procurement of components, Assembling and Testing of HMI module,

Main Power Supply Module, Power Supply Module & Front Panel PCB with piggyback

Module)

1: Block diagram of HMI Module

brication of PCB Design, Procurement of components, Assembling and Testing of HMI module,

piggybackKeypad)

1.2- BOM of HMI Module

Table 1: BoM of HMI Module

Item Quantity Reference Part

1 1 CY1 1NF/2KV

2 9 C1,C2,C3,C4,C5,C15,C16,C24,C32 0.1uF

3 2 C6,C7 CAP

4 5 C8,C9,C11,C17,C29 1uF, 50V

5 4 C10,C14,C22,C30 0.22uF, 50V

6 4 C12,C13,C23,C31 1uF, 50V(NF)

7 1 C18 330UF/50V

8 2 C19,C20 4U7F/50V

9 1 C21 10UF/50V

10 1 C25 4.7uF, 12V

11 1 C26 600 pF 50V

12 2 C27,C28 10uF, 10V

13 11 C33,C34,C35,C36,C37,C38,C39,C40,C41,C42,C50 100nF

14 1 C43 4.7uF

15 2 C44,C48 3.9pF

16 2 C45,C46 2.2uF

17 2 C47,C49 1.5pF

18 4 D1,D2,D3,D4 CDSOT23-SM712

19 1 F1 FUSE

20 1 J1 DB 9 Connector

21 1 J2 CON26A

22 1 J3 CON20A

23 1 J4 12VDC

24 1 J5 24VDC

25 1 J6 JUMPER1

26 4 L1,L2,L4,L6 10uH

27 1 L3 12UH

28 1 L5 470nH , 20%

29 1 P1 Connector

30 1 RV1 S14K35

31 4 R1,R3,R4,R6 10E

32 2 R2,R5 100K

33 17 R7,R8,R9,R11,R12,R13,R14,R15,R16,R17,R18,R19,R20,R21,R27,R3

1,R33

10K

34 1 R10 4.7K

35 3 R22,R23,R25 5K

36 2 R24,R26 13.3E, 1%

37 2 R28,R32 4E, 1%

38 1 R29 90K, 1%

39 1 R30 20K, 1%

40 1 SW1 SW PUSHBUTTON-

SPST-2/SM

41 1 U1 SN65HVD33MDRE

P

42 1 U2 MAX3221-EPDB16

43 1 U3 TCA8418RTWR

44 1 U4 LP5912-3P3DRVT

45 4 U5,U6,U8,U10 LT3465AES6TRMP

BF

46 1 U7 PUZ3-D12-S24-D

47 1 U9 TPS62823DLCR

48 2 U11,U12 STM32H743ZIT6

49 1 Y1 25MHZ

50 1 Y2 32.768KHZ

2.1-Block Diagram (Main Power Supply

Figure-2: Block diagram of

Main Power Supply Module)

2: Block diagram of Main Power Supply Module

2.2- BOM of Main Power Supply Module

Table 2: BoM of Main Power Supply Module

S.

