THEMIS INSTRUMENT CDR Peer ReviewSYSTEM- 1 UCB, April 19, 2004 TITLE: Test Flow RFA CODE: UCB-10...
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Transcript of THEMIS INSTRUMENT CDR Peer ReviewSYSTEM- 1 UCB, April 19, 2004 TITLE: Test Flow RFA CODE: UCB-10...
THEMIS INSTRUMENT CDR Peer Review SYSTEM-1 UCB, April 19, 2004
TITLE: Test Flow RFA CODE: UCB-10
REQUESTED BY: Preble SPECIFIC REQUEST:
We recommend that UCB define the development, engineering model, qualification, and acceptance testing approach for all of the THEMIS instruments. We think that this could be contained in an I&T test plan. For starters, however, we recommend that each instrument team (or the project-level system engineering team) develop a flow chart identifying the testing that will be conducted. The conditions of the testing such as temperature, vacuum or air, cycles, etc. should be added when available.
Response: THM_SYS_005d_Instrument Payload Verification Plan and Environmental Test Specification provides the test plan for all instruments. Flow charts for each instrument are contained in the plan. The THEMIS Environmental Test Matrix contains specific test conditions such as vacuum or air, number of cycles, etc.
IPDR Peer Review RFA #10
THEMIS INSTRUMENT CDR Peer Review SYSTEM-2 UCB, April 19, 2004
RFA #10:Instrument Payload I&T Flow
FGMFunctional(Level 2)
SCMFunctional(Level 2)
SSTFunctional(Level 2)
HarnessBake-out
IDPU-HarnessSafe-to-Mate
PayloadThermal
PayloadEMI/EMC/MAG
ESAFunctional(Level 2)
• Test Review
InstrumentPER
MAG INTEGRATION
EFI INTEGRATION
ESA/SST INTEGRATION
PAYLOAD ENVIRONMENTALPayloadVibration
PayloadAcceptance
• Workmanship (if necessary)
MagAlignment
EFI AXBDeploy
EFI SPBDeploy
Mag BoomDeploy
EFIFunctional(Level 1)
EFIFunctional(Level 2)
EFI/SCM/FGMPhasing
ESA/SSTTiming
PayloadCPT
THEMIS INSTRUMENT CDR Peer Review SYSTEM-3 UCB, April 19, 2004
RFA #10:FGM I&T Flow
FGSVibration
FGSThermal
IDPUSafe-to-Mate
IDPU/ESA/SCM Pre-Amp
Vibration
FGSAcceptance
FGMFunctional(Level 2)
• Inspection• Mass Properties• DC Magnetics
• 2 cycles T-V• Bake-out +60C
• Sensor in TCU
FGEAcceptance
FGMFunctional(Level 0)
• Without FGS• Inspection
IDPUThermal
• 2 cycles T-V• Bake-out +60C• FGS Functional (Level 1)
FGBVibration
FGB/SCBThermal
• 1 cycle T-V• Hot/Cold Deploy
FGBAcceptance
• Inspection• Mass Properties• DC Magnetics
• Backplane
Alignment EFI/SCM/FGM
Phasing Mag Boom
Deploy Payload
Safe-to-Mate
• Harness
PayloadThermal
PayloadEMI/EMC/MAG
• 6 cycles T-V• FGM Functional (Level 1)
IDPUAcceptance
• Inspection• Mass Properties• DC Magnetics
• Test Review
• Boom Levels
InstrumentPER
FGM BOOM (FGB)
FGM SENSOR (FGS)
FGM ELECTRONICS (FGE)
FGM / PAYLOAD INTEGRATION
PAYLOAD ENVIRONMENTALPayloadVibration
PayloadAcceptance