No. Reference Qty Description Package

1 C1,C2,C7,C10 4 0.1uF,100V,10%,X7R E0603

2 C3 1 DNP E0603

3 C4 1 0.56uF,25V,10% E0805

4 C5 1 1uF E0603

5 C6 1 10uF E0603

6 C8 1 1nF E0603

7 C9,C11,C12 3 10uF/50V E1210, X5R

8 C13 1 1uF/100V E1206, X7R

9 C14,C15,C16,C17 4 47uF,100V,20% SMD Electrolyte

10 C18,C19,C20,C21,C35,C36,C37,C38 8 4700pF,2kV,10%,X7R E1210

11 C22,C42 2 0.2uF E2220

12 C23,C24,C25,C26,C27,C28,C29,C43,C44,C

45,C46,C47,C48,C49 14 4.7uF,100V,20%,X7R E2220

13 C30,C50 2 4700uF,100V,20% SMD Electrolyte

14 C31,C32,C33,C34,C51,C52,C53,C54 8 4.7uF,100V,10%,X7R E1206

15 C39,C40,C41 3 C E0603

16 C55 1 0.1uF,16V,10%,X7R E0603

17 D1,D5 2 DIODE DO214AB

18 D2,D7 2 S1A SMA

19 D3,D8 2 TPSMC39A DO214AB

20 D4,D11 2 18V DO214AB

21 D6 1 35V DO214AB

22 D9,D10 2 LTST-C193KGKT E0603

23 D12 1 12V DO214AB

24 D13,D14 2 R-LED E0805

25 F1,F2 2 FUSE (30A, 125V) AXIAL

26 F3 1 FUSE (3A, 125V) AXIAL

27 F4 1 FUSE (8A, 125V) AXIAL

28 F5 1 FUSE (10A, 125V) AXIAL

29 J1 1 CON6 CON6

30 J2,J3 2 HEADER 2 HEADER2

31 L1 1 BLM31SN500SH1L SMD IND

32 L2 1 3.3uH SMD IND

33 L3,L4,L5,L6 4 0.33uH, 20%, 50A SMD IND

34 L7 1 FB, 33E, 6A E1206

35 P1 1 6450849-7 VPX Connector

36 P2 1

PETC-01-12-01-01-S-

RA-SD-L PETC

37 Q1,Q4 2 SUD50P06-15 TO252

38 Q2,Q3 2 FDN5630 SSOT-3

39 R1,R2,R3,R30,R31,R34,R35,R38 8 100K E0603

40 R4,R64,R65,R68,R70 5 1k, 1/10W, 5% E0603

41 R5,R6,R21,R22,R23 5 DNP E0603

42 R7,R9,R36 3 10K E0603

43

R8,R12,R13,R14,R15,R16,R18,R19,R29,R3

7,R39,R40,R41,R45,R46,R47,R54,R55,R56,

R60,R61,R62,R63 23 0E E0603

44 R10 1 200K E0603

45 R11 1 4.7K E0603

46 R17,R28 2 47K E0603

47 R20 1 100E E0603

48 R24,R27 2 330E E0603

49 R25,R33 2 2.2K E0603

50 R26 1 1.3M E0603

51 R32 1 15K E0603

52 R42,R51 2 10E, 1/4W E0805

53 R43,R52 2 1E, 1/4W, 5% E1206

54 R44,R53 2 250m, 1W E2512

55 R48,R49,R50,R58,R59 5 R E0603

56 R57 1 500k, 1/2W, 10% POT T/H POT

57 R66,R67 2 49.9k, 1/10W, 1% E0603

58 R69,R71 2 4.99k, 1/10W, 0.1% E0603

59 SW1,SW2 2 TL3301AF160QJ Tactile Switch

60

TP1,TP2,TP3,TP4,TP5,TP6,TP7,TP8,TP9,T

P10,TP11,TP12,TP13,TP14,TP15,TP16,TP1

7,TP18,TP19,TP20,TP21,TP22,TP23,TP24,

TP25,TP26,TP27,TP28,TP29,TP30 30 Test point Berg1.1

61 U1 1 LTC2955ITS8-1 8-Lead ThinSOT

62 U2 1

MSP430G2553IPW20

R 20-PIN TSSOP

63 U3 1 EC6AW-24S12 DIP-24

64 U4,U5 2 MQPI-18LP T/H EMI

65 U6 1 V28C3V3T50B

57.9 x 36.8 x 12.7

mm

66 U7 1 V28C5T50B

57.9 x 36.8 x 12.7

mm

67 U8,U9 2 CNY17-3 PDIP-6

3.1- Block Diagram ( Power Supply

Figure-3: Block diagram of

Power Supply Module)

: Block diagram of RF Power Supply Module

3.2- BOM of Power Supply Module

Table 3: BoM of Power Supply Module

S.

No. Reference Qty Description Package

1 C1,C2,C3,C4 4 47uF, 100V, 20% SMD Electrolyte

(øD = 10mm)

2 C5 1 0.1uF, 16V, 10%, X7R E0603

3 C6,C7,C8,C9,C26,C27,C28,C29 8 4700pF, 2kV, 10%, X7R E1210

4 C10,C11,C12,C30,C31,C32 6 DNP E0603

5 C13,C14,C15,C16,C17,C18,C19,C33,C

34,C35,C36,C37,C38,C39 14 4.7uF, 100V, 20%, X7R E2220

6 C20, C40 2 680uF, 63V, 20% (ESR 21 mΩ) Radial -

Electrolyte

7 C21, C41 2 4700uF, 63V, 20% (ESR 21

mΩ)