• Workmanship (if necessary)
THEMIS INSTRUMENT CDR Peer Review SYSTEM-4 UCB, April 19, 2004
FGM Level 0 – Without Sensor (Aliveness)• B-field about zero if FGM in Cal Mode (preferred mode)
• B-field saturated if feedback is closed
• Interface full functional
• Power consumption reduced by about 200mW
FGM Level 1 – Sensor in Mu-metal cap (Limited Performance Test)• B-field about 10,000nT, Noise about 1nT
• Full functionality,
but B-field not representative
FGM Level 2 – Sensor in TCU (Comprehensive Performance Test) • B-field < 10nT, Noise <10pT/sqrt (Hz)
• B-field has to be available in full quality
• Delta in calibration coefficients known
FGM Test Configurations
THEMIS INSTRUMENT CDR Peer Review SYSTEM-5 UCB, April 19, 2004
RFA #10:SCM I&T Flow
SCM SensorVibration
SCM SensorThermal
SCM Pre-AmpBake-out
IDPU/ESA/SCM Pre-Amp
Vibration
SCM SensorBake-out
Functional(Level 3)
• Bake-out +60C• 3 cycles (air)
• SCM Sensor in Mu Metal
SCM Pre-AmpThermal
SCM Pre-AmpAcceptance
IDPUThermal
• 2 cycles T-V• Bake-out +60C• SCM Functional (Level 1)
SCBVibration
• 14.1g RMS
FGB/SCBThermal
• 1 cycle T-V• Hot/Cold Deploy
SCBAcceptance
• Inspection• Mass Properties• DC Magnetics
• Bake-out +60C
Alignment EFI/SCM/FGM
Phasing Mag Boom
Deploy Payload
Safe-to-Mate
• Harness
PayloadThermal
PayloadEMI/EMC/MAG
• 6 cycles T-V• SCM Functional (Level 2)
IDPUAcceptance
• Inspection• Mass Properties• DC Magnetics
• Test Review
• Boom Levels
InstrumentPER
SCM BOOM (SCB)
SCM SENSOR (SCM)
SCM PRE-AMP
SCM / PAYLOAD INTEGRATION
PAYLOAD ENVIRONMENTALPayloadVibration
PayloadAcceptance
• Workmanship (if necessary)
SCM SensorAcceptance
• Inspection• Mass Properties• DC Magnetics
• 3 cycles (air) • Inspection• Mass Properties• DC Magnetics
THEMIS INSTRUMENT CDR Peer Review SYSTEM-6 UCB, April 19, 2004
SCM Test ConfigurationsSCM Safety – Feedback Plug
• Required when SCM Pre-Amp is powered and sensor is not connected
SCM Level 0 – With SCM EGSE I/F Box (Aliveness)• Same Power, Command, Analog output interfaces
• Power and Cal Mode identification by LED
• Cal Signal re-injected to the input
• Signal generator connected to input
• Validation by analysis of data
SCM Level 1, 2 – Sensor in Mu Metal Box (Comprehensive Performance Test) • Sensor kept in mu metal box during integration
• Axis identification
• Re-verification of end-to-end calibration
• Phase relation
• Check of conducted noise
• SCM/EField timing reference
THEMIS INSTRUMENT CDR Peer Review SYSTEM-7 UCB, April 19, 2004
RFA #10:ESA I&T Flow
ESAFunctional(Level 2)
• Instrument Functional• Cover Simulator Test
ESAThermal
ESAAcceptance
• Inspection• Mass Properties• DC Magnetics
ESA/SSTTiming
PayloadSafe-to-Mate
• Harness
PayloadThermal
PayloadEMI/EMC/MAG
• 6 cycles T-V• ESA Functional (Level 1)
• Test Review
InstrumentPER
ESA SENSOR
ESA ELECTRONICS (ETC)
ESA / PAYLOAD INTEGRATION
PAYLOAD ENVIRONMENTAL PayloadVibration
PayloadAcceptance
• Workmanship (if necessary)
• 2 cycles T-V• Bake-out +60C
IDPUSafe-to-Mate
IDPU/ESA/SCM Pre-Amp
Vibration
ESAFunctional(Level 0)
IDPUThermal
• 2 cycles T-V• Bake-out +60C
• Backplane
IDPUAcceptance
• Inspection• Mass Properties• DC Magnetics
ETCAcceptance
• Inspection
THEMIS INSTRUMENT CDR Peer Review SYSTEM-8 UCB, April 19, 2004
RFA #10:SST I&T Flow
SSTFunctional(Level 2)
• SST w/ Radiation Source• Attenuator Test
SST Vibration
SSTThermal
SSTAcceptance
• Inspection• Mass Properties• DC Magnetics
ESA/SSTTiming
PayloadSafe-to-Mate
• Harness
PayloadThermal
PayloadEMI/EMC/MAG
• 6 cycles T-V• SST Functional (Level 1)
• Test Review
InstrumentPER
SST SENSOR
SST ELECTRONICS(DAP and ETC)
SST / PAYLOAD INTEGRATION
PAYLOAD ENVIRONMENTAL PayloadVibration
PayloadAcceptance
• Workmanship (if necessary)
• 2 cycles T-V• Bake-out +60C
IDPUSafe-to-Mate
IDPU/ESA/SCM Pre-Amp
Vibration
DAPAcceptance
SSTFunctional(Level 0)
• Without SST
• InspectionIDPU
Thermal
• 2 cycles T-V• Bake-out +60C
• Backplane
IDPUAcceptance
• Inspection• Mass Properties• DC Magnetics
ETCAcceptance
• Inspection
THEMIS INSTRUMENT CDR Peer Review SYSTEM-9 UCB, April 19, 2004
RFA #10:EFI I&T Flow
EFI Pre-AmpBake-out
EFI AXBDeploy
• Sensor in Mu Metal
EFI Pre-AmpThermal
EFI Pre-AmpAcceptance
AXBVibration
AXBThermal
• 1 cycle T-V• Hot/Cold Deploy
AXBAcceptance
• Inspection• Mass Properties• DC Magnetics
• Bake-out +60C
EFI Functional(Level 2)
EFI/SCM/FGMPhasing
EFI SPBDeploy
PayloadSafe-to-Mate
• Harness
PayloadThermal
PayloadEMI/EMC/MAG
• 6 cycles T-V• EFI Functional (Level 1)
• Test Review
InstrumentPER
EFI AXIAL BOOM (AXB)
EFI RADIAL BOOM (SPB)
EFI PRE-AMP
EFI / PAYLOAD INTEGRATION
PAYLOAD ENVIRONMENTAL PayloadVibration
PayloadAcceptance
• Workmanship (if necessary)
• 3 cycles (air) • Inspection• Mass Properties• DC Magnetics
EFI ELECTRONICS(BEB and DFB)
SPBVibration
SPBThermal
• 1 cycle T-V• Hot/Cold Deploy
SPBAcceptance
• Inspection• Mass Properties• DC Magnetics
EFI Pre-AmpVibration
IDPUSafe-to-Mate
IDPU/ESA/SCM Pre-Amp
Vibration
BEBAcceptance EFI
Functional(Level 0)
• Without sensors
• Inspection
IDPUThermal
• 2 cycles T-V• Bake-out +60C
• Backplane
IDPUAcceptance
• Inspection• Mass Properties• DC Magnetics
DFBAcceptance
• Inspection
THEMIS INSTRUMENT CDR Peer Review SYSTEM-10 UCB, April 19, 2004
RFA #10:Environmental Test Matrix
THEMIS INSTRUMENT CDR Peer Review SYSTEM-11 UCB, April 19, 2004
RFA #10:Environmental Test Matrix
THEMIS INSTRUMENT CDR Peer Review SYSTEM-12 UCB, April 19, 2004
RFA #10:Environmental Test Matrix
THEMIS INSTRUMENT CDR Peer Review SYSTEM-13 UCB, April 19, 2004
RFA #10:Environmental Test Matrix