Radial -

Electrolyte

8 C22,C23,C24,C25,C42,C43,C44,C45 8 4.7uF, 100V, 10%, X7R E1210

9 C46 1 1uF, 50V, 10% E0805

10 C47 1 470uF, 63V, 20% SMD Electrolyte

(øD = 16mm)

11 C48 1 100uF, 63V, 10% SMD Electrolyte

(øD = 10mm)

12 D1,D2,D3,D4 4 R-LED E0805

13 F1,F2 2 FUSE (30A, 125V) AXIAL

14 L1 1 FB, 33E, 6A E1206

15 L2,L3,L4,L5 4 0.33uH, 20%, 50A SMD IND

16 P1,P2 2 PETC-01-12-01-01-S-RA-SD-L PETC

17 Q1 1 P-MOSFET SOT23-3

18 R1,R2,R6,R7,R8,R9,R18,R19,R20,R27

,R28,R29 12 0E E0603

19 R3 1 500k, 1/2W, 10% POT T/H POT

20 R4,R5,R22,R23,R24,R30,R31,R32 8 DNP E0603

21 R10,R11,R14,R16 4 1k, 1/10W, 5% E0603

22 R12,R13 2 49.9k, 1/10W, 1% E0603

23 R15,R17 2 4.99k, 1/10W, 0.1% E0603

24 R21,R33 2 10E, 1/4W,1% E0805

25 R25,R34 2 1E, 1/4W, 5% E1206

26 R26,R35 2 250m, 1W, 1% E2512

27 R36 1 20k, 1/10W, 1% E0603

28 R37,R38 2 2k, 1/10W, 1% E0603

29 R39 1 174k, 1/10W, 1% E0603

30 SW1 1 SW_SPDT SMD Switch

31

TP1,TP2,TP3,TP4,TP5,TP6,TP7,TP8,T

P9,TP10,TP11,TP12,TP13,TP14,TP15,

TP16,TP17,TP18,TP19,TP20,TP21,TP

22,TP23,TP24,TP25,TP26,TP27,TP28,

TP29,TP30

30 Test Point BERG1.1

32 U1,U2 2 QPI-5LZ Lidded SiP

33 U3,U4 2 CNY17-3 PDIP-6 Gull wing

34 U5,U6 2 DCM3623T50T31A6T00 3623 through-hole

ChiP package

35 U7 1 uRAM2TF1 Micro Package

(Quarter Brick)

4.1- Front Panel PCB with piggyback

Figure 4: Assembled

Figure 5 piggyback keypad

piggyback Keypad

ssembled Front Panel PCB with piggyback keypad

piggyback keypad PCB dimension

Figure 6

Note:

1. Silicone Rubber Keypads from Proto Tool

2. Glue to be fixed between the edges of k

3. Front panel with Keypad assembly

4.2- BOM for Front Panel PCB with Keypad

Table 4: BoM of

Item Quantity

1 4

2 24

6 : Front panel PCB dimension

Silicone Rubber Keypads from Proto Tool ( as per Figure-5)

ween the edges of keypad and metal mounting surface for IP 65

has to be IP65 qualified.

Front Panel PCB with Keypad

: BoM of Front Panel PCB with Keypad

Quantity Reference

D1

D2

D11

D20

Apem: Q

D3

D4

D5

D6

D7

D8

D9

D10

D12

D13

D14

D15

D16

D17 SML-

eypad and metal mounting surface for IP 65

Part

Apem: Q-6-P-3

-P11

D18

D19

D21

D22

D23

D24

D25

D26

D27

D28

3 3 J1

J4B1

J4A1

Samtec Make:

QMS-026-01-SL-

D-PC4

4 1

J2

MOLEX Make:

0512964594

5 2 J3

J4

Samtec make:

LSHM-120-3.0-F-

DV-A

6 1 P1 Samtec Make:

QMS-052-01-SL-

D-PC4

7 1 P2 SamtecMake::

QMS-052-01-SL-

D-PC4

8 24 SW1

SW2

SW3

SW4

SW5

SW6

SW7

SW8

SW9

SW10

SW11

SW12

SW13

SW14

SW15

SW16

SW17

SW18

SW19

SW20

SW21

SW22

SW23

SW24

C&K Make: KXT

321 LHS

9 1 4.3” TFT Graphical LCD Mitsubishi Make:

AC043NB